CN220626582U

CN220626582U - Test spring plate and test device

Info

Publication number: CN220626582U
Application number: CN202322033605.8U
Authority: CN
Inventors: 曾伍平
Original assignee: Shenzhen Ruixinhui Technology Co ltd
Current assignee: Shenzhen Ruixinhui Technology Co ltd
Priority date: 2023-07-31
Filing date: 2023-07-31
Publication date: 2024-03-19
Anticipated expiration: 2033-07-31

Abstract

The utility model relates to the technical field of electronic chip testing, in particular to a test spring and a test device, which comprise a test structure, a connecting structure and a fixing structure, wherein the test structure, the connecting structure and the fixing structure are sequentially connected along a first direction; and the test structure comprises a contact part and a supporting part, the contact part and the supporting part are arranged along a second direction, one ends of the contact part and the supporting part are respectively connected with the connecting structure, a first buffer groove with an opening is formed between the other ends of the contact part and the supporting part, one side, away from the contact part, of the supporting part is used for receiving external force, one end, away from the connecting structure, of the contact part is used for contacting with a pin, and the first direction and the second direction are mutually perpendicular. The test shrapnel has long service life.

Description

Test spring plate and test device

Technical Field

The utility model relates to the technical field of electronic chip testing, in particular to a test spring and a test device.

Background

Along with the rapid development of modern electronic products, electronic chips serve as important constituent cores, quality detection and control are becoming more and more strict in the production and processing processes, and in the actual detection process, the electronic chips are placed in a limiting frame by a test fixture and are pressed by force through an automatic production line, and the electronic chips are communicated with a detection circuit through a test elastic sheet, so that performance detection of the electronic chips is realized.

Currently, the electronic chip testing device mostly adopts a kelvin testing method to perform performance testing of the chip, which is also called four-terminal testing (4T testing), four-wire testing or 4-point probe method, and is an electrical impedance measuring technology, and uses separate opposite current and voltage testing electrodes, so that compared with the traditional two-terminal (2T) sensing, the kelvin four-wire testing can perform more accurate measurement, and is used for some ohm meters and impedance analyzers, and can also be used for measuring the thin layer of a film or the resistance of the chip in the wiring configuration of a precision strain gauge and a resistance thermometer.

In the prior art, a metal spring plate is mostly adopted to perform contact test with a pin of an electronic chip. In particular, the contact portion of the metal spring plate is moved towards the direction close to the pin by an external force, so that the metal spring plate is contacted with the pin, however, because the pin is placed at each time, if the metal spring plate is contacted with the pin, the external force is applied to the metal spring plate, and the metal spring plate is easy to deform or break.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a testing spring and a testing device, so as to solve the above-mentioned problems in the prior art.

The utility model solves the problems in the prior art by adopting the technical scheme that: the test elastic sheet comprises a test structure, a connecting structure and a fixing structure, wherein the test structure, the connecting structure and the fixing structure are sequentially connected along a first direction; and

the test structure comprises a contact part and a supporting part, the contact part and the supporting part are arranged along a second direction, one ends of the contact part and the supporting part are respectively connected with the connecting structure, a first buffer groove with an opening is formed between the other ends of the contact part and the supporting part, one side, away from the contact part, of the supporting part is used for receiving external force, one end, away from the connecting structure, of the contact part is used for being contacted with a pin, and the first direction and the second direction are mutually perpendicular.

It can be seen that in the test shell fragment of this application, test structure is including contact portion and support and hold the portion to be provided with first dashpot between contact portion and the portion of supporting, and contact portion and the portion of supporting are all connected with connection structure, so when the portion of supporting accepts external force, contact portion and the portion of supporting can move towards the direction that is close to the pin simultaneously, but if after contact portion and the pin contact, still continue to move towards the direction that is close to contact portion to the portion of supporting, first dashpot can play the effect of buffering to the removal of supporting the portion, avoid test structure to warp or fracture, and then can improve test shell fragment's life.

As a preferable mode of the utility model, a guide inclined surface is arranged on one side of the abutting part far away from the contact part, and the guide inclined surface is used for receiving external force along a first direction so as to enable the abutting part to move towards the direction close to the contact part.

As a preferable mode of the utility model, one end of the contact part far away from the connecting structure extends towards a direction far away from the abutting part to form a contact end, and the contact end is used for contacting with a pin.

As a preferable mode of the utility model, the contact end comprises a side surface far away from one side of the abutting part and an end surface far away from one end of the connecting structure, and the connecting part between the side surface and the end surface is of an arc-shaped structure.

As a preferable scheme of the utility model, the test structure further comprises a bending part, two ends of the bending part are respectively connected with one end, close to the connecting structure, of the contact part and the supporting part, and the bending part is also connected with the connecting structure.

In a preferred embodiment of the present utility model, a side of the bending portion adjacent to the first buffer tank is arcuate.

As a preferred scheme of the utility model, the connecting structure comprises a first connecting part and a second connecting part, one end of the first connecting part is respectively connected with the contact part and the supporting part, the other end of the first connecting part is connected with the second connecting part, and an included angle is formed between the first connecting part and the second connecting part; and

one end of the second connecting part far away from the first connecting part is also connected with the fixing structure, and a second buffer groove with an opening is also formed between one end of the second connecting part close to the first connecting part and the fixing structure.

A test device comprising the test spring of any one of the above.

As a preferred scheme of the utility model, the test device comprises two test elastic pieces and a driving piece corresponding to each test elastic piece, and test structures in at least two test elastic pieces are oppositely arranged;

a containing cavity which is convenient for pin insertion is formed between the contact parts in the two test elastic sheets; and

each driving piece applies external force to the abutting part in the corresponding test elastic piece respectively, so that the contact part can move towards the direction close to the pin and abut against the pin.

As a preferable mode of the utility model, the testing device further comprises a moving plate capable of moving along the first direction, the driving piece is arranged on the moving plate, the moving plate is used for supporting the chip, and through holes for the pins of the chip to pass through are formed in the moving plate.

Drawings

FIG. 1 is a schematic diagram of a test spring according to the present utility model;

FIG. 2 is a schematic diagram of a testing apparatus according to the present utility model;

FIG. 3 is a second schematic diagram of a testing apparatus according to the present utility model.

Reference numerals in the drawings:

100. testing the spring plate; 110. a test structure; 111. a contact portion; 112. a holding portion; 113. a first buffer tank; 114. a guide slope; 115. a contact end; 116. a junction; 117. a bending part; 120. a connection structure; 121. a first connection portion; 122. a second connecting portion; 123. a second buffer tank; 130. a fixed structure;

200. a driving member; 300. a receiving chamber; 400. a moving plate; 500. pins.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The test elastic sheet provided by the application can be used for testing a chip, and it is noted that the test elastic sheet can be used for testing an electronic connector or other electronic components besides testing the chip, and the type of the electronic components is not limited.

As shown in fig. 1: a test spring comprises a test structure 110, a connecting structure 120 and a fixing structure 130, wherein the test structure 110, the connecting structure 120 and the fixing structure 130 are sequentially connected along a first direction. Wherein the test structure 110 is for contact with the pins 500 of the electronic chip, e.g. the test structure 110 may be for contact with the sidewalls of the pins 500. The connection structure 120 is used to connect the test structure 110 and the fixing structure 130. The fixing structure 130 is generally used for fixing the test spring 100 on a base of the test device, and the fixing structure 130 is also used for electrically connecting with the PCB.

The first direction may be a vertical direction. The test spring 100 may be made of copper sheet, iron sheet or alloy sheet, that is, the test structure 110, the connection structure 120 and the fixing structure 130 in the test spring 100 may be made of copper sheet, iron sheet or alloy sheet.

In some embodiments, the test structure 110, the connection structure 120, and the fixing structure 130 may be integrally formed, which not only facilitates the processing of the test spring 100, but also improves the ductility, toughness, and electrical conductivity of the entire test spring 100, resulting in a longer service life of the test spring 100.

In other embodiments, the test structure 110, the connection structure 120, and the fixing structure 130 may also be assembled, such as by welding the test structure 110, the connection structure 120, and the fixing structure 130 together.

Further, the test structure 110 includes a contact portion 111 and an abutting portion 112, the contact portion 111 and the abutting portion 112 may extend along a first direction, that is, the contact portion 111 and the abutting portion 112 may be elongated structures, the contact portion 111 and the abutting portion 112 may be arranged in parallel along a second direction, the second direction may be a horizontal direction, one ends of the contact portion 111 and the abutting portion 112 are respectively connected with the connection structure 120, and a first buffer slot 113 having an opening is formed between the other ends of the contact portion 111 and the abutting portion 112. Wherein, one side of the abutting portion 112 away from the contact portion 111 is used for receiving an external force, one end of the contact portion 111 away from the connection structure 120 is used for contacting with the pin 500, and the first direction and the second direction are perpendicular to each other.

In the test, an external force is applied to the abutting portion 112 to enable the abutting portion 112 to move in a direction approaching to the contact portion 111, and since the abutting portion 112 and the contact portion 111 are both connected with the connecting structure 120, when the abutting portion 112 moves, the contact portion 111 and the abutting portion 112 move simultaneously under the action of the connecting structure 120 to enable the contact portion 111 to contact with the side wall of the pin 500, and at this time, if the abutting portion 112 continues to move in a direction approaching to the contact portion 111 after the contact portion 111 contacts the pin 500, the first buffer groove 113 arranged between the contact portion 111 and the abutting portion 112 can play a role of buffering the movement of the abutting portion 112, so that the deformation or fracture of the test structure 110 is avoided.

It can be seen that, in the test spring 100 of the present application, the test structure 110 includes the contact portion 111 and the abutting portion 112, and the first buffer slot 113 is disposed between the contact portion 111 and the abutting portion 112, and the contact portion 111 and the abutting portion 112 are both connected with the connection structure 120, so when the abutting portion 112 receives an external force, the contact portion 111 and the abutting portion 112 can move towards the direction close to the pin 500 at the same time, but if the contact portion 111 contacts the pin 500, the abutting portion 112 still continues to move towards the direction close to the contact portion 111, the first buffer slot 113 can play a role of buffering the movement of the abutting portion 112, so as to avoid deformation or fracture of the test structure 110, and further improve the service life of the test spring 100.

Alternatively, in some embodiments, a side of the abutting portion 112 away from the contact portion 111 is provided with a guiding inclined surface 114, and the guiding inclined surface 114 is used for receiving an external force along the first direction so as to move the abutting portion 112 towards a direction approaching the contact portion 111.

For example, the driving member 200 in the testing device can move along the first direction and act on the guiding inclined plane 114, and when the guiding inclined plane 114 receives the force applied by the driving member 200 in the first direction, the guiding inclined plane 114 can convert the force in the first direction into the force for moving the supporting portion 112 along the second direction, so that the supporting portion 112 receives the force along the second direction and further drives the contact portion 111 to move.

Optionally, in some embodiments, an end of the contact portion 111 remote from the connection structure 120 extends away from the abutment portion 112 to form a contact end 115, the contact end 115 being for contacting the pin 500. That is, the contact end 115 protrudes away from the abutting portion 112 relative to the contact portion 111, so that the distance that the contact portion 111 moves can be reduced during the contact process between the contact portion 111 and the pin 500, and further the deformation of the test spring 100 can be reduced, and the service life of the test spring 100 can be prolonged.

Further, the contact end 115 may include a side surface far from the side of the abutting portion 112 and an end surface far from one end of the connection structure 120, and the connection portion 116 between the side surface and the end surface is an arc structure, which facilitates the contact between the contact end 115 and the pin 500; and/or the contact end 115 may include a side surface far from the side of the abutting portion 112 and an end surface near to one end of the connection structure 120, where the connection 116 between the side surface and the end surface is an arc structure, and the arc structure facilitates the contact between the contact end 115 and the pin 500.

Optionally, in some embodiments, the test structure 110 may further include a bending portion 117, two ends of the bending portion 117 are respectively connected to the contact portion 111 and one end of the abutting portion 112 near the connecting structure 120, and the bending portion 117 is further connected to the connecting structure 120, where the bending portion 117 is beneficial to the abutting portion 112 to move in the first buffer slot 113 relative to the contact portion 111, so as to avoid deformation or fracture of the connecting position between the abutting portion 112 and the connecting structure 120 during the movement of the abutting portion 112.

Preferably, the side of the bending portion 117 near the first buffer groove 113 is in an arc shape, which can reduce stress on the bending portion 117 when the abutting portion 112 moves relative to the contact portion 111, so as to avoid deformation or fracture of a connection position between the abutting portion 112 and the bending portion 117.

Referring to fig. 1, the connection structure 120 includes a first connection portion 121 and a second connection portion 122, one end of the first connection portion 121 is connected with the contact portion 111 and the supporting portion 112, the other end of the first connection portion 121 is connected with the second connection portion 122, an included angle is formed between the first connection portion 121 and the second connection portion 122, one end of the second connection portion 122, which is far away from the first connection portion 121, is further connected with the fixing structure 130, a second buffer slot 123 with an opening is further formed between one end of the second connection portion 122, which is close to the first connection portion 121, and the fixing structure 130, and the second buffer slot 123 plays a role of buffering in the contact process of the test structure 110 and the pin 500, so as to avoid deformation or fracture of a connection position between the connection structure 120 and the fixing structure 130, and reduce deformation or fracture of a connection position between the supporting portion 112 and the connection structure 120.

Specifically, when the abutting portion 112 and the contact portion 111 move towards the direction approaching the pin 500 under the action of the connection structure 120, the second buffer groove 123 can play a role in buffering the formation of the connection structure 120, and in addition, when the abutting portion 112 moves in the first buffer groove 113 relative to the contact portion 111, the second buffer groove 123 can also play a role in buffering the deformation of the abutting portion 112 and the connection structure 120, so that the service life of the test spring 100 can be prolonged.

In addition, referring to fig. 2, the present application further provides a testing device, including the testing spring plate 100 in the above embodiment, where the testing device is capable of implementing a test on an electronic chip by contacting the testing spring plate 100 with a pin 500 of the electronic chip.

Further, the testing device may include two testing spring plates 100 and driving members 200 corresponding to each testing spring plate 100, the testing structures 110 in at least two testing spring plates 100 are disposed opposite to each other, a receiving cavity 300 for facilitating insertion of the pin 500 is formed between the contact portions 111 in the two testing spring plates 100, and each driving member 200 applies an external force to the abutting portion 112 in the corresponding testing spring plate 100, so that the contact portion 111 can move in a direction approaching to the pin 500 and abut against the pin 500.

During testing, the pin 500 of the chip is inserted into the accommodating cavity 300 formed between the contact portions 111 of the two test spring plates 100, and then the driving member 200 applies a force to the corresponding supporting portions 112, respectively, and the contact portions 111 and the supporting portions 112 move towards the direction close to the pin 500 under the action of the connecting structure 120 and are supported on the side walls of the pin 500, and in addition, since the two test structures 110 are oppositely arranged, the two contact portions 111 can be supported on the opposite side walls of the pin 500.

In addition, referring to fig. 3, in some embodiments, the chip may be placed on the moving plate 400 provided with the driving member 200, and when the moving plate 400 moves in the first direction, the pins 500 may be inserted into the accommodating chambers 300, and at the same time, the driving member 200 may apply a force to the abutting portion 112.

In some embodiments, when the supporting portion 112 is provided with the guiding inclined surface 114, the driving member 200 and the moving plate 400 can act on the guiding inclined surface 114 during the moving process along the first direction, and apply a force to the guiding inclined surface 114.

Of course, in order to enable the chip pins 500 placed on the moving plate 400 to be inserted into the receiving cavities 300, through holes (not shown) through which the chip pins 500 pass may be provided on the moving plate 400.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The test elastic sheet is characterized by comprising a test structure, a connecting structure and a fixing structure, wherein the test structure, the connecting structure and the fixing structure are sequentially connected along a first direction; and

2. A test spring according to claim 1, wherein a guide inclined surface is provided on a side of the abutting portion away from the contact portion, the guide inclined surface being adapted to receive an external force in a first direction so as to move the abutting portion in a direction approaching the contact portion.

3. A test spring according to claim 1, wherein the end of the contact portion remote from the connection structure extends away from the abutment portion to form a contact end for contacting a pin.

4. A test spring according to claim 3, wherein the contact end comprises a side surface far from the side of the supporting part and an end surface far from one end of the connecting structure, and the connection part between the side surface and the end surface is an arc-shaped structure.

5. A test spring according to any one of claims 1 to 4, wherein the test structure further comprises a bending portion, two ends of the bending portion are connected to one end of the contact portion and the abutting portion, which is close to the connecting structure, respectively, and the bending portion is further connected to the connecting structure.

6. The test spring according to claim 5, wherein a side of the bending portion adjacent to the first buffer slot is arc-shaped.

7. A test spring according to any one of claims 1 to 4, wherein the connecting structure comprises a first connecting portion and a second connecting portion, one end of the first connecting portion is connected to the contact portion and the abutting portion, respectively, the other end of the first connecting portion is connected to the second connecting portion, and an included angle is formed between the first connecting portion and the second connecting portion; and

8. A test device comprising a test strip according to any one of claims 1 to 7.

9. A testing device according to claim 8, wherein the testing device comprises two testing spring plates and a driving member corresponding to each testing spring plate, and the testing structures in at least two testing spring plates are arranged oppositely;

10. The test device of claim 9, further comprising a movable plate movable in a first direction, wherein the driving member is disposed on the movable plate, wherein the movable plate is configured to support a chip, and wherein the movable plate is provided with a through hole through which a pin of the chip passes.