JP2008076316A - Sheet connector, semiconductor tester, and packaged semiconductor product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet connector as an anisotropic conductive sheet for easily thinning a sheet, semiconductor tester and packaged semiconductor product using the above sheet connector. <P>SOLUTION: The sheet connector comprises a resin sheet 12 with a hollow conduction area 5 formed along the wall of a through-hole 9 passing through in thickness direction, and a metallic spring 3 arranged on the above hollow conduction part 5 to be electrically-connected with the conduction part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sheet-like connector, a semiconductor inspection device, and a mounted semiconductor product, and more specifically, in an inspection of a semiconductor device or the like, or incorporated in a mounted product including a semiconductor device, etc. The present invention relates to a sheet-like connector, a semiconductor inspection apparatus using the sheet-like connector, and a mounted semiconductor product, which are used for ensuring reliability.

  In a circuit board such as a printed circuit board used for a semiconductor device such as an LSI, the pitch of the number of electrodes is narrowed, and the tendency to increase in density and complexity is increasing. For example, a multilayer substrate including an inner layer circuit substrate and an outer layer circuit substrate is increasingly used. In order to achieve such electrical connection between the lead electrodes of the LSI circuit board and other circuit terminals, an anisotropic conductive sheet has been conventionally interposed between them. For example, when an LSI is inspected, an anisotropic conductive sheet is interposed, so that the electrodes of the LSI and the terminals of the LSI inspection apparatus can be easily electrically connected.

  This anisotropic conductive sheet has conductivity only in the thickness direction, and can be elastically deformed or recoverable in the thickness direction against pressure. The reason why the above-described deformation can be applied to the pressurization is that there is a limit to the dimensional accuracy in the thickness direction of the circuit board to be inspected, particularly the accuracy in the thickness direction position (height position) of the lead electrode. . By pressing and deforming the conductive part of the anisotropic conductive sheet, even if there is a variation in the dimensional accuracy of the circuit board, especially in the thickness direction position of the lead electrode, the variation can be absorbed to ensure electrical connection. Can be. Even when the anisotropic conductive sheet is repeatedly used, the conductive portion comes into contact with all the lead electrodes in the surface of the circuit board at a pressure equal to or higher than a predetermined value, and thus can be contacted with a low contact resistance. In short, the above-described deformation is indispensable for repeatedly and reliably performing electrical connection between terminals.

As an anisotropic conductive sheet that can be deformed under pressure as described above and can be electrically connected to a lead electrode with a fine pitch, it is subjected to elastic deformation against the pressure by an insulating polymer substance, and there The structure which shares electrical conductivity with the electroconductive particle with which it filled was proposed (patent document 1).
Japanese Patent No. 3456235

  In the proposed configuration, the range of the stroke (the difference between the compression elastic deformation state and the recovery state in the thickness direction) depends on the thickness of the sheet formed of the polymer material. For example, the upper limit of the stroke is obtained by compressive strain deformation of about 25% at maximum of the sheet thickness. For this reason, depending on the other semiconductor device, in order to obtain a stroke large enough to absorb the variation in the terminal height, it is necessary to increase the thickness of the electrically conductive portion and thus the thickness of the sheet to match the thickness. Therefore, according to the said structure, it will interfere with thickness reduction of an anisotropic conductive sheet. Further, since the size of the stroke depends on the size of the conductive portion, to obtain a stroke large enough to absorb the height variation of the mating terminal, the size of the conductive portion, that is, the connector terminal must be increased. Inevitably, it becomes difficult to handle terminals with a narrow pitch.

  An object of the present invention is to provide a sheet-like connector which is an anisotropic conductive sheet that can facilitate the thinning of the sheet, a semiconductor inspection apparatus and a mounted semiconductor product using the sheet-like connector. Furthermore, it aims at providing the sheet-like connector which can respond | correspond to narrow pitch terminals, such as an other party's chip | tip, a semiconductor inspection apparatus using the same, and a mounted semiconductor product.

  The sheet-like connector of the present invention includes a resin sheet having a hollow conductive portion formed along a wall of a through hole penetrating in the thickness direction, and a metal spring disposed in the conductive portion and electrically connected to the conductive portion. It is characterized by providing.

  With the above configuration, the thickness of the resin sheet can be reduced, and the limit stroke can be expanded by both the elastic deformation of the resin sheet and the elastic deformation of the metal spring, thereby ensuring durability for repeated long-term use. That is, unlike an anisotropic conductive sheet made of a resin sheet alone or a metal spring alone, a large stroke can be obtained even with a thin resin sheet by both the metal spring and the resin sheet.

  Further, the spring constant of the resin sheet can be equal to or less than the spring constant of the metal spring. With this configuration, in long-term use, sudden displacement can be absorbed by deformation of the resin sheet to prevent plastic deformation of the metal spring, and durability can be improved.

  The metal spring may be a spiral spring. With this configuration, the stroke is large enough to sufficiently absorb the variation in the mating terminal height position while ensuring sufficient electrical connection by increasing the contact surface pressure and contact area between the mating spring terminal and other terminals. Can be easily obtained. Even if the spiral spring is small, the contact surface pressure and the contact area can be increased, so that the contact resistance can be made sufficiently low. For this reason, the size of the electrode formed by the spiral spring and the conducting portion can be reduced, and it is possible to deal with a narrow pitch terminal.

  Moreover, porous resin is used for said resin sheet, A conduction | electrical_connection part can be made to have a part which penetrates into the wall of the through-hole opened in the porous resin sheet. With this configuration, the resin sheet is porous, and the conducting portion has a portion that soaks into the porous resin and has a porous character, and thus can be easily deformed. For this reason, the contact part (electrode) formed by the metal spring and the conduction part can be greatly deformed, and therefore the stroke can be increased. Further, when the metal spring is inserted into the conducting portion and mechanically fixed, the conducting portion is easily deformed as described above, and therefore, a portion for receiving and fixing the metal spring is easily formed.

  The resin sheet may have a porous polytetrafluoroethylene film. With this configuration, the same effect as that of the porous resin sheet can be obtained. That is, since it is a porous polytetrafluoroethylene film, the conducting part can also be deformed by having a part that soaks into the porous resin. For this reason, the contact portion formed by the metal spring and the conducting portion can be greatly deformed, and therefore the stroke can be increased. Further, when the metal spring is inserted into the conducting portion and mechanically fixed, the conducting portion is deformed to easily form a portion for receiving and fixing the metal spring. In the porous polytetrafluoroethylene film, the resin itself is high in strength, rich in elasticity, and porous due to the form in which the fibers are entangled, so that many excellent unique effects can be obtained. Sufficient plating metal particle penetration (in the conducting portion), deformability, recovery force, durability, required heat resistance, and the like can be ensured.

  The above-mentioned spring structure of the metal spring can be formed inside the hollow conducting portion when seen in a plan view. With this configuration, when contacting the bumps or the like, the spring structure portion protrudes into the hollow space, so that a larger stroke can be obtained as compared with a single resin sheet having the same thickness.

  The metal spring has a spiral spring structure formed inside a hollow conducting portion when viewed in plan, the resin sheet is formed of a porous polytetrafluoroethylene film, and the conducting portion is formed of the porous polytetrafluoroethylene. The structure which has the part which soaks into the wall of the through-hole opened in the fluoroethylene film | membrane can be taken. With this configuration, it is possible to specifically realize sheet thinning while ensuring reliable electrical continuity with the electrode unit of the external device and its repeated durability.

  Moreover, the hollow diameter of the conducting portion can be made smaller than the outer diameter of the metal spring. With this configuration, the metal spring can be easily inserted into the hollow of the conduction portion and mechanically fixed.

  Further, the through hole can be tapered, and the conducting portion can be formed along the tapered wall. With this configuration, by making the outer diameter of the metal spring larger than the diameter of the smaller end of the tapered conducting part, the metal spring is inserted from the end with the larger taper diameter, and firmly and reliably in the middle of the taper wall. Can be fixed. Further, it is possible to eliminate the possibility that the metal spring will come out in the straight hole.

  A two-stage shape can be formed inside the conductive portion. With this configuration, the metal spring can be inserted from the end of the two-stage conductive portion having the larger diameter, and the metal spring can be stopped at the step portion to facilitate fixing. Further, it is possible to eliminate the possibility that the metal spring will come out in the straight hole.

  The semiconductor inspection apparatus of the present invention is an apparatus provided with a sheet-like connector used for inspecting a semiconductor device to be inspected. In this semiconductor inspection apparatus, the above-mentioned sheet-like connector is disposed in the resin sheet having a hollow conductive part formed along the wall of the through hole penetrating in the thickness direction, and the conductive part is electrically connected to the conductive part. And a metal spring that is connected in a mechanical manner. With this configuration, since a large stroke can be taken while using a thin resin sheet, it is possible to provide a semiconductor inspection apparatus capable of performing an inspection with reliable electrical connection after being thinned.

  The mounted semiconductor product of the present invention is a semiconductor product provided with a sheet-like connector used for mounting a semiconductor device on a mounting substrate. In this mounted semiconductor product, the sheet-like connector is disposed in the conductive portion on the surface side of at least one surface of the resin sheet having a hollow conductive portion formed along the wall of the through hole penetrating in the thickness direction. And a metal spring electrically connected to the conducting portion. With this configuration, it is possible to obtain a mounted semiconductor product that is thin and secures electrical connection without using solder. For this reason, it becomes easy to remove the semiconductor device and the mounting substrate, and the flexibility in manufacturing the mounted semiconductor product can be enhanced.

  According to the sheet-like connector, the semiconductor inspection apparatus, and the mounted semiconductor product of the present invention, it is possible to easily reduce the thickness of the sheet.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a sheet-like connector 10 according to Embodiment 1 of the present invention. In FIG. 1, a through hole is formed in the resin sheet 12, and a conduction portion 5 is formed along the wall of the through hole. When the resin sheet 12 is porous PTFE, a portion that penetrates along the wall of the through hole is formed. This conducting portion 5 forms an electrode together with the metal spring 3. The metal spring 3 is inserted and fixed to the conductive portion 5 on one surface side of the resin sheet 12 and is electrically connected to each other. The specific structure of the metal spring 3 will be described later, but the specific structure is omitted in FIG. The resin sheet 12 only needs to contain a porous resin in part, and for example, one of the multilayer resin sheets may be a porous resin sheet. Needless to say, the entire resin sheet 12 may be formed of a porous resin. Next, the structure of each part will be described.

  FIG. 2 is a perspective view showing an example of the structure of the metal spring 3. FIG. 3 is a cross-sectional view thereof. The metal spring 3 illustrated in FIGS. 2 and 3 has a spiral spring structure. For example, the height b of the metal spiral spring 3 is preferably about 100 μm for a resin sheet having a thickness of 400 μm. The outer diameter D is preferably larger than the hollow diameter of the conducting portion 5. The thickness a of the spiral spring 3 does not necessarily need to be uniform, and is preferably thick at the outer periphery of the ring shape and thin at the center.

  FIG. 4 is a plan view showing the resin sheet 12 having the hollow conductive portion 5, and FIG. 5 is a cross-sectional view taken along the line VV in FIG. 4. The resin sheet 12 can contain porous polytetrafluoroethylene (PTFE). A hollow conductive portion 5 is formed on the wall of the through hole provided in the resin sheet 12 by plating or electroforming. The conductive part formed by electroforming has a part that soaks into the wall of the porous PTFE. Therefore, while it is a metal electroformed body, it has a porous character and is easily deformed, increasing the stroke. Therefore, it is preferable. In consideration of inserting and fixing the spiral spring 3 into the conducting portion 5, the diameter d of the hollow space is appropriately adjusted. Even when the spiral spring 3 is inserted and fixed, the conducting portion 5 exhibits a deformation behavior close to that of a porous tissue, and thus the spiral spring 3 can be easily fixed.

  6 and 7 are diagrams illustrating one method for mechanically fixing the metal spring 3 to the hollow conducting portion 5 of the resin sheet 12. As shown in FIG. 6, the outer diameter D of the metal spring 3 is made larger than the hollow diameter d of the conducting portion 5. As shown in FIG. 7, the metal spring 3 is mechanically fixed by inserting the metal spring 3 from the end of the through-hole conducting portion. At this time, in the conduction | electrical_connection part 5, a deformation | transformation arises with a porous resin sheet, and the part which receives and fixes the metal spring 3 substantially is formed. In the portion where the conductive portion 5 enters the hole of the porous resin, the restraint is loose in the range where the deformation amount for forming the receiving portion is small, and when the predetermined deformation amount is reached, strong restraint occurs, and the fixation is stabilized. . For this reason, the spiral spring 3 is stably stopped by this receiving part.

  FIG. 8 is a diagram showing a state of deformation when the BGA (Ball Grid Array) bumps 24 of the wiring board of the semiconductor device are pressed using the sheet-like connector 10 in the present embodiment. It should be noted here that (1) the resin sheet is mainly elastically deformed due to compressive strain in the conductive portion 5 of the porous resin sheet 12 and the surrounding region S; The center portion of the spring 3 protrudes into the hollow space of the conducting portion 5 and is deformed. When a spiral spring structure is used, by pressing a convex electrode such as a bump against the center of the spiral, the center of the spiral protrudes into the hollow space of the conducting part, and the contact area is increased according to the shape of the convex electrode. However, it deforms (generates contact surface pressure) and is electrically connected to the convex electrode. In addition, when a porous resin sheet is used, the deformation of the resin sheet itself is facilitated, and the deformation of the conductive portion 5 having a portion that permeates the resin sheet is facilitated. When the resin sheet is not porous, the degree of deformation of (1) is reduced, but elastic deformation still occurs and can contribute to an increase in stroke.

  In the present embodiment, the stroke is shared by the elastic deformation of the resin sheet 12 and the elastic deformation of the metal spring 3, particularly the elastic deformation in which the central portion of the spiral spring structure protrudes into the hollow space of the conducting portion. A large stroke can be obtained even if the thickness is reduced.

  The spiral spring 3 preferably has a cylindrical ring structure in the outer peripheral portion. When the outer ring has a cylindrical ring structure, it is easy to place and fix the spiral spring on the hollow conducting part, and it becomes easier to hold the spiral spring by the hollow conducting part, and the spiral spring can be firmly fixed. , Can be excellent in stability.

  Next, the metal spring, particularly the spiral spring structure, and the method for manufacturing the resin sheet will be described.

(Metal spring manufacturing method)
The spiral spring can be manufactured by using a method for manufacturing a contact terminal disclosed in, for example, Japanese Patent Application Laid-Open No. 2006-32105. Although a method using synchrotron radiation (SR) X-rays and a method not using SRX rays are disclosed, the LIGA (Lithographie Galvanoformung Abformung: registered trademark) process using SRX rays can be summarized as follows.
(First treatment): A substrate made of substrate / conductive layer / resist is prepared.
(Second process): SR irradiation is performed on the substrate (resist) through an X-ray mask pattern having a spiral pattern.
(Third treatment): The SR-irradiated substrate is subjected to a development treatment to form a female mold having a spiral pattern.
(Fourth treatment): A metal spiral spring is cast into a female die of a spiral pattern by plating (electroforming) treatment.
(Fifth treatment): The resist and the conductive layer are removed to expose a metal spiral spring on the substrate, and then the substrate is removed to obtain a spiral spring.

  According to the above process, a thick mechanical structure can be manufactured by exposing a resist having a thickness of about 1 mm at the maximum in order to utilize high X-ray transmittance. Therefore, a spiral spring having an aspect ratio ((b / a) in FIG. 2) of 2 or more can be easily obtained, and a spiral spring of about 10 can be obtained. In the case of a simpler structure than the spiral spring, a maximum aspect ratio of 100 can be obtained. Any metal can be used for electroforming, but Ni, Ni-Mn alloy, or the like can be suitably used. In the case of a Ni—Mn alloy, crystal grains can be made finer and strength, Young's modulus, elastic limit, and repeated durability can be improved compared to Ni.

  FIG. 9 shows another example of the spiral spring shown in FIG. FIG. 9A shows a metal spring having a spiral spring structure that protrudes outward in the shape of a bamboo shoot in a cylindrical ring constituting the outer peripheral portion. Since this spiral spring has a tip portion protruding outward, it is possible to reliably obtain electrical continuity even with a flat electrode disposed in an LGA (Land Grid Array) package or the like. It is also useful for electrodes having irregularities or depressions on the surface.

  The spiral spring shown in FIG. 9B has a columnar spiral spring and a projection located at the center of the spiral. The protruding portion protrudes toward the electrode of the other electronic device. Such a spiral spring can also provide a reliable electrical connection to a flat electrode such as an LGA package. The spiral spring preferably has a tip shape that comes into contact with the flat electrode, even if it is pressed against the flat electrode, so that mechanical damage to the flat electrode is small, and the tip of the spiral spring itself is less worn. Further, even if the spiral spring and the flat electrode are in contact with each other with an inclination, the connection state can be kept constant. For this reason, it can be a highly reliable metal spring for electrical connection. From this viewpoint, it is desirable that the surface shape of the protrusion is a spherical surface or a paraboloid of revolution. As described above, it is desirable that the outer peripheral portion of the metal spring has a cylindrical ring structure.

  FIG. 10 is a diagram illustrating another example of a spiral spring having a two-dimensional pattern different from the two-dimensional pattern of the spiral spring (spring). In the spiral spring shown in FIG. 10 (a), since the entire three separated springs are configured, a soft spring can be obtained. Further, in the spiral spring shown in FIG. 10B, since the overall shape is rectangular, the area ratio of the spring on the mounting connector or the inspection socket is higher than that of the circular spiral spring. Efficiency can be improved. The structure of the metal spring is not limited to the spiral spring structure (spring structure) shown in FIGS. 9 and 10, and may be a metal spring in which the arm is folded in a bellows structure in the center direction.

(Method for forming resin sheet)
1. Resin sheet (base film)
In a sheet-like connector for burn-in test such as a semiconductor wafer, the base film is preferably excellent in heat resistance. The sheet-like connector needs to be electrically insulating in the lateral direction (a direction perpendicular to the film thickness direction). Therefore, the synthetic resin that forms the porous material needs to be electrically insulating.

  Examples of the porous resin material used as the base film (resin sheet) include polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), and tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer ( Fluororesin such as PFA), polyvinylidene fluoride (PVDF), polyvinylidene fluoride copolymer, ethylene / tetrafluoroethylene copolymer (ETFE resin); polyimide (PI), polyamideimide (PAI), polyamide (PA ), Modified polyphenylene ether (mPPE), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polysulfone (PSU), polyethersulfone (PES), liquid crystal polymer (LCP), etc. Stick; and the like. Among these, PTFE is preferable in terms of heat resistance, workability, mechanical properties, dielectric properties, and the like.

  Examples of the method for producing the porous resin sheet include a pore making method, a phase separation method, a solvent extraction method, a stretching method, and a laser irradiation method. By forming the porous resin sheet, elasticity can be given in the film thickness direction, and the dielectric constant can be further lowered.

  The porous resin sheet preferably has a porosity of about 20 to 80%. The porous resin sheet preferably has an average pore diameter of 10 μm or less or a bubble point of 2 kPa or more, and more preferably has an average pore diameter of 1 μm or less or a bubble point of 10 kPa or more from the viewpoint of fine pitching of the conducting part. . Although the film thickness of a porous resin sheet can be suitably selected according to a use purpose or a use location, it is 3 mm or less normally, Preferably it is 1 mm or less. In particular, in a sheet-like connector for burn-in test, the film thickness is preferably about 5 to 500 μm, more preferably about 10 to 200 μm, and particularly preferably about 15 to 100 μm in many cases.

  Among the porous resin sheets, the porous polytetrafluoroethylene film (porous PTFE film) obtained by the stretching method is excellent in heat resistance, workability, mechanical properties, dielectric properties, etc. and has a uniform pore size distribution. Since it is easy to obtain a porous film having the same, it is the most excellent material as a base film for a sheet-like contact.

  The porous PTFE membrane can be produced, for example, by the method described in Japanese Patent Publication No. 42-13560. First, a liquid lubricant is mixed with the unsintered powder of PTFE, and extruded into a tube shape or a plate shape by ram extrusion. When a thin sheet is desired, the plate is rolled with a rolling roll. After the extrusion rolling process, the liquid lubricant is removed from the extruded product or the rolled product as necessary. When the extruded product or the rolled product thus obtained is stretched at least in a uniaxial direction, unsintered porous PTFE is obtained in the form of a film. An unsintered porous PTFE membrane is highly porous when heated and stretched to a temperature of 327 ° C. or higher, which is the melting point of PTFE, while being fixed so that shrinkage does not occur. A PTFE membrane is obtained. When the porous PTFE membrane is in a tube shape, a flat membrane can be obtained by opening the tube.

  The porous PTFE membrane obtained by the stretching method has a fine fibrous structure composed of very thin fibers (fibrils) formed by PTFE and nodes (nodes) connected to each other by the fibers. In the porous PTFE membrane, this fine fibrous structure forms a porous structure.

2. Formation of conductive part Conductive metal is attached to the wall of the through hole (resin part of porous structure) penetrating from the front surface to the back surface at a plurality of locations on the base film made of an electrically insulating porous film made of resin. Thus, a conductive portion capable of imparting conductivity in the film thickness direction is provided.

  In order to form conductive portions at a plurality of locations on the base film, first, it is necessary to specify the position where the conductive metal is attached. As a method for specifying the position where the conductive metal is attached, for example, a method in which a porous film is impregnated with a liquid resist, exposed in a pattern and developed, and the resist removal portion is set as the conductive metal attachment position. (Photolithographic method). However, here, it is possible to suitably employ a method in which fine through holes are formed in the film thickness direction at a specific position of the porous film and the wall surface of the through hole is used as a conductive metal deposition position. The method of forming a large number of through-holes in the porous film is suitable for the case where a conductive metal is deposited at a fine pitch as compared with the former method using a photolithography technique. Further, the method of forming a large number of through holes in the porous film is suitable for forming a conductive portion having a fine diameter of, for example, 30 μm or less, and further 25 μm or less. Any method may be used depending on the situation.

  Conductive portions are formed by attaching a conductive metal to a wall of a through hole (resin portion having a porous structure) penetrating from the front surface to the back surface at a plurality of locations on the base film made of a porous film. In the method using the photolithography technique, conductive metal particles are deposited on the resist removal portion by an electroless plating method or the like, and the conductive metal is continuously attached to the wall (resin portion having a porous structure). In this case, the conductive metal is continuously attached to the resin portion having the porous structure so as to penetrate from the front surface to the back surface of the resist removal portion. In the method of forming the through hole, the conductive metal particles are attached to the resin portion having a porous structure exposed on the wall surface of the through hole by a method of depositing conductive metal particles by an electroless plating method or the like.

  The resin part having a porous structure means a skeleton part forming the porous structure of the porous film. The shape of the resin part having a porous structure differs depending on the type of porous film and the method of forming the porous film. For example, in the case of a porous PTFE membrane formed by a stretching method, the porous structure is formed of a large number of fibrils each made of PTFE and a large number of nodes connected to each other by the fibrils. These are fibrils and nodes.

  A conductive metal is attached to the porous resin portion to form a conducting portion. Under the present circumstances, the porous structure in a conduction | electrical_connection part can be hold | maintained by controlling the adhesion amount of a conductive metal moderately. In the sheet-like contact of the present invention, since the conductive metal adheres along the surface of the resin portion having a porous structure, the portion of the conductive metal layer is integrated with the porous structure to form a porous structure. As a result, it can be said that the conducting portion is porous. For this reason, as mentioned above, the deformation | transformation ease of the conduction | electrical_connection part itself at the time of a contact with a bump etc. and the insertion fixation of a metal spring can be acquired easily. Most or substantially most of the conductive metal layer may have a porous structure.

  When an electroless plating method or the like is employed, the conductive metal particles adhere to the resin portion having a porous structure. In the sheet-like connector of the present invention, a state in which conductive metal particles are attached while maintaining the porous structure (porosity) constituting the porous membrane to some extent is obtained. The thickness of the porous resin part (for example, the thickness of the fibril) is preferably 50 μm or less. The particle diameter of the conductive metal particles is preferably about 0.001 to 5 μm. The adhesion amount of the conductive metal particles is preferably about 0.01 to 4.0 g / ml in order to maintain porosity and elasticity. Although it depends on the porosity of the porous film used as the base film, if the amount of conductive metal particles attached is too large, the elasticity of the sheet-like connector becomes too large, and the elastic recovery of the sheet-like connector will occur under normal use compression load. Performance is significantly reduced. If the adhesion amount of the conductive metal particles is too small, it is difficult to obtain conduction in the film thickness direction even when a compressive load is applied.

  A method of attaching a conductive metal to the resin portion having a porous structure on the wall surface of the through hole will be described with reference to FIGS. 4 and 5. The porous resin sheet (base film) 12 has a plurality of through holes 9 penetrating from the front surface to the back surface. These through holes are generally formed in the porous resin sheet 12 in a predetermined pattern. FIG. 5 is a cross-sectional view taken along the line VV in FIG. 4 and shows a state in which conductive metal particles adhere to the resin portion of the porous structure on the wall surface of the through hole to form the conductive portion 5. ing. The porous resin sheet 12 is a base film, and through holes are provided at a plurality of predetermined locations. Conductive metal particles adhere to the resin portion of the porous structure on the wall surface of the through hole, and the conduction portion 5. Is formed. Since the conducting part 5 is formed by adhering to the surface of the porous resin part, it has a porous characteristic. When the pressure is removed, the entire resin sheet including the conducting portion is elastically recovered, so that the sheet-like contact can be used repeatedly.

  FIG. 11 and FIG. 12 are diagrams showing a modification of the method of inserting and fixing the metal spring 3 into the conducting portion 5. In the method shown in FIGS. 6 and 7, a metal spring is inserted into a conductive portion having a certain thickness on a flat wall surface perpendicular to the surface and mechanically fixed. In the method shown in FIG. 11, the layer thickness of the hollow conducting portion is changed to two steps to provide a large diameter portion and a small diameter portion, a metal spring is inserted from the end of the large diameter portion, and the small diameter portion and the large diameter portion are A metal spring is locked to the step portion and mechanically fixed. When the metal spring is inserted into the straight hollow portion, the metal spring may come out of the hollow portion, and such inconvenience can be avoided by the method shown in FIG.

  Moreover, in the method shown in FIG. 12, the through-hole in a resin sheet is made into a taper shape, the conduction | electrical_connection part 5 is formed along the taper-shaped wall surface, and the metal spring 3 is attached from the large diameter side of a taper-shaped conduction | electrical_connection part. Insert and fix the metal spring in the contacted position. By this method, it is possible to eliminate the possibility that the metal spring will escape from the hollow space. In both methods shown in FIGS. 11 and 12, by using the resin sheet 12 as a porous PTFE film or the like, the conducting portion 5 has a portion that soaks into the wall and exhibits the characteristics of a porous material. It can be easily inserted into the conducting part 5 and fixed.

(Embodiment 2)
FIG. 13 is a sectional view showing a semiconductor inspection apparatus 50 according to the second embodiment of the present invention. The semiconductor inspection apparatus 50 includes a sheet-like connector 10 for electrically conducting with bumps 24 that are electrode terminals of a semiconductor device 60 to be inspected. The resin sheet 12 of the sheet connector 10 is formed of a porous PTFE membrane. The semiconductor inspection device 50 is formed on a wiring substrate 51 including wirings 52 and includes a guide 55 for surely aligning with the semiconductor device 60. The semiconductor device 60 is formed on a substrate 61 and protrudes the bumps 24 of the BGA electrode terminals toward the semiconductor inspection device 50. The planar position of the bump 24 and the planar position of the hollow conducting part 5 or the spiral spring 3 correspond one-to-one.

  When a load is applied to the semiconductor device so as to follow the guide 55 for the inspection of the semiconductor device 60, the bump 24 and the electrode of the sheet-like connector 10 (consisting of the conductive portion 5 and the spiral spring 3) are mechanical. For this reason, it is electrically connected. At this time, there is a variation in the height positions of all the bumps 24. If a sufficiently large stroke due to elastic deformation is not generated in the spiral spring 3 and the resin sheet 12, the variation in the height positions of the bumps 24 is caused. It cannot be absorbed. In the sheet-like connector 10 of the present invention, as shown in FIG. 8, elastic deformation is shared by both the spiral spring 3 and the porous PTFE membrane 12 including the conducting portion 5, so that a large stroke can be obtained. As a result, a highly reliable semiconductor inspection apparatus can be provided.

(Embodiment 3)
FIG. 15 is a diagram showing a state in which the mounted semiconductor product 90 according to the third embodiment of the present invention is assembled. In FIG. 15, a device 80 such as an LSI chip is formed on a semiconductor substrate 81, and a bump 84 formed on a terminal portion 83 for electrical connection protrudes on the back surface. Further, an alignment guide hole 81h is provided at the end. The LSI chip 80 is mounted on the mother board 71 with electrical connection terminals connected to each other. On the mother board 71, bumps 74 are formed on the terminals 73, and alignment pins 75 are provided. In order to securely connect the terminals of the device 80 and the mother board 71, the sheet-like contact 10 is used and incorporated in a mounted product. The resin sheet 12 of the sheet connector 10 is formed of a porous PTFE membrane.

  In the sheet-like contact 10, the metal springs 3 are arranged on both the upper surface side and the lower surface side of the conducting portion 5 so that a sufficiently large stroke is generated in electrical connection with the bumps 84 and 74 on the upper and lower surfaces. Therefore, the variation in the height position of the bump 84 in the device and the variation in the height position of the bump 74 in the mother board 71 are soaked into the spiral spring 3, the porous PTFE film 12, and the wall of the through hole. It can be absorbed by deformation with the conductive part 5. As a result, the electrical connection between the bumps 74 of the motherboard 71 and the bumps 84 of the device can be realized with a sufficiently low contact resistance. At this time, the upper and lower bumps 74 and 84 and the spiral spring 3 can be firmly connected to each other without using solder. For this reason, it is not necessary to take various measures associated with the use of solder, and since the spiral spring 3 and the bumps 74 and 84 can be easily detached, the flexibility of manufacturing a mounted semiconductor product can be increased. In addition, at this time, the resin sheet of the sheet-like contact 10 can be made sufficiently thin. For this reason, the thickness of the mounted semiconductor product 90 after being mounted on the mother board 71 can be reduced and made thinner, and the commercial value can be increased.

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. According to the present invention, any form of the metal spring and the form of the resin sheet can be used as long as both the metal spring and the resin sheet can be elastically deformed to increase the stroke and absorb the variation in the thickness direction position of the connection terminal of the semiconductor device or the like. Even so, it belongs to the technical scope of the present invention. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  In the present invention, since the elastic deformation is shared by both the metal spring and the resin sheet, a large stroke is generated so as to absorb variation in the position of the connection terminal while using a thin resin sheet. Further, when a spiral spring is used as the metal spring, the size of the spiral spring and the hollow electrode can be reduced, so that it can be applied to a semiconductor device in which terminals with a narrow pitch are arranged. Further, the mounted semiconductor product has an advantage that it is not necessary to use solder for electrical connection between the mother board and the device. For this reason, it is expected to contribute to the semiconductor device and the inspection device itself, which are increased in density, pitch, and thickness, and the manufacture thereof.

It is sectional drawing which shows the sheet-like connector in Embodiment 1 of this invention. It is a figure which shows the structure (spiral spring structure) of the metal spring shown in FIG. It is sectional drawing of the metal spring of FIG. It is a top view which shows a resin sheet. It is sectional drawing which follows the VV line of FIG. It is a schematic diagram which shows the conduction | electrical_connection part of a resin sheet, and a metal spring. It is a figure which shows the state which inserts and fixes a metal spring in the conduction | electrical_connection part of a resin sheet. It is a figure which shows the elastic deformation which arises when the bump of a semiconductor device presses against the electrode (it consists of a conduction | electrical_connection part and a metal spring) of a sheet-like connector. It is a figure which shows another example of a spiral spring, (a) shows the metal spring of the spiral structure which the center part protrudes helically, (b) is a figure which shows the metal spring which has a projection part in the center part of a spiral spring It is. It is a figure which shows another example of the planar pattern of a spiral spring, (a) shows the planar pattern formed by three springs isolate | separated from each other, (b) is 4 strip | lines extended from each side of a rectangle to the center. It is a figure which shows the plane pattern formed of this spring. It is a figure which shows another example of the method of inserting and fixing a metal spring in a hollow conduction | electrical_connection part. It is a figure which shows another example of the method of inserting and fixing a metal spring in a hollow conduction | electrical_connection part. It is a figure which shows the semiconductor inspection apparatus in Embodiment 2 of this invention. It is a figure which shows the state which act | operated the semiconductor inspection apparatus of FIG. It is a figure which shows assembly operation of the mounting semiconductor product in Embodiment 3 of this invention.

Explanation of symbols

3 Metal spring (spiral spring), 5 conducting portion, 10 sheet connector, 12 resin sheet, 12h guide hole, 24 bump, 50 semiconductor inspection device, 51 wiring board, 52 wiring, 53 connection terminal, 55 guide, 60 semiconductor device , 61 board, 71 motherboard, 73 connection terminal, 74 bump, 75 guide pin, 80 device, 81 board, 81h guide hole, 83 connection terminal, 84 bump, 90 mounted semiconductor product, b metal spring thickness (height), D The outer diameter of the metal spring, d The hollow diameter of the conducting portion, S The elastic deformation region of the resin sheet.

Claims (8)

A resin sheet having a hollow conducting portion formed along the wall of the through hole penetrating in the thickness direction;
A sheet-like connector, comprising: a metal spring disposed in the conducting portion and electrically connected to the conducting portion.   2. The sheet-like connector according to claim 1, wherein a spring structure of the metal spring is formed on an inner side of the hollow conducting portion when seen in a plan view.   The metal spring has a spiral spring structure formed inside the hollow conducting portion when viewed in plan, the resin sheet is formed of a porous polytetrafluoroethylene film, and the conducting portion is porous. The sheet-like connector according to claim 1, wherein the sheet-like connector has a portion that penetrates into a wall of the through hole formed in the polytetrafluoroethylene film.   The sheet-like connector according to any one of claims 1 to 3, wherein a hollow diameter of the conducting portion is smaller than an outer diameter of the metal spring.   The sheet-like connector according to any one of claims 1 to 4, wherein the through hole has a tapered shape, and the conductive portion is formed along the tapered wall.   The sheet-like connector according to any one of claims 1 to 4, wherein the conducting portion has a hollow diameter formed in a two-stage shape having a large-diameter portion and a small-diameter portion. A semiconductor inspection apparatus provided with a sheet-like connector used for inspecting a semiconductor device to be inspected,
The sheet-like connector includes a resin sheet having a hollow conductive portion formed along a wall of a through hole penetrating in the thickness direction, a metal spring disposed in the conductive portion and electrically connected to the conductive portion. A semiconductor inspection apparatus comprising: A semiconductor product including a sheet-like connector used for mounting a semiconductor device on a mounting board,
The sheet-like connector is disposed in the conduction portion on at least one surface side of the resin sheet, the resin sheet having a hollow conduction portion formed along the wall of the through hole penetrating in the thickness direction, and the conduction A mounted semiconductor product comprising a metal spring electrically connected to the portion.

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