CN109752576B - Probe card device and signal transmission module thereof - Google Patents
Probe card device and signal transmission module thereof Download PDFInfo
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- CN109752576B CN109752576B CN201711057796.4A CN201711057796A CN109752576B CN 109752576 B CN109752576 B CN 109752576B CN 201711057796 A CN201711057796 A CN 201711057796A CN 109752576 B CN109752576 B CN 109752576B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe card device and a signal transmission module thereof. The probe card device comprises a transfer board, a first carrier board, a second carrier board and a plurality of rectangular probes. A plurality of metal balls are arranged on the first plate surface of the adapter plate. The first carrier is formed with a plurality of first through holes corresponding to the plurality of metal balls along a first direction perpendicular to the first plate surface. The second carrier is formed with a plurality of second through holes which are arranged in a staggered way with the plurality of first through holes. Each rectangular probe has a first contact section and a second contact section on opposite sides. The first contact sections penetrate through the first through holes and are respectively connected with the metal balls. In each rectangular probe, the first contact section is provided with a recognition part which is asymmetrical relative to the first contact section, and at least part of the first contact section is connected with the corresponding metal ball along a second direction which is not parallel to the first direction. Therefore, the contact area between the first contact section and the metal ball can be effectively increased, and the bonding force between the rectangular probe and the adapter plate is strengthened.
Description
Technical Field
The present invention relates to a probe card, and more particularly, to a probe card apparatus and a signal transmission module thereof.
Background
When the semiconductor chip is tested, the test equipment is electrically connected with the object to be tested through a probe card device, and the test result of the object to be tested is obtained through signal transmission and signal analysis. The conventional probe card device is provided with a plurality of probes arranged corresponding to the electrical contacts of the object to be tested, so that the probes can simultaneously contact the corresponding electrical contacts of the object to be tested.
More specifically, the probe card device includes a circular probe and a rectangular probe, and the shape of the rectangular probe can be designed according to the needs of the designer. After the rectangular probe is inserted and fixed on the probe seat, the rectangular probe needs to be combined with a signal adapter plate so as to transmit a measured signal to a test machine table by utilizing the wiring of the signal adapter plate.
However, the contact effect between the pin tail of the rectangular probe and the electrical contact (such as a metal solder ball or a copper ball) of the signal adapting board is not good, and the problems of poor bonding force, excessive contact resistance, noise in signal transmission, etc. often occur. Moreover, the orientation of the rectangular probe in the probe seat (such as the bending direction or the fixing position of the tenon) is not easy to be identified, thereby reducing the manufacturing efficiency and quality of the probe card device.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
Embodiments of the present invention provide a probe card device and a signal transmission module thereof, which can effectively overcome the defects possibly generated by the conventional probe card device.
The embodiment of the invention discloses a probe card device, which comprises an adapter plate, a first carrier plate, a second carrier plate and a plurality of rectangular probes. The adapter plate is provided with a first plate surface and a second plate surface which are positioned on opposite sides, and a plurality of metal balls are arranged on the first plate surface of the adapter plate; the first carrier is provided with a plurality of first through holes, and the positions of the first through holes correspond to the metal balls along a first direction vertical to the first board surface; a plurality of second through holes are formed on the second carrier plate, and the plurality of second through holes are arranged in a staggered manner with the plurality of first through holes respectively; a plurality of rectangular probes are mounted on the first carrier plate and the second carrier plate, and each rectangular probe is provided with a first contact section and a second contact section which are positioned on opposite sides; the first contact sections of the rectangular probes respectively penetrate through the first through holes of the first carrier and are respectively connected to the metal balls, and the second contact sections of the rectangular probes respectively penetrate through the second through holes of the second carrier and are used for contacting a wafer to be tested; in each rectangular probe, the first contact section is provided with an identification part, the identification part is asymmetrical relative to the first contact section, and at least part of the first contact section is connected to the corresponding metal ball along a second direction which is not parallel to the first direction.
Preferably, in each of the rectangular probes, the rectangular probe has a middle section located between the first contact section and the second contact section and a locking part extending from the middle section, and the middle section is located between the first carrier plate and the second carrier plate; the relative positions of the tenon clamping part and the identification part of each rectangular probe are the same.
Preferably, in each of the rectangular probes, the identification portion includes an inclined surface, a normal vector of the inclined surface is parallel to the second direction, and the inclined surface is connected to the corresponding metal ball along the second direction.
Preferably, in each of the rectangular probes, an end portion of the first contact section defines a contact portion, the contact portion is inserted into the corresponding metal ball, and at least a part of the contact portion is connected to the corresponding metal ball along the second direction.
Preferably, in each of the rectangular probes, the identification part is located on the contact part.
Preferably, in each of the rectangular probes, the length of the contact portion is at least 25% of the length of the first contact section, or the length of the contact portion is at least 25% of the height of the corresponding metal ball.
Preferably, in each of the rectangular probes, the contact portion is plated with a metal plating layer, and the material of the metal plating layer is the same as that of the corresponding metal ball.
The embodiment of the invention also discloses a signal transmission module of the probe card device, which comprises an adapter plate and a plurality of rectangular probes. The adapter plate is provided with a first plate surface and a second plate surface which are positioned on opposite sides, a plurality of metal balls are arranged on the first plate surface of the adapter plate, and a first direction vertical to the first plate surface is defined by the adapter plate; each of the plurality of rectangular probes has a first contact section and a second contact section on opposite sides; wherein the first contact sections of the plurality of rectangular probes are respectively connected to the plurality of metal balls; in each rectangular probe, the first contact section is provided with an identification part, the identification part is asymmetrical relative to the first contact section, and at least part of the first contact section is connected to the corresponding metal ball along a second direction which is not parallel to the first direction.
Preferably, in each of the rectangular probes, the rectangular probe has a middle section located between the first contact section and the second contact section, and a tenon portion extending from the middle section; the relative positions of the tenon clamping part and the identification part of each rectangular probe are the same.
Preferably, in each of the rectangular probes, a terminal portion of the first contact section defines a contact portion, the contact portion is inserted into the corresponding metal ball, and at least a part of the contact portion is connected to the corresponding metal ball along the second direction, and a length of the contact portion is at least 25% of a length of the first contact section, or the length of the contact portion is at least 25% of a height of the corresponding metal ball.
In summary, the probe card device and the signal transmission module thereof according to the embodiments of the invention can connect the first contact section to the corresponding metal ball at least partially along a second direction that is not parallel to the first direction, so that the contact area between the first contact section and the metal ball is effectively increased, thereby effectively enhancing the bonding force between the rectangular probe and the interposer, effectively reducing the contact resistance between the rectangular probe and the interposer, and effectively improving the reliability of signal transmission.
Furthermore, the probe card device and the signal transmission module thereof disclosed by the embodiment of the invention can make the rectangular probes pass through the probe seat and identify whether the action directions of each rectangular probe and other rectangular probes are consistent or not through the identification part after the rectangular probes are arranged on the probe seat, so that the manufacturing efficiency and quality of the probe card device are greatly improved.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic perspective view of a probe card apparatus according to an embodiment of the invention.
FIG. 2 is a schematic cross-sectional view of FIG. 1 taken along line II-II.
Fig. 3 is a schematic cross-sectional view of a rectangular probe according to an embodiment of the present invention, in which the recognition portion and the contact portion are configured to be separated from each other.
FIG. 4 is a cross-sectional view of a rectangular probe with a recessed contact portion according to an embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a rectangular probe with a bump-shaped contact portion according to an embodiment of the invention.
FIG. 6 is a cross-sectional view of a rectangular probe with a preferred ratio of the length of the contact portion to the length of the contact segment or the height of the metal ball according to an embodiment of the present invention.
Fig. 7 is a schematic cross-sectional view illustrating a contact portion of a rectangular probe is plated with a metal layer according to an embodiment of the present invention.
Detailed Description
Referring to fig. 1 to 7, it should be noted that, in the embodiment of the present invention, relevant numbers and shapes mentioned in the corresponding drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate understanding of the content of the present invention, and are not used for limiting the scope of the present invention.
Referring to fig. 1, the present embodiment discloses a probe card apparatus 100, which includes an adapter plate 1, a probe holder 2, and a plurality of rectangular probes 3. The probe holder 2 includes a first carrier 21(upper die) and a second carrier 22(lower die), the first carrier 21 and the second carrier 22 are disposed at an interval, two ends of the plurality of rectangular probes 3 respectively penetrate through the first carrier 21 and the second carrier 22, and one ends of the plurality of rectangular probes 3 penetrating through the first carrier 21 are respectively electrically connected to the adapter board 1. In addition, the probe seat 2 may also be provided with a spacing plate (not shown) between the first carrier 21 and the second carrier 22, but the invention is not limited thereto.
It should be noted that, for the convenience of understanding of the present embodiment, the drawings only show a partial structure of the probe card apparatus 100 (e.g., a single rectangular probe 3 and its corresponding adapter plate 1 and probe base 2), so as to clearly show the structure and connection relationship of each component of the probe card apparatus 100. The configuration of each component of the probe card device 100 of the present embodiment and the connection relationship thereof will be described separately below.
As shown in fig. 1 and 2, the adapter Board 1 is a Signal Transfer Board (STB) in this embodiment. The interposer 1 has a first board surface 11 and a second board surface 12 located on opposite sides, wherein the first board surface 11 of the interposer 1 can be electrically connected to the rectangular probes 3, the second board surface 12 of the interposer 1 can be electrically connected to a circuit board (not shown), and the interposer 1 can be used to arbitrarily enlarge or reduce a corresponding ratio or a distribution range of electrical contacts (not numbered) between the circuit board and the rectangular probes 3, that is, the distribution range of the electrical contacts between the circuit board and the interposer 1 can be larger or smaller than the distribution range of the electrical contacts between the rectangular probes 3 and the interposer 1. More specifically, as shown in fig. 2, the interposer 1 has a plurality of metal balls 13 (e.g., copper balls or solder balls) disposed on the first board surface 11, and the first board surface 11 of the interposer 1 is electrically connected to the plurality of rectangular probes 3 through the plurality of metal balls 13. Preferably, the metal balls 13 are substantially slab-shaped bumps (or hemispheres), and the material structure of the metal balls is copper (Cu), nickel (Ni), and gold (Au) in sequence from inside to outside. In more detail, the metal ball 13 is a metal Pad (Pad) on the C4 layer of the interposer 1, but the invention is not limited thereto.
As shown in fig. 2, a plurality of first through holes 211 are formed in the first carrier 21 of the probe holder 2, and the positions of the plurality of first through holes 211 approximately correspond to the plurality of metal balls 13 along a first direction D1 perpendicular to the first board surface 11, respectively. The second carrier 22 is substantially parallel to the first carrier 21, the second carrier 22 has a plurality of second through holes 221, and the plurality of second through holes 221 are substantially staggered with the plurality of first through holes 211. Wherein, each first through hole 211 has a first aperture (not numbered), and each second through hole 221 has a second aperture (not numbered) not larger than the first aperture.
In the present embodiment, the plurality of rectangular probes 3 are all conductive and have a flexible straight strip structure. The cross section of each rectangular probe 3 is substantially rectangular (including square), and the material of each rectangular probe 3 may be, for example, gold (Au), silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), or an alloy thereof, and the material of the rectangular probe 3 is preferably at least one of copper, a copper alloy, a nickel-cobalt alloy, a palladium-nickel alloy, a nickel-manganese alloy, a nickel-tungsten alloy, a nickel-phosphorus alloy, and a palladium-cobalt alloy, but the rectangular probe 3 of the present invention is not limited to the above materials.
The plurality of rectangular probes 3 are mounted on the first carrier 21 and the second carrier 22 and arranged in a substantially matrix shape. Each rectangular probe 3 has a first contact section 31 and a second contact section 32 on opposite sides, and an intermediate section 33 between the first contact section 31 and the second contact section 32. The first contact sections 31 of the rectangular probes 3 respectively penetrate through the first through holes 211 of the first carrier 21 and are connected to the metal balls 13, and the second contact sections 32 of the rectangular probes 3 respectively penetrate through the second through holes 221 of the second carrier 22 and are used for contacting a wafer to be tested (not shown).
It should be noted that although the rectangular probes 3 and the adapter plate 1 of the present embodiment are described as being associated with the probe seat 2, the practical application of the rectangular probes 3 and the adapter plate 1 is not limited thereto. For example, the rectangular probe 3 and the interposer 1 can be combined with each other to form a signal transmission module and applied to various types of probe card apparatuses 100. Furthermore, although the rectangular probe 3 of the present embodiment is described as being manufactured by using Micro Electro Mechanical Systems (MEMS) technology, the rectangular probe 3 is not limited to this in actual manufacturing. In other words, the rectangular probe 3 can be manufactured by other process technologies.
Since the plurality of rectangular probes 3 of the present embodiment have substantially the same structure, the drawings and the following description exemplify a single rectangular probe 3, but the present invention is not limited thereto. For example, in the embodiment not shown in the present invention, the plurality of rectangular probes 3 may have different structures.
Referring to fig. 2, the first contact segment 31 of the rectangular probe 3 is provided with a recognition portion 311, and the recognition portion 311 is asymmetric with respect to the first contact segment 31, and at least a part of the first contact segment 31 is connected to the corresponding metal ball 13 along a second direction D2 that is not parallel to the first direction D1.
Therefore, the probe card apparatus 100 can be connected to the corresponding metal balls 13 through at least a portion of the first contact section 31 along a second direction D2 that is not parallel to the first direction D1, so that the contact area between the first contact section 31 and the metal balls 13 is effectively increased, thereby effectively enhancing the bonding force between the rectangular probe 3 and the interposer 1, effectively reducing the contact resistance between the rectangular probe 3 and the interposer 1, and effectively improving the reliability of signal transmission.
Moreover, the probe card apparatus 100 can use the first contact section 31 to be provided with the identification portion 311, and the identification portion 311 is configured to be asymmetric with respect to the first contact section 31, so that after the rectangular probes 3 are inserted into the probe holder 2, the identification portion 311 can identify whether the actuation directions of each rectangular probe 3 and the other rectangular probes 3 are the same, thereby greatly improving the manufacturing efficiency and quality of the probe card apparatus 100.
Further, the rectangular probe 3 has a tenon portion 331 extending from the middle section 33, and the tenon portion 331 can be used to abut against the first carrier plate 21 or the second carrier plate 22, thereby limiting the space for the rectangular probe 3 to move up and down relative to the probe seat 2. The relative positions of the tenon portion 331 and the identification portion 311 of the rectangular probe 3 are the same.
After the rectangular probe 3 is inserted into the probe seat 2, the middle section 33 and the locking part 331 of the rectangular probe 3 are blocked by the first carrier plate 21 or the second carrier plate 22, so that it is difficult to confirm whether the locking part 331 is fixed at the correct position and whether the middle section 33 is bent in the correct direction.
In view of the above-mentioned drawbacks, the probe card apparatus 100 according to the embodiment of the invention can make the fixing position of the tenon 331 and the bending direction of the middle section 33 be confirmed by the orientation of the identification part 311 by the structural design that the relative positions of the tenon 331 and the identification part 311 of the rectangular probe 3 are the same.
It should be noted that although the rectangular probe 3 has the tenon 331 extending from the middle section 33 in the embodiment, the invention is not limited thereto. For example, the rectangular probe 3 may not have the tenon portion 331.
More specifically, the identification portion 311 of the rectangular probe 3 includes a slope, a normal vector (not numbered) of the slope is parallel to the second direction D2, and the slope is connected to the corresponding metal ball 13 along the second direction D2. In the present embodiment, the end portion of the first contact section 31 of the rectangular probe 3 is defined as a contact portion 312, the contact portion 312 is inserted into the corresponding metal ball 13 (the insertion manner may be a joggle or a joggle), and at least a part of the contact portion 312 is connected to the corresponding metal ball 13 along the second direction D2. In other words, in the present embodiment, the identification portion 311 is located on the contact portion 312, but the present invention is not limited thereto. For example, the identification portion 311 and the contact portion 312 may be separated from each other, and the identification portion 311 may be asymmetric with respect to the first contact section 31 (e.g., a small bump protruding from the first contact section 31 in fig. 3 to 5), and the contact portion 312 may be asymmetric with respect to the first contact section 31 (e.g., a slope in fig. 3) or symmetric (e.g., a groove in fig. 4 or a bump in fig. 5). In addition, the shapes of the recognition portion 311 and the contact portion 312 of the present embodiment may be processed by photolithography and electroplating, or by laser, which is not limited in the present invention.
Therefore, the probe card apparatus 100 can be inserted into the corresponding metal balls 13 through the contact portions 312 (the insertion manner may be jogged or embedded), and at least part of the contact portions 312 are connected to the corresponding metal balls 13 along the second direction D2, so that the rectangular probes 3 and the interposer 1 have good fixing effect (not easy to slip) and low contact resistance, thereby improving the quality and the service life of the probe card apparatus 100.
Referring to fig. 6, in the present embodiment, the length L1 of the contact portion 312 has a preferable ratio range. More specifically, the length L1 of the contact portion 312 is at least 25% of the length L2 of the first contact section 31, or the length L1 of the contact portion 312 is at least 25% of the height H of the corresponding metal ball 13, but the present invention is not limited thereto.
Referring to fig. 7, in order to improve the bonding force between the contact portion 312 of the rectangular probe 3 and the metal ball 13 of the interposer 1, the contact portion 312 is preferably plated with a metal plating layer 313, and the material of the metal plating layer 313 is the same as the material (e.g., copper or tin) of the corresponding metal ball 13.
[ technical effects of embodiments of the present invention ]
In summary, the probe card apparatus 100 and the signal transmission module thereof according to the embodiment of the invention can connect the first contact section 31 to the corresponding metal ball 13 at least partially along a second direction D2 that is not parallel to the first direction D1, so that the contact area between the first contact section 31 and the metal ball 13 is effectively increased, thereby effectively strengthening the bonding force between the rectangular probe 3 and the interposer 1, effectively reducing the contact resistance between the rectangular probe 3 and the interposer 1, and effectively improving the reliability of signal transmission.
Furthermore, the probe card apparatus 100 and the signal transmission module thereof disclosed in the embodiment of the present invention can make the rectangular probes 3 penetrate through the probe holder 2 by the recognition portion 311 after the rectangular probes 3 are arranged on the probe holder 2 through the first contact section 31 having the recognition portion 311 and the recognition portion 311 having the asymmetric structural design with respect to the first contact section 31, so as to identify whether the actuation directions of each rectangular probe 3 and the other rectangular probes 3 are the same, thereby greatly improving the manufacturing efficiency and quality of the probe card apparatus 100.
In addition, the probe card apparatus 100 and the signal transmission module thereof according to the embodiment of the invention can confirm the fixing position of the tenon portion 331 and the bending direction of the middle section 33 by the orientation of the identification portion 311 after the rectangular probe 3 is inserted into the probe holder 2 by the structural design that the relative positions of the tenon portion 331 and the identification portion 311 of the rectangular probe 3 are the same.
Finally, in the probe card apparatus 100 and the signal transmission module thereof according to the embodiment of the invention, the contact portion 312 of the rectangular probe 3 is plated with a metal plating layer 313, and the material of the metal plating layer 313 is the same as the material (e.g., copper or tin) of the corresponding metal ball 13, so as to improve the bonding force between the contact portion 312 of the rectangular probe 3 and the metal ball 13 of the interposer 1.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.
Claims (9)
1. A probe card apparatus, characterized in that the probe card apparatus comprises:
the adapter plate is provided with a first plate surface and a second plate surface which are positioned on opposite sides, and a plurality of metal balls are arranged on the first plate surface of the adapter plate;
a first carrier formed with a plurality of first through holes, the positions of the first through holes corresponding to the plurality of metal balls along a first direction perpendicular to the first board surface;
a second carrier plate, wherein a plurality of second through holes are formed, and the plurality of second through holes are respectively arranged in a staggered manner with the plurality of first through holes; and
a plurality of rectangular probes mounted on the first carrier and the second carrier, each of the rectangular probes having a first contact section and a second contact section on opposite sides; the first contact sections of the rectangular probes respectively penetrate through the first through holes of the first carrier and are respectively connected to the metal balls, and the second contact sections of the rectangular probes respectively penetrate through the second through holes of the second carrier and are used for contacting a wafer to be tested; in each rectangular probe, the end part of the first contact section is defined as a contact part, the contact part is inserted into the corresponding metal ball, and the length of the contact part is at least 25% of the length of the first contact section, or the length of the contact part is at least 25% of the height of the corresponding metal ball;
in each rectangular probe, the first contact section is provided with an identification part, the identification part is asymmetrical relative to the first contact section, and at least part of the first contact section is connected to the corresponding metal ball along a second direction which is not parallel to the first direction.
2. The probe card apparatus of claim 1, wherein each of the rectangular probes has an intermediate section between the first contact section and the second contact section and a locking tongue portion extending from the intermediate section, the intermediate section being located between the first carrier plate and the second carrier plate; the relative positions of the tenon clamping part and the identification part of each rectangular probe are the same.
3. The probe card apparatus of claim 2, wherein the identification portion of each of the rectangular probes comprises a slope, a normal vector of the slope is parallel to the second direction, and the slope is connected to the corresponding metal ball along the second direction.
4. The probe card apparatus according to any one of claims 1 to 3, wherein at least a part of the contact portion in each of the rectangular probes is connected to the corresponding metal ball along the second direction.
5. The probe card apparatus of claim 4, wherein in each of the rectangular probes, the identification portion is located on the contact portion.
6. The probe card apparatus of claim 4, wherein in each of the rectangular probes, the contact portion is plated with a metal plating layer, and the metal plating layer is made of the same material as that of the corresponding metal ball.
7. A signal transmission module of a probe card apparatus, the signal transmission module of the probe card apparatus comprising:
the adapter plate is provided with a first plate surface and a second plate surface which are positioned on opposite sides, a plurality of metal balls are arranged on the first plate surface of the adapter plate, and a first direction perpendicular to the first plate surface is defined by the adapter plate; and
a plurality of rectangular probes, each having a first contact section and a second contact section on opposite sides; wherein the first contact sections of the plurality of rectangular probes are respectively connected to the plurality of metal balls; in each rectangular probe, the end part of the first contact section is defined as a contact part, the contact part is inserted into the corresponding metal ball, and the length of the contact part is at least 25% of the length of the first contact section, or the length of the contact part is at least 25% of the height of the corresponding metal ball;
in each rectangular probe, the first contact section is provided with an identification part, the identification part is asymmetrical relative to the first contact section, and at least part of the first contact section is connected to the corresponding metal ball along a second direction which is not parallel to the first direction.
8. The signal transmission module of the probe card device of claim 7, wherein in each of the rectangular probes, the rectangular probe has an intermediate section between the first contact section and the second contact section and a tenon portion extending from the intermediate section; the relative positions of the tenon clamping part and the identification part of each rectangular probe are the same.
9. The signal transmission module of the probe card device according to claim 7 or 8, wherein in each of the rectangular probes, at least a part of the contact portion is connected to the corresponding metal ball along the second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057796.4A CN109752576B (en) | 2017-11-01 | 2017-11-01 | Probe card device and signal transmission module thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057796.4A CN109752576B (en) | 2017-11-01 | 2017-11-01 | Probe card device and signal transmission module thereof |
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| Publication Number | Publication Date |
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| CN109752576A CN109752576A (en) | 2019-05-14 |
| CN109752576B true CN109752576B (en) | 2021-01-08 |
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| CN201711057796.4A Active CN109752576B (en) | 2017-11-01 | 2017-11-01 | Probe card device and signal transmission module thereof |
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| CN111351970B (en) * | 2020-05-08 | 2022-05-10 | 沈阳圣仁电子科技有限公司 | Vertical probe card for making multiple probes have uniform elasticity |
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| CN101490570A (en) * | 2006-01-03 | 2009-07-22 | 佛姆法克特股份有限公司 | A probe array structure and a method of making a probe array structure |
| CN203849368U (en) * | 2013-12-31 | 2014-09-24 | 标准科技股份有限公司 | Probe card and test machine |
| WO2016146476A1 (en) * | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Testing head with vertical probes, particularly for high frequency applications |
| TW201636622A (en) * | 2015-03-13 | 2016-10-16 | 探針科技公司 | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
| CN107037243A (en) * | 2016-02-03 | 2017-08-11 | 京元电子股份有限公司 | Probe card assembling structure, assembling method thereof and method for taking out broken pins |
| TWI596346B (en) * | 2016-08-24 | 2017-08-21 | 中華精測科技股份有限公司 | Probe device of vertical probe card |
| CN207408451U (en) * | 2017-11-01 | 2018-05-25 | 中华精测科技股份有限公司 | Probe card device and its signal transmission module and rectangular probe |
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2017
- 2017-11-01 CN CN201711057796.4A patent/CN109752576B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101490570A (en) * | 2006-01-03 | 2009-07-22 | 佛姆法克特股份有限公司 | A probe array structure and a method of making a probe array structure |
| CN203849368U (en) * | 2013-12-31 | 2014-09-24 | 标准科技股份有限公司 | Probe card and test machine |
| WO2016146476A1 (en) * | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Testing head with vertical probes, particularly for high frequency applications |
| TW201636622A (en) * | 2015-03-13 | 2016-10-16 | 探針科技公司 | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
| CN107037243A (en) * | 2016-02-03 | 2017-08-11 | 京元电子股份有限公司 | Probe card assembling structure, assembling method thereof and method for taking out broken pins |
| TWI596346B (en) * | 2016-08-24 | 2017-08-21 | 中華精測科技股份有限公司 | Probe device of vertical probe card |
| CN207408451U (en) * | 2017-11-01 | 2018-05-25 | 中华精测科技股份有限公司 | Probe card device and its signal transmission module and rectangular probe |
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| CN109752576A (en) | 2019-05-14 |
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