JP2005345443A - Contact pin for probe card and probe card employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact pin for probe cards with simply detachable by one and one, making stable electrical connection in recursive use possible and capable of absorbing difference of thermal expansion coefficient of each substrate, of probe cards inspecting semiconductor devices. <P>SOLUTION: The aforementioned contact pin 7 for probe card is comprised of a tip 71 inserted into a through-hole of the aforementioned sub-substrate, a first contact section 72 forcing elastic contact within the through-hole, a supporting section 73 supporting the first contact section concerned, a stopper section 74 abutting on the aforementioned sub-substrate and the aforementioned ST-B surface, a second contact section 75 forcing elastic contact within the through-hole of the aforementioned ST-B, and a third contact section 76 forcing elastic contact within the through-hole of the aforementioned ST-S. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a probe card connection pin for electrically connecting a plurality of substrates constituting a probe card for measuring electrical characteristics of a semiconductor device such as an LSI chip, and further using the probe card connection pin It relates to a probe card.

  Probe cards for measuring electrical characteristics of semiconductor devices such as LSI chips include a horizontal type called a cantilever type and a vertical type called a vertical type. Of these, the horizontal type probe card is not suitable for multi-chip simultaneous measurement due to the recent large-scale integration of LSI chips and the multiplexing of testers. On the other hand, the vertical type probe card is currently mainstream because more probes can be used, the degree of freedom of probe arrangement is high, and it is suitable for multichip simultaneous measurement.

  The vertical probe card includes a main board having electrodes connected to the electrodes of the measuring instrument, a space transformer having probes connected to the electrodes of the object to be inspected, and a sub board provided between the main board and the space transformer. And connecting pins are used for their electrical connection.

  In testing semiconductor devices such as LSI chips, it is required to measure a plurality of chips simultaneously, and even if the number of probe card electrodes used in recent years further increases, the stability of electrical contact is higher. High performance, high reliability probe card is required.

  As the connection pins for electrical connection between the substrates, as shown in FIG. 5, they are soldered and fixed to the second substrate (the space transformer) and contact the inner wall of the through hole of the first substrate (the sub substrate). Many of these types have been used (the main board is not shown). However, since this type of connection pin cannot be removed from the second substrate (space transformer) even if it is attempted to change the substrate configuration of the probe card in accordance with the type of semiconductor device to be inspected, the configuration that can be supported is limited. In addition, there is a disadvantage that only the corresponding connection pin cannot be removed and the entire second board (space transformer) needs to be replaced when an accident such as bending or breaking of the connection pin occurs. was there.

  Further, since the plurality of connection pins are completely fixed to the second substrate (space transformer), it is difficult to insert the connection pins into the first substrate (sub-substrate) even if the connection pins are slightly misaligned. Therefore, in manufacturing, it is necessary to solder the connection pins one by one while maintaining extremely high positioning accuracy, resulting in disadvantages that the manufacturing time is increased and the manufacturing cost is increased.

  In order to avoid such drawbacks, the present inventors have proposed a connection pin that can be easily attached and detached one by one as shown in FIG. 6 and that enables stable electrical connection in repeated use. (See Patent Document 1).

  That is, the connection pins include first and second insertion portions that are inserted into through holes provided in the first substrate (sub-substrate) and the second substrate (space transformer). The second contact portion, and a stopper portion that abuts on the surface of the first substrate (sub-substrate) and the second substrate (space transformer), the first and second contact portions have a spring property, and the through holes The said objective is achieved by making it contact with a side wall.

  In the probe card for inspecting a semiconductor device, the connection pins can be easily attached and detached one by one and enable a stable electrical connection in repeated use. And the clearance (gap) between the second substrate and the connection pin is very small.

  The vertical probe card includes a main board having an electrode connected to an electrode of a measuring instrument, a space transformer having a probe connected to an electrode of an object to be inspected, and a sub-board provided between the main board and the space transformer. Although it is comprised from a board | substrate, generally they are produced with the material which differs according to the objective, respectively, and a thermal expansion coefficient also differs.

When measuring semiconductor devices, the semiconductor devices generate heat when energized, and the heat is transferred to the probe card to thermally expand each substrate. However, as described above, the coefficients of thermal expansion differ because the materials of each substrate are different. As a result, shear stress acts on the connection pins in a direction parallel to the surface of each substrate, and accidents such as bending and bending of the connection pins are likely to occur.
Japanese Patent Application No. 2003-336400

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a probe card connection pin in a probe card for inspecting a semiconductor device, which can eliminate poor conduction between the upper and lower sides of the substrate due to imperfect plating in the through hole. In addition, it is possible to provide a connection pin that can be easily attached and detached one by one, enables stable electrical connection in repeated use, and further absorbs the difference in coefficient of thermal expansion of each substrate. It is to provide a probe card used.

  In order to solve the above problems, a book used in a probe card for measuring various electrical characteristics, which is composed of a main board, a sub board, a space transformer base (ST-B), and a space transformer surface (ST-S) The probe card connection pin of the invention is a probe card connection pin for detachably connecting the sub board, the ST-S and the ST-B, and is inserted into a through hole of the sub board. A first contact portion that makes elastic contact in the through hole, a support portion that supports the first contact portion, a stopper portion that contacts the surface of the sub-board and the ST-B, and the through-hole of the ST-B It is characterized by comprising a second contact portion that makes elastic contact in the hole and a third contact portion that makes elastic contact in the through-hole of the ST-S.

  The insertion portion into the through hole of the sub-board composed of the first contact portion, the tip portion, and the support portion is configured such that the support portion has a substantially central portion of the through hole from the stopper portion as an inner wall of the through hole. Extending substantially parallel, the tip of the support portion is bent so as to come into contact with the inner wall of the through hole, and the tip portion extends from the tip of the support portion so that the other end of the tip portion faces the stopper portion. It is preferable that the first contact portion is extended in a curved manner so that the tip of the first contact portion contacts the inner wall of the through hole from the other end of the tip portion.

  Moreover, it is preferable that the said 2nd contact part is the substantially O shape which has a spring property, or a substantially 8 shape.

  Furthermore, it is preferable that the third contact portion has a substantially U shape having a spring property.

  Moreover, it is preferable that the thickness of the support part is not more than ½ of the diameter of the through hole of the sub-board.

  The probe card connection pin is preferably manufactured from a metal material by etching, pressing, electroforming, or the like.

In order to solve the above problems, a probe card used for measuring electrical characteristics of the measurement object of the present invention is:
A main provided with a first main surface having a first connection electrode in contact with a measuring instrument and a second main surface having a second connection electrode electrically connected to the first connection electrode by wiring. substrate,
A sub-board having a through hole electrically connected to the second connection electrode and coupled to the main board;
A connection pin having one end electrically connected to the through hole of the sub-board or the second connection electrode of the main board;
A space transformer comprising a first main surface equipped with the other end of the connection pin, and a second main surface having a contact that is electrically connected to the connection pin and is in contact with the measurement object;
A probe card comprising:
The space transformer is composed of a space transformer S having the contact and a space transformer base, and the connection pin is the probe card connection pin according to any one of claims 1 to 6.

  The probe card connection pin of the present invention is used in a probe card for measuring various electrical characteristics, which includes a main board, a sub board, a space transformer base (ST-B), and a space transformer surface (ST-S). The sub-board, the ST-S, and the ST-B can be detachably electrically connected. The probe card connection pin of the present invention includes a tip portion inserted into the through hole of the sub-board, a first contact portion that makes elastic contact in the through hole, a support portion that supports the first contact portion, A stopper portion that contacts the surface of the sub-substrate and the ST-S, a second contact portion that makes elastic contact in the through-hole of the ST-B, and a second contact portion that makes elastic contact in the through-hole of the ST-S. Since it consists of 3 contact parts, the connection pin which can be easily attached or detached one by one can be provided.

  The probe card connection pin according to the present invention includes an insertion portion of the first contact portion, the tip portion, and the support portion into the through hole of the sub-board, wherein the support portion extends from the stopper portion to the through hole. The substantially central portion extends substantially parallel to the inner wall of the through hole, the tip of the support portion is bent so as to contact the inner wall of the through hole, and the other end of the tip portion is connected to the stopper portion. The first contact portion is extended from the other end of the tip portion so that the tip of the first contact portion contacts the inner wall of the through hole. As a result, a clearance between the inner wall of the through hole and the support portion can be ensured, and a difference in thermal expansion coefficient between the sub-board and ST-B can be absorbed.

  In the probe card connection pin according to the present invention, since the second contact portion has a substantially O-shaped shape or a substantially 8-shaped shape having a spring property, the probe to the center in the through-hole of the ST-B Positioning of the card connection pin is easy and secure fixing is possible, the second contact portion is pressed against and supported by the through hole of the ST-B, and the connection pin is positioned to the ST-B together with the stopper portion. A stable electrical connection between the substrates is possible.

  In the probe card connection pin of the present invention, since the third contact portion has a substantially U shape having a spring property, the connection with the ST-S can be reliably performed, and the attachment / detachment is facilitated.

  In the probe card connection pin of the present invention, since the thickness of the support portion is ½ or less of the diameter of the through hole of the sub-board, the clearance between the support portion and the inner wall of the through hole is maintained. Therefore, it is possible to provide a connection pin that can absorb the difference in coefficient of thermal expansion of each substrate.

  The probe card connection pin of the present invention is manufactured from a metal material by etching, pressing, electroforming or the like, so that metal fatigue due to processing does not remain, so stable electrical connection in repeated use Enable.

  The probe card of the present invention is a probe card for measuring electrical characteristics of a measurement object, and includes a first main surface having a first connection electrode that is in contact with a measuring instrument, the first connection electrode, A main board having a second main surface having a second connection electrode electrically connected to the wiring, and having a through hole electrically connected to the second connection electrode and coupled to the main board. A sub-board having one end electrically connected to a through hole of the sub-board or a second connection electrode of the main board, a first main surface equipped with the other end of the connection pin, and the connection pin And a space transformer having a second main surface having a contact that is in contact with an object to be measured, the space transformer having a space transformer surface (S -S) and a space transformer base (ST-B), and the connection pin is a connection pin for a probe card according to any one of claims 1 to 6, whereby plating in the through hole of the space transformer Therefore, it is possible to provide a probe card that can eliminate the conduction failure between the upper and lower sides of the substrate due to the incompleteness of the substrate, and can easily attach and detach the connection pins one by one.

  As shown in part of FIG. 1, the probe card A has a first main surface having a first connection electrode 4 that is in contact with an inspection measuring instrument (not shown) such as a tester, and the first connection surface. A main substrate 1 having a second main surface having a second connection electrode 5 electrically connected to the electrode by wiring, and a plurality of through holes 9 electrically connected to the second connection electrode 5. The sub-substrate 3 has a plurality of through holes 19 penetrating from the main surface 2b to the opposite surface, and a plurality of contacts 6 that are in contact with a semiconductor device (not shown) as an object to be inspected such as an IC chip on the main surface 2b. Space transformer surface (ST-S) 21 provided with a space transformer and a space transformer base (ST-B) 22 having a plurality of through holes 29 penetrating from the main surface 2a to the opposite surface. Form 2, connecting pin 7 that is detachably inserted into the through hole 9 of the sub-board 3 and the through holes 19 and 29 of the space transformer 2, and the holder 10 that removably attaches the ST-B 22 to the main board 1. It is comprised from the volt | bolt 11.

  As shown in FIG. 1, the main board 1 is provided with a plurality of first connection electrodes 4 electrically connected to the measuring instrument for inspection on the first main surface 1a, and is used for electric conduction to a sub-board 3 described later. A plurality of second connection electrodes 5 are provided on the second main surface 1b, and the second connection electrodes 5 are electrically connected to the first connection electrodes 4 through wiring in the main substrate.

  The main substrate 1 converts the interval from the second adjacent connection electrode interval having a narrow interval on the second main surface 1b to the adjacent first connection electrode interval having a wider interval on the first main surface 1a, and The first connection electrodes 4 on the first main surface 1a are arranged at wide intervals corresponding to the electrodes.

  As shown in FIG. 1, the sub-board 3 has a first main face 3 a that faces the second main face 1 b of the main board 1 and a second main face that faces the first main face 2 a of the ST-B 22 that constitutes the space transformer 2. A surface 3b is provided, and a plurality of through holes 9 are provided between the first main surface 3a and the second main surface 3b.

  The plurality of through holes 9 penetrate between the first main surface 3a and the second main surface 3b with a conductive plating layer, and a plurality of third connection electrodes provided on the first main surface 3a. 15 is electrically connected.

  The sub-board 3 is fixed between the third connection electrode 15 and the second connection electrode 5 of the main board 1 with a conductor 13 made of solder, conductive resin, or the like. A resin member 14 for substrate bonding is loaded between the second main surface 1b of the substrate 1 and the first main surface 3a of the sub-substrate 3 facing each other. As a result, the sub board 3 is integrally coupled to the main board 1 while being electrically connected.

  As shown in FIG. 1, the space transformer 2 composed of ST-S21 and ST-B22 includes a first main surface 2a of ST-B22 facing the second main surface 3b of the sub-substrate 3, and a high density of semiconductor devices. And a second main surface 2b of ST-S21 equipped with a plurality of contacts 6 for contacting electrodes (not shown) disposed on the surface.

  As shown in FIG. 1, the space transformer 2 is composed of a space transformer surface (ST-S) 21 having a contact and a space transformer base (ST-B) 22 made of a rigid body. The ST-B 22 is accurately fixed by the plurality of positioning pins 23 and the plurality of fixing screws 24. A through hole 19 is provided in the ST-S 21 and a through hole 29 is provided in the ST-B 22 so as to penetrate the first main surface 2 a and the second main surface 2 b of the space transformer 2. A connection pin 7 is inserted through. The ST-S 21 is equipped with a plurality of fifth connection electrodes 17 on the second main surface 2 b, and the contacts 6 are soldered to the fifth connection electrodes 17.

  A space between a plurality of adjacent contacts 6 of ST-S21 corresponds to a narrow interval of electrodes (not shown) of the semiconductor device.

  The connection pins 7 detachably mounted in the through hole 19 of ST-S 21 and the through hole 29 of ST-B 22 are detachably inserted into the through hole 9 of the sub-board 3 and are shown in FIG. As described above, the through hole 9 having the conductive plating layer and the inner surface of the through hole 19 are elastically contacted to be electrically connected. By adopting this configuration, it is not necessary to plate the inner surface of the through hole 29 penetrating the ST-B 22, and only the through hole 19 of the thin ST-S 21 needs to be plated. Further, by clearly sharing the roles of ST-S21 and ST-B22, the optimum material, structure, dimensions, etc. can be adopted for each.

  The connection pin 7 of the present invention is manufactured from a highly conductive metal material such as copper (Cu) or nickel (Ni) by etching, pressing, electroforming or the like, preferably gold (Au) or tin (Sn). As shown in FIGS. 1 and 2, the tip portion 71 inserted into the through hole 9 of the sub-substrate 3 and the first contact portion 72 that makes elastic contact in the through hole 9 are provided. , A support portion 73 that supports the first contact portion, a stopper portion 74 that contacts the sub-board and the surface of ST-B22, a second contact portion 75 that makes elastic contact in the through hole 29 of ST-B22, and ST-S21 It consists of a third contact portion 76 that makes elastic contact within the through hole 19. The shape of the tip 71 inserted into the through hole of the sub-board 3 is U-shaped or V-shaped for smooth insertion into the through hole.

  The connection pin 7 of the present invention is aligned with the center portion of the through hole 9 by the shape of the second contact portion 75 and the stopper portion 74. The support portion 73 is generated between the substrates because a clearance can be maintained between the support portion 73 and the inner wall of the through hole 9 by extending the central portion of the through hole of the sub-substrate 3 from the stopper portion 74 in parallel with the inner wall of the through hole. It becomes possible to absorb the difference in the amount of thermal expansion.

  The support portion 73 that supports the first contact portion 72 has a thickness sufficiently smaller than the diameter of the through hole 9 in order to obtain the effect of relieving the above-described shear stress caused by thermal expansion, and the clearance from the inner wall of the through hole 9 is small. It is important to ensure enough. The thickness of the support portion 73 is preferably 1/2 or less of the diameter of the through hole 9 and more preferably 1/3 or less.

  The stopper part 74 bears the role of keeping the distance between the two appropriately by contacting the surface of the sub-board 3 and ST-B22. Accordingly, it is necessary that the diameter of each of the through hole 9 of the sub-board 3 and the through hole 29 of the ST-B 22 is wider than each of the diameters.

  Maintaining a proper distance between the sub-substrate 3 and the ST-B 22 is necessary for electrical insulation between the two, but it also means that they are thermally insulated. As described above, when a semiconductor device is measured, the semiconductor device generates heat due to energization, the heat is transmitted to the probe card, and each substrate thermally expands. Accidents such as turning and folding are likely to occur. In order to prevent such troubles, it is important to keep the two at an appropriate interval and to insulate them.

  Further, in order to keep the distance between the sub-board 3 and the ST-B 22 properly, the dimensional accuracy of the portion sandwiched between the support portion 73 and the second contact portion 75 is important, and all the connecting pins 7 to be used have the same dimensional accuracy. It is desirable to have.

  The second contact portion 75 inserted into the through hole 29 of the ST-B 22 has a substantially O-shaped shape and is configured to make elastic contact within the through hole 29. Since this shape is symmetrical with respect to the center line of the through hole, the connection pin 7 is automatically aligned with the center of the through hole 29 just by being inserted, and is connected to the second contact portion 75. The contact portion 76 is guided to the center position of the through-hole 19 of ST-S21, and stable elastic contact is achieved.

  The 3rd contact part 76 which contacts the inner wall of the through-hole 19 of ST-S21 is made into the substantially U shape shape where one side opened as shown in FIG. 1, FIG. By adopting this shape, it is possible to effectively give elasticity to the distal end side of the third contact portion 76, and by contacting that portion with the inner wall of the through hole 19, the space transformer 2 can be separated from the second main surface 2 b. Protrusion can be minimized.

  As shown in FIGS. 1, 2, and 3, the connection pin 7 of the present invention is inserted into the through hole 9 of the sub-board 3 by inserting the tip portion 71, the first contact portion 72, and the support portion 73. The first contact portion 72 comes into contact with the inner wall of the through hole having the conductive plating layer, and the through hole 9 of the sub-board 3 and the connection pin 7 are in an electrically conductive state. Of course, if the space transformer 2 is pulled down, the front end portion 71, the first contact portion 72, and the support portion 73 of the connection pin 7 can be pulled out from the through hole 9.

  The distal end portion 71, the first contact portion 72, and the support portion 73 of the connection pin 7 are inserted into the through hole 9 of the sub-board 3, the contact portion is elastically contacted in the through hole 9, and the second contact portion 75 is further provided. The third contact portion 76 is inserted into the through hole 19 provided in the ST-S 21 and the through hole 29 provided in the ST-B 22, and the second contact portion 75 and the third contact portion 76 are inserted into the inner walls of the through holes 29 and 19. Are in elastic contact with each other. As a result, the through hole 19 of the ST-S 21 and the connection pin 7 become electrically conductive, and the through hole 9 of the sub-board 3 and the through hole 19 of ST-S 21 become electrically conductive. Of course, the space transformer 2 and the connection pin 7 can be easily separated.

  In this case, there is a difference between the spring pressure of the first contact portion 72 of the connection pin 7 on the side of the sub-board 3 and the spring pressure of the second contact portion 75 of the through hole 29 provided in the ST-B 22 and the connection pin 7. By providing, when attaching and detaching the space transformer 2 from the sub-board 3, a member for leaving the connection pin 7 can be selected. That is, by making the spring pressure on the ST-B 22 side larger than the spring pressure on the sub-board 3 side, the connection pins 7 always remain on the space transformer 2 side when the space transformer 2 is attached / detached. (If the sub-board 3 side is set strongly, it remains on the sub-board 3 side.)

  FIG. 2 is an enlarged view of the connection pin 7 of the present invention described with reference to FIG. 1. As described above, the tip 71 inserted into the through hole 9 of the sub-board 3 and the elastic in the through hole 9 are shown in FIG. A first contact portion 72 that makes a mechanical contact, a support portion 73 that supports the first contact portion, a stopper portion 74 that contacts the surface of the sub-board and the space transformer, and a second that makes an elastic contact in the through hole 29 of the ST-B22. The contact portion 75 includes a third contact portion 76 that makes elastic contact in the through hole 19 of the ST-S21, and is etched, pressed, or made from a highly conductive metal material such as copper (Cu) or nickel (Ni). It is manufactured by electroforming or the like, and is preferably plated with gold (Au) or tin (Sn).

  The connecting pin 7 of the present invention shown in FIG. 2 is automatically inserted only by inserting it because the second contact portion 75 and the third contact portion 76 are symmetrical with respect to the center line of the through holes 29 and 19. It is possible to stand at the center of the through holes 29 and 19, and to ensure stable conduction between the third contact portion 76 and the through hole 19, and at the same time, it is possible to cope with a so-called fine pitch in which the connection pins are arranged close together. Become.

  The shape shown in FIG. 2 can be produced only by a processing method such as etching, pressing, or electroforming. However, these processing methods are processing methods that do not involve bending of metal, so that metal fatigue due to processing does not remain. It is a method with excellent durability that does not deteriorate the spring property even after repeated use.

  The connection pin 7 of the present invention can change the length and width of the contact portion and the support portion according to the thickness of the substrate to be inserted and the size of the through hole, respectively, and the shape is also limited to that shown in FIG. Is not to be done. For example, the substantially O-shaped shape of the second contact portion 75 inserted into the through-hole 29 of the ST-B 22 is an approximately 8-shaped shape as shown in FIG. 4 depending on the thickness of the substrate and the size of the through-hole. It is also possible. In this case, even if the contact pressures of the respective contact portions are the same, the insertion / extraction force is doubled, so that it is possible to determine the substrate where the connection pins remain when the substrate is attached / detached.

  As is clear from the above description, the probe card connection pin of the present invention is composed of a main board, a sub board, a space transformer base (ST-B), and a space transformer surface (ST-S). In the probe card for measuring characteristics, a probe card connection pin for detachably connecting the sub board, the ST-S, and the ST-B, which is inserted into a through hole of the sub board A tip part, a first contact part that makes elastic contact in the through hole, a support part that supports the first contact part, a stopper part that contacts the surface of the sub-board and the ST-S, and a through hole of the ST-B Because it consists of a second contact part that makes elastic contact inside and a third contact part that makes elastic contact inside the ST-S through hole, it can be easily attached and detached one by one It is possible to provide a performance connection pin.

  The probe card connection pin according to the present invention includes an insertion portion of the first contact portion, the tip portion, and the support portion into the through hole of the sub-board, wherein the support portion extends from the stopper portion to the through hole. The substantially central portion extends substantially parallel to the inner wall of the through hole, the tip of the support portion is bent so as to contact the inner wall of the through hole, and the other end of the tip portion is connected to the stopper portion. The first contact portion is extended from the other end of the tip portion so that the tip of the first contact portion contacts the inner wall of the through hole. As a result, a clearance between the inner wall of the through hole and the support portion can be ensured, and it is possible to realize a difference in thermal expansion coefficient between the sub-substrate and ST-B.

  In the probe card connection pin according to the present invention, since the second contact portion has a substantially O-shaped shape or a substantially 8-shaped shape having a spring property, the probe to the center in the through-hole of the ST-B Positioning of the card connection pin is easy and secure fixing is possible, the second contact portion is pressed against and supported by the through hole of the ST-B, and the connection pin is positioned to the ST-B together with the stopper portion. A stable electrical connection between the substrates is possible.

  In the probe card connection pin of the present invention, since the third contact portion has a substantially U shape having a spring property, the connection with the ST-S can be reliably performed, and the attachment / detachment is facilitated.

  Further, the probe card connection pin of the present invention can absorb the difference in thermal expansion coefficient of each substrate because the thickness of the support portion is less than or equal to ½ of the diameter of the through hole of the sub substrate. Possible connection pins can be provided.

  The probe card connection pin of the present invention is manufactured from a metal material by etching, pressing, electroforming or the like, so that there is no residual metal fatigue due to processing, so stable electrical connection in repeated use Enable.

  The probe card of the present invention is a probe card for measuring electrical characteristics of a measurement object, and includes a first main surface having a first connection electrode that is in contact with a measuring instrument, the first connection electrode, A main board having a second main surface having a second connection electrode electrically connected to the wiring, and having a through hole electrically connected to the second connection electrode and coupled to the main board. A sub-board having one end electrically connected to a through hole of the sub-board or a second connection electrode of the main board, a first main surface equipped with the other end of the connection pin, and the connection pin A space transformer having a second main surface having a contact that is electrically connected to the object to be measured, and the space transformer has a space transformer surface (S -S) and a space transformer base (ST-B), and the connection pin is a connection pin for a probe card according to any one of claims 1 to 6, whereby plating in the through hole of the space transformer Therefore, it is possible to provide a probe card that can eliminate the conduction failure between the upper and lower sides of the substrate due to the incompleteness of the substrate, and can easily attach and detach the connection pins one by one.

The partial schematic diagram which shows the coupling state of the connection pin of the Example of this invention. The enlarged view which shows the connection pin shape of this invention Example. The B section enlarged view shown in FIG. The enlarged view which shows the connection pin shape of another Example of this invention. Schematic which shows the coupling state of the connection pin of a prior art example. Schematic which shows the coupling state of the connection pin of another prior art example.

Explanation of symbols

A Probe card 1 Main board 1a First main surface 1b of main board Second main surface 2 of main board 2 Space transformer 2a First main surface 2b of space transformer Second sub surface 3a of sub-substrate 3a First sub-board 3a Main surface 3b Second main surface 4 of sub-board 4 First connection electrode 5 Second connection electrode 6 Contact 7 Connection pin 8 Reinforcement plate 9 Sub-board through-hole 10 Holder 11 Fixing bolt 13 Conductor 14 Resin member 15 Third connection electrode 16 Fourth connection electrode 17 Fifth connection electrode 19 Space transformer surface through hole 21 Space transformer surface (ST-S)
22 Space Transformer Base (ST-B)
23 Positioning pin 24 Fixing screw 29 Space transformer base through-hole 71 Tip portion 72 First contact portion 73 Support portion 74 Stopper portion 75 Second contact portion 76 Third contact portion

Claims (7)

Used for a probe card for measuring electrical characteristics, which is composed of a main board, a sub board, a space transformer base (ST-B) and a space transformer surface (ST-S).
A probe card connection pin for detachably connecting the sub-board, the ST-S and the ST-B,
The tip portion inserted into the through hole of the sub-board, the first contact portion that makes elastic contact in the through hole, the support portion that supports the first contact portion, the sub-board, and the surface of the ST-S A probe card comprising: a stopper portion that comes into contact; a second contact portion that makes elastic contact in the through hole of ST-B; and a third contact portion that makes elastic contact in the through hole of ST-S. Connection pins.   The insertion portion into the through hole of the sub-board composed of the first contact portion, the tip portion, and the support portion is configured such that the support portion has a substantially central portion of the through hole from the stopper portion as an inner wall of the through hole. Extending substantially parallel, the tip of the support portion is bent so as to come into contact with the inner wall of the through hole, and the tip portion extends from the tip of the support portion so that the other end of the tip portion faces the stopper portion. The first contact portion extends from the other end of the tip portion so that the tip of the first contact portion contacts the inner wall of the through hole. Connection pin for probe card.   3. The probe card connection pin according to claim 1, wherein the second contact portion has a substantially O-shaped shape or a substantially 8-shaped shape having a spring property. 4.   The probe card connection pin according to claim 1, wherein the third contact portion has a substantially U shape having a spring property.   5. The probe card connection pin according to claim 1, wherein a thickness of the support portion is ½ or less of a diameter of a through hole of the sub-board.   6. The probe card connection pin according to claim 1, wherein the probe card connection pin is manufactured from a metal material by etching, pressing, electroforming or the like. A probe card for measuring electrical characteristics of a measurement object,
A main provided with a first main surface having a first connection electrode in contact with a measuring instrument and a second main surface having a second connection electrode electrically connected to the first connection electrode by wiring. substrate,
A sub-board having a through hole electrically connected to the second connection electrode and coupled to the main board;
A connection pin having one end electrically connected to the through hole of the sub-board or the second connection electrode of the main board;
The space transformer includes a first main surface equipped with the other end of the connection pin, and a second main surface having a contact that is electrically connected to the connection pin and is in contact with the measurement object. ,
The space transformer is composed of a space transformer surface (ST-S) having the contact and a space transformer base (ST-B), and the connection pins are for the probe card according to claim 1. A probe card characterized by being a connection pin.

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