JP2010019672A - Substrate body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate body with through conductive members suitable for pitch narrowing. <P>SOLUTION: This substrate body B is made by sticking an anisotropically conductive sheet 20 on a substrate 11. A part of the substrate for disposing the conductive sheet 20 thereon is determined by positioning pins. On the conductive sheet 20, the through conductive members 22 are dispersedly disposed in each of disposition zones for respective substrate-side conductors 15. A plurality of through conductive members 22 constitute a through conductive member group 22g in each of the disposition zones for the respective substrate-side conductors 15. Continuity is given to a substrate-side conductor 15 and a counter conductor 33 with a conductive member 22 put between them. When pitch narrowing is performed, erroneous connection or short circuiting can be prevented from occurring even if the position or size of the counter conductor 33 varies. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate body on which an anisotropic conductive sheet used for inspection of electronic components and connection of wiring boards and the like is arranged.

  Conventionally, inspection of various electronic components has been performed using probe pins. The inspection includes a burn-in test of a semiconductor device and an electrical connection test of connectors of various wiring boards. Examples of the wiring board include FPC (flexible printed wiring board) and PCB (printed circuit board).

  However, with the progress of high-density mounting of electronic components, the number of electrodes to which the probe pins are pressed increases and the pitch is reduced. Therefore, the cost of the spring-type probe pin for pressing against the electrode is extremely high.

  Therefore, recently, an increasing number of cases use anisotropic conductive sheets instead of spring-type probe pins. The anisotropic conductive sheet exhibits conductivity only in the thickness direction. The anisotropic conductive sheet is provided so as to conduct between the mating conductor and the board-side conductor when the positions on the plane match. Since it is not necessary to align the position of the conductive member in the anisotropic conductive sheet with the positions of the mating conductor and the board-side conductor, it is advantageous for reducing the pitch.

In the technique of Patent Document 1, a frame plate made of an elastic polymer sheet is used in which a large number of holes serving as penetrating conductive members are formed. Each hole is provided with a conductive portion embedded with a wire or conductive paste.
In the technique of Patent Document 2, a frame plate made of an elastic polymer such as high-strength resin is used. The holes in the frame plate are filled with a through conductive member filled with conductive magnetic particles.
In the technique of Patent Document 3, a technique is disclosed in which porous PTFE is used as a frame plate and a through conductive member is formed on the inner wall portion of each hole by electroless plating.

Patent Document 4 discloses an inspection apparatus in which the anisotropic conductive sheet of Patent Document 3 is bonded to a substrate. In this inspection apparatus, an electronic component is pressed against an anisotropic conductive sheet for inspection. A lead wire extends from the substrate toward the inspection circuit.
JP 9-35789 A Japanese Patent Laid-Open No. 9-320667 JP 2004-265844 A JP 2007-292537 A

  By mounting a substrate using an anisotropic conductive sheet on the inspection apparatus as in the techniques of Patent Documents 1 to 4, it is not necessary to use probe pins with a narrow pitch. Therefore, there is an advantage that the inspection apparatus can be configured at low cost. However, in the techniques of Patent Documents 1 to 4, there is a possibility of causing the following problems.

  FIG. 7 is a plan view of the state in which the anisotropic conductive sheet 120 is sandwiched between the mating conductor 133 and the board-side conductor 115 as viewed from above. In the anisotropic conductive sheet 120, penetrating conductive members 122 are uniformly arranged on a frame plate 121 made of a porous resin. The position of the penetrating conductive member 122 does not have to coincide with the position of the counterpart conductor 133 or the board-side conductor 115. Further, it is not necessary for all the through conductive members 122 to be in contact with the mating conductor 133 or the board-side conductor 115. If the positions of the counterpart conductor 133 and the board-side conductor 115 on the plane coincide with each other, they are conducted through any of the through conductive members 122 in the anisotropic conductive sheet 120. In general, the pitch of the through conductive members 122 of the anisotropic conductive sheet 120 is sufficiently smaller than the pitch of the counterpart conductor 133 such as an electrode of an electronic component.

  However, in the above conventional technique, when the pitch of the counterpart conductor 133 is further increased, the following problems occur. FIG. 8 is a plan view when the pitch between the electrodes in FIG. 7 is further reduced.

As shown in FIG. 8, when there are three substrate-side conductors 115a, 115b, and 115c and the counterpart conductors 133a, 133b, and 133c, it is assumed that the position and size of the conductors are shifted. In the example shown in FIG. 8, the counterpart conductor 133a is in contact with the penetrating conductive member 102a shown in FIG. However, the through conductive member 102a is in contact with the board-side conductor 115b adjacent to the board-side conductor 115a. Accordingly, the adjacent substrate-side conductors 115a and 115b become conductive. That is, there is a possibility of causing an erroneous connection or a short circuit. On the other hand, if the penetrating conductive member 102 is minimized, there is a risk of causing a conduction failure between the substrate-side conductor 115 and the counterpart-side conductor 133.
The same problem occurs when an anisotropic conductive sheet is used for connection between wiring boards such as FPC.

  An object of the present invention is to provide a substrate body that can cope with a narrow pitch.

The substrate body of the present invention is arranged in an inspection device for inspecting electronic components and a connector for electrical connection between wiring boards. The substrate body includes a substrate on which a substrate-side conductor is formed, an anisotropic conductive sheet, and an anisotropic conductive sheet positioning mechanism. And in the anisotropic conductive sheet, penetrating conductive members are arranged in a dispersed manner for each region where the board-side conductor is arranged.
As the anisotropic conductive sheet, for example, those described in Patent Documents 1 to 4 can be arbitrarily selected and used.

  Thereby, a board | substrate body can be set to a test | inspection apparatus or a connector, and an electronic component test | inspection, a wiring board connection, etc. can be performed. The through-conductive members are not arranged uniformly as in the prior art, but are distributed in the arrangement area of the board-side conductors. Further, the planar position of the substrate-side conductor and the through conductive member can be aligned by the positioning mechanism. Therefore, even when the board-side conductor or the counterpart-side conductor has a narrow pitch, the possibility of erroneous connection or short circuit can be suppressed.

  In that case, it is preferable that at least a part of each penetrating conductive member is in contact with the substrate-side conductor. Thereby, the conduction | electrical_connection defect of a board | substrate side conductor and the other party conductor can be suppressed.

  It is preferable that a plurality of penetrating conductive members are provided for each substrate-side conductor arrangement region to form a penetrating conductive member group. Thereby, even when the positions of the counterpart conductor and the substrate conductor are shifted, both can be more reliably conducted.

  The anisotropic conductive sheet preferably includes a base material made of a porous resin and an electroless plating layer formed on the surface of the porous resin of the base material. Thereby, the board | substrate body which has the penetration conductive member suitable for pinching pitch is obtained.

  According to the substrate body of the present invention, it is possible to provide a substrate body that can cope with a narrow pitch.

(Embodiment 1)
FIG. 1 is a sectional view of an inspection apparatus A according to Embodiment 1 of the present invention. FIG. 2 is a rear view of the substrate body B. FIG. In FIG. 2, the fitting member 16 is not shown. FIG. 3 is a longitudinal sectional view of the substrate body B. As shown in FIG. However, FIG. 1 and FIG. 2 show partial cross-sections of the main parts, and not all members shown in the drawings are present on a common cut surface.

As shown in FIG. 1, the inspection apparatus A includes a lower jig 41, an upper jig 43, and a movable jig 42 that can move up and down between both jigs. The lower jig 41 and the upper jig 43 are fixed to each other by a column 44. The movable jig 42 is pulled to the upper jig 43 side by a spring member 47. The movable jig 42 is pressed downward by the handle 45.
The movable jig 42 is provided with spring-type probe pins (external terminals) 40 corresponding to the external electrodes 13 of the substrate body B. A wiring 40a for sending an inspection signal to the outside extends from the proximal end side of the spring-type probe pin 40.

  As shown in FIGS. 2 and 3, the substrate body B includes a substrate 11, an anisotropic conductive sheet 20, and a fitting member 16. On the main surface of the substrate 11 (the upper surface in FIG. 3), substrate-side conductors 15 having a narrow pitch are disposed. And the some anisotropic conductive sheet 20 is affixed for every area | region made into the pinch pitch. The substrate 11 is provided with two positioning pins 18 for each anisotropic conductive sheet 20. The positioning pin 18 is fitted in the pin hole of the anisotropic conductive sheet 20. Thereby, the arrangement | positioning site | part on the board | substrate 11 of the anisotropically conductive sheet 20 is defined. However, the positioning mechanism is not limited to a combination of positioning pins and pin holes. For example, other positioning mechanisms such as providing a step or the like on the substrate 11 and engaging the anisotropic conductive sheet 22 with the stepped portion can be employed.

In the present embodiment, the anisotropic conductive sheet 20 described in Patent Document 3 or Patent Document 4 is used. That is, as shown in the perspective view of FIG. 4, a through conductive member 22 is provided on a frame plate 21 made of a porous PTFE membrane. The porous PTFE membrane is made of PTFE having a large number of micropores with a porosity of about 20 to 80%. A through hole 23 is formed in the frame plate 21. And the through-conductive member 22 is formed by performing electroless plating on the inner wall portion including the inner wall surface of the through-hole 23 and the inside of the fine hole. The anisotropic conductive sheet 20 can be manufactured, for example, by the method described in JP-A-2004-265844 (Patent Document 3).
However, the anisotropic conductive sheet 20 may be of the type described in Patent Document 1 or Patent Document 2.

  A back electrode 12 is formed on the back surface of the substrate 11. The substrate-side conductor 15 and the back electrode 12 are electrically connected to each other through the through-hole conductive portion 17. On the back surface of the substrate 11, the back electrode 12 and the external electrode 13 are electrically connected to each other through the wiring 14. The through-hole conductive portion 17, the back electrode 12, and the wiring 14 constitute a connection member that electrically connects the substrate-side conductor 15 and the external electrode 13.

The substrate 11 is provided with spring-type probe pins 25 connected to electrodes such as a power supply line and a ground line. Since the electrodes such as the power supply line are disposed outside the region having the narrow pitch, it is not necessary to use the anisotropic conductive sheet 20. Thereby, useless anisotropic conductive sheet 20 can be eliminated and manufacturing cost can be reduced. The spring-type probe pin 25 is electrically connected to the external electrode 13 through the through-hole conductive portion and the wiring 14.
The substrate 11 is provided with a pair of positioning pins 26 for positioning the substrate-side conductor 15 and the counterpart-side conductor 33. This is because the electronic component is set in the concave portion of the lower jig 41 but is not set in a fitted state but only in a state where there is play.

  A fitting member 16 for fitting the substrate body B to the movable jig 42 is provided on the back side of the substrate 11. The fitting member 16 is made of a resin such as bakelite or acrylic resin. The proximal end sides of the spring-type probe pin 25 and the positioning pin 26 are embedded in the fitting member 16. As shown in FIG. 1, the substrate body B is attached to the movable jig 42 by fitting the fitting member 16 into the concave portion of the movable jig 42. At this time, the tip of the spring-type probe pin 40 is pressed against the external electrode 13. As a result, a signal is extracted from the external electrode 13 to the outside.

FIG. 5 is an enlarged plan view showing a state in which the anisotropic conductive sheet 20 is sandwiched between the counterpart conductor 33 and the substrate side conductor 22.
As shown in the figure, penetrating conductive members 22 are distributed and arranged for each arrangement region of the board-side conductors 15. In this embodiment, a plurality of penetrating conductive members 22 constitute a penetrating conductive member group 22g for each arrangement region of the board-side conductors 15. However, a single penetrating conductive member 22 may be arranged for each arrangement region of the board-side conductors 15. Further, it may be partially protruded from the board-side conductor 15 like one through conductive member 22a in FIG. The penetrating conductive member 22 only needs to be in contact with the substrate-side conductor 15 at least partially.

As shown in FIG. 5, the distance X1 between the through conductive members 22 in the common through conductive member group 22g is smaller than the distance X2 between the through conductive members 22 in the adjacent through conductive member groups 22g. Further, the distance X1 between the penetrating conductive members 22 in the common penetrating conductive member group 22g is smaller than the distance (pitch) p1 between the substrate-side conductors 15.
The penetrating conductive member 22 is preferably in contact with the substrate-side conductor 15 at least partially. In particular, it is more preferable that the penetrating conductive member 22 is in contact with the board-side conductor 15 at a portion of half or more of the cross-sectional area.

  In the present embodiment, the penetrating conductive members 22 have a staggered arrangement pattern, but a grid pattern or other patterns may be used.

  The anisotropic conductive sheet 20 can reduce the diameter of the through hole 23 to 10 μm (0.01 mm) or less. Further, the pitch of the through conductive members 22 can be sufficiently reduced to 25 μm (0.025 mm) or less. Therefore, even if the width of the board-side conductor 15 is 0.1 mm or less and the pitch p1 of the board-side conductor 15 is 0.05 mm or less, it is possible to cope with a sufficient margin.

Next, an electronic component inspection procedure will be described.
Before the state shown in FIG. 1, that is, before the electronic component is attached, the movable jig 42 is pulled upward by the spring member 47. In this state, the electronic component (in this embodiment, the connector 32 of the FPC 31) is set on the lower jig 41. The connector 32 is provided with a counterpart conductor 33 having a narrow pitch. Further, a special electrode 33a for a power supply line or a ground line is provided in a region other than the sandwiching pitch.

  The substrate body B and the upper jig 42 are positioned with relatively high accuracy by the fitting member 16, but the electronic components vary greatly in shape. For this purpose, the positioning pin 26 is mounted, but the variation in the position and the like of the mating conductor 33 is larger than that of the board conductor 15. On the other hand, the pitch of the mating conductor 33 accompanying the miniaturization of electronic components is progressing.

Next, the movable jig 42 is moved downward by the handle 45. Then, the positioning pins 26 align the positions of the mating conductor 33 of the connector 32 and the board-side conductor 15 of the board body B on the plane. That is, the positioning pins 18 and 26 align the positions of the board-side conductor 15, the mating conductor 33, and the through-conductive member group 22g (see FIG. 5).
Then, the counterpart conductor 33 is pressed against the anisotropic conductive sheet 20. Thereby, the board | substrate side conductor 15 and the other party conductor 33 electrically conduct on both sides of the penetration conductive member 22. The spring type probe pin 25 is pressed against the special electrode 33a.

  Although not shown, the wiring 40a and the other end of the FPC 31 are connected to an inspection circuit. And the quality of the connector 32 etc. can be determined by test | inspecting the electrical connection state of the wiring 40a of the spring type probe pin 40, and FPC31.

As described above, the electronic component has a large variation in shape, and the variation in the position and the like of the counterpart conductor 33 is larger than that of the board-side conductor 15. On the other hand, the pitch of the mating conductor 33 accompanying the miniaturization of electronic components is progressing.
On the other hand, in the present embodiment, the penetrating conductive member 22 is arranged in a distributed manner for each arrangement region of the board-side conductor 15 and the positioning pin 18 is provided. Thereby, the position alignment of the board | substrate side conductor 15 and the penetration conductive member 22 is securable.
And as shown in FIG. 5, even if the other party conductor 33 slip | deviates, the situation which contacts the penetration conductive member 22 of an adjacent area | region can be avoided. Therefore, even if the pitch of the board-side conductor 15 and the counterpart-side conductor 33 is reduced to 0.05 mm or less, the occurrence of erroneous connection or short circuit can be suppressed.

  It is preferable that a plurality of penetrating conductive members 22 (penetrating conductive member group 22g) are provided for each arrangement region of the substrate-side conductor 15. In this way, even when the positions of the counterpart conductor 33 and the board-side conductor 15 are deviated, they can be more reliably conducted.

  The anisotropic conductive sheet 20 preferably includes a base material made of a porous resin and an electroless plating layer formed on the surface of the porous resin of the base material. Thereby, the board | substrate body B which has the through-conductive member 22 suitable for pinching pitch is obtained.

  In the present embodiment, when the substrate body B is periodically replaced, it is only necessary to remove the entire substrate body B from the inspection apparatus A, and it is not necessary to peel off the anisotropic conductive sheet 20. Therefore, the time and labor for replacing the inspection board are reduced. However, the structure of the substrate body B of the present invention is not limited to this example. For example, as disclosed in Patent Document 4, a large anisotropic conductive sheet 20 may be attached to the entire substrate 11.

  In the first embodiment, the example in which the connector 32 of the FPC 31 is inspected as the electronic component that is the inspection object has been described. However, the inspection apparatus A and the substrate body B of the present invention can also be used for a burn-in test of a semiconductor device, an electrical connection test of a connector of another type of wiring board such as a PCB, and the like. Furthermore, it can be used not only as an inspection apparatus but also as a connection part such as a connector as in the second embodiment.

(Embodiment 2)
6A and 6B are cross-sectional views showing structures before and after connection of the connection structure C according to Embodiment 2 of the present invention. In the connection structure C, a rigid printed wiring board (PCB) has a rigid substrate 50 and a counterpart conductor 51 that is a wiring thereon. The FPC (substrate body) includes a flexible substrate 60 and a substrate-side conductor 61 that is a wiring thereon. An anisotropic conductive sheet 20 having a through conductive member 22 is attached to the flexible substrate 60.

  Positioning pins 18 are provided on the flexible substrate 60. The positioning pin 18 is fitted in the pin hole of the anisotropic conductive sheet 20. Thereby, the arrangement | positioning site | part on the board | substrate 11 of the anisotropically conductive sheet 20 is defined. As in the first embodiment, the positioning mechanism is not limited to a combination of positioning pins and pin holes. For example, other positioning mechanisms such as providing a step or the like on the flexible substrate 60 and engaging the anisotropic conductive sheet 22 with the stepped portion can be employed.

  Although not shown, also in the present embodiment, the penetrating conductive member 22 has an arrangement pattern as shown in FIG. That is, the penetrating conductive members 22 are arranged in a distributed manner for each arrangement region of the FPC board-side conductor 61 on the plane. In the present embodiment, the FPC and the anisotropic conductive sheet 20 constitute the substrate body of the present invention.

  A support portion 52 and a lock portion 55 around an axis 56 of the support portion 52 are connected to the rigid substrate 50 by an adhesive or the like. At the time of connection, as shown in FIG. 6A, the FPC and the anisotropic conductive sheet 20 are inserted into the support portion 52.

  Next, as shown in FIG. 6B, the lock portion 55 is rotated around the shaft 56 to press the FPC 83 against the RCB. As a result, the penetrating conductive member 22 of the anisotropic conductive sheet 20 comes into contact with the mating conductor 61 on the rigid substrate 60, and both are conducted. The distal end portion of the lock portion 55 is locked to both arm portions (not shown) extending to the side of the support portion 52 at the lowest position. Further, the locking of the lock portion 55 is provided so as to be releasable by well-known and conventional means. This structure utilizes a known ZIF (Zero Insertion Force) connector mechanism. By using the anisotropic conductive sheet 20, a connection structure C that can be easily reconnected is obtained.

  In the present embodiment, the anisotropic conductive sheet 20 is attached to the FPC to constitute the substrate body of the present invention. As a result, a substrate body suitable for pinching a wiring board or connector can be obtained. In the present embodiment also, a preferable form similar to that in Embodiment 1 can be adopted.

  The structures of the above embodiments are merely examples, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention includes the description of the scope of claims, meaning equivalent to the description, and all modifications within the scope.

  The present invention can be used for testing and inspection of electronic components such as semiconductor integrated circuits and various devices, or connection of various wiring boards and electronic components.

It is sectional drawing of the inspection apparatus which concerns on Embodiment 1 of this invention. It is a reverse view of the board | substrate body which concerns on Embodiment 1 of this invention. It is a longitudinal cross-sectional view of the board | substrate body which concerns on Embodiment 1 of this invention. It is a perspective view of the substrate body concerning Embodiment 1 of the present invention. 3 is an enlarged plan view showing a state in which an anisotropic conductive sheet is sandwiched between a mating conductor and a substrate-side conductor in Embodiment 1. FIG. (A), (b) is sectional drawing which shows the structure before the connection of the connection structure C which concerns on Embodiment 2 of this invention, and after a connection. It is the top view which looked at the state which pinched | interposed the anisotropic conductive sheet between the conventional other party conductor and the board | substrate side conductor from the upper direction. FIG. 8 is a plan view when the pitch between the electrodes in FIG. 7 is further reduced.

Explanation of symbols

A Inspection apparatus B Substrate body C Connection structure 11 Substrate 12 Back electrode 13 External electrode 14 Wiring 15 Substrate side conductor 16 Fitting member 17 Through-hole conducting portion 20 Anisotropic conductive sheet 21 Frame plate 22 Through conductive member 25 Spring type probe Pin 26 Positioning pin 31 FPC
32 connector 33 mating conductor 40 spring type probe pin 40a wiring 41 lower jig 42 movable jig 43 upper jig 44 support 45 handle 47 spring member 50 rigid substrate 51 mating conductor 52 support section 55 locking section 56 shaft 60 flexible Substrate 61 Substrate side conductor

Claims (4)

A substrate on which a substrate-side conductor is formed;
An anisotropic conductive sheet attached on the substrate;
A positioning mechanism for positioning the mounting position of the anisotropic conductive sheet on the substrate;
With
A substrate body, wherein the anisotropic conductive sheet is provided with at least one penetrating conductive member that is dispersed and arranged in each region where the substrate-side conductor is disposed. The substrate body according to claim 1,
Each said through-conductive member is a board | substrate body which is contacting the said board | substrate side conductor at least in part. The substrate body according to claim 1 or 2,
A substrate body in which a plurality of the at least one penetrating conductive member are provided to form a penetrating conductive member group. In the board | substrate body as described in any one of Claims 1-3,
The anisotropic conductive sheet is
A substrate made of a porous resin having a plurality of micropores;
An electroless plating layer formed in a surface region including the inside of each micropore of the substrate;
A substrate body comprising:

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