CN215005521U - Chip testing seat - Google Patents

Chip testing seat Download PDF

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Publication number
CN215005521U
CN215005521U CN202121056401.0U CN202121056401U CN215005521U CN 215005521 U CN215005521 U CN 215005521U CN 202121056401 U CN202121056401 U CN 202121056401U CN 215005521 U CN215005521 U CN 215005521U
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China
Prior art keywords
test
test piece
chip
piece
contact
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CN202121056401.0U
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Chinese (zh)
Inventor
宁丽娟
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Shenzhen Furuida Electronics Co ltd
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Shenzhen Furuida Electronics Co ltd
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Priority to CN202121056401.0U priority Critical patent/CN215005521U/en
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Abstract

The utility model relates to an electronic chip tests technical field, in particular to chip test seat, be in including test seat main part and even setting a plurality of groups test piece subassembly of test seat main part, wherein, every group test piece subassembly is all including first test piece and second test piece at least, first test piece and second test piece set up side by side along X axle horizontal direction in the test seat main part, and the outward appearance of first test piece and second test piece all scribbles insulating material. Through setting up first test piece and second test piece on the test seat main part along X axle horizontal direction side by side, be convenient for first test piece and second test piece install in the test seat main part, also make the structure of test seat simple more, compact, and also be convenient for first test piece and the installation and the change of second test piece more, in addition, the outward appearance of first test piece and second test piece all scribbles insulating material, prevent to switch on each other between first test piece and the second test piece, realize electronic chip's kelvin test method.

Description

Chip testing seat
Technical Field
The utility model relates to an electronic chip tests technical field, in particular to chip test seat.
Background
Along with the rapid development of modern electronic products, an electronic chip is taken as an important composition core, quality detection control becomes stricter in the production and processing processes, in the actual detection process, the electronic chip is placed in a limiting frame by a test fixture through an automatic production line and is pressed by applying force, and the electronic chip is communicated with a detection circuit through a test elastic sheet, so that the performance detection of the electronic chip is realized.
At present, most of detection devices for electronic chips adopt the kelvin test method to perform chip performance test, which is also called as four-terminal detection (4T detection), four-wire detection or 4-point probe method, and is an electrical impedance measurement technology, and a single pair of current-carrying and voltage-carrying detection electrodes are used, so that more accurate measurement can be performed compared with the traditional two-terminal (2T) sensing, and the kelvin four-wire detection is used for some ohm meters and impedance analyzers, and can also be used for measuring the resistance of thin layers of films or chips in the wiring configuration of a precision strain gauge and a resistance thermometer.
In the prior art, a metal sheet is often used to connect an electronic chip and a detection circuit, so as to realize kelvin testing for the electronic chip. Because a pin of the chip needs to contact two metal sheets for contact so as to realize multi-contact testing, but the existing metal sheets mostly adopt a laminated structure design, the structure of the testing seat is complex and not compact enough, and the metal sheets are inconvenient to replace.
Therefore, how to design a chip testing socket with a simple and compact structure becomes a technical problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defects of the prior art, the present invention provides a chip testing socket to solve the problems proposed in the above-mentioned background art.
The utility model provides a technical scheme that problem among the prior art adopted does: the utility model provides a chip test seat, is in including test seat main part and even setting a plurality of groups test piece subassembly of test seat main part, wherein, every group test piece subassembly all is including first test piece and second test piece at least, first test piece and second test piece set up side by side along X axle horizontal direction in the test seat main part, and scribble insulating material between first test piece and the second test piece.
As the utility model discloses a preferred scheme, first test strip and second test strip are equallyd divide and are do not including the test strip main part, be used for with the first contact jaw of chip contact and be used for with the second contact jaw of PCB board contact, the test strip main part is located in the test seat main part, first contact jaw and second contact jaw are for the part that extends to both sides from the test piece main part along Y axle horizontal direction, wherein, the first contact jaw of first test strip and second test strip sets up along Y axle horizontal direction symmetry, the second contact jaw of first test strip and second test strip sets up along Y axle horizontal direction fault.
As a preferred embodiment of the present invention, the first contact end is provided with a first protrusion convenient for contacting with the chip on the end surface contacting with the chip.
As the utility model discloses a preferred scheme, first contact jaw is equipped with the inclined plane at the terminal surface with the chip contact, and this inclined plane makes first contact jaw and chip contact point reduce, is convenient for better contact between first contact jaw and the chip.
As the utility model discloses a preferred scheme, first contact jaw is equipped with the second arch at the terminal surface of keeping away from the chip, the second is protruding right chip test seat is installed and is played the guiding orientation effect on outside casing.
As the preferred scheme of the utility model, the second contact jaw is including integrated into one piece's kink and contact site, the terminal surface of contact site keeps the level, is convenient for contact better with the PCB board.
As the preferred scheme of the utility model, be equipped with the stopper that is used for restricting first test piece and second test piece position in the test seat main part in the test piece main part.
As the utility model discloses a preferred scheme, the test seat main part is including dismantling lower casing and the last casing that links together go up casing or lower casing and go up the storage tank that runs through along Y axle horizontal direction and be provided with holding test piece main part.
As an optimized scheme of the utility model the storage tank is internally provided with stopper assorted spacing groove.
As the preferred scheme of the utility model, the preparation material of test piece subassembly is copper sheet, iron sheet or alloy piece.
Compared with the prior art, the utility model discloses following technological effect has:
the utility model provides a chip test seat, through setting up first test piece and second test piece on the test seat main part along X axle horizontal direction side by side, be convenient for first test piece and second test piece are installed in the test seat main part, also make the structure of test seat simple more, compact, and also be convenient for first test piece and second test piece's installation and change more, in addition, the outward appearance of first test piece and second test piece all scribbles insulating material, prevent to switch on each other between first test piece and the second test piece, realize electronic chip's kelvin test method.
Drawings
FIG. 1 is a schematic diagram of a chip test socket according to the present invention;
FIG. 2 is a block diagram of a test chip assembly in a chip test socket according to the present invention;
fig. 3 is an exploded view of a chip test socket according to the present invention;
fig. 4 is a structural diagram of a lower housing in a chip test socket according to the present invention.
Reference numbers in the figures:
10. a test socket body; 11. a lower housing; 12. an upper housing; 13. a containing groove; 14. a limiting groove; 15. positioning holes; 16. a positioning column; 17. a U-shaped groove;
20. a test piece assembly; 21. a first test piece; 22. a second test piece; 211. a test strip body; 212. a first contact end; 213. a second contact end; 214. a limiting block; 2121. a first protrusion; 2122. an inclined surface; 2123. a second protrusion; 2131. a bending section; 2132. a contact portion.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The chip testing socket provided by the application can be used for testing a chip, and it should be noted that the chip testing socket can be used for testing an electronic connector or other electronic components besides the chip, and the type of the electronic components is not limited herein.
As shown in figure 1: a chip testing seat comprises a testing seat main body 10 and a plurality of groups of testing sheet assemblies 20 which are uniformly arranged on the testing seat main body 10, wherein the number of the testing sheet assemblies 20 can be determined according to the number of pins of a chip to be tested, each group of testing sheet assemblies 20 at least comprises a first testing sheet 21 and a second testing sheet 22, and the first testing sheet 21 and the second testing sheet 22 are arranged on the testing seat main body 10 in parallel along the X-axis horizontal direction, so that the structure of the testing seat main body 10 is simpler and more compact, and meanwhile, the first testing sheet 21 and the second testing sheet 22 are more convenient to install and replace.
Further, the surfaces of the first test strip 21 and the second test strip 22 are coated with insulating materials, so that the first test strip 21 and the second test strip 22 are prevented from contacting with each other to cause short circuit. In other embodiments, the first test strip 21 and the second test strip 22 may be spaced apart from each other such that the first test strip 21 and the second test strip 22 are spaced apart from each other to prevent the first test strip 21 and the second test strip 22 from contacting each other.
In the present embodiment, the first test strip 21 and the second test strip 22 are used to test two contacts of one pin of the chip. In other embodiments, the test strip assembly 20 may further include a plurality of test strips such as a first test strip 21, a second test strip 22, a third test strip, etc. according to actual test requirements, and the specific number of the test strips is not limited herein.
Further, referring to fig. 2, each of the first test strip 21 and the second test strip 22 includes a test strip main body 211, a first contact end 212 for contacting with a chip, and a second contact end 213 for contacting with a PCB, the test strip main body 211 is disposed on the test socket main body 10, the first contact end 212 and the second contact end 213 are portions extending from the test strip main body to two sides along the Y-axis horizontal direction, wherein the first contact ends 212 of the first test strip 21 and the second test strip 22 are symmetrically disposed along the Y-axis horizontal direction, and the second contact ends 213 of the first test strip 21 and the second test strip 22 are staggered along the Y-axis horizontal direction.
In this embodiment, the test strip body 211, the first contact end 212, and the second contact end 213 can be integrally formed to reduce the manufacturing cost.
Further, the first contact end 212 is provided with a first bump 2121 at the end surface contacting with the chip for facilitating better contact with the chip.
Further, the first contact end 212 is provided with an inclined surface 2122 at an end surface contacting with the chip, and the inclined surface 2122 reduces the contact point between the first contact end 212 and the chip, so as to facilitate better contact between the first contact end 212 and the chip, and in this embodiment, the inclined surface 2122 is provided at an outer side of the first protrusion 2121.
Further, the first contact end 212 is provided with a second protrusion 2123 on an end surface away from the chip, and when the chip pin contacts the first contact end 212, the second protrusion 2123 serves as a guiding and positioning function for the chip testing socket to be mounted on the external housing.
As a preferred embodiment of the present invention, the second contact end 213 includes an integrally formed bending portion 2131 and a contact portion 2132, so that the second contact end 213 is in contact with the PCB.
Further, the end surface of the contact portion 2132 is kept horizontal, facilitating better contact with the PCB.
As the utility model discloses a preferred scheme, be equipped with the stopper 214 that is used for restricting first test piece 21 and second test piece 22 position on test seat main part 10 on the test piece main part 211, be convenient for first test piece 21 and second test piece 22 are installed on test piece main part 211, prevent that first test piece 21 and second test piece 22 from producing the displacement in the course of the work.
Referring to fig. 3 and 4, the test socket main body 10 includes a lower housing 11 and an upper housing 12 detachably connected together, and a receiving groove 13 for receiving the test strip main body 211 is formed in the upper housing 12 or the lower housing 11 along a Y-axis horizontal direction.
Further, one of the lower casing 11 and the upper casing 12 is provided with a positioning hole 15, the other one of the lower casing 11 and the upper casing 12 is provided with a positioning post 16, the lower casing 11 and the upper casing 12 are assembled together through the positioning hole 15 and the positioning block and can be fixed by screws, the structure is convenient for disassembling the test socket main body 10, and the assembling and replacing efficiency of the first test piece 21 and the second test piece 22 is improved.
As the preferred embodiment of the present invention, a limiting groove 14 is provided in the accommodating groove 13 and is matched with the limiting block 214.
Further, two sides of the limiting groove 14 are provided with U-shaped grooves 17, and the U-shaped grooves 17 facilitate replacement of the first test piece 21 and the second test piece 22.
As a preferred embodiment of the present invention, the material for making the test strip assembly 20 is copper sheet, iron sheet or alloy sheet.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The chip testing seat is characterized by comprising a testing seat main body and a plurality of groups of testing piece assemblies which are uniformly arranged on the testing seat main body, wherein each group of testing piece assemblies at least comprises a first testing piece and a second testing piece, the first testing piece and the second testing piece are arranged on the testing seat main body in parallel along the horizontal direction of an X axis, and the outer surfaces of the first testing piece and the second testing piece are coated with insulating materials.
2. The chip test socket according to claim 1, wherein: the first test piece and the second test piece are respectively provided with a test piece main body, a first contact end used for being in contact with a chip and a second contact end used for being in contact with a PCB, the test piece main body is arranged on the test seat main body, the first contact end and the second contact end are parts extending from the test piece main body to two sides along the Y-axis horizontal direction, the first contact ends of the first test piece and the second test piece are symmetrically arranged along the Y-axis horizontal direction, and the second contact ends of the first test piece and the second test piece are arranged in a staggered mode along the Y-axis horizontal direction.
3. The chip test socket according to claim 2, wherein: the first contact end is provided with a first bump convenient for contacting the chip on the end surface contacting the chip.
4. The chip test socket according to claim 2, wherein: the first contact end is provided with an inclined surface on the end surface contacted with the chip, and the inclined surface reduces the contact points of the first contact end and the chip, so that the first contact end is better contacted with the chip.
5. The chip test socket according to claim 2, wherein: the end face, far away from the chip, of the first contact end is provided with a second bulge, and the second bulge plays a role in guiding and positioning the chip test seat on an external shell.
6. The chip test socket according to claim 2, wherein: the second contact end comprises a bending part and a contact part which are integrally formed, and the end face of the contact part is kept horizontal, so that the second contact end can be better contacted with a PCB.
7. The chip test socket according to claim 2, wherein: the test piece main body is provided with a limiting block for limiting the positions of the first test piece and the second test piece on the test seat main body.
8. The chip test socket according to claim 7, wherein: the test seat main body comprises a lower shell and an upper shell which are detachably connected together, and an accommodating groove for accommodating the test piece main body is arranged on the upper shell or the lower shell in a penetrating manner along the Y-axis horizontal direction.
9. The chip test socket according to claim 8, wherein: and a limiting groove matched with the limiting block is arranged in the accommodating groove.
10. The die test socket according to any one of claims 1 to 9, wherein: the test piece assembly is made of copper sheets, iron sheets or alloy sheets.
CN202121056401.0U 2021-05-17 2021-05-17 Chip testing seat Active CN215005521U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121056401.0U CN215005521U (en) 2021-05-17 2021-05-17 Chip testing seat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121056401.0U CN215005521U (en) 2021-05-17 2021-05-17 Chip testing seat

Publications (1)

Publication Number Publication Date
CN215005521U true CN215005521U (en) 2021-12-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121056401.0U Active CN215005521U (en) 2021-05-17 2021-05-17 Chip testing seat

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Country Link
CN (1) CN215005521U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114545211A (en) * 2022-04-25 2022-05-27 江铃汽车股份有限公司 Packaged chip antistatic capability detection system
CN116990656A (en) * 2023-09-27 2023-11-03 苏州朗之睿电子科技有限公司 Test piece for semiconductor tester and preparation method thereof
CN117590205A (en) * 2024-01-19 2024-02-23 苏州朗之睿电子科技有限公司 Chip tester, manufacturing method thereof and chip testing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114545211A (en) * 2022-04-25 2022-05-27 江铃汽车股份有限公司 Packaged chip antistatic capability detection system
CN116990656A (en) * 2023-09-27 2023-11-03 苏州朗之睿电子科技有限公司 Test piece for semiconductor tester and preparation method thereof
CN116990656B (en) * 2023-09-27 2023-12-12 苏州朗之睿电子科技有限公司 Test piece for semiconductor tester and preparation method thereof
CN117590205A (en) * 2024-01-19 2024-02-23 苏州朗之睿电子科技有限公司 Chip tester, manufacturing method thereof and chip testing device
CN117590205B (en) * 2024-01-19 2024-04-05 苏州朗之睿电子科技有限公司 Chip tester, manufacturing method thereof and chip testing device

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