JP4611367B2 - Socket for semiconductor integrated circuit - Google Patents

Description

  The present invention relates to a semiconductor integrated circuit socket, and more particularly to a semiconductor integrated circuit socket applicable to a BGA (Ball Grid Array) package type semiconductor integrated circuit.

  As semiconductor integrated circuits (hereinafter referred to as ICs) have become more functional and faster, the importance of operation tests of ICs prior to mounting on products is increasing in order to ensure product reliability.

  In an IC operation test, it is necessary to electrically connect a test device (IC tester) and an IC through a socket, and therefore an IC socket that has considered durability as well as electrical characteristics has already been proposed. (For example, see Patent Document 1 and Patent Document 2).

  The IC socket disclosed in Patent Document 1 has a structure in which an IC terminal is directly brought into contact with a corresponding connection pin of the socket by inserting the IC into a frame-shaped holder.

  Further, the IC socket disclosed in the cited document 2 is inserted through a stopper having a thickness slightly smaller than the height of the terminal in order to prevent damage to the IC terminal by inserting the IC into a frame-shaped holder. The terminal and the corresponding connection pin of the socket are in contact with each other.

That is, the connection pins of the IC socket are arranged with reference to the inner surface of the holder, and the position of the IC terminal is determined by inserting the IC into the holder.
JP 2002-008810 A JP 2003-272788 A

  However, actually, the terminals of the IC are not arranged with reference to the outer edge of the IC.

FIG. 5 is a perspective view of a BGA package type IC, and hemispherical solder balls 101 are arranged in an array on the bottom surface of the IC 10. Then, the pitch PY pitch PX and the Y-axis direction of the X-axis direction between the solder balls 101 but specified in the standard, length LX and LY from the outer edge of the IC of the solder balls 101 are not defined by the standard.

  For this reason, the IC socket according to the above-described proposal has a problem that reliable contact between the IC terminal and the connection pin is not guaranteed.

  Further, in the IC socket according to the above proposal, since the signal transmission characteristic of the signal transmission path inside the IC socket is not particularly considered, when testing an IC that operates at high speed, the signal loss inside the IC socket There was also a problem that could occur.

  The present invention has been made in order to solve the conventional problems, and it is possible not only to reliably contact the contactor of the IC terminal and the socket, but also to reduce the signal loss in the socket. An object is to provide a socket for an integrated circuit.

  The socket for a semiconductor integrated circuit according to the present invention includes a plurality of connection pins that are in electrical contact with a plurality of terminals of the semiconductor integrated circuit, and a plurality of through holes through which the connection pins pass, the inner surface of which is covered with an insulating layer. A metal main body having holes formed therein, and a plurality of through holes that are disposed above the main body via elastic members and through which the connection pins pass, and the through holes and the upper surface are covered with an insulating layer. A printed circuit board having a land that is disposed on the bottom surface of the main body and is in electrical contact with the connection pins that are in contact with terminals other than the ground terminal of the semiconductor integrated circuit, and is disposed between the main body and the printed circuit board. The inner surface of the semiconductor integrated circuit that is in contact with the ground terminal and the inner surface through which the connection pin that is in contact with the printed circuit board is covered with the conductive plate that is in electrical contact with the bottom surface of the main body. Through hole is covered with an insulating layer has a structure including a ground substrate drilled.

  With this configuration, the IC terminal is not only accurately positioned at the connection pin position, but each connection pin is shielded with metal through the insulating layer.

  The socket for a semiconductor integrated circuit according to the present invention has a configuration of a funnel shape in which a through hole drilled in the holding plate expands upward.

  With this configuration, the IC terminal and the connection pin are accurately positioned.

  The socket for a semiconductor integrated circuit according to the present invention has a configuration in which the main body has a laminated structure in which a plurality of plate-like bodies are laminated.

  This configuration not only facilitates the formation of the insulating layer on the inner surface of the through hole, but also facilitates assembly of the socket itself.

  The socket for a semiconductor integrated circuit of the present invention has a configuration in which the upper surface of the holding plate, the inner surface of the through hole, and the insulating layer on the inner surface of the through hole of the main body are an anodized film and a fluorine impregnated film.

  With this configuration, even if the holding plate and the main body are made of metal, an insulating layer is reliably formed on the upper surface of the holding plate, the inner surface of the through hole, and the inner surface of the through hole of the main body.

  The semiconductor integrated circuit socket according to the present invention has a configuration in which a land of the printed circuit board is a hollow rivet inserted into a through hole.

  With this configuration, it is possible not only to make sure that the connection pin and the land come into contact with each other but also prevent the land from being worn.

  The socket for a semiconductor integrated circuit according to the present invention supplies a negative pressure to a terminal surface of the semiconductor integrated circuit through a rivet hollow portion of the printed circuit board and a through hole of the ground substrate, the main body, and the holding plate. It has the structure provided with the adsorption | suction means which adsorb | sucks an integrated circuit to the said holding plate.

  With this configuration, the terminals of the IC and the connection pins are more reliably brought into contact.

  In the present invention, not only can the IC terminals and the connection pins be brought into contact with each other by providing a holding plate above the main body, but also the signal can be transmitted by making the main body and the holding plate made of metal and the socket itself a coaxial cable structure. An IC socket having an effect of reducing loss can be provided.

  Embodiments of an IC socket according to the present invention will be described below with reference to the drawings.

  As shown in the perspective view of FIG. 1, the IC socket 1 according to the present invention includes a plurality of connection pins 11 that are in electrical contact with terminals of a semiconductor integrated circuit, and a plurality of through holes through which the connection pins 11 pass. A metal main body 12 in which a through-hole whose inner surface is covered with an insulating layer is perforated, and a metal in which a plurality of through-holes that are arranged above the main body 12 via an elastic member and through which the connection pin 11 passes are perforated. A holding board 13, a printed circuit board 14 having a land which is disposed opposite to the bottom surface of the main body 12 and is in electrical contact with a connection pin 11 which contacts a terminal other than the ground terminal of the semiconductor integrated circuit, and between the main body 12 and the printed circuit board 14 A through-hole through which the connection pin 11 that is disposed in contact with the ground terminal of the semiconductor integrated circuit and the conductive plate that is in electrical contact with the bottom surface of the metal body 12 and through which the connection pin 11 that contacts the printed circuit board 14 passes is formed. And a ground substrate 15, which is.

  FIG. 2 is a ZZ cross-sectional view of the IC socket 1 according to the present invention, and has a configuration in which a holding plate 13, a main body 12, a ground substrate 15 and a printed circuit board 14 are laminated in order.

  The main body 12 is preferably made of aluminum having an insulating layer formed on the inner surface of the through hole.

  The holding plate 13 is disposed on the upper surface of the main body 12 via the elastic member 16 and is preferably made of aluminum having an insulating layer formed on the upper surface and the inner surface of the through hole. Further, it is desirable that the diameter of the through hole of the holding plate 13 is increased upward at a large angle of 45 degrees or more. The elastic member 16 may be an elastic material having conductivity, and a spring, conductive rubber, or the like can be used.

  The insulating layers of the main body 12 and the holding plate 13 are preferably formed by anodizing treatment and fluorine impregnation treatment.

  A connection pin 11 (four connection pins 111, 112, 113 and 114 are shown) is stored in the through hole of the main body 12. The connection pin 111 is shown as a cross-sectional view.

  That is, the connection pin 11 includes a hollow cylindrical middle portion 11a, upper and lower pins 11b and 11c inserted at both ends of the middle portion, and a spring that is housed in the middle portion 11a and biases the upper and lower pins 11b and 11c. 11d.

  The lower end portion of the upper pin 11 b is inserted into the upper end of the intermediate portion 11 a, and the upper end portion of the upper pin 11 b is disposed so as to penetrate through the through hole of the holding plate 13.

The upper end portion of the lower pin 11c is inserted into the lower end of the intermediate portion 11a, and the lower end portion of the lower pin 11c contacts the conductor plate 151 of the ground substrate 15 or passes through the through hole of the ground substrate 15 and the printed circuit board 14. In contact with the land 141.

  The main body 12 has a multi-layered structure so that the connection pins 11 can be stored and the insulating film can be easily formed. In this embodiment, the main body 12 has a three-layer structure of an upper layer 121, an intermediate layer 122, and a lower layer 123 in which a recess for inserting an IC is formed.

  FIG. 3 is a cross-sectional view of the anodizing apparatus 2 for anodizing the inner surface of the through hole of the holding plate 13. The holding plate 13 is immersed in the electrolytic solution 21 in the electrolytic cell 20. The wire electrode 22 is disposed in the through hole of the holding plate 13, the upper end portion of the wire electrode 22 is held by the conductor 23 and the lower end portion is held by the insulator 24, and the wire electrode 22 does not contact the inner surface of the through hole of the holding plate 13. Apply tension.

  In this state, if the holding plate 13 is connected to the positive electrode of the DC power source 25 and the conductor 23 is connected to the negative electrode of the DC power source 25, the inner surface of the through hole of the holding plate 13 can be uniformly anodized.

  The through hole of the main body 12 can also be anodized by the same method. However, as in this embodiment, the main body has a three-layer structure of an upper layer 121, an intermediate layer 122, and a lower layer 123, thereby increasing the scale of the apparatus. This makes it easy to uniformly anodize the inner surface of the through-hole without any problems.

  The land of the printed circuit board 14 with which the connection pin 11 comes into contact is preferably formed of a hollow rivet inserted into a through hole that penetrates the printed circuit board 14 from the viewpoint of reducing contact resistance and preventing wear of the land due to contact pressure.

  The printed circuit board 14 is a multilayer printed circuit board, and the hollow rivet is connected to a conductor pattern formed inside the printed circuit board 14.

  The operation of the IC socket according to the present invention will be described below with reference to a cross-sectional view when the IC 10 is mounted on the socket 1 according to the present invention shown in FIG.

  First, the IC 10 is mounted on the holding plate 13 with the terminal side facing the holding plate 13, and the IC 10 is pressed down by an appropriate method.

  Then, since the diameter of the through hole of the holding plate 13 is increased upward, the solder terminal of the IC 10 is introduced into the through hole along the slope. As a result, the solder terminal 101 and the connection pin 11 can be accurately opposed to each other.

  By pressing the IC 10, the elastic member 16 is compressed, the IC 10 and the holding plate 13 are lowered, and the terminals of the IC 10 and the upper ends of the upper pins 11 b of the connection pins 11 come into contact with each other.

  The lower pin 11c is biased downward by a spring 11d and comes into contact with a conductor plate of the ground substrate 15 or a land of the printed circuit board 14.

Further, negative pressure is supplied from the bottom surface of the printed circuit board 14 through the hollow rivets of the printed circuit board 14 , the ground substrate 15, the main body 12, and the holding plate 13 , and the bottom surface of the IC 10 is attracted to the socket 1. The contact between the IC 10 and the connection pin 11 and between the connection pin 11 and the ground substrate 15 or the printed circuit board 14 can be further ensured.

In addition, since the holding plate 13 and the main body 12 are made of metal and an insulating film is formed on the surface facing the IC 10 and the connecting pin 11, the socket according to the present invention has the connecting pin 11 that is a conductor through the insulating film. Even when applied to an IC that operates at an extremely high speed, it is possible to reduce the loss of the signal propagating through the connection pin 11 .

Further, since the bottom surface of the main body 12 is in direct contact with the conductive plate of the ground substrate 15, the ground potential difference inside the IC socket is minimized by connecting the conductive plate to the ground line of the printed circuit board 14 at one or more points. It is also possible to make it.

  As described above, the semiconductor integrated circuit socket according to the present invention has an effect that not only can the terminal of the IC and the printed circuit board be securely connected, but also the signal loss inside the socket can be reduced. It is effective for the test equipment.

1 is an exploded perspective view of a semiconductor integrated circuit socket according to an embodiment of the present invention. Sectional drawing of the semiconductor integrated circuit socket of embodiment of this invention (When semiconductor integrated circuit is not mounted) Cross section of anodizing equipment Sectional drawing of the semiconductor integrated circuit socket of embodiment of this invention (at the time of semiconductor integrated circuit mounting) BGA package perspective view

Explanation of symbols

1 ... IC socket 11, 111, 112, 113, 114 ... connection pin 12 ... main body 121 ... upper layer 122 ... middle layer 123 ... lower layer 13 ... holding plate 14 ... Printed circuit board 15 ... Earth circuit board 16 ... Elastic member

Claims (6)

A plurality of connection pins in electrical contact with a plurality of terminals of the semiconductor integrated circuit;
A plurality of through-holes through which the connection pin passes, and a metal main body in which a through-hole whose inner surface is covered with an insulating layer is perforated,
A metal holding plate disposed above the main body via an elastic member, in which a plurality of through-holes through which the connection pin passes are perforated, and the through-holes and the upper surface are covered with an insulating layer;
A printed circuit board having a land disposed on the bottom surface of the main body and in contact with the connection pin that contacts a terminal other than the ground terminal of the semiconductor integrated circuit;
The connection pin disposed between the main body and the printed circuit board, covered with the connection pin contacting the ground terminal of the semiconductor integrated circuit and the conductive plate electrically contacting the bottom surface of the main body, and contacting the printed circuit board A semiconductor integrated circuit socket, comprising: a grounding substrate having a through-hole in which an inner surface through which a pin passes is covered with an insulating layer; The socket for a semiconductor integrated circuit according to claim 1, wherein the through hole drilled in the holding plate has a funnel shape whose diameter increases upward. The socket for a semiconductor integrated circuit according to claim 1, wherein the main body has a laminated structure in which a plurality of plate-like bodies are laminated. 4. The semiconductor integrated circuit according to claim 1, wherein the insulating layer on the upper surface of the holding plate and the inner surface of the through hole and the inner surface of the through hole of the main body is an anodized film and a fluorine-impregnated film. Socket. 5. The semiconductor integrated circuit socket according to claim 1, wherein the land of the printed board is a hollow rivet inserted into a through hole. Adsorption for supplying negative pressure to the terminal surface of the semiconductor integrated circuit through the through-holes of the rivet hollow portion of the printed circuit board, the ground substrate, the main body and the holding plate, and adsorbing the semiconductor integrated circuit to the holding plate the semiconductor integrated circuit socket of claim 5, Ru with means.

Images