JPH0772212A - Lsi measuring board - Google Patents

Abstract

PURPOSE:To embody an LSI measuring board which can deal quickly with an LSI whose wiring connection is different. CONSTITUTION:An LSI measuring board is constituted so as to be featured in such a way that a hole 16 which communicates with individual wiring layers is made in a multilayer circuit board 11, that contact makers 12 are constituted so as to be capable of being inserted and pulled out, that the contact makers 12 are formed of a plurality of kinds whose position of a contact part 15 coming into contact with wiring layers in the multilayer circuit board 11 is different and that the contact makers are selected according to the wiring structure of an LSI 4 so as tic be inserted into, and fixed to, the hole 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LSI measuring board which can deal with flat package type LSIs having the same shape but different terminal connections.

An LSI is configured with a large number of lead terminals consisting of a signal line, a power supply line and a ground line, and its position is also roughly determined, but the power supply voltage is changed depending on the convenience of circuit design and user's request. Or, the one with the lead terminal position changed is made. Therefore, in the evaluation of the characteristics and the shipping test, a measurement board suitable for each type of LSI is required, and a considerable number of man-hours are required for this preparation.
This leads to an increase in the cost of new LSI products.

[0003]

2. Description of the Related Art FIG. 5 is a sectional view showing the structure of a conventional LSI measurement board, in which an LSI measurement board 1 has a socket 2
And a multi-layer circuit board 3 on which this is mounted. Here, a large number of contacts 6 are embedded and molded in the socket 2 corresponding to the number and contact positions of the large number of lead terminals 5 provided on the side surface of the flat package type LSI 4 to be measured. That is, phosphor bronze and beryllium copper (Be
A large number of contacts 6 made of an elastic metal material such as -Cu) and having a leaf spring structure such as an S shape are accurately arranged at the lead terminal pitch of the LSI 4.

The multi-layer circuit board 3 has a three-layer structure including at least a signal line 7, a power line 8 and a ground line 9. The tip of the contact 6 embedded in the socket 2 is a multi-layer circuit. It is inserted into the through hole of the substrate 3 to make a circuit connection with the wiring of the required layer. For example, the contact 6 in the case of FIG. 5 is circuit-connected to the signal line 7.

Next, a large number of wirings including the signal lines 7, the power supply lines 8 and the ground lines 9 provided on the multilayer circuit board 3 are connected to the IC through a connector provided on the board 3.
Connected to a measuring device such as a tester, the LSI 6 is attached to the contact 6 protruding above the socket 2 of the LSI measurement board 1.
The lead terminal 5 is contacted, and the electrical characteristics are measured in this state.

However, since such an LSI measurement board 1 is compatible with the terminal connection of the LSI 4 to be measured, in order to test an LSI with special specifications in which the terminal connection is changed, a socket 2 suitable for this is used. The provided LSI measurement board 1 must be used. Therefore, it is necessary to prepare a dedicated measurement board for the LSI with special specifications, which is one of the causes of cost increase.

[0007]

In many cases, LSIs of the same type have special specifications in addition to those of standard specifications. In this case, dedicated measurement for testing or characteristic evaluation is performed. Since it requires a board, it is troublesome and increases the cost of the product. Therefore, it is an object to put into practical use a measurement board that can easily change the terminal connection between the wiring pattern and the contact provided on the multilayer circuit board.

[0008]

SUMMARY OF THE INVENTION In the LSI measuring board, the above-mentioned problems are solved by providing a hole through each wiring layer in a multilayer circuit board so that a contactor can be inserted and removed, and the contactor is connected to the wiring of the multilayer circuit board. The LSI measurement board is configured by using a plurality of types of contact parts that are in contact with the layers and having different positions, selecting a contact according to the wiring structure of the LSI, and inserting and fixing it in a hole for use. It can be solved by doing.

[0009]

In the LSI measuring board according to the present invention, the contacts are formed in different shapes for signal lines, power lines and ground lines, and can be inserted and removed from the printed wiring board in accordance with the required terminal connection. 1 and 2 are cross-sectional views showing a usage state of the LSI measurement board according to the present invention. That is, in the structure shown in FIG. 1, the contact 12 of the printed wiring board 11 is inserted into and removed from the contact 13 by forming the contact 12 into a mortar shape having a step.
Is configured to be fixed by the holding plate 14.

That is, the multi-layer circuit board 11 has a three-layer structure of at least the signal line 7, the power line 8 and the ground line 9 as in the conventional case, and the stepped portions of the mortar-shaped holes 16 into which the contacts 12 are inserted are respectively above the steps. Each of the signal line 7, the power supply line 8 and the ground line 9 is exposed. In the case of FIG. 1, the contact 12 is brought into contact with the power supply line 8 and the upper portion 13 is fixed by the holding plate 14. When the LSI 4 is positioned on the measurement board, the lead terminal 5 for power supply contacts the contact 12 of the contact 12. The circuit is connected to the power line 8 through the section 15.

Next, in the structure of FIG. 2, the hole 23 for inserting the contact 18 of the multilayer circuit board 17 is formed in a through hole shape, and the holes 23 of the signal line 7, the power supply line 8 and the ground line 9 are formed.
The electrode 19 is provided at the exposed position.

On the other hand, the contactors 18 are made of three kinds of materials having different positions of the contact portions 20 for signal lines, power source lines and ground lines, and are provided with spring pins 21 on the upper part. Then, in the case of FIG. 2, the contact 18 for the ground wire is inserted into the hole 23, and the upper portion 13 of the contact 18 is fixed by the pressing plate 14. By adopting such a structure, the special L
With respect to SI, it is possible to easily prepare an LSI measurement board and perform measurement.

[0013]

【Example】

Example 1 (corresponding to claim 2 and FIG. 1) FIG. 3 shows a configuration of an LSI measurement board according to the present invention. FIG. 3A shows a ground wire contactor, and FIG. 3B shows a power supply line. FIG. 3C shows a cross section of the multilayer circuit board 11 and FIG. 6C shows a signal line contactor. Here,
All three types of contacts are made of Be-Cu alloy,
Only the interlayer distance (1.5 mm) of the multilayer circuit board 11
The intervals of 5 were changed, and gold (Au) plating was applied to the contact position 22 of the multilayer circuit board 11 with the conductor line. The length of the contact portion 15 protruding in each contact is 1.5 mm for the signal line (C in the figure), 3.5 mm for the power line (B in the figure), and 3.5 mm for the ground line (A in the figure). It is 4.5 mm.

The holes 16 of the multilayer circuit board 11 are formed with a step of 1.5 mm in the conductor line as described above, and the exposed conductor line is plated with Au. Then, insert such a contact into the hole 16 of the multi-layer circuit board 11 in accordance with the terminal connection of the LSI to be tested, apply a load of 100 g and crimp it, then contact and fix the holding plate 14. Completed the LSI measurement board. Example 2 (corresponding to claim 3 and FIG. 2) FIG. 4 shows a configuration of an LSI measurement board according to the present invention. FIG. 4A shows a ground wire contactor, and FIG. FIG. 6C shows a signal line contactor, and FIG. 7D shows a multilayer circuit board 17. Here, the body parts of the three types of contacts, the spring pins 21 and the springs 24 are all formed of Be-Cu alloy, and the contact positions 22 of the spring pins 21 and the contact parts 20 are each plated with Au. did. In the three types of contacts, the contact portion 20 has a length of 3 mm and the interlayer distance of the multilayer circuit board 17 (1.5 mm
) Are formed at different intervals.

Next, the multilayer circuit board 17 has an interlayer distance of 1.5 mm.
Although the ground line 9, the power supply line 8 and the signal line 7 are formed by patterning, in the hole 23 having a hole diameter of 3 mm, the exposed portion of each wire is Au-plated to form the electrode 19. Then, the LSI measurement board was completed by inserting such a contact into the hole 23 of the multilayer circuit board 17 in accordance with the terminal connection of the LSI to be tested.

[0016]

By implementing the present invention, it is possible to easily prepare an LSI measurement board corresponding to the terminal connection of an LSI, and it is possible to suppress the cost increase for a specially designed LSI.

[Brief description of drawings]

FIG. 1 is a sectional view showing a usage state of an LSI measurement board according to the present invention.

FIG. 2 is a cross-sectional view showing a usage state of another LSI measurement board according to the present invention.

FIG. 3 is a cross-sectional view of a contactor and a multilayer circuit board that form an LSI measurement board according to the present invention.

FIG. 4 is another cross-sectional view of a contactor and a multilayer circuit board that constitute the LSI measurement board according to the present invention.

FIG. 5 is a sectional view showing a configuration of a conventional LSI measurement board.

[Explanation of symbols]

 1 LSI measurement board 2 Sockets 3, 11, 17 Multi-layer circuit board 4 LSI 5 Lead terminal 6, 12, 18 Contact 7 Signal line 8 Power line 9 Ground line 13 Top 14 Presser plate 15, 20 Contact part 16, 23 Hole 19 Electrode 21 Spring pin 22 Contact position

Claims (2)

[Claims] 1. A plurality of contacts (1) provided with a plurality of lead terminals (5) provided on an LSI (4) on a multilayer circuit board (11).
In the LSI measurement board used for measuring the characteristics of the LSI (4) by aligning and contacting with 2), the contactor (12) contacts the lead terminal (5) of the LSI (4). The contact part (10), the upper part (13) fixed by the holding plate (14) provided on the multilayer circuit board (11), and the multilayer circuit board (1
1) includes a contact portion (15) in contact with a wiring layer provided in (1), and the contact (12) has a contact portion (15) position that differs depending on the position of the wiring layer that constitutes the multilayer circuit board (11). The multilayer circuit board (11) is made of a plurality of types, the hole (16) for inserting the contactor (12) is formed in a mortar shape with a step so that the plurality of wiring layers are exposed, and measurement is performed. LSI to perform
The contactor (12) is selected according to the wiring structure of (4) and inserted into the hole (16) provided in the multilayer circuit board (11) to bring the contact portion (15) into contact with the wiring layer. An LSI measuring board characterized in that the upper part (13) of a contactor (12) is fixed by a holding plate (14). 2. A plurality of contacts (1) provided with a plurality of lead terminals (5) provided on an LSI (4) on a multilayer circuit board (17).
In the LSI measurement board used for measuring the characteristics of the LSI (4) by aligning and contacting with 8), the contact (18) is a spring that contacts the lead terminal (5) of the LSI (4). The pin (21), the upper part (13) fixed by the holding plate (14) provided on the multilayer circuit board (17), and the contact part (20) contacting the wiring layer provided on the multilayer circuit board (11) )
In addition, the contact (18) is made of a plurality of types in which the position of the contact portion (20) differs depending on the position of the wiring layer forming the multilayer circuit board (17), and the multilayer circuit board (17) is the contactor. (1
The through hole-like hole (23) for inserting 8) is provided with the electrode (19) on the exposed portion of the wiring layer, and the contactor (18) is selected according to the wiring structure of the LSI (4) to be measured. , Multilayer circuit board (1
Insert into the hole (23) provided in 7) and contact part (20)
Contact the wiring layer and the contact plate with the holding plate (14).
An LSI characterized in that the upper part (13) of (18) is fixed
Measurement board.