KR101882758B1 - Test socket having double S conductive wire contact structure - Google Patents

Abstract

The test socket of the present invention comprises a first base film on which a plurality of first contact bumps are arranged at regular intervals, a first bonding wire in the form of an elastic spring which is wire-bonded on the plurality of first contact bumps through a first bonding pad, And a first substrate coupling disposed on the first base film and electrically connected to a terminal of the test device by including at least a first spacer of a window type that exposes the first bonding wire, A second base film on which bumps are arranged at regular intervals, a second bonding wire in the form of an elastic spring which is wire-bonded on the plurality of second contact bumps through a second bonding pad and connected to the first bonding wire, And a second spacer disposed on the second base film and in the form of a window to expose at least the second bonding wire, And a second substrate combination body electrically connected to the first substrate assembly. According to the structure of the present invention, the first bonding wire and the second bonding wire can absorb mutual physical impact and minimize damage by the elastic spring.

Description

{Test socket having double S wire contact structure}

The present invention is characterized in that the test socket for inspecting the electrical characteristics before the semiconductor device manufactured through the semiconductor package manufacturing process has a double "S" wire contact structure, more specifically the "S" The present invention relates to a test socket in which a pair of " S "wires are provided in a spring-like form, whereby the durability of the contacts is enhanced by mutual orthogonal contact, and the physical impact is absorbed despite repetitive inspections and damage is minimized.

In general, semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests.

Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, in order to electrically connect the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device to each other , A test socket is disposed between the semiconductor device and the test apparatus.

However, the test socket is provided with a conductive connector (wire or spring, etc.) for contacting the terminals provided in the test instrument.

However, the conductive connector must be capable of absorbing the impact even in numerous contact with semiconductor devices and should not be damaged.

KR Patent Publication No. 10-2012-0138304

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a method for preventing a conductive connector from being damaged, So that the product life of the socket is prolonged.

According to an aspect of the present invention for achieving the above object, a test socket of the present invention includes a first base film on which a plurality of first contact bumps are arranged at regular intervals, a first base film on a first plurality of contact bumps, A first bonding wire in the form of an elastic spring that is wire-bonded through a bonding pad, and a first spacer disposed on the first base film and having a window shape to expose at least the first bonding wire, And a second base film on which a plurality of second contact bumps are arranged at regular intervals and a plurality of second contact bumps through a second bonding pad, A second bonding wire in the form of an elastic spring connected to a wire and a second bonding wire disposed on the second base film, And a second substrate bonding body electrically connected to the conductive balls of the semiconductor device, wherein the first bonding wire and the second bonding wire absorb mutual physical shocks by the elastic spring, And damage can be minimized.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, no matter how large the load applied to the conductive wire is, the conductive wire takes the form of an "S" wire, and the pair of "S" , And the problem caused by disconnection of the conductive wire in particular is prevented at the source.

Second, since this conductive wire is connected to the terminal of the test device through the conductive silicon contact bump, the shape of the contact bump can be variously changed, and the contact characteristics are improved.

1 is a perspective view showing a configuration of a test socket according to the present invention;
2 is a perspective view showing another configuration of a test socket according to the present invention;
3 is a partial cross-sectional view showing a configuration of a test socket according to the present invention;
4 and 5 are a perspective view and a cross-sectional view, respectively, showing the structure of a bonding wire according to an embodiment of the present invention;
6 is a cross-sectional view showing the configuration of a bonding wire according to another embodiment of the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of a test socket having a double "S" wire contact structure according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, the test socket 100 of the present invention includes a first substrate bonding body 200 corresponding to a test device, and a second substrate bonding body 300 corresponding to a semiconductor device.

The first substrate bonding body 200 includes a first base film 210 on which a plurality of first contact bumps 202 are formed with a predetermined rule, a first bonding pad 204 on the plurality of first contact bumps 202, And a first spacer 230 disposed on the first base film 210 and having a window shape to expose at least the first bonding wire 220. The first bonding wire 220 may be a wire- .

The first base film 210 may be a rigid PCB or a polyimide film having a circuit formed by printing copper or the like on an epoxy resin or a phenol resin, a flexible printed circuit board (Flexible PCB) that forms various circuit patterns by copper (Cu), gold (Ag), or other conductive material may be used.

If the flexible printed circuit board (FPCB) is used as the first base film 210, it is easy to design a circuit pattern using a screen printing or a photolithography process, and the workability is excellent. Especially for roll-to-roll continuous processes.

The first contact bump 202 may be comprised of a separate conductive silicone rubber in contact with the terminals of the test device. The individual electrically conductive silicone rubber functions to elastically support the first bonding wire 220 in order to enhance the contact characteristics of the first bonding wire 220 with the terminal of the test instrument.

For example, the individual conductive silicone rubber may protrude from the first base film 210 for more accurate contact upon contact with the test device, and may have a cylindrical shape or a cone shape or a trapezoidal shape in which the diameter gradually decreases And the like.

The first bonding pads 204 are formed on the first contact bumps 202 and are electrically connected through the first bonding wires 220. Accordingly, the first bonding pad 204 may be formed of a conductive material of substantially the same material as the first bonding wire 220. The first bonding pads 204 can be fabricated by electroplating or electroless plating gold (Au) or copper (Cu). The first bonding pad 204 may be plated with conductive gold (Ag) or nickel (Ni).

The first bonding wire 220 vertically connects the first bonding pad 204 and the like between the first substrate bonding body 200 and the second substrate bonding body 300. According to an embodiment of the present invention, the first bonding wire 220 may be formed in a straight line shape so that the test socket 100 can be held at the same time while absorbing the impact even if the test socket 100 is pressed by the test device. And provides a curve shape.

For example, the first bonding wire 220 vertically connecting the first substrate bonding body 200 and the second substrate bonding body 300 is bent at least twice in the left and right direction to provide elasticity. The end of the first bonding wire 220 is finished in a vertical direction so as to be fastened to the second bonding wire, which will be described later. Whereby the first bonding wire 220 may have the " S "wire form.

4 and 5, the first bonding wire 220 includes a vertical wire 220a vertically extending from the first bonding pad 204, a vertical wire 220b extending perpendicularly from the vertical wire 220a, 1 elastic wire 220b, a second elastic wire 220c bent in a U-shape from the first elastic wire 220b and a stopper wire 220d extending perpendicularly from the second elastic wire path 220c do.

At this time, the vertical wire 220a, the first elastic wire 220b, the second elastic wire 220c, and the stopper wire 220d are considered to extend in the same plane. However, the vertical wire 220a extends vertically from the center of the first bonding pad 204, but the stopper wire 220d is eccentric by a certain distance from the center.

Therefore, a first bending area bent at 90 占 exists between the vertical wire 220a and the first elastic wire 220b, and a first bending area bent at 180 占 between the first elastic wire 220b and the second elastic wire 220c Lt; RTI ID = 0.0 > second < / RTI > Further, there is a third banding region bent at 90 占 between the second elastic wire 220c and the stopper wire 220d.

Referring to FIG. 6, the second elastic wire 220c may further include a seating wire 220e in a region where the vertical wire 220a extends vertically. The seating wire 220e is bent to a certain degree and the seating wire 320e to be described later can be seated with each other.

Thus, the first bonding wire 220 is provided in a spring shape of an " S "wire structure having a plurality of elastic regions, thereby absorbing physical impact and minimizing damage.

The first bonding wire 220 is bonded onto the first bonding pad 204. After the bonding process, nickel (Ni) may be firstly plated on the wire. Nickel (Ni) may have a somewhat lower conductivity. In the case of high frequency, the signal may flow to the surface and the characteristics may be deteriorated. Therefore, gold (Ni) can be secondarily plated with nickel (Ni).

2, the second substrate bonding body 300 includes a second base film 310 on which a plurality of second contact bumps 302 are disposed at regular intervals, a second base film 310 on the plurality of second contact bumps 302, A second bonding wire 320 that is wire-bonded through the second bonding pad 304 and a window-shaped second spacer that is disposed on the second base film 310 and exposes at least the second bonding wire 320 330).

4, the second bonding wire 320 includes a vertical wire 320a vertically extending from the second bonding pad 304, a first elastic wire 320b bent at a right angle to the vertical wire 320a, A second elastic wire 320c bent in a U-shape from the first elastic wire 320b and a stopper wire 320d extending perpendicularly from the second elastic wire 320c.

Although the first substrate combination 200 and the second substrate combination 300 may be somewhat different, it is assumed that the first substrate combination 200 and the second substrate combination 300 are symmetrical in the vertical direction, and the detailed description thereof will be omitted herein.

Meanwhile, an insulating silicone rubber may be further filled between the first substrate bonding body 200 and the second substrate bonding body 300. Or in the form of a void. In order to adjust the height of the task socket 100, the thickness of the first and second spacers 230 and 330 may be adjusted or a third spacer may be further inserted therebetween.

Alternatively, the first and second spacers 230 and 330 may be formed of a stainless steel (SUS) material effective for shielding electromagnetic waves so as to perform a function of blocking external electromagnetic waves.

As described above, according to the present invention, the conductive wires connecting the upper and lower base films are respectively formed of " S "wires, and the pair of " S" wires are cross- It is understood that the durability of the outer conductor is greatly enhanced and the elastic force is greatly improved. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: test socket 200: first substrate combination body
202: first contact bump 204: first bonding pad
210: first base film 220: first bonding wire
230: first spacer 300: second substrate combination body

Claims (7)

A first base film in which a plurality of first contact bumps are arranged at regular intervals,
A first bonding wire in the form of an elastic spring that is wire-bonded onto a plurality of first contact bumps through a first bonding pad,
And a first spacer disposed on the first base film and having a window shape to expose at least the first bonding wire,
A first substrate bonding body electrically connected to a terminal of the test apparatus; And
A second base film in which a plurality of second contact bumps are disposed at regular intervals,
A second bonding wire in the form of an elastic spring that is wire-bonded to the plurality of second contact bumps through a second bonding pad and connected to the first bonding wire,
And a second spacer disposed on the second base film and having a window shape to expose at least the second bonding wire,
And a second substrate bonding body electrically connected to the conductive balls of the semiconductor device,
Wherein the first bonding wire and the second bonding wire absorb the mutual physical impact and minimize damage by the elastic spring. The method according to claim 1,
Wherein the first bonding wire comprises:
A vertical wire extending vertically from the first bonding pad,
A first elastic wire bent at right angles to the vertical wire,
A second elastic wire bent from the first elastic wire to " U "
And a stopper wire extending at right angles to the second elastic wire so as to have an " S "wire structure. 3. The method of claim 2,
Wherein the vertical wires, the first elastic wires, the second elastic wires, and the stopper wires of the first bonding wire extend in the same first plane and the second bonding wires extend in the same second plane, Wherein the first plane and the second plane cross each other such that the first and second bonding wires provide a steric contact of a double " S "wire. 4. The method of claim 3,
Wherein the vertical wire extends vertically at the center of the first bonding pad, but the stopper wire is eccentric at a distance from the center. 3. The method of claim 2,
Between the vertical wire and the first elastic wire, there is a first banding region bent at 90 [deg.],
And a second banding region bent 180 DEG between the first elastic wire and the second elastic wire,
And a third banding region bent at 90 [deg.] Between the second elastic wire and the stopper wire. 3. The method of claim 2,
Wherein the first contact bump is an individual conductive silicone rubber which is in contact with a terminal of the test device and is made of an electrically conductive gold (Au) powder and a platinum (Pt) Connector, and protrudes from the first base film, and the shape thereof is a cylindrical shape. The method according to claim 6,
The first bonding pad is formed on the first contact bump and is formed of a conductive material of the same Au material as the first bonding wire by being electrically connected through the first bonding wire. Test socket.

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