JP2008098258A - Connection structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure capable of being reduced in thickness and size while maintaining connection reliability of a flexible wiring board etc. <P>SOLUTION: The connection structure includes a rigid printed wiring board having a wiring 11 formed on a rigid board 10, a flexible printed wiring board having a wiring 21 formed on a flexible board 20, and an anisotropic conductive sheet 30 having through electrodes 36. On the rigid board 10, a supporting portion 12 and a locking portion 15 turnably attached around a shaft 16 of the supporting portion 12 are connected via an adhesive or the like. When the locking portion 15 is rotated around the shaft 16 to press the flexible printed wiring board onto the rigid printed wiring board, the through electrodes 36 of the anisotropic conductive sheet 30 are brought into a state of contacting the wiring 11 on the rigid board 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a connection structure for connecting wires used in various electric devices such as a mobile phone, in particular, a flexible wiring board to another wiring board.

  2. Description of the Related Art Conventionally, film-shaped wiring bodies, so-called flexible wiring boards, are often arranged particularly in small and light electrical devices such as mobile phones. In recent years, flexible wiring boards have been used more frequently because they are very convenient for electrical connection in devices having an opening / closing mechanism and a rotating mechanism such as a mobile phone. The flexible wiring board is rich in flexibility, but unlike a rigid wiring board having a rigid structure, it is difficult to increase the insertion force when the flexible wiring board is inserted into the insertion port of the connector. Therefore, a non-insertion force connector (ZIF: Zero Interpose Force) is widely used as a connection structure (connector) for connecting a flexible wiring board to another wiring board (see Patent Documents 1 and 2).

  FIGS. 4A and 4B are a plan view and a side view showing the structure of a general ZIF connector. As shown in the figure, in a rigid printed wiring board, a ZIF connector 110 is disposed on a rigid substrate 100 having a rigid structure on which wirings 101 are formed. In the flexible printed wiring board, wiring 201 is formed on a flexible substrate 200. The ZIF connector 110 is provided with a plurality of metal wire-like contacts 103 each connected to the wiring 101. The contact 103 is provided in a U shape when viewed from the side, and an upper end portion of the contact 103 has a hook shape. When connecting, the flexible printed wiring board is inserted into the U-shaped opening of the contact 103 of the ZIF connector 110 with almost no insertion force. Then, in a state where the contact 103 and the wiring 201 are in contact with each other, the lock portion 105 is rotated around the shaft 106 to press the hook-shaped upper end portion of the contact 103 into the flexible substrate 200. This completes the connection between the wirings. The lock portion 105 is locked by both arm portions extending to the side of the ZIF connector 110 when the tip end portion moves to the lowest position.

  By the operation of the ZIF connector 110, the wiring 201 on the flexible substrate 200 and the wiring 101 on the rigid substrate 100 which is a mother board are electrically connected. Then, the flexible printed wiring board is held so that the connection state between the contact 103 and the wiring 201 on the flexible substrate 200 is maintained. Patent Documents 1 and 2 disclose various structures of the lock portion 105 and the contact 103.

Japanese Patent Publication No. 6-65090 Japanese Patent Publication No. 7-24230

  However, as the recent trend toward miniaturization of various electric devices such as mobile phones, when the ZIF connector is required to be thinner and smaller, the reliability of electrical connection in the ZIF connector 110 is maintained. It has become difficult to do.

  That is, there is a limit to reducing the wire-like contactor 103 and the thickness and width dimension of the portion supporting the contactor 103 while maintaining the mechanical strength for keeping the shape in the set state.

  Further, if the thickness and width dimension of the ZIF connector 110 and the contact 103 are reduced, it is difficult to maintain the gripping force of the flexible printed wiring board by the contact 103 of the ZIF connector 110 sufficiently high. On the other hand, if this gripping force is maintained sufficiently high to ensure connection reliability, it is difficult to make the ZIF connector 100 thinner and smaller. For example, when the width of the wirings 101 and 201 is about 0.1 mm and the gap between the wirings is about 0.1 mm due to the narrow pitch, the width of the contact 103 needs to correspond to that, but in that case, The gripping force is weakened and the flexible printed wiring board is very likely to come off.

  The above-described problems occur not only in the connection between the flexible printed wiring board and the rigid printed wiring board but also in the connection between the flexible printed wiring boards, and may also occur in various flexible wiring boards.

  It is an object of the present invention to reduce the thickness and size of a connection structure for maintaining electrical connection between a flexible wiring board and another wiring board, and to maintain connection reliability. Is to provide a simple structure.

  The connection structure of the present invention has a structure in which two wiring boards are pressed with a plate-like intermediate member having a through electrode interposed between two wiring bodies such as flexible wiring boards.

  This eliminates the need for a contact made of a number of metal wires corresponding to the number of wires, which is present in the conventional ZIF connector, and eliminates the need to support the contact in the ZIF connector. And even if the dimension of each penetration electrode of a plate-shaped intermediate member is reduced, the intensity | strength for maintaining the shape of a connection structure is hardly adversely affected. Therefore, it is possible to reduce the thickness and width dimension of the entire connection structure while keeping the mechanical strength of each part high, and it is possible to cope with the progress of thinning and miniaturization.

  Since the intermediate member is an elastic body, it is possible to prevent contact failure due to unevenness of each wiring of the first wiring body and the second wiring body due to elastic deformation of the intermediate member when the intermediate member is pressed. . In addition, the gripping force on the wiring body is also improved. Therefore, connection reliability can be ensured.

  The intermediate member retains the elasticity of the intermediate member by adopting a structure in which a porous resin having a plurality of micropores is used as a base material and a through electrode is formed on an inner wall portion including the inside of each micropore of the base material. On the other hand, the occurrence of poor conduction in the through electrode can be suppressed, and the connection reliability can be further improved.

  The connection structure of the present invention is particularly effective when at least one of the first wiring body and the second wiring body is a flexible wiring board.

  According to the connection structure of the present invention, since a plate-like intermediate member having a through electrode is used instead of a wire-like contact like the conventional ZIF connector, it corresponds to the progress of thinning and miniaturization. be able to.

-Overall structure of connection structure-
FIGS. 1A and 1B are cross-sectional views showing structures before and after connection of the connection structure according to the embodiment of the present invention. As shown in FIG. 1A, the connection structure includes a rigid printed wiring board, which is a first wiring body in which wiring 11 is formed on a rigid substrate 10, and wiring 21 on a flexible substrate 20. The flexible printed wiring board which is the 2nd wiring body, and the anisotropic conductive sheet 30 which is an intermediate member which has the penetration electrode 36 are provided. Further, the rigid substrate 10 is connected to a support portion 12 and a lock portion 15 attached to be rotatable about an axis 16 of the support portion 12 by an adhesive or the like. In the state shown in FIG. 1A, the anisotropic conductive sheet 30 is fixed to the flexible substrate 20 with an adhesive or the like, and the through electrode 36 and the wiring 21 are in contact with each other. Although not shown in FIGS. 1A and 1B, the support portion 12 is provided with both arm portions extending sideways as in the structure shown in FIG.

  The rigid substrate 10 is not limited to a glass epoxy plate but may be a paper phenol plate, a paper epoxy plate, a fluororesin plate, an alumina plate, or the like. As a material for the wiring 11, a copper alloy is generally used, but is not limited thereto. As the flexible substrate 20, not only a polyimide plate but also a polyester plate (low temperature use), a glass epoxy plate (thin plate), or the like is used. The material of the wiring 21 is generally a copper alloy, but is not limited to this.

  Then, as shown in FIG. 1B, in a state where the flexible printed wiring board and the anisotropic conductive sheet 30 are installed at predetermined positions on the rigid board, the lock portion 15 is rotated around the shaft 16. When the flexible printed wiring board is pressed against the rigid printed wiring board, the through electrode 36 of the anisotropic conductive sheet 30 comes into contact with the wiring 11 on the rigid substrate 10. The distal end portion of the lock portion 15 is locked to both arm portions extending to the side of the support portion 12 in the lowest position, similarly to the structure shown in FIG. Further, the locking of the lock portion 15 is provided so as to be releasable by well-known and conventional means.

  As can be seen from the above-described operation, the flexible printed wiring board (second wiring body) is rigidly sandwiched between the anisotropic conductive sheet 30 (intermediate member) as an intermediate member by the support arm 12, the shaft 16 and the lock portion 15. A pressing means for pressing the printed wiring board (first wiring body) is configured. In the state shown in FIG. 1A, the anisotropic conductive sheet 30 that is an intermediate member does not need to be bonded to the flexible substrate 20, and may be in a free state, or may be attached to the rigid substrate 10. It may be adhered.

  FIG. 2 is a plan view conceptually showing the relationship between the position of the through electrode 36 when the wiring 11 on the rigid substrate 10 and the wiring 21 on the flexible substrate 20 are overlapped. In the present embodiment, the anisotropic conductive sheet 30 has a structure that can be used for various standards of flexible printed wiring boards. Basically, unlike the state shown in FIG. 2, it is sufficient that one or several through electrodes 36 exist in the width direction of the wirings 11 and 12. It does not have to exist. However, it is necessary to avoid a plurality of wires 11 (or 21) on the same wiring board coming into contact with one through electrode 36 because a short circuit occurs.

  In addition, as shown in FIG. 2, in the plan view, the existence region of the through electrode 36 and the existence region of the wirings 11 and 21 may overlap, and the through electrode 36 in the width direction of the wirings 11 and 21. Need not be included in the wirings 11 and 21. There is no problem even if the through electrode 36 exists in the gap between the wirings. If the contact with the through electrode 36 is ensured for each of the wirings 11 and 21, the wiring 11 and the wiring 12 are electrically connected without being short-circuited. Further, the wirings 11 and 21 may be electrically connected by at least one through electrode 36.

  Furthermore, a structure in which the diameter of the through electrode 36 is significantly smaller than the width of the wirings 11 and 21 and the wirings 11 and 21 are connected by a large number of through electrodes 36 may be employed. As will be described later, in the case of an anisotropic conductive sheet, the diameter of the through holes can be sufficiently fine pitch up to 10 μm (0.01 mm) or less and the pitch can be up to 25 μm (0.025 mm) or less. Therefore, even if the wiring width is 0.1 mm or less and the interval between the wirings is fine pitch of 0.1 mm or less, it is possible to cope with a sufficient margin.

  As can be seen from the above, by using the anisotropic conductive sheet 30 having the through electrode 36 in the present embodiment as an intermediate member, the formation pattern of the through electrode 36 in the anisotropic conductive sheet 36 is uniform. Therefore, it can be widely used for a connection structure between various wiring boards. Further, when such a connection structure is used, the arrangement of the through electrode 36 is devised, so that even if the positions of the wiring 11 and the wiring 21 are slightly deviated, a short circuit is avoided and the wiring 11 is connected to the wiring 21. It is easy to ensure electrical connection.

-Structure of anisotropic conductive sheet-
FIGS. 3A to 3E are cross-sectional views showing a manufacturing process of the anisotropic conductive sheet. Hereinafter, the manufacturing process of the anisotropic conductive sheet will be described with reference to FIGS.

  In the step shown in FIG. 3A, a frame plate 30a that is a porous PTFE membrane is prepared. Generally, methods for producing a porous film using a synthetic resin include a pore making method, a phase separation method, a solvent extraction method, a stretching method, a laser irradiation method, and the like. By forming a porous film using a synthetic resin, elasticity can be given in the plate thickness direction and the dielectric constant can be further lowered. In particular, the porous film obtained by the stretching method (porous PTFE film in the present embodiment) is excellent in heat resistance, processability, mechanical properties, dielectric properties, etc., and has a uniform pore size distribution. Therefore, it is an optimum material for the base material of the anisotropic conductive sheet.

  The porous PTFE membrane of the present embodiment can be produced by, for example, the method described in Japanese Patent Publication No. 42-13560. First, a liquid lubricant is mixed with the unsintered powder of PTFE, and extruded into a tube shape or a plate shape by ram extrusion. When a thin sheet is desired, the plate is rolled with a rolling roll. After the extrusion rolling process, the liquid lubricant is removed from the extruded product or the rolled product as necessary. When the extruded product or the rolled product thus obtained is stretched at least in a uniaxial direction, unsintered porous PTFE is obtained in the form of a film. An unsintered porous PTFE membrane is highly porous when heated and stretched to a temperature of 327 ° C. or higher, which is the melting point of PTFE, while being fixed so that shrinkage does not occur. A PTFE membrane is obtained. When the porous PTFE membrane is in a tube shape, a flat membrane can be obtained by opening the tube.

  Next, in the step shown in FIG. 3 (b), the mask films 31 and 32 are fused to both surfaces of the frame plate 30a, which is a porous PTFE film obtained by a stretching method, to form a laminate 33 having a three-layer structure. The through-hole 35 is formed in the whole laminated body 33 (refer to a broken line). As the mask films 31 and 32, a PTFE film made of the same material as that of the frame plate 30a, preferably a porous PTFE film is used. At this time, for example, three layers of porous PTFE membranes are fused to each other by sandwiching both surfaces of three laminated porous PTFE membranes with two stainless steel plates and heating each stainless steel plate to a high temperature. Can do.

  In general, examples of a method for forming a through hole in a film thickness direction at a specific position of a synthetic resin include a chemical etching method, a thermal decomposition method, an ablation method using laser light or soft X-ray irradiation, and an ultrasonic method. For the laminate 33 made of a porous PTFE film formed by a stretching method, a method of irradiating synchrotron radiation or laser light having a wavelength of 250 nm or less, and an ultrasonic method are preferable. The diameter of the through-hole 35 by the laser method is generally about 5 to 100 μm. In the present embodiment, the diameter of the through hole 35 is several tens of μm.

  Although description about the method of forming the through-hole 35 by the ultrasonic method is omitted, it is as disclosed in Japanese Patent Application Laid-Open No. 2004-265844 (see paragraphs [0042] to [0051]). The cross-sectional shape of the through hole 35 is arbitrary, such as a circle, a star, an octagon, a hexagon, a quadrangle, and a triangle. Further, the through hole 35 may be formed by machining using a drill or the like.

  Next, in the step shown in FIG. 3C, the catalyst is applied through conditioning, washing and pre-dip of the laminate 33. The purpose of conditioning is to make the surface of PTFE having water repellency as hydrophilic as possible, and to facilitate the adhesion of the catalyst (Pd) in a later step. For the porous PTFE membrane, a solution containing alcohol such as ethanol or a surfactant is used as a conditioner, and the conditioner is infiltrated to each fiber in the porous structure.

  And after completion | finish of a pre-dip process, the laminated body 33 is immersed in the catalyst liquid (for example, a tin chloride-palladium chloride colloid liquid) containing Pd, and the surface of each fiber of PTFE constituting the laminated body 33 is made of a Pd compound. Colloidal particles are adhered to form a colloidal particle adhesion region 34 formed by the colloidal particles adhering to the surface of each fiber on the surface region such as the inner wall of the through hole 35. In the colloidal particle adhesion region 34, the colloidal particles are rarely a continuous layer and are often island-shaped layers. At this time, the colloidal particle adhesion region 34 is also formed in the surface region (hatched region shown in FIG. 3C) where the mask films 31 and 32 are exposed. Even if the pre-dip step is omitted, the effect of the present invention can be exhibited.

  Next, in the step shown in FIG. 3D, the mask films 31 and 32 are peeled off from both surfaces of the frame plate 30a. At this time, the colloidal particle formation region 34 is not formed on both surfaces of the frame plate 30a. On the other hand, the colloidal particle adhesion region 34 is also formed on the side edge of the frame plate 30a. The colloidal particle adhesion region 34 formed in this part is appropriately formed after the end of this step or after the end of the electroless plating. Removed.

  Next, in the step shown in FIG. 3 (e), electroless plating is performed to form the through electrode 36. Before that, a colloidal particle adhesion region 34 made of a Pd compound is used by using dilute hydrochloric acid, dilute sulfuric acid, or the like. A process for activating Pd therein is performed. Thereby, activated catalyst particles are formed. The catalyst particles generally contain a Pd compound (for example, palladium-tin chloride) and simple Pd, and Pd is exposed on the surface even if all the colloidal particles are not changed to simple Pd. If it does, the function as a catalyst of electroless plating can be exhibited. Thereafter, the treatment liquid adhering to the surface of the frame plate 30a is washed away with water.

  In the electroless plating step, Cu is deposited around the catalyst particles from a copper sulfate solution or the like by electroless Cu plating using a solution containing copper ions such as copper sulfate and a reducing agent such as formaldehyde. Since the deposited Cu also has catalytic activity, a Cu layer having a thickness corresponding to the plating time is formed. When the electroless plating of Cu is completed, the process proceeds to the next step after washing with water.

  Next, in order to adhere the catalyst to the surface of the Cu layer, the frame plate 30a is immersed again in the catalyst solution. Here, a palladium chloride solution is used as the catalyst solution. Pre-dip and conditioning are not performed, and the catalyst liquid does not contain tin chloride, so that the catalyst particles hardly adhere to the exposed portions of PTFE that are not covered with the Cu layer. Thereafter, washing with water is performed to remove the catalyst solution remaining on the surface.

  Next, an Ni alloy layer (actually Ni-P alloy plating) is used on the Cu layer by electroless Ni plating (actually Ni-P alloy plating) using a solution containing Ni ions such as nickel sulfate and a reducing agent containing phosphinate ions. Is deposited with a Ni-P alloy layer). Then, it is washed with water.

  Thereafter, an Au layer is formed by displacement gold plating. When an electrochemically noble metal (Ni) is immersed in a solution containing electrochemically noble metal (Au) ions, noble metal ions are reduced by electrons released by the dissolution of the noble metal, A noble metal (Au) coating is deposited on the base metal (Ni) surface. Through the steps described above, the through electrode 36 composed of catalyst particles, a Cu layer, a Ni—P alloy layer, and an Au layer is formed. Note that the Au layer may be formed by autocatalytic electroless plating after displacement plating. Then, the electroless plating process is completed by drying through water washing and alcohol substitution.

  In the manufacturing process of the anisotropic conductive sheet 30, the frame plate 30 a is sandwiched between the mask films 31 and 32 from both sides to form the laminated body 33, and then the through holes are formed and immersed in the catalyst solution. However, the stacked body 33 is not necessarily formed. For example, the steps shown in FIGS. 3C to 3E, such as formation of through holes, application of a catalyst, activation treatment, and electroless plating, may be performed on the frame plate alone. In that case, an electroless plating layer is also formed on the plate surface of the frame plate, but may be removed by polishing or the like. However, by forming the through hole 35 in the stacked body 33 as in the present embodiment, a highly accurate through hole 35 can be obtained. In addition, the manufacturing cost can be reduced by not forming an extra electroless plating layer.

  The anisotropic conductive sheet 30 formed by the above steps includes a through electrode 36 serving as a conductive portion formed on the inner wall portion of the through hole 35. Thereby, the anisotropic conductive function of having conductivity in the plate thickness direction and no conductivity in the plate surface direction is provided. In order to prevent an electrical short circuit between the through electrodes 36 serving as a conduction portion, the frame plate 30a needs to be an insulator. In the present embodiment, in order to make the anisotropic conductive sheet 30 have both elasticity and high strength, the frame plate 30a is made of a synthetic resin of a porous film.

  Synthetic resin materials constituting the porous membrane frame plate 30a of the present embodiment include polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl. Fluorine resins such as vinyl ether copolymer (PFA), polyvinylidene fluoride (PVDF), polyvinylidene fluoride copolymer, ethylene / tetrafluoroethylene copolymer (ETFE resin); polyimide (PI), polyamideimide (PAI) ), Polyamide (PA), modified polyphenylene ether (mPPE), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polysulfone (PSU), polyethersulfone (PES), liquid crystal polymer (LCP), etc. -Engineering plastic, and the like. Among these, PTFE has excellent characteristics when comprehensively considering heat resistance, workability, mechanical characteristics, dielectric characteristics, and the like. Therefore, in the present embodiment, a porous PTFE film (porous polytetrafluoroethylene film) is used as the frame plate 30a. In the present embodiment, as will be described later, since a porous PTFE membrane obtained by a stretching method is used, the frame plate 30a is formed by very thin fibers (fibrils) formed by PTFE and the fibers, respectively. It has a fine fibrous structure (porous structure) composed of nodes (nodes) connected to each other.

  In the present embodiment, the porous PTFE membrane used as the frame plate 30a preferably has a porosity of about 20 to 80%. The porous PTFE membrane preferably has an average pore diameter of 10 μm or less or a bubble point of 2 kPa or more from the viewpoint of fine pitching of the conducting part, and an average pore diameter of 1 μm or less or a bubble point of 10 kPa or more. It is more preferable. The thickness of the porous PTFE membrane can be appropriately selected according to the purpose of use and the location of use, but is usually 0.05 to 3 mm.

  The through electrode 36 has a multilayer metal plating layer (electroless plating layer) with a tube thickness of 0.2 to 5 μm on the inner wall portion including the inner wall surface of the through hole 35 and the inside of the fine hole. That is, in the electroless plating, the through electrode 36 is formed in the surface region including the fibers of the porous PTFE film by the catalyst particles and the metal that have entered the fine holes from the inner wall surface. In the present embodiment, the through electrode 36 is constituted by a Cu layer, a Ni alloy layer (Ni—P alloy layer), and an Au layer deposited using catalyst particles attached to the fiber surface as nuclei. However, the Cu layer is not necessarily required.

  As described above, during electroless plating, the catalyst particles penetrate not only through the inner wall surface of the through-hole 35 but also through the micropores of the porous PTFE film and adhere to the fiber surface. The porous PTFE membrane is deposited by penetrating into the inside from the micropores. That is, the through electrode 36 includes not only the multilayer metal plating layer but also the fibers of the porous PTFE film. Since the through electrode 36 is formed by adhering to the surface of the resin portion having a porous structure, the through electrode 36 itself has a characteristic of being porous. Then, by applying a compressive load in the thickness direction of the anisotropic conductive sheet 30, conductivity is imparted only in the thickness direction of the anisotropic conductive sheet 30 while maintaining insulation between the through electrodes 36. (Anisotropic conductivity). Further, when the compressive load is removed, the entire anisotropic conductive sheet 30 including the through electrode 36 is elastically recovered, so that the anisotropic conductive sheet 30 of the present embodiment can be used repeatedly.

  The tube thickness of the through electrode 36 is preferably set so that the resistance value of the through electrode 36 which is a conducting portion becomes 0.1Ω or less when a predetermined compression amount (about 30 μm) is applied. In general, the compression amount is preferably set to about ¼ of the thickness of the frame plate 30a. In the present embodiment, since the frame plate 30a having a thickness of about 120 μm is used, the compression amount is set. Is set to 30 μm. However, since the upper limit of the resistance value differs depending on the type of anisotropic conductive sheet 30 and the type of equipment to be mounted, the resistance value of each through electrode 36 having a variation in contact degree is less than the desired resistance value. Any compression amount that fits into

  According to the present embodiment, instead of the conventionally formed contact made of a metal wire of the ZIF connector, the rigid substrate 10 and the flexible substrate 20 are provided via the plate-like anisotropic conductive sheet 30 (intermediate member). Since the wirings 11 and 21 are electrically connected to each other, it is possible to easily cope with reduction in thickness and size. That is, a portion for supporting the contact is not necessary, and a sufficiently high strength can be obtained even if the thickness of the plate-like anisotropic conductive sheet 30, the diameter of the through electrode 36, the interval, etc. are reduced to 0.1 mm or less. It is done. And as shown in FIG.1 (b), when pressing a flexible printed wiring board with the lock | rock part 15, since a flexible printed wiring board can be pressed in a large area, it is gripped with respect to a flexible printed wiring board by a frictional force. A large amount of power can be secured.

  In particular, in this embodiment, since the porous PTFE, which is an elastic body, is used as the base material of the anisotropic conductive sheet 30 like the anisotropic conductive sheet 30, the anisotropic conductive sheet is formed by the lock portion 15. Even if the surfaces of the wiring 11 and the wiring 21 are uneven by pressing the contact 30, the elastic deformation of the anisotropic conductive sheet 30 causes the contact between the wiring 11 and the through electrode 36 and the wiring 21 and the penetration. Contact with the electrode 36 can be ensured. Accordingly, contact failure can be reliably suppressed. Further, the elastic deformation of the anisotropic conductive sheet 30 also improves the gripping force for the flexible printed wiring board. Therefore, the reliability of electrical connection by the connection structure is further improved.

  Among porous resins, especially porous PTFE has high strength and heat resistance, and since there is almost no deterioration in elasticity due to repeated loading, it can prevent a decrease in gripping force due to deterioration in elasticity even after long-term use. Can do.

(Other embodiments)
In the above embodiment, the anisotropic conductive sheet 30 in which the catalyst particles and the electroless plating layer are formed on the inner wall portion of the through hole 35 of the frame plate 30a made of the porous PTFE film is used as the intermediate member. However, the intermediate member of the present invention is not limited to such an anisotropic conductive sheet 30. For example, a through hole may be formed in a plate made of a general-purpose resin that is not porous, and a through electrode may be provided by electroless plating or the like.

  On the other hand, since the resin constituting the intermediate member has elasticity, the gripping force for gripping the flexible substrate 20 can be increased, but the elasticity of the through electrode 36 made of metal is small. Therefore, since the resin constituting the intermediate member is porous, the through electrode 36 is also porous, and the entire through electrode 36 has elasticity like a spring. Therefore, it is preferable to use a porous resin as the base resin of the intermediate member.

  Among the porous resins, as described above, porous PTFE has high reliability in long-term use, but is expensive, but uses other inexpensive porous resins for the purpose of reducing costs. Is also possible.

  In the above embodiment, an example in which a rigid printed wiring board (abbreviated as PCB) is used as the first wiring body and a flexible printed wiring board (abbreviated as FPC) is used as the second wiring body has been described. The wiring body 1 is not limited to the rigid printed wiring board 12 but may be a flexible printed wiring board. Moreover, even if it is a flexible wiring board, there exists what is called a flexible flat cable (FFC), and it can be used for the connection of these various wiring boards. However, it is desirable that one is a flexible wiring board. This is because a simpler structure than that of the present invention can be adopted when electrical connection is made between rigid wiring boards.

  In the above embodiment, the pressing means for pressing the two wiring bodies with each other is configured by the support portion 12, the lock portion 15, and the shaft 16, but the pressing means of the present invention is not limited to this structure. There are numerous variations in the configuration of the pressing means as well-known and commonly used means, and any configuration may be adopted.

  The structure of the embodiment of the present invention disclosed above is merely an example, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  INDUSTRIAL APPLICABILITY The present invention can be used as a connector that performs electrical connection between wiring between a flexible wiring board mounted on an electric device such as a mobile phone and another wiring board.

(A), (b) is sectional drawing which shows the structure before the connection of the connection structure which concerns on embodiment of this invention, and after a connection. It is a top view which shows notionally the relationship between the position when both the wiring on a rigid board | substrate and the wiring on a flexible substrate overlap, and the position of a penetration electrode. (A)-(e) is sectional drawing which shows the manufacturing process of the anisotropically conductive sheet which concerns on embodiment. (A), (b) is the top view and side view which show the structure of the connector of a general ZIF structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Rigid board | substrate 11 Wiring 12 Support part 15 Locking part 16 Axis 20 Flexible board 21 Wiring 30 Anisotropic conductive sheet 30a Frame board 31 Mask film 32 Mask film 35 Through hole 36 Through electrode

Claims (4)

A first wiring body in which a first wiring is formed;
A second wiring body on which a second wiring is formed;
A plate-like intermediate member interposed between the first wiring body and the second wiring body;
Pressing means for pressing the second wiring body and the first wiring body together with the intermediate member interposed therebetween;
The intermediate member has a through electrode connected to the first wiring and the second wiring. The connection structure according to claim 1,
The connection structure, wherein the intermediate member is an elastic body. The connection structure according to claim 1 or 2,
The intermediate member is
Based on a porous resin having a plurality of micropores,
The through electrode is a connection structure formed on an inner wall portion including the inside of each fine hole of the base material. In the connection structure in any one of Claims 1-3,
A connection structure in which at least one of the first wiring body and the second wiring body is a flexible wiring board.

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