JP2007109414A - Socket for integrated circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an integrated circuit capable of reducing occurrence of contact failures with a plurality of electrodes formed on a surface of the integrated circuit as compared with a conventional one. <P>SOLUTION: A socket 10 for LSI measurement is provided with: a plurality of contact probes 20 each used for contacting each of a plurality of solder balls 81 while energizing each of the plurality of solder balls 81 formed on a surface 80a of an LSI 80; a probe holding plate 30 for holding the plurality of contact probes 20; a base 40 for supporting the probe holding plate 30 with movement of the probe holding plate 30 in a direction shown by an arrow 10b being a direction opposite to the energization direction shown by an arrow 10a of the solder balls 81 by the contact probes 20 restricted; and an upper lid 70 for applying pressure to the LSI 80 in a direction shown by the arrow 10b. The probe holding plate 30 is formed of a metal with a nonconductive surface treatment applied thereto. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a socket for an integrated circuit such as an LSI (Large Scale Integration).

  As a conventional integrated circuit socket, a plurality of contacts for contacting the solder ball terminal of a BGA (Ball Grid Array) package type IC (Integrated Circuit) device at the upper end, and a plurality of contacts at the middle of the plurality of contacts There is known an IC socket including a housing for fixing a contact and a multilayer printed wiring board having a land that contacts lower ends of a plurality of contacts, and the housing is formed of a resin (for example, see Patent Document 1). .)

The pressure applied to the housing of the IC socket when the solder ball terminal of the BGA package type IC device contacts the contact of the IC socket is, for example, an area of the housing of 13 cm ² , and the contact on the housing is a lattice point. If a total of 1296 wires, 36 in length and 36 in width, are placed in contact with one solder ball terminal of a BGA package type IC device and one contact of an IC socket with a contact force of 20 g, about 2 kg. / Cm ² .
Japanese Patent Laid-Open No. 9-55273 (page 3, FIG. 1)

However, in the conventional integrated circuit socket, since the housing is made of resin, even if a pressure of about 2 kg / cm ² is applied as described above, the housing is warped by the pressure, and the center of the housing Contact failure such that the solder ball terminal of the BGA package type IC device and the contact of the IC socket cannot be contacted in the vicinity of the contact portion, or even if contact can be made, a sufficient contact area cannot be secured and the contact resistance increases. There was a problem that occurred.

  The present invention has been made to solve the conventional problems, and provides an integrated circuit socket capable of reducing the occurrence of poor contact with a plurality of electrodes formed on the surface of an integrated circuit. For the purpose.

  The integrated circuit socket according to the present invention includes a plurality of contact terminals for contacting each of the plurality of electrodes while energizing the plurality of electrodes formed on the surface of the integrated circuit, and the plurality of contact terminals. A terminal holding member to be held; a support member that supports the terminal holding member in a state in which movement of the terminal holding member in a direction opposite to a biasing direction of the electrode by the contact terminal is restricted; A pressure member that applies pressure to the integrated circuit, and the terminal holding member has a configuration formed of a non-conductive surface-treated metal.

  With this configuration, the integrated circuit socket of the present invention has a higher mechanical strength of the terminal holding member than the configuration in which the terminal holding member is made of resin, so that the warp of the terminal holding member that holds the contact terminal is reduced. Can do. Accordingly, the integrated circuit socket of the present invention can reduce the occurrence of contact failure between the plurality of electrodes formed on the surface of the integrated circuit and the plurality of contact terminals held by the terminal holding member. .

  In addition, the terminal holding member of the integrated circuit socket of the present invention has a configuration formed of aluminum or aluminum alloy having an anodized surface.

  In addition, the terminal holding member of the integrated circuit socket of the present invention has a structure formed of aluminum or an aluminum alloy that is anodized on the surface and further impregnated with fluorine or coated with fluorine. .

  Further, the socket for an integrated circuit according to the present invention includes a plurality of contact terminals for contacting each of the plurality of electrodes while energizing the plurality of electrodes formed on the surface of the integrated circuit, and the plurality of contacts. A terminal holding member that holds a terminal; a support member that supports the terminal holding member in a state in which movement of the terminal holding member in a direction opposite to a biasing direction of the electrode by the contact terminal is restricted; An electrode positioning member having a through hole for introducing an electrode and disposed in the biasing direction with respect to the terminal holding member, and a pressure member for applying pressure to the integrated circuit in the opposite direction The electrode positioning member has a configuration formed of a non-conductive surface-treated metal.

  With this configuration, the integrated circuit socket of the present invention has a higher mechanical strength of the electrode positioning member than the configuration in which the electrode positioning member is made of resin, so that the positioning of a plurality of electrodes formed on the surface of the integrated circuit is possible. It is possible to reduce the warpage of the electrode positioning member that performs. Therefore, the integrated circuit socket according to the present invention has caused the occurrence of poor contact between the plurality of electrodes formed on the surface of the integrated circuit and positioned by the electrode positioning member and the plurality of contact terminals held by the terminal holding member. It can be further reduced.

  In addition, the electrode positioning member of the socket for an integrated circuit according to the present invention has a configuration formed of aluminum or aluminum alloy whose surface is anodized.

  In addition, the electrode positioning member of the integrated circuit socket of the present invention has a structure formed of aluminum or an aluminum alloy that is anodized on the surface and further impregnated with fluorine or coated with fluorine. .

  In addition, the contact terminal of the integrated circuit socket of the present invention has a configuration that is a spiral terminal having a free end at the center side.

  With this configuration, the integrated circuit socket according to the present invention can arrange the contact terminals at an extremely narrow pitch of 0.4 mm or the like, for example. Here, in the integrated circuit socket of the present invention, the smaller the contact terminal pitch is, the smaller the area of the terminal holding member other than the hole in which the contact terminal is arranged, so the load per unit area received by the terminal holding member is smaller. Since the area of the hole portion in which the contact terminal is arranged in the terminal holding member is large, the mechanical strength of the terminal holding member is small. That is, in the integrated circuit socket of the present invention, the terminal holding member is more likely to warp as the contact terminal pitch is narrower, and the plurality of electrodes formed on the surface of the integrated circuit and the plurality of contact terminals held by the terminal holding member. Contact failure is likely to occur. However, the integrated circuit socket according to the present invention includes a plurality of electrodes formed on the surface of the integrated circuit by forming the terminal holding member or the electrode positioning member from a non-conductive surface-treated metal, Since the occurrence of poor contact with a plurality of contact terminals held by the terminal holding member can be reduced as compared with the prior art, even if the pitch of the contact terminals is narrow, a plurality of electrodes formed on the surface of the integrated circuit, Occurrence of poor contact with the plurality of contact terminals held by the terminal holding member can be suppressed.

  The present invention can provide an integrated circuit socket that can reduce the occurrence of poor contact with a plurality of electrodes formed on the surface of an integrated circuit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the configuration of the LSI measurement socket as the integrated circuit socket according to the first embodiment will be described.

  As shown in FIG. 1, an LSI measurement socket 10 according to the present embodiment includes a printed circuit board 90 on which a BGA package type LSI 80 as an integrated circuit is mounted and has a function of measuring the electrical characteristics of the LSI 80; This is for electrically connecting the LSI 80.

  The LSI measuring socket 10 includes a plurality of solders while urging the solder balls 81 as a plurality of electrodes formed in a lattice point on the surface 80a of the LSI 80 in the directions indicated by arrows 10a substantially orthogonal to the surface 80a. A contact probe 20 as a plurality of contact terminals for contacting each of the balls 81, a probe holding plate 30 as a terminal holding member for holding the plurality of contact probes 20, and an arrow 10a of the solder ball 81 by the contact probe 20 A base 40 as a support member for supporting the probe holding plate 30 in a state in which the movement of the probe holding plate 30 in the direction indicated by the arrow 10b, which is the direction opposite to the urging direction shown, is regulated, and a plurality of solder balls 81 are introduced. Is formed in the direction indicated by the arrow 10a with respect to the probe holding plate 30. A floating guide 50 as an electrode positioning member, a plurality of springs 60 arranged between the probe holding plate 30 and the floating guide 50, and an arrow 10b that is detachably attached to the base 40 and fixed to the base 40. And an upper lid 70 as a pressing member for applying pressure to the LSI 80 in the direction indicated by.

  The contact probe 20 includes a central portion 21 fixed to the probe holding plate 30, an upper end portion 22 in which one end portion is housed in the central portion 21 and the other end portion contacts the solder ball 81 of the LSI 80, and the central portion 21. And a lower end 23 that contacts a terminal (not shown) on the printed circuit board 90. The upper end portion 22 is urged in the direction indicated by the arrow 10a by a spring (not shown) housed in the central portion 21, and the amount of protrusion to the outside of the central portion 21 can be changed.

  The probe holding plate 30 is made of a non-conductive surface-treated metal. For example, the probe holding plate 30 may be an anodized aluminum or aluminum alloy as a non-conductive surface-treated metal, or the surface may be further anodized. It may be aluminum or aluminum alloy that has been impregnated with fluorine or coated with fluorine.

  The base 40 is screwed to the printed circuit board 90 at the end 40a.

  The floating guide 50 is made of a non-conductive surface-treated metal. For example, the floating guide 50 may be aluminum or an aluminum alloy having an anodized surface as a metal subjected to a non-conductive surface treatment, or may be further anodized on the surface. It may be aluminum or aluminum alloy that has been impregnated with fluorine or coated with fluorine. The floating guide 50 has a spring 60, a positioning hole 30 a formed in the probe holding plate 30, and a positioning pin 51 inserted into a positioning hole 40 b formed in the base 40.

  Next, a method of using the LSI measurement socket 10 will be described.

  The LSI measuring socket 10 has the upper lid 70 removed as shown in FIG. 2, and the LSI 80 is placed on the floating guide 50 with the solder balls 81 of the LSI 80 introduced into the through holes 50a of the floating guide 50 as shown in FIG. Is placed.

  Next, as shown in FIG. 1, the LSI measuring socket 10 has the upper lid 70 fixed to the base 40, whereby the LSI 80 is pressed by the upper lid 70 in the direction indicated by the arrow 10b. The LSI 80 causes the floating guide 50 to move to the arrow. In addition to being pressed in the direction indicated by 10b, the upper end portion 22 of the contact probe 20 is also pressed in the direction indicated by the arrow 10b by the solder ball 81 of the LSI 80. Here, the LSI 80 is pushed back in the direction indicated by the arrow 10 a by the floating guide 50 biased by the spring 60, and the solder ball 81 of the LSI 80 is arrowed by the upper end portion 22 biased by the spring in the contact probe 20. It is pushed back in the direction indicated by 10a. Therefore, the upper end portion 22 of the contact probe 20 and the solder ball 81 of the LSI 80 are in contact with each other with a sufficient contact force.

  The printed circuit board 90 inputs and outputs electrical signals to and from the LSI 80 via the lower end portion 23, the central portion 21 and the upper end portion 22 of the contact probe 20 and the solder balls 81 of the LSI 80, and measures the electrical characteristics of the LSI 80. To do.

  In the state shown in FIG. 1, the force that the plurality of solder balls 81 of the LSI 80 pushes the upper end portion 22 of the contact probe 20 in the direction indicated by the arrow 10b is applied to the probe holding plate 30 in the central portion 21 of the contact probe 20. Has been added through.

  As described above, in the LSI measurement socket 10, when the force shown in FIG. 1 is applied to the probe holding plate 30 from the plurality of contact probes 20 in the direction indicated by the arrow 10b, the probe holding plate 30 is made of resin. Since the mechanical strength of the probe holding plate 30 is higher than that of the configuration, the warpage of the probe holding plate 30 that holds the contact probe 20 can be reduced. Therefore, the LSI measurement socket 10 can reduce the occurrence of contact failure between the plurality of solder balls 81 formed on the surface 80a of the LSI 80 and the plurality of contact probes 20 held by the probe holding plate 30 as compared with the related art. Can do.

  For example, the probe holding plate 30 is made of anodized aluminum on the surface, the contact probe 20 has a total length of 2.5 mm, the LSI 80 has 2304 solder balls 81, and two adjacent solder balls 81. Each pair is short-circuited by the internal connection of the LSI 80 to form 1152 pairs, the resistance on the printed circuit board 90 with respect to each pair of solder balls 81 is 110 mΩ, one solder ball 81 and one contact probe 20. Is applied with a contact force of 15 g, a current of 1 mA is passed through each printed board 90 to each pair of solder balls 81, and the resistance is measured at room temperature by the four-terminal method. The result of subtracting the existing resistance 110 mΩ on 90 and dividing by 2, that is, the uniqueness of the LSI 80 per one solder ball 81 The total value of the resistance and the contact resistance between the contact probe 20 (hereinafter referred to as “total resistance value”) is as shown in FIG. Further, when the probe holding plate 30 is made of resin, the total length of the contact probe 20 is 5 mm, and other conditions are the same as the conditions for obtaining the total resistance value shown in FIG. 4, the total resistance value is as shown in FIG. As shown. As shown in FIG. 4 and FIG. 5, the LSI measurement socket 10 has a probe that is compared with the case where the probe holding plate 30 is made of resin when the probe holding plate 30 is made of anodized aluminum. Even if the holding plate 30 is thin, it is possible to reduce the occurrence of contact failure between the plurality of solder balls 81 formed on the surface 80a of the LSI 80 and the plurality of contact probes 20 held by the probe holding plate 30 as compared with the conventional case. Further, under the condition that the total resistance value shown in FIG. 4 is obtained, the performance is maintained even if the LSI 80 is attached to or detached from the LSI measurement socket 10 at least 1000 times. 4 and 5, “MAX” is the maximum of the total resistance values of the 2304 solder balls 81, and “average” is each of the 2304 solder balls 81. It is an average value of the total resistance value, and “variation” is a standard deviation of the total resistance value of the 2304 solder balls 81.

  The mechanical strength can be increased by sufficiently increasing the thickness of the probe holding plate 30 made of resin. However, when the thickness of the probe holding plate 30 is increased, the thickness of the probe holding plate 30 is increased. Since the length of the contact probe 20 must be increased by increasing the length of the socket, the high-speed response performance of the LSI 80 socket is degraded. However, since the LSI measuring socket 10 does not need to increase the thickness of the probe holding plate 30, the contact failure with the plurality of solder balls 81 formed on the surface 80 a of the LSI 80 is not impaired without impairing the high-speed response performance. Generation can be reduced as compared with the conventional case.

  Further, when the LSI measuring socket 10 is in the state shown in FIG. 1, force is applied to the floating guide 50 from the LSI 80 in the direction indicated by the arrow 10b. Since the mechanical strength is high, the warp of the floating guide 50 for positioning the plurality of solder balls 81 formed on the surface 80a of the LSI 80 can be reduced. Therefore, the LSI measurement socket 10 causes a contact failure between the plurality of solder balls 81 formed on the surface 80 a of the LSI 80 and positioned by the floating guide 50 and the plurality of contact probes 20 held by the probe holding plate 30. Can be reduced as compared with the prior art.

  Although the resin-made floating guide 50 can increase the mechanical strength by increasing its thickness, the solder ball 81 formed on the surface 80a of the LSI 80 is introduced into the through hole 50a of the floating guide 50. Therefore, the thickness of the floating guide 50 is limited due to the relationship with the size of the solder ball 81 formed on the surface 80a of the LSI 80, and the thickness of the floating guide 50 is limited. There is a limit to the mechanical strength of the floating guide 50 due to the increase. However, since the LSI measuring socket 10 can sufficiently improve the mechanical strength of the floating guide 50 without increasing the thickness of the floating guide 50, a plurality of solder balls 81 formed on the surface 80 a of the LSI 80. It is possible to reduce the occurrence of contact failure with the conventional one.

  In the above, the upper end portion 22 of the contact probe 20 is urged in the direction indicated by the arrow 10a by a spring (not shown) housed in the central portion 21, and the amount of protrusion to the outside of the central portion 21 can be changed. However, the lower end portion 23 of the contact probe 20 is also urged in the direction indicated by the arrow 10b by a spring (not shown) housed in the central portion 21, and is moved out of the central portion 21. It may be configured such that the amount of protrusion can be changed. When the lower end 23 is biased in the direction indicated by the arrow 10b by a spring (not shown) housed in the central portion 21, the LSI 80 is not placed on the floating guide 50 in the state shown in FIG. Even in such a case, the LSI measuring socket 10 is in contact with the printed circuit board 90 by the lower end portion 23 and is held by the plurality of contact probes 20 biased in the direction indicated by the arrow 10a by the spring accommodated in the central portion 21. Although force is applied to the plate 30 in the direction indicated by the arrow 10a, the probe holding plate 30 has a higher mechanical strength than the configuration in which the probe holding plate 30 is made of resin. Can be reduced.

(Second Embodiment)
First, the configuration of the LSI measurement socket as the integrated circuit socket according to the second embodiment will be described. Of the configuration of the LSI measurement socket according to the present embodiment, the same configuration as that of the LSI measurement socket 10 (see FIG. 1) according to the first embodiment is described in the first embodiment. The same reference numerals as those in the configuration of the LSI measurement socket 10 according to the embodiment are attached and detailed description thereof is omitted.

  As shown in FIG. 6, the configuration of the LSI measurement socket 110 according to the present embodiment holds a spiral terminal (hereinafter referred to as “spiral terminal”) 120 as a contact terminal and a plurality of spiral terminals 120. The terminal holding plate 130 as a terminal holding member is the same as the configuration provided in the LSI measurement socket 10 in place of the contact probe 20 (see FIG. 1) and the probe holding plate 30.

  The spiral terminal 120 has a free end 120a on the center side as shown in FIG. 7, and contacts the terminal (not shown) on the printed circuit board 90 with the tip 120a as shown in FIG.

  The terminal holding plate 130 is made of a non-conductive surface-treated metal. For example, the terminal holding plate 130 may be aluminum or an aluminum alloy having an anodized surface as a non-conductive surface-treated metal, or may be further anodized on the surface. It may be aluminum or aluminum alloy that has been impregnated with fluorine or coated with fluorine.

  Next, a method for using the LSI measurement socket 110 will be described.

  In the LSI measurement socket 110, the upper lid 70 is removed as shown in FIG. 8, and the LSI 80 is placed on the floating guide 50 with the solder balls 81 of the LSI 80 introduced into the through holes 50a of the floating guide 50 as shown in FIG. Is placed.

  Next, as shown in FIG. 6, the LSI measuring socket 110 is configured such that the LSI 80 is pressed by the upper lid 70 in the direction indicated by the arrow 10 b when the upper lid 70 is fixed to the base 40. The spiral terminal 120 is also pressed in the direction indicated by the arrow 10b by the solder ball 81 of the LSI 80. Here, the LSI 80 is pushed back in the direction indicated by the arrow 10 a by the floating guide 50 biased by the spring 60, and the solder ball 81 of the LSI 80 is pushed back in the direction indicated by the arrow 10 a by the spring force of the spiral terminal 120. . Therefore, the spiral terminal 120 and the solder ball 81 of the LSI 80 are in contact with each other with a sufficient contact force.

  The printed circuit board 90 inputs / outputs an electrical signal to / from the LSI 80 via the spiral terminal 120 and the solder ball 81 of the LSI 80 and measures the electrical characteristics of the LSI 80.

  In the state shown in FIG. 6, a force that the plurality of solder balls 81 of the LSI 80 pushes the spiral terminal 120 in the direction indicated by the arrow 10 b is applied to the terminal holding plate 130 via the spiral terminal 120.

  As described above, since the LSI measurement socket 110 includes the spiral terminal 120 as a contact terminal, the spiral terminal 120 can be arranged at an extremely narrow pitch such as 0.4 mm. Here, in the LSI measurement socket 110, the smaller the pitch of the spiral terminals 120, the smaller the area of the terminal holding plate 130 other than the hole 130a (see FIG. 6) in which the spiral terminals 120 are arranged. Since the load per unit area received by 130 is large and the area of the hole 130a in the terminal holding plate 130 is large, the mechanical strength of the terminal holding plate 130 is low. That is, in the LSI measurement socket 110, the smaller the pitch of the spiral terminals 120, the easier the terminal holding plate 130 warps, and the poor contact between the plurality of solder balls 81 of the LSI 80 and the plurality of spiral terminals 120 tends to occur. However, in the LSI measurement socket 110, the floating guide 50 and the terminal holding plate 130 are formed of a non-conductive surface-treated metal, so that the plurality of solder balls 81 of the LSI 80, the plurality of spiral terminals 120, and the like. Therefore, even if the pitch of the spiral terminals 120 is narrow, the occurrence of poor contact between the plurality of solder balls 81 of the LSI 80 and the plurality of spiral terminals 120 can be suppressed. it can.

  As described above, the socket for an integrated circuit according to the present invention has an effect that the occurrence of contact failure with a plurality of electrodes formed on the surface of the integrated circuit can be reduced as compared with the conventional one, and the BGA package type It is useful as a socket for measuring the electrical characteristics of an LSI.

Side surface sectional drawing of the socket for LSI measurement which concerns on the 1st Embodiment of this invention Side sectional view of the LSI measurement socket shown in FIG. 1 before mounting the LSI Side cross-sectional view of the LSI measurement socket shown in FIG. 1 after mounting the LSI The figure which shows the total resistance value per solder ball at the time of using the socket for LSI measurement shown in FIG. The figure which shows the total resistance value per solder ball at the time of using the socket for LSI measurement whose probe holding plate is resin. Side surface sectional drawing of the LSI measuring socket which concerns on the 2nd Embodiment of this invention Top view of the spiral terminal of the LSI measurement socket shown in FIG. Side cross-sectional view of the LSI measurement socket shown in FIG. 6 before mounting the LSI Side surface sectional view of the LSI measuring socket shown in FIG. 6 after the LSI is mounted.

Explanation of symbols

10 LSI measurement socket (integrated circuit socket)
20 Contact probe (Contact terminal)
30 Probe holding plate (terminal holding member)
40 base (support member)
50 Floating guide (electrode positioning member)
50a Through hole 70 Upper lid (pressure member)
80 LSI (integrated circuit)
80a surface 81 solder ball (electrode)
110 LSI measurement socket (integrated circuit socket)
120 spiral terminal (contact terminal)
120a tip 130 terminal holding plate (terminal holding member)

Claims (7)

A plurality of contact terminals (20, 120) for contacting each of the plurality of electrodes while energizing each of the plurality of electrodes (81) formed on the surface (80a) of the integrated circuit (80); A terminal holding member (30, 130) that holds a plurality of contact terminals, and supports the terminal holding member in a state in which movement of the terminal holding member in a direction opposite to a direction in which the electrode is biased by the contact terminals is restricted. A supporting member (40) for applying, and a pressing member (70) for applying pressure to the integrated circuit in the opposite direction,
The integrated circuit socket (10, 110), wherein the terminal holding member is made of a non-conductive surface-treated metal. The integrated circuit socket (10, 110) according to claim 1, wherein the terminal holding member (30, 130) is formed of aluminum or an aluminum alloy having an anodized surface. The said terminal holding member (30,130) was formed with the aluminum or aluminum alloy which performed the anodic oxidation process on the surface, and also gave the fluorine impregnation or the fluorine coating on it. Integrated circuit socket (10, 110). A plurality of contact terminals (20, 120) for contacting each of the plurality of electrodes while energizing each of the plurality of electrodes (81) formed on the surface (80a) of the integrated circuit (80); A terminal holding member (30, 130) that holds a plurality of contact terminals, and supports the terminal holding member in a state in which movement of the terminal holding member in a direction opposite to a direction in which the electrode is biased by the contact terminals is restricted. And an electrode positioning member (50) which is formed in the biasing direction with respect to the terminal holding member by forming a through hole (50a) for introducing the plurality of electrodes, A pressure member (70) for applying pressure to the integrated circuit in the opposite direction;
The integrated circuit socket (10, 110), wherein the electrode positioning member is made of a non-conductive surface-treated metal. The integrated circuit socket (10, 110) according to claim 4, wherein the electrode positioning member (50) is formed of aluminum or aluminum alloy having an anodized surface. 5. The integrated circuit according to claim 4, wherein the electrode positioning member is formed of aluminum or an aluminum alloy having an anodized surface and further fluorine impregnated or fluorine coated thereon. Socket (10, 110). The integrated circuit socket (1) according to any one of claims 1 to 6, wherein the contact terminal (120) is a spiral terminal having a free end at a center end (120a). 110).

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