JP5092979B2 - Anisotropic conductive sheet and substrate body - Google Patents

Description

  The present invention relates to a substrate body on which an anisotropic conductive sheet used for inspection of electronic components and connection of wiring boards and the like is arranged.

  Conventionally, inspection of various electronic components has been performed using probe pins. The inspection includes a burn-in test of a semiconductor device and an electrical connection test of connectors of various wiring boards. Examples of the wiring board include FPC (flexible printed wiring board) and PCB (printed circuit board).

  However, with the progress of high-density mounting of electronic components, the number of electrodes to which the probe pins are pressed increases and the pitch is reduced. Therefore, the cost of the spring-type probe pin for pressing against the electrode is extremely high.

  Therefore, recently, an increasing number of cases use anisotropic conductive sheets instead of spring-type probe pins. The anisotropic conductive sheet exhibits conductivity only in the thickness direction. The anisotropic conductive sheet is provided so as to conduct between the mating conductor and the board-side conductor when the positions on the plane match. Since it is not necessary to align the position of the conductive member in the anisotropic conductive sheet with the positions of the mating conductor and the board-side conductor, it is advantageous for reducing the pitch.

In the technique of Patent Document 1, a frame plate made of an elastic polymer sheet is used in which a large number of holes serving as penetrating conductive members are formed. Each hole is provided with a conductive portion embedded with a wire or conductive paste.
In the technique of Patent Document 2, a frame plate made of an elastic polymer such as high-strength resin is used. The holes in the frame plate are filled with a through conductive member filled with conductive magnetic particles.
In the technique of Patent Document 3, a technique is disclosed in which porous PTFE is used as a frame plate and a through conductive member is formed on the inner wall portion of each hole by electroless plating.

Patent Document 4 discloses an inspection apparatus in which the anisotropic conductive sheet of Patent Document 3 is bonded to a substrate. In this inspection apparatus, an electronic component is pressed against an anisotropic conductive sheet for inspection. A lead wire extends from the substrate toward the inspection circuit.
JP 9-35789 A Japanese Patent Laid-Open No. 9-320667 JP 2004-265844 A Special mass 2007-292537

  By mounting a substrate using an anisotropic conductive sheet on the inspection apparatus as in the techniques of Patent Documents 1 to 4, it is not necessary to use probe pins with a narrow pitch. Therefore, there is an advantage that the inspection apparatus can be configured at low cost. However, in the techniques of Patent Documents 1 to 4, there is a possibility of causing the following problems.

  Generally, the pitch of the through conductive member of the anisotropic conductive sheet is sufficiently smaller than the pitch of the counterpart conductor such as an electrode of an electronic component. Further, the through conductive member is uniformly arranged on the base material. Therefore, it is not necessary that the center position of the penetrating conductive member coincides with the center position of the counterpart conductor or the board-side conductor. Further, it is not necessary for all the through conductive members to be in contact with the mating conductor or the substrate conductor. If the positions on the plane of the counterpart conductor and the board-side conductor coincide with each other, they are conducted through one of the through conductive members in the anisotropic conductive sheet.

However, in the above conventional technique, when the pitch of electronic parts is further increased, the following problems occur. When variations occur in the shape of the electronic component, the positional deviation of the electronic component inserted into the inspection apparatus increases. For this reason, there may be a case where sufficient conduction between the board-side conductor and the other-side conductor such as an electrode of an electronic component is not ensured.
On the other hand, if the through conductive member is minimized, there is a risk of causing poor conduction between the substrate-side conductor and the counterpart-side conductor.

  An object of the present invention is to provide an anisotropic conductive sheet that can cope with miniaturization and a narrow pitch of a conductor to be connected, and a substrate body using the same.

  The anisotropic conductive sheet of the present invention is disposed in an inspection device for inspecting an electronic component or a connector for electrical connection between wiring boards. The anisotropic conductive sheet is made of a porous resin and includes a frame plate in which a plurality of through holes penetrating in the plate thickness direction are formed. The through-hole has a taper over the whole. Then, a through conductive member including an electroless plating layer is provided on the inner wall surface of the through hole and the surface region including the inside of each fine hole.

This makes it possible to repeatedly use the porous resin by utilizing the elasticity of the porous resin, and to obtain a fine-shaped through conductive member. And since a through-hole has a taper, even if a through-hole is refined | miniaturized, it becomes easy for an electroless plating solution to infiltrate into a through-hole. Therefore, even if the through conductive member formed on the inner wall portion of the through hole is made small, the amount of metal to be electrolessly plated can be secured. Therefore, it is possible to suppress a conduction failure between the board-side conductor and the counterpart-side conductor with the penetrating conductive member interposed therebetween, and it is possible to cope with the increase in pitch.
In addition, the plating layer is thick on the large diameter side of the through hole, and the plating layer is thin on the small diameter side. Therefore, by using the small-diameter side connected to the mating conductor of the electronic component, it is possible to cope with the narrowing pitch of the mating conductor.

The board | substrate body of this invention is equipped with the board | substrate with which the board | substrate side conductor was formed, and the said anisotropically conductive sheet. The taper of the through hole of the anisotropic conductive sheet is a taper whose diameter decreases from the substrate side toward the side facing the substrate.

  Thereby, a board | substrate body can be set to a test | inspection apparatus or a connector, and an electronic component test | inspection, a wiring board connection, etc. can be performed. At this time, since the through conductive member has a taper whose diameter decreases toward the side facing the substrate, it is possible to cope with a narrow pitch of the mating conductor. Further, even if the through conductive member is miniaturized, the amount of metal can be ensured, so that it is possible to cope with a narrow pitch of the board-side conductors.

  In the substrate body of the present invention, it is preferable to disperse and arrange the through conductive members for each arrangement portion of the substrate-side conductor. In that case, a positioning mechanism for positioning the mounting position of the anisotropic conductive sheet on the substrate is provided.

  As a result, the through conductive members are not arranged uniformly as in the prior art, but are distributed in the arrangement area of the board-side conductors. Further, the planar position of the substrate-side conductor and the through conductive member can be aligned by the positioning mechanism. Therefore, even when the board-side conductor or the counterpart-side conductor has a narrow pitch, the possibility of erroneous connection or short circuit can be suppressed.

  According to the anisotropic conductive sheet or substrate body of the present invention, it is possible to cope with a narrow pitch while suppressing conduction failure between miniaturized conductors.

(Embodiment 1)
FIG. 1 is a sectional view of an inspection apparatus A according to Embodiment 1 of the present invention. FIG. 2 is a rear view of the substrate body B. FIG. In FIG. 2, the fitting member 16 is not shown. FIG. 3 is a longitudinal sectional view of the substrate body B. As shown in FIG. However, FIG. 1 and FIG. 3 show partial cross-sections of the main parts, and not all members shown in the drawings are present on a common cut surface.

As shown in FIG. 1, the inspection apparatus A includes a lower jig 41, an upper jig 43, and a movable jig 42 that can move up and down between both jigs. The lower jig 41 and the upper jig 43 are fixed to each other by a column 44. The movable jig 42 is pulled to the upper jig 43 side by a spring member 47. The movable jig 42 is pressed downward by the handle 45.
The movable jig 42 is provided with spring-type probe pins (external terminals) 40 corresponding to the external electrodes 13 of the substrate body B. A wiring 40a for sending an inspection signal to the outside extends from the proximal end side of the spring-type probe pin 40.

  As shown in FIGS. 2 and 3, the substrate body B includes a substrate 11, an anisotropic conductive sheet 20, and a fitting member 16. On the main surface of the substrate 11 (the upper surface in FIG. 3), substrate-side conductors 15 having a narrow pitch are disposed. And the some anisotropic conductive sheet 20 is affixed for every area | region made into the pinch pitch.

  In the present embodiment, the anisotropic conductive sheet 20 described in Patent Document 3 or Patent Document 4 is used. That is, as shown in the perspective view of FIG. 4, a through conductive member 22 is provided on a frame plate 21 made of a porous PTFE membrane. The porous PTFE membrane is made of PTFE having a large number of micropores with a porosity of about 20 to 80%. The frame plate 21 is formed with a tapered through hole 23 having a taper over the entire plate. And the through-conductive member 22 is formed by performing electroless plating on the inner wall portion including the inner wall surface of the through-hole 23 and the inside of the fine hole. A method for forming the anisotropic conductive sheet 20 will be described in detail later.

  A back electrode 12 is formed on the back surface of the substrate 11. The substrate-side conductor 15 and the back electrode 12 are electrically connected to each other through the through-hole conductive portion 17. On the back surface of the substrate 11, the back electrode 12 and the external electrode 13 are electrically connected to each other through the wiring 14. The through-hole conductive portion 17, the back electrode 12, and the wiring 14 constitute a connection member that electrically connects the substrate-side conductor 15 and the external electrode 13.

The substrate 11 is provided with spring-type probe pins 25 connected to electrodes such as a power supply line and a ground line. Since the electrodes such as the power supply line are disposed outside the region having the narrow pitch, it is not necessary to use the anisotropic conductive sheet 20. Thereby, useless anisotropic conductive sheet 20 can be eliminated and manufacturing cost can be reduced. The spring-type probe pin 25 is electrically connected to the external electrode 13 through the through-hole conductive portion and the wiring 14.
The substrate 11 is provided with a pair of positioning pins 26 for positioning the substrate-side conductor 15 and the counterpart-side conductor 33. This is because the electronic component is set in the concave portion of the lower jig 41 but is not set in a fitted state but only in a state where there is play.

  A fitting member 16 for fitting the substrate body B to the movable jig 42 is provided on the back side of the substrate 11. The fitting member 16 is made of a resin such as bakelite or acrylic resin. The proximal end sides of the spring-type probe pin 25 and the positioning pin 26 are embedded in the fitting member 16. As shown in FIG. 1, the substrate body B is attached to the movable jig 42 by fitting the fitting member 16 into the concave portion of the movable jig 42. At this time, the tip of the spring-type probe pin 40 is pressed against the external electrode 13. As a result, a signal is extracted from the external electrode 13 to the outside.

FIG. 5 is an enlarged plan view showing a state in which the anisotropic conductive sheet 20 is sandwiched between the counterpart conductor 33 and the substrate side conductor 22.
In the anisotropic conductive sheet 20, penetrating conductive members 22 are uniformly arranged on a frame plate 21 made of a porous resin. The position of the penetrating conductive member 22 does not have to coincide with the position of the counterpart conductor 33 or the board-side conductor 15. Further, it is not necessary that all the through conductive members 22 are in contact with the counterpart conductor 33 or the substrate side conductor 15. If the positions of the mating conductor 33 and the board-side conductor 15 on the plane coincide with each other, they are conducted through one of the through conductive members 22 in the anisotropic conductive sheet 20.

  In the present embodiment, the penetrating conductive members 22 have a staggered arrangement pattern, but a grid pattern or other patterns may be used.

Next, an electronic component inspection procedure will be described.
Before the state shown in FIG. 1, that is, before the electronic component is attached, the movable jig 42 is pulled upward by the spring member 47. In this state, the electronic component (in this embodiment, the connector 32 of the FPC 31) is set on the lower jig 41. The connector 32 is provided with a counterpart conductor 33 having a narrow pitch. Further, a special electrode 33a for a power supply line or a ground line is provided in a region other than the sandwiching pitch.
The substrate body B and the upper jig 42 are positioned with relatively high accuracy by the fitting member 16, but the electronic components vary greatly in shape. For this purpose, the positioning pin 26 is mounted, but the variation in the position and the like of the mating conductor 33 is larger than that of the board-side conductor 15. On the other hand, the pitch of the mating conductor 33 accompanying the miniaturization of electronic components is progressing.

Next, the movable jig 42 is moved downward by the handle 45. And the position on the plane of the other party conductor 33 of the connector 32 and the board | substrate side conductor 15 of the board | substrate body B is matched with the positioning pin 26 (refer FIG. 5).
Then, the counterpart conductor 33 is pressed against the anisotropic conductive sheet 20. Thereby, the board | substrate side conductor 15 and the other party conductor 33 electrically conduct on both sides of the penetration conductive member 22. The spring type probe pin 25 is pressed against the special electrode 33a.

  Although not shown, the wiring 40a and the other end of the FPC 31 are connected to an inspection circuit. And the quality of the connector 32 etc. can be determined by test | inspecting the electrical connection state of the wiring 40a of the spring type probe pin 40, and FPC31.

-Manufacturing method of anisotropic conductive sheet-
FIGS. 6A to 6E are perspective views showing a manufacturing process of the anisotropic conductive sheet 20 according to the first embodiment. Hereinafter, the manufacturing process of the anisotropic conductive sheet 20 will be described with reference to FIGS. However, the method for producing the anisotropic conductive sheet of the present invention is not limited to the following method.

  In the step shown in FIG. 6A, a frame plate 21 that is a porous PTFE membrane is prepared. Generally, methods for producing a porous film using a synthetic resin include a pore making method, a phase separation method, a solvent extraction method, a stretching method, a laser irradiation method, and the like. By forming a porous film using a synthetic resin, elasticity can be imparted in the thickness direction. Further, the dielectric constant can be further lowered. In particular, a porous film obtained by a stretching method (a porous PTFE film in this embodiment) is excellent in heat resistance, workability, mechanical properties, dielectric properties, and the like. Moreover, it is easy to obtain a porous membrane having a uniform pore size distribution. Therefore, it is an optimal material for the substrate (frame plate 21) of the anisotropic conductive sheet 20.

  The porous PTFE membrane of the present embodiment is manufactured by, for example, the stretching method described in Japanese Patent Publication No. 42-13560. First, a liquid lubricant is mixed with the unsintered powder of PTFE, and extruded into a tube shape or a plate shape by ram extrusion. When a thin sheet is desired, the plate is rolled with a rolling roll. After the extrusion rolling process, the liquid lubricant is removed from the extruded product or the rolled product as necessary. When the extruded product or the rolled product thus obtained is stretched at least in a uniaxial direction, unsintered porous PTFE is obtained in the form of a film. The unsintered porous PTFE membrane is heated to a temperature of 327 ° C. or higher, which is the melting point of PTFE, while being fixed so as not to shrink. As described above, when the stretched structure is sintered and fixed, a porous PTFE membrane having high strength can be obtained. When the porous PTFE membrane is in a tube shape, a flat membrane can be obtained by opening the tube.

  Next, in the step shown in FIG. 6B, the mask films 28 and 29 are fused to both surfaces of the frame plate 21 obtained by the stretching method. Thereby, the laminate 24 having a three-layer structure is formed. And the through-hole 23 with a taper is formed in the whole laminated body 24 (refer broken line). A PTFE film made of the same material as the mask films 28 and 29 and the frame plate 21, preferably a porous PTFE film is used. At this time, for example, both surfaces of the three laminated porous PTFE membranes are sandwiched between two stainless steel plates, and each stainless steel plate is heated to a high temperature. Thereby, the three-layer porous PTFE membrane can be fused to each other.

  In general, examples of a method for forming a through hole in a film thickness direction at a specific position of a synthetic resin include a chemical etching method, a thermal decomposition method, an ablation method using laser light or soft X-ray irradiation, and an ultrasonic method. For the laminate 24 composed of a porous PTFE film formed by stretching, a method of irradiating synchrotron radiation or laser light having a wavelength of 250 nm or less, and an ultrasonic method are preferable. In particular, in order to form the tapered through hole 23, an ablation method is preferable.

  When the through-hole 23 is formed by irradiation with synchrotron radiation or laser light having a wavelength of 250 nm or less, the following procedure is used. Before forming the through hole 23, a light shielding sheet (not shown) is formed on the upper surface of the laminate 24. As the light shielding sheet, for example, a tungsten sheet is preferable. A plurality of openings are formed in the tungsten sheet using photolithography or the like, and the openings are used as a light transmission portion. A portion where light is transmitted and irradiated from the plurality of openings of the light shielding sheet to the laminated body 24 side is etched to form a through hole 23. The pattern of the opening of the light shielding sheet can be any shape such as a circle, a star, an octagon, a hexagon, a rectangle, or a triangle. The pore diameter of the opening may be larger than the average pore diameter of the porous PTFE membrane to be used. What is necessary is just to form the hole diameter of the through-hole 23 suitably according to the size of the through-conductive member 22 to produce.

  In the present embodiment, the pitch p between the through holes 23 is set to a pitch of 30 μm or less (specifically, about 25 μm). The diameter d of the through hole 23 is generally about 5 to 100 μm, but is preferably 15 μm or less in order to cope with the narrow pitch. In the present embodiment, the diameter d of the through hole 5 is about 15 μm at the large diameter portion and about 10 μm at the small diameter portion.

  Although description about the method of forming the through-hole 23 by the ultrasonic method is omitted, it is as disclosed in Japanese Patent Application Laid-Open No. 2004-265844 (see paragraphs [0042] to [0051]). When the through hole 23 is formed in the porous PTFE film by a normal punching method, burrs are generated, and it is difficult to form the through hole 23 having an accurate shape without deposits. On the other hand, when processed by the ultrasonic method disclosed in the publication, the through hole 5 having a desired shape can be easily and inexpensively formed in the porous PTFE membrane. Also in that case, the cross-sectional shape of the through-hole 23 is arbitrary, such as a circle, a star, an octagon, a hexagon, a quadrangle, and a triangle.

  Next, in the step shown in FIG. 6C, the catalyst is applied through conditioning, washing and pre-dip of the laminate 24. Conditioning makes the surface of PTFE having water repellency as hydrophilic as possible, and facilitates adhesion of the catalyst (Pd) in the subsequent process. For the porous PTFE membrane, a solution containing an alcohol such as ethanol or a surfactant is used as a conditioner. This allows the conditioner to penetrate to each fiber in the porous structure.

  After completion of the pre-dip process, the laminate 24 is immersed in a catalyst solution containing Pd (for example, a tin chloride-palladium chloride colloid solution). Then, colloidal particles made of a Pd compound adhere to the surface of each PTFE fiber constituting the laminate 24. Thereby, the colloidal particle adhesion region 22x is formed in the surface region such as the inner wall portion of the through hole 23. When the catalyst application step is completed, the laminate 24 is washed with water, and the process proceeds to the next step.

  Next, in the step shown in FIG. 6D, the mask films 28 and 29 are peeled off from both surfaces of the frame plate 21. At this time, the colloidal particle formation region 22x is not formed on both surfaces of the frame plate 21. On the other hand, colloidal particle adhesion regions 22x are also formed at the side edges of the frame plate 21. The colloidal particle adhesion region 22x is appropriately removed after the end of this step or after the end of electroless plating.

  Next, in the step shown in FIG. 6 (e), electroless plating is performed to form the penetrating conductive member 22. Before that, a colloidal particle adhesion region made of a Pd compound is used by using dilute hydrochloric acid, dilute sulfuric acid, or the like. A process of activating Pd in 22x is performed. Thereby, activated catalyst particles are formed. The catalyst particles generally contain a Pd compound (for example, palladium-tin chloride) and simple Pd. Thereafter, the processing liquid adhering to the surface of the frame plate 21 is washed away with water.

  In the electroless plating step, Cu is deposited around the catalyst particles from a copper sulfate solution or the like by electroless Cu plating using a solution containing copper ions such as copper sulfate and a reducing agent such as formaldehyde. Since the deposited Cu also has catalytic activity, a Cu layer having a thickness corresponding to the plating time is formed. When the electroless plating of Cu is completed, the process proceeds to the next step after washing with water.

  Next, in order to adhere the catalyst to the surface of the Cu layer, the frame plate 21 is immersed again in the catalyst solution. Here, a palladium chloride solution is used as the catalyst solution. Pre-dip and conditioning are not performed, and the catalyst liquid does not contain tin chloride, so that the catalyst particles hardly adhere to the exposed portions of PTFE that are not covered with the Cu layer. Thereafter, washing with water is performed to remove the catalyst solution remaining on the surface.

  Next, electroless Ni plating is performed using a solution containing Ni ions such as nickel sulfate and a reducing agent containing phosphinic acid ions. Thereby, a Ni alloy layer is deposited on the Cu layer. Then, it is washed with water. In addition, electroless Ni plating can also be performed on the activated catalyst particles without forming a Cu layer.

  Thereafter, an Au layer is formed by displacement gold plating. At this time, an electrochemically base metal (Ni) is immersed in a solution containing ions of electrochemically noble metal (Au). Then, noble metal ions are reduced by electrons released by dissolution of the base metal, and a noble metal (Au) film is deposited on the base metal (Ni) surface. Through the steps described above, the penetrating conductive member 22 composed of catalyst particles, a Cu layer, a Ni—P alloy layer, and an Au layer is formed. Note that the Au layer may be formed by autocatalytic electroless plating after displacement plating. Then, the electroless plating process is completed by drying through water washing and alcohol substitution.

  The through conductive member 22 formed by the above steps has an electroless plating layer that is thick on the large diameter side of the taper (t2) and thin on the small diameter side (t1). That is, when immersed in various liquids in the above steps, various liquids are more easily penetrated on the large diameter side than on the small diameter side. For example, when the through hole 23 has a large diameter of about 15 μm and a small diameter of about 10 μm, t1≈1 (μm) and t2≈2 (μm).

  The anisotropic conductive sheet 20 can reduce the diameter of the through hole 23 to 10 μm (0.01 mm) or less. Further, the pitch of the through conductive members 22 can be sufficiently reduced to 25 μm (0.025 mm) or less. Therefore, even when the width of the board-side conductor 15 is 0.1 mm or less and the pitch p1 of the board-side conductor 15 is 0.05 mm or less, it is possible to cope with a sufficient margin.

  According to the present embodiment, the following operational effects can be obtained. A tapered through hole 23 is formed in the anisotropic conductive sheet 20, and a through conductive member 22 using electroless plating is formed on the inner wall portion thereof. Since the through hole 23 has a taper, the electroless plating solution can easily enter the through hole 23 even if the through hole 23 is miniaturized. Therefore, even if the through conductive member 22 formed on the inner wall portion of the through hole 23 is made small, the amount of metal to be electrolessly plated can be secured. Therefore, it is possible to suppress poor conduction between the board-side conductor 15 and the counterpart-side conductor 33 with the penetrating conductive member 22 interposed therebetween, and it is possible to cope with a reduction in pitch.

  Further, the plating layer is thick on the large diameter side of the through hole 23, and the plating layer is thin on the small diameter side. Therefore, it is possible to cope with the narrow pitch of the counterpart conductor 33 that contacts the small diameter side of the through conductive member 22.

  In the present embodiment, when the substrate body B is periodically replaced, it is only necessary to remove the entire substrate body B from the inspection apparatus A, and it is not necessary to peel off the anisotropic conductive sheet 20. Therefore, the time and labor for replacing the inspection board are reduced. However, the structure of the substrate body B of the present invention is not limited to this example. For example, as disclosed in Patent Document 4, a large anisotropic conductive sheet 20 may be attached to the entire substrate 11.

  In the present embodiment, an example in which the connector 32 of the FPC 31 is inspected as an electronic component that is an inspection object has been described. However, the inspection apparatus A and the substrate body A of the present invention can also be used for a burn-in test of a semiconductor device, an electrical connection test of a connector of another type of wiring board such as a PCB, and the like. Furthermore, it can be used not only as an inspection apparatus but also as a connection part such as a connector as in the second embodiment.

(Modification of Embodiment 1)
FIG. 7 is an enlarged plan view showing a state where the anisotropic conductive sheet 22 is sandwiched between the mating conductor 33 and the board-side conductor 15 according to the modification of the first embodiment. Also in this modified example, the frame plate 21 is formed with a tapered through hole. A through conductive member 22 using electroless plating is formed on the inner wall portion of the through hole.

Here, in the present modification, the penetrating conductive members 22 are distributed and arranged for each arrangement region of the board-side conductor 15. The plurality of penetrating conductive members 22 constitute a penetrating conductive member group 22g.
Although not shown in FIG. 7, positioning pins are formed on the substrate, and pin holes are formed on the anisotropic conductive sheet 20. Thereby, the positional alignment between the board-side conductor 15 and the penetrating conductive member 22 is ensured.

  And in this modification, in addition to the effect of Embodiment 1, the following effects can be acquired. That is, as shown in FIG. 7, even if the counterpart conductor 33 is displaced, it is possible to avoid a situation where the penetrating conductive member 22 in the adjacent region is contacted. Therefore, even if the pitch of the board-side conductor 15 and the counterpart-side conductor 33 is reduced to 0.05 mm or less, the occurrence of erroneous connection or short circuit can be suppressed.

  In this modification, it is preferable that a plurality of penetrating conductive members 22 (penetrating conductive member group 22g) are provided for each arrangement region of the substrate-side conductor 15. In this way, even when the positions of the counterpart conductor 33 and the board-side conductor 15 are deviated, they can be more reliably conducted.

  The alignment direction distance x2 between the through conductive members 22 in the different conductive member groups 22g is larger than the alignment direction distance x1 between the through conductive members 22 in the common through conductive member group 22g. Thereby, the above-mentioned effect can be acquired reliably.

(Embodiment 2)
8A and 8B are cross-sectional views showing structures before and after connection of the connection structure C according to Embodiment 2 of the present invention. In the connection structure C, a rigid printed wiring board (PCB) has a rigid substrate 50 and a counterpart conductor 51 that is a wiring thereon. The FPC (substrate body) includes a flexible substrate 60 and a substrate-side conductor 61 that is a wiring thereon. An anisotropic conductive sheet 20 having a through conductive member 22 is attached to the flexible substrate 60.

  Although not shown, also in the present embodiment, the penetrating conductive member 22 has an arrangement pattern as shown in FIG. That is, the penetrating conductive members 22 are uniformly arranged on a plane. In the present embodiment, the FPC and the anisotropic conductive sheet 20 constitute the substrate body of the present invention.

  However, also in the present embodiment, as in the modification of the first embodiment, the penetrating conductive member 22 may be distributed and arranged for each arrangement region of the board-side conductor 15. In that case, the through-conductive member 22 and the substrate-side conductor 33 are aligned with each other by a positioning pin or a stepped portion.

  A support portion 52 and a lock portion 55 around an axis 56 of the support portion 52 are connected to the rigid substrate 50 by an adhesive or the like. At the time of connection, as shown in FIG. 8A, the FPC and the anisotropic conductive sheet 20 are inserted into the support portion 52.

  Next, as shown in FIG. 8B, the lock portion 55 is rotated around the shaft 56 to press the FPC 83 against the RCB. As a result, the penetrating conductive member 22 of the anisotropic conductive sheet 20 comes into contact with the mating conductor 61 on the rigid substrate 60, and both are conducted. The distal end portion of the lock portion 55 is locked to both arm portions (not shown) extending to the side of the support portion 52 at the lowest position. Further, the locking of the lock portion 55 is provided so as to be releasable by well-known and conventional means. This structure utilizes a known ZIF (Zero Insertion Force) connector mechanism. By using the anisotropic conductive sheet 20, a connection structure C that can be easily reconnected is obtained.

  In the present embodiment, the anisotropic conductive sheet 20 is attached to the FPC to constitute the substrate body of the present invention. As a result, a substrate body suitable for pinching a wiring board or connector can be obtained. In the present embodiment also, a preferable form similar to that in Embodiment 1 can be adopted.

  The structures of the above embodiments are merely examples, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention includes the description of the scope of claims, meaning equivalent to the description, and all modifications within the scope.

  The present invention can be used for testing and inspection of electronic components such as semiconductor integrated circuits and various devices, or connection of various wiring boards and electronic components.

It is sectional drawing of the inspection apparatus which concerns on Embodiment 1 of this invention. It is a reverse view of the board | substrate body which concerns on Embodiment 1 of this invention. It is a longitudinal cross-sectional view of the board | substrate body which concerns on Embodiment 1 of this invention. It is a perspective view of the substrate body concerning Embodiment 1 of the present invention. 3 is an enlarged plan view showing a state in which an anisotropic conductive sheet is sandwiched between a mating conductor and a substrate-side conductor in Embodiment 1. FIG. (A)-(e) is a perspective view which shows the manufacturing process of the anisotropically conductive sheet which concerns on Embodiment 1. FIG. 3 is an enlarged plan view showing a state in which an anisotropic conductive sheet is sandwiched between a mating conductor and a substrate-side conductor in Embodiment 1. FIG. (A), (b) is sectional drawing which shows the structure before the connection of the connection structure C which concerns on Embodiment 2 of this invention, and after a connection.

Explanation of symbols

A Inspection apparatus B Substrate body C Connection structure 11 Substrate 12 Back electrode 13 External electrode 14 Wiring 15 Substrate side conductor 16 Fitting member 17 Through-hole conducting portion 20 Anisotropic conductive sheet 21 Frame plate 22 Through conductive member 22x Colloid adhesion region 24 Laminated body 25 Spring type probe pin 26 Positioning pin 28 Mask film 28 Mask film 31 FPC
32 connector 33 mating conductor 40 spring type probe pin 40a wiring 41 lower jig 42 movable jig 43 upper jig 44 support 45 handle 47 spring member 50 rigid substrate 51 mating conductor 52 support section 55 locking section 56 shaft 60 flexible Substrate 61 Substrate side conductor

Claims (3)

A frame plate made of a porous resin having a plurality of fine holes, and formed with a plurality of through holes penetrating in the plate thickness direction;
A penetrating conductive member formed on the inner wall surface of the through hole and the surface region including the inside of each micro hole, and including an electroless plating layer;
With
The anisotropic conductive sheet, wherein the plurality of through holes have a taper inclined in a common direction over the entire through hole. A substrate on which a substrate-side conductor is formed;
The anisotropic conductive sheet according to claim 1 attached on the substrate;
With
The through hole of the anisotropic conductive sheet has a taper that decreases in diameter from the substrate side toward the side facing the substrate. The substrate body according to claim 2,
The penetrating conductive member is distributed and arranged for each arrangement part of the substrate-side conductor,
A substrate body further comprising a positioning mechanism for positioning an attachment position of the anisotropic conductive sheet to the substrate.

Images