JP2005251403A - Manufacturing method of spiral contact piece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of spiral contact pieces, capable of forming a projection on the surface of the spiral contact pieces with reduced production cost. <P>SOLUTION: A resist layer 43 is formed on a Cu substrate 41 on which, a recess 41a is formed in advance, and a spiral groove part 43a is formed by exposing and developing the surface of the resist layer. A projection 22c can be integrally molded on the surface of a conduction part 22 of the spiral contact piece 20 by applying a plating process to the groove part 43a and the recess 41a. A manufacturing period is shortened and the increase of the production cost is restrained since the spiral contact piece 20 and the projection 22c are formed in an identical process. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a spiral contactor that contacts an LGA or BGA provided in an IC (integrated circuit) or the like, and in particular, a spiral contact provided with a convex portion protruding three-dimensionally from the surface of the contactor. The present invention relates to a child manufacturing method.

  The semiconductor inspection apparatus (IC socket) described in Patent Document 1 is for temporarily temporarily connecting a semiconductor (IC or the like) to an external circuit board or the like. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor, and a large number of concave portions are provided on the insulating base opposite to the spherical contacts. Are arranged opposite to each other.

  When the back side of the semiconductor is pressed toward the insulating base, the spiral contact comes into contact with the outer surface of the spherical contact so as to be spirally wound. The electrical connection between the child is ensured.

A specific method for manufacturing such a spiral contact is described in FIGS.
JP 2002-175859 A

  In the spiral contactor, it is necessary to stabilize the electrical connection characteristics by increasing the contact pressure between the spiral contactor and the external contactor and reducing the contact resistance generated therebetween. For this reason, a convex portion is formed on the surface of the spiral contact, and the convex contact and the external contact are point-contacted, that is, with the contact pressure concentrated on the convex portion, the spiral contact and the external contact are made. It is preferable to contact the child.

  However, if a convex portion is formed on the surface of the spiral contactor, a separate process other than the conventional spiral contactor manufacturing method is required, so that the manufacturing time becomes long and the manufacturing cost is likely to increase. was there.

  The present invention is for solving the above-described conventional problems, and it is possible to form a convex portion on the surface of the spiral contact without increasing the number of manufacturing steps, and to reduce the manufacturing cost. The object is to provide a manufacturing method.

The present invention provides a method for producing a spiral contact,
(A) forming a recess in one surface of the substrate;
(B) coating the other surface of the substrate with a protective layer;
(C) providing a resist layer on one surface of the substrate;
(D) forming a spiral groove on one surface of the substrate by exposing and developing the resist layer to remove a part of the resist layer;
(E) Steps of integrally forming the spiral contact and a protrusion corresponding to the recess on the surface of the spiral contact by plating in the groove and in the recess;
(F) removing the remaining resist layer to expose one surface of the spiral contact;
(G) a step of fixing a plurality of spiral contacts by attaching a temporary fixing sheet to one surface of the spiral contacts;
(H) exposing the other surface of the spiral contact by removing the protective layer and the substrate;
(I) a step of attaching a holding sheet to the edge of the other surface side of the spiral contact;
(J) peeling the temporary fixing sheet from one surface of the spiral contact;
It is characterized by having.

  In the present invention, as shown in the step (a), the conductive portion and the convex portion of the spiral contactor can be formed together in the step (e) by forming the concave portion on the substrate in advance. It becomes.

  Thus, in this invention, it can suppress that the manufacturing process of a spiral contactor increases by forming the said electroconductive part and a convex part together. Further, since the conductive portion and the convex portion can be integrally formed, it is possible to prevent the occurrence of a problem that the convex portion is detached from the conductive portion or cracked during use. Therefore, it is possible to improve the accuracy and life of the inspection equipment using this spiral contact.

Moreover, a several recessed part shall be formed in the said process (a).
In the above process, since a plurality of convex portions can be formed on the spiral contactor, it is possible to prevent the convex portion from sliding on the surface of the external contactor when the convex portion contacts the external contactor. Therefore, it is possible to prevent contact marks or the like from being formed on the surface of the external contact by the convex portion.

  Further, in the step (g), a holding sheet may be attached to an edge portion on one surface side of the spiral contact, and thereafter only the step (h) may be performed.

  In the above, since the process (i) and the process (j) can be omitted, the manufacturing process can be further simplified.

  Further, the concave portion is a depression hole or a through hole, and the depth dimension of the concave portion in this case is in the range of 10 μm to 50 μm, and the diameter is preferably in the range of 10 μm to 50 μm.

  Alternatively, the depressed hole or the through hole may be in a long groove shape, a hemispherical shape, an egg shape, or an oval shape.

In the present invention, a Cu substrate can be used as the substrate.
Furthermore, Ni plating can be used for the plating.

  In the spiral contactor manufacturing method of the present invention, since the spiral conductive portion and the convex portion can be formed together in the same process, it is possible to prevent an increase in manufacturing time and an increase in manufacturing cost. That is, a spiral contact having a convex portion can be manufactured in a short manufacturing time and at a low cost.

  In addition, since the convex portion can be integrally formed with the conductive portion, it is possible to prevent the convex portion receiving the force from the external contactor from detaching from the surface of the conductive portion or causing a crack in the convex portion.

  FIG. 1 is a perspective view showing an inspection device (connection device) used in a test for confirming the operation of an electronic component, and FIG. 2 is a sectional view taken along line 2-2 of FIG. It is sectional drawing of a state.

  The inspection apparatus 1 shown in FIG. 1 individually connects a plurality of spherical or planar external contacts and spiral contacts provided on the bottom surface of an electronic component or the like, and inspects the electrical characteristics and the like of the electronic component. It is a device for.

  As shown in FIG. 1, the inspection apparatus 10 includes a base 11 and a lid 12 that is rotatably supported via a hinge 13 provided on one edge of the base 11. ing. The base 11 and the lid body 12 are formed of an insulating resin material or the like, and a loading region 11A that is concave in the Z2 direction is formed at the center of the base 11. An electronic component B such as a semiconductor can be mounted in the loading area 11A. A locked portion 14 is formed on the other edge of the base 11.

  This inspection apparatus 10 targets an electronic component B in which a large number of external contact portions C are arranged on a connection surface in a matrix (lattice or grid). The external contact portion is, for example, a flat contact (LGA: Land Grid Array) formed in a thin plate shape, or a spherical contact (BGA: Ball Grid Array) as described below.

  As shown in FIG. 2, the loading area 11 </ b> A has a predetermined diameter, and a plurality of through holes 11 a penetrating from the front surface of the loading area 11 </ b> A to the back surface of the base 11 are provided on the connection surface of the electronic component B. It is provided corresponding to the external contact portion C which is a spherical contact. A spiral contact 20 formed in a spiral shape is provided on the upper surface of each through hole 11a (the surface of the loading region 11A).

  3 is a plan view showing a state in which a plurality of spiral contacts are arranged on the holding sheet, FIG. 4 is an enlarged plan view of the spiral contacts, FIG. 5 is a side view of the spiral contacts, and FIGS. FIG. 6A shows a state before the spiral contact comes into contact with the external contact, and FIG. 6B shows a state after the spiral contact comes into contact with the external contact.

  As shown in FIG. 3, a plurality of the spiral contacts 20 are arranged on the holding sheet 16 fixed to the surface of the loading area 11A at predetermined intervals in the vertical and horizontal directions. Openings 16 a are formed at positions facing the through holes 11 a of the holding sheet 16, and the upper surface of the outer edge of the base portion 21 of the spiral contactor 20 is formed on the opening 16 a by the holding sheet 16. It is fixed to the edge. A part of the inner edge is a winding start end 22a on the center side of the base 21, and a winding end 22b, which is a free end side, extends from the winding start end 22a to the center of the through hole 11a and the opening 16a in a spiral shape. 22 is provided in a cantilever state. As shown in FIGS. 4 and 5, the surface of the winding end 22b of the conductive portion 22 is provided with a convex portion 22c that protrudes three-dimensionally in the Z1 direction shown in the drawing. The spiral contact 20 has the winding start end 22a as a fixed end, and the conductive portion 22 on the free end side can be elastically deformed up and down (Z1 and Z2 directions in FIG. 6A).

  As shown in FIG. 4, the width T1 of the conductive portion 22 of the spiral contact 20 is preferably formed in the range of 10 μm to 30 μm in consideration of strength and spring constant. When the external contact portion C is, for example, a spherical contact having a diameter of 400 μm, a preferable range of the average plate thickness dimension (dimension in the Z direction) H1 of the base 21 and the conductive portion 22 of the spiral contact 20 is H1. = 10 μm to 40 μm.

  Moreover, the preferable shape of the said convex part 22c is a column shape and a truncated cone shape. In this case, the height dimension H2 of the convex portion 22c in the Z direction is such that the one-point contact portion tends to be unstable if H2 is less than 10 μm, and the behavior of the one-point contact portion tends to become unstable if it exceeds 50 μm. A range of 10 μm to 50 μm is preferable. The average diameter r of the tip of the convex portion 22c is preferably in the range of r = 10 μm to 50 μm because if r is less than 10 μm, processing tends to be difficult, and if it exceeds 50 μm, the contact area is maximized.

  In addition, the shape of the convex portion 22c is not limited to a cylindrical shape or a truncated cone shape, and may be a hemispherical shape, a semi-egg shape, an oval shape, or the like.

  On the other hand, as shown in FIG. 2, a conductive portion 11b is formed on the inner wall surface of the through hole 11a, and the upper end of the conductive portion 11b and the base portion 21 of the spiral contact 20 are made of a conductive adhesive or the like. Connected with. The opening end below the through hole 11a is closed by a connection terminal 18 connected to the conducting portion.

  As shown in FIG. 2, a printed circuit board 29 having a plurality of wiring patterns and other circuit components is provided below the base 11, and the base 11 is fixed on the printed board 29. . The surface of the printed circuit board 29 is provided with a counter electrode 31 facing the connection terminal 18 provided on the bottom surface of the base 11, and the connection terminals 18 are in contact with the counter electrodes 31, respectively. The electronic component B and the printed circuit board 29 are electrically connected via the spiral contact 20, the conduction part 11 b and the connection terminal 18.

  On the other hand, at the center position of the inner surface of the lid 12 of the inspection apparatus 10, a convex pressing portion 12a that presses the electronic component B downward in the figure is provided facing the loading area 11A. Further, a lock portion 15 is formed at a position on the opposite side to the hinge portion 13.

  Between the inner surface of the lid body 12 and the pressing portion 12a, a biasing member made of a coil spring or the like that biases the pressing portion 12a away from the inner surface of the lid body 12 is provided (not shown). . Therefore, when the electronic component B is mounted in the through hole 11a, the lid 12 is closed, and the lock portion 15 is hooked on the locked portion 14 and locked, the electronic component B approaches the surface of the loading region 11A. It can be elastically pressed in the (Z2 direction).

  As shown in FIG. 6A, the size of the loading area 11A of the base 11 is substantially the same as the outer shape of the electronic component B, and the electronic component B is mounted on the loading area 11A and the lid 12 is attached. When locked to the base 11, the electronic component B is positioned in the loading area 11 A, and each external contact portion C provided on the connection surface of the electronic component B is accurately opposed to each spiral contact 20 in the inspection apparatus 10. It is done.

  As shown in FIG. 6B, when the lock portion 15 of the lid 12 is locked to the locked portion 14 of the base 11, the electronic component B is pressed downward by the pressing portion 12a, so that the external contact portion C Each spherical contactor enters into each through-hole 11a, and the spiral contactor 20 is elastically deformed in the inner direction (Z2 direction in the drawing) of the through-hole 11a.

  At this time, as shown in FIG. 6B, the convex portion 22 c formed at the winding terminal end 22 b of the spiral contact 20 can be positively brought into point contact with the surface of the spherical contact that is the external contact portion C. Therefore, since the elastic force of the spiral contact 20 can be concentrated on the convex portion 22c, it is possible to minimize the contact resistance generated between the spiral contact 20 and the external contact portion C. A stable connection state can be formed.

  Below, the manufacturing method of the spiral contactor 20 which has the said convex part 22c is demonstrated.

  FIG. 7 is a process diagram showing a method for manufacturing a spiral contact according to the present invention. FIG. 7 shows a manufacturing method of one spiral contact for each process, but a plurality of spiral contacts can be formed simultaneously by using the process of FIG.

  In the process shown in FIG. 7 a, a Cu substrate 41 having a thickness of about 10 μm to 200 μm is prepared, and a recess 41 a is formed on the Cu substrate 41. The concave portion 41a is, for example, a recessed hole or a through hole formed in a circular shape, and a preferable depth range of the concave portion 41a is 10 μm to 50 μm, and a preferable diameter range is 10 μm to 50 μm. The recess 41a is not limited to a circle. For example, it may be a recessed groove or a through-hole formed in a long groove shape, a hemispherical shape, an egg shape, or an oval shape, and these are also included in the category of the concave portion 41a. A plurality of the concave portions 41a are formed in a matrix at predetermined pitches in the vertical direction and the horizontal direction on the Cu substrate 41 by using a press processing machine, a punching processing machine, or the like.

  In the step shown in FIG. 7b, a protective sheet (protective layer) 42 is provided on the lower surface (the other surface) of the Cu substrate to prevent a plating layer from being formed in a later step. The protective sheet 42 is, for example, a dry film having a plurality of adhesive layers, and the lower surface is entirely covered by adhering the adhesive layer to the lower surface (the other surface) of the Cu substrate 41.

  In the step of FIG. 7c, a resist layer 43 is provided on the upper surface (one surface) of the Cu substrate 41 including the recess 41a.

  In the step of FIG. 7d, a groove 43a having a pattern having the same shape as that of the spiral contact 20 shown in FIG. In the exposure / development, a mask layer (not shown) having an exposed portion formed in the same shape as the conductive portion 22 of the spiral contactor 20 is disposed above the resist layer 43 to expose and develop the resist layer 43.

  At this time, the recess 41a is located immediately below the tip of the spiral groove 43a (a position corresponding to the surface of the winding end 22b), and the recess 41a is simultaneously exposed and developed. At this time, the layer remaining on the Cu substrate 41 functions as the resist layer 43.

  7E, the exposed and developed Cu substrate 41 is dipped in a plating bath, and the Ni plating layer 44 is applied in the spiral groove 43a and the recess 41a to form the spiral contactor 20.

  In the step of FIG. 7f, the resist layer 43 is removed with a strong alkaline solution, and the spiral contact 20 formed of the Ni plating layer 44 on the upper surface side on the Cu substrate 41 is exposed on the upper surface side.

  In the process of FIG. 7g, a peelable temporary fixing sheet 45 is stuck on and fixed to the upper surface of the spiral contactor 20, and a plurality of spiral contactors 20 arranged in a matrix are temporarily fixed.

  As shown in FIG. 7g, the base 21 of the spiral contact 20 is fixed to the spiral contact 20 temporarily.

  In the step of FIG. 7h, the protective sheet (protective layer) 42 is peeled off, and the Cu substrate 41 is dissolved and removed using a cupric chloride solution or the like, so that the lower surface side of the spiral contactor 20 is exposed.

  In the process of FIG. 7i, the lower surface side of the base 21 of the spiral contactor 20 is fixed in earnest in each opening 16a of the holding sheet 16 in which the plurality of openings 16a are formed.

  In the step of FIG. 7j, the temporary fixing sheet 45 is peeled off to complete a sheet in which the plurality of spiral contacts 20 are fixed to the holding sheet 16.

  In the manufacturing method described above, the process of forming the spiral contact 20 and the process of forming the convex portion 22c can be formed in the same process, so that the number of manufacturing processes is not increased and the manufacturing cost is increased. Can be suppressed.

  In addition, since the spiral contact 20 and the convex portion 22c can be integrally formed in the same plating process, the convex portion 22c that receives the force from the external contact is detached from the surface of the spiral contact 20 or the convex portion 22c. It is possible to prevent the portion 22c from being cracked. That is, it is possible to provide a high-quality spiral contactor 20.

  In the above embodiment, the manufacturing method is shown in which the spiral contact 20 is temporarily fixed in the step of FIG. 7h, and the surface on which the convex portion 22c is provided in the step of FIG. However, the present invention is not limited to the above, and the surface of the spiral contact 20 that does not have the convex portion 22c in the process of FIG. In this case, the steps of FIGS. 7i and 7j can be eliminated.

  In the above step (a), one concave portion 41a is formed on the substrate 41 to form one convex portion 22c at the winding end 22b. However, the present invention is not limited to this. Alternatively, a plurality of convex portions 22c may be formed at the winding end 22b by forming a plurality of (about 3 to 5) concave portions 41a on the substrate 41.

  By forming such a plurality of convex portions 22c on the winding end 22b, it is possible to easily prevent the convex portions 22c from sliding on the surface of the external contact when the convex portion 22c contacts the external contact C. Therefore, it is possible to prevent contact marks and the like from being formed on the surface of the external contact by the convex portion.

The perspective view which shows the test | inspection apparatus (connection apparatus) used for the test for confirming operation | movement of an electronic component, 1 is a cross-sectional view taken along line 2-2 of FIG. A plan view showing a state in which a plurality of spiral contacts are arranged on a holding sheet; An enlarged plan view of a spiral contact, Side view of spiral contact, FIG. 3 is an enlarged cross-sectional view similar to FIG. 2, and shows a state before the spiral contactor contacts the external contactor; FIG. 3 is an enlarged cross-sectional view similar to FIG. 2, and shows a state after the spiral contact with the external contact; Process drawing which shows the manufacturing method of the spiral contactor of this invention,

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 16 Holding sheet | seat 16a Opening hole 20 Spiral contactor 21 Base 22 Conductive part 22a Winding start end 22b Winding end 22c Convex part 41 Cu substrate 41a Concave part 42 Protection sheet (protective layer)
43 Resist layer 44 Ni plating layer 45 Temporary fixing sheet B Electronic component C External contact portion

Claims (9)

(A) forming a recess in one surface of the substrate;
(B) coating the other surface of the substrate with a protective layer;
(C) providing a resist layer on one surface of the substrate;
(D) forming a spiral groove on one surface of the substrate by exposing and developing the resist layer to remove a part of the resist layer;
(E) Steps of integrally forming the spiral contact and a protrusion corresponding to the recess on the surface of the spiral contact by plating in the groove and in the recess;
(F) removing the remaining resist layer to expose one surface of the spiral contact;
(G) a step of fixing a plurality of spiral contacts by attaching a temporary fixing sheet to one surface of the spiral contacts;
(H) exposing the other surface of the spiral contact by removing the protective layer and the substrate;
(I) a step of attaching a holding sheet to the edge of the other surface side of the spiral contact;
(J) peeling the temporary fixing sheet from one surface of the spiral contact;
A process for producing a spiral contact, comprising:   The method for manufacturing a spiral contact according to claim 1, wherein a plurality of recesses are formed in the step (a).   The manufacturing method of the spiral contactor of Claim 1 or 2 which affixes a holding | maintenance sheet | seat on the edge part of the one surface side of the said spiral contactor at the process of said (g), and performs only the process of (h) after that. .   The method for manufacturing a spiral contact according to any one of claims 1 to 3, wherein the recess is a depressed hole or a through hole.   The method for producing a plating layer according to any one of claims 1 to 4, wherein a range of a depth dimension of the recess is in a range of 10 µm to 50 µm.   The spiral contactor manufacturing method according to any one of claims 1 to 5, wherein a diameter of the concave portion is in a range of 10 µm to 50 µm.   The method for manufacturing a spiral contact according to claim 4 or 5, wherein the recessed hole or the through hole is in a long groove shape, a hemispherical shape, an egg shape or an oval shape.   The method for manufacturing a spiral contact according to any one of claims 1 to 7, wherein a Cu substrate is used as the substrate.   The method for manufacturing a spiral contact according to claim 1, wherein Ni plating is used for the plating.

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