KR100954101B1 - Interconnection assembly - Google Patents

Abstract

The interconnect includes a body portion, a first elastic portion extending from the body portion, having a first end portion, and a second elastic portion extending from the body portion opposite the first elastic portion and having a second end portion. Thus, the interconnect can maintain a constant elastic force.

Description

Interconnect Assembly {INTERCONNECTION ASSEMBLY}

1 is a perspective view for explaining a conventional interconnect.

2A is a perspective view illustrating an interconnection according to an embodiment of the present invention.

FIG. 2B is a side view for explaining the interconnect shown in FIG. 2A.

3A is a perspective view illustrating an interconnection according to an embodiment of the present invention.

FIG. 3B is a side view for explaining the interconnect shown in FIG. 3B.

4 is a cross-sectional view illustrating an interconnect assembly according to an embodiment of the present invention.

5 is a cross-sectional view illustrating an interconnect assembly according to an embodiment of the present invention.

The present invention relates to interconnects and interconnect assemblies comprising the same. More particularly, the present invention relates to interconnects for inspecting semiconductor substrates and interconnect assemblies comprising the same.

Recently, the manufacturing technology of semiconductor devices has been developed to improve the degree of integration, reliability, response speed, etc. in order to meet various needs of consumers. In general, a semiconductor device forms a predetermined film on a silicon wafer used as a semiconductor substrate, and fabricates a film in a pattern having electrical properties, and electrically inspects each die on which the pattern is formed. A probe test process, a cutting process of cutting each die, a bonding process of welding gold or aluminum wires to a semiconductor substrate divided into respective dies by a cutting process, and a bonding process The finished semifinished substrate is manufactured by a packaging process of sealing with ceramic or plastic.

The probe test process is a process of inspecting electrical characteristics of each die formed on a semiconductor substrate, and is also commonly referred to as an electrical die sorting (EDS) process.

The probe test process is a process of determining whether each die formed on the semiconductor substrate is in an electrically good state or in a bad state. This is to reduce the effort and cost consumed in the packaging process by removing the die having a bad state before performing the packaging process through the probe test process, and to early find and reclaim the die having the bad state. For sake.

The probe test process examines the electrical characteristics of the die formed on the semiconductor substrate using a probe card.

An interconnect used in a conventional probe card assembly and an interconnect assembly having the same are disclosed in Korean Patent Publication No. 2005-0064531.

1 is a perspective view for explaining a conventional interconnect.

Referring to FIG. 1, a conventional interconnect 10 includes a first connection part 12 having a bar shape made of an elastic material in contact with a contact terminal of a space transducer, a connection part 14 having a circular ring shape with one open side, It includes a support 16 formed with a locking step in the predetermined portion and the second connecting portion 18 of the circular ring shape.

The interconnect 10 has only a connecting portion 14 as an elastic part, wherein the connecting portion 14 has a relatively long length, for example, 2 to 3 mm to prevent damage to the first connecting portion 12. It is formed to have a range. In addition, when assembling the interconnect 10 and the printed circuit board (not shown) to produce the interconnect assembly, a guide film supporting the first interconnect 12 may be required. Furthermore, if the printed circuit board having an opening for receiving the second connection 18 has a tolerance, there may be an electrical opening between the printed circuit board and the interconnect 10. Moreover, the interconnect according to the prior art has a problem that is difficult to replace due to breakage, so that repair thereof is difficult.

It is an object of the present invention to provide an interconnect which can maintain a constant elastic force in order to solve the problems of the prior art.

It is another object of the present invention to provide an interconnect assembly comprising an interconnect that can maintain a constant elastic force.

In order to achieve the above object, the interconnect according to an embodiment of the present invention extends from the body portion to the opposite side of the body portion, the first elastic portion extending from the body portion having a first end and the first elastic portion And a second elastic portion having a second end. Here, the first elastic portion may have an S-shaped spring shape. In addition, the second elastic portion may have a circular ring shape. Protrusions may be formed at the first and second ends, respectively. The body portion may have a step width having a smaller step toward the second elastic portion. The first and second elastic parts and the body part may be integrally formed. The first and second elastic parts and the body part may include nickel (Ni), nickel-cobalt alloy, beryllium-copper alloy, or stainless steel.

In an embodiment of the present invention, the interconnect may further include a third elastic part connected to the second end and integrally formed with the first and second elastic parts and the body part and having a circular ring shape. Can be.

In order to achieve the above object, an interconnect assembly according to another embodiment of the present invention includes a first space transducer having a first connection terminal, a second space transducer facing the space transducer, and a second space transducer having a second connection terminal, and a body part. And a first elastic portion extending from a first end of the body portion and electrically connected to the first connecting terminal, extending from a second end of the body portion opposite to the first end and electrically connecting to the second connecting terminal. An interconnect having a second elastic portion having a second end portion, and between the first space deformer and the second space deformer, a fixing member having a first opening through which the body part penetrates to fix the body part. do. Here, the interconnect assembly may further comprise a fastening member for fastening the fastening member to the second spatial transducer. In addition, a first fastening groove may be formed in the fixing member and a second fastening groove may be formed in the second space transformer so that the fastening member may penetrate the first and second fastening grooves. In addition, the second spatial transducer may include a printed circuit board.

In one embodiment of the present invention, the interconnection further includes a third elastic portion connected to the second end and having a circular ring shape, and the second space deformer passes through the third elastic portion. An opening can be formed. Here, the second connection terminal may be formed on the inner wall of the second opening, and may be electrically connected to the third elastic portion.

In one embodiment of the present invention, the interconnection body is disposed on a lower surface of the second space transducer, and presses an end of the third elastic portion to make electrical connection between the third elastic portion and the second connection terminal. It may further include a pressing member to secure.

According to the present invention, the interconnect having the first and second elastic portions can maintain a constant elastic force with a relatively short length. In addition, the interconnect assembly according to the embodiment of the present invention includes a detachable fixing member, thereby facilitating repair and replacement of the interconnect. The interconnect assembly according to the embodiment of the present invention includes a pressing member, thereby ensuring electrical connection between the interconnect and the second space deformation period.

With respect to the embodiments of the present invention disclosed in the text, specific structural to functional descriptions are merely illustrated for the purpose of describing embodiments of the present invention, embodiments of the present invention may be implemented in various forms and It should not be construed as limited to the embodiments described in.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between. Other expressions describing the relationship between components, such as "between" and "immediately between" or "neighboring to" and "directly neighboring", should be interpreted as well.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, component, or combination thereof that is described, rather than one or more other features or components, or combinations thereof. It should be understood that no pre-existence or possibility of addition is excluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A is a perspective view illustrating an interconnection according to an embodiment of the present invention. FIG. 2B is a side view for explaining the interconnect shown in FIG. 2A.

2A-2B, an interconnect 100 according to an embodiment of the present invention includes a first elastic portion 110, a body portion 120, and a second elastic portion 130.

The first elastic portion 110 includes an elastic contact element. Therefore, the first elastic part 110 is electrically connected to the first element (not shown), for example, the space transducer. In addition, for example, a round protrusion 111 is formed at the first end 115 of the first elastic portion 110. The first elastic part 100 is electrically connected to the first element through the protrusion 111. In addition, a locking jaw 113 is formed at the second end 116 opposite to the first end 115 of the first elastic part 110. When assembling the interconnect 100 to produce the interconnect assembly, the latching jaw 113 secures the first elastic portion 110 in a predetermined position.

The first elastic portion 110 may have a spring shape of the S-shape. The first elastic portion 110 having a spring shape has elasticity of a predetermined size. Therefore, the first elastic part 110 may contract and expand.

The first elastic portion 110 is a material having a relatively high modulus of elasticity, for example, nickel (Ni), nickel-cobalt (Ni-Co) alloy, beryllium-copper alloy (Be-Cu) alloy or stainless steel ( stainless steel).

The body portion 120 connects the first elastic portion 110 and the second elastic portion 130. That is, the body part 120 is disposed between the second end 116 of the first elastic part 110 and the first end 135 of the second elastic part 130. The body part 120 may have a bar shape, for example.

The body part 120 may be integrally formed with the first elastic part 110. Therefore, since the body portion 120 may include a material that is substantially the same as the first elastic portion 110, a material having a relatively high modulus of elasticity, for example, nickel (Ni) and nickel-cobalt (Ni -Co) alloy, beryllium-copper alloy (Be-Cu) alloy or stainless steel (stainless steel).

In one embodiment of the present invention, the body portion 120 has a plurality of steps having a width that becomes smaller toward the first end 135 of the second elastic portion 130. Thus, when assembling the interconnect 100 to produce the interconnect assembly, the body 120 can be easily inserted into the opening formed member.

The second elastic portion 130 is formed to be connected to the body portion 120. The second elastic part 130 has a circular ring shape, for example. The second elastic portion 130 having a circular ring shape has elasticity, thereby allowing contraction and expansion. Accordingly, the interconnect 100 having the first elastic portion 110 and the second elastic portion 130 has a certain range of elastic force, whereby the interconnect 100 having a relatively short length has a constant size. Elastic force can be maintained.

The second elastic part 130 may be integrally formed with the first elastic part 110 and the body part 120. Therefore, since the second elastic portion 130 may include a material that is substantially the same as the first elastic portion 110, a material having a relatively high elastic modulus, for example, nickel (Ni), nickel-cobalt (Ni-Co) alloy, beryllium-copper alloy (Be-Cu) alloy or stainless steel (stainless steel).

The second elastic part 130 may have a protrusion 131 formed at the second end 136 opposite to the first end 135. When the interconnect 100 is assembled into an interconnect assembly comprising a printed circuit board (not shown), the protrusions formed at the second end 136 of the second elastic portion 130 may be connected to the connection terminals of the printed circuit board. In contact with the interconnect 100 and the printed circuit board.

3A is a perspective view illustrating an interconnection according to an embodiment of the present invention. FIG. 3B is a side view for explaining the interconnect shown in FIG. 3B.

3A and 3B, an interconnect 200 according to an embodiment of the present invention may include a first elastic portion 210, a body portion 220, a second elastic portion 230, and a third elastic portion. 240.

The first elastic portion 210 is electrically connected to a connection terminal of the first element, for example, the space transducer. Therefore, for example, a round protrusion 211 is formed at the first end portion 215 of the first elastic portion 210. The first elastic part 210 is electrically connected to the connection terminal of the first element through the protrusion 211.

The first elastic portion 210 may have a spring shape of the S-shape. The first elastic portion 210 having a spring shape has elasticity of a predetermined size. Therefore, the first elastic portion 210 may contract and expand. In addition, the first elastic portion 210 is a material having a relatively high modulus of elasticity, for example, nickel (Ni), nickel-cobalt (Ni-Co) alloy, beryllium-copper alloy (Be-Cu) alloy or stainless steel May comprise stainless steel.

The body portion 220 connects the first elastic portion 210 and the second elastic portion 230. That is, the body portion 220 is disposed between the second end portion 216 and the first end portion 235 of the second elastic portion 230 that face the first end portion 215 of the first elastic portion 210. do. The body part 220 may have, for example, a bar shape.

The body portion 220 may be integrally formed with the first elastic portion 210. The body part 220 may have a multi-step shape having a plurality of steps, and may have a width that decreases toward the first end 235 of the second elastic part 230. Thus, when assembling the interconnect 200 to produce the interconnect assembly, the body portion 220 can be easily inserted into the opening formed member.

The second elastic portion 230 is formed to be connected to the body portion 220. The second elastic portion 230 has a circular ring shape, for example. The second elastic portion 230 having a circular ring shape has elasticity, thereby allowing contraction and expansion. Accordingly, the interconnect 200 having the first elastic portion 210 and the second elastic portion 230 has a predetermined range of elastic force, whereby the interconnect 200 having a relatively short length has a constant size. Elastic force can be maintained.

The third elastic part 240 is connected to the second elastic part 230. For example, the third elastic part 240 is connected to the second end 236 of the second elastic part 230. The third elastic part 240 has a circular ring shape. When the interconnect 200 having the third elastic portion 240 is fastened to a printed circuit board (not shown) having an opening, the third elastic portion 240 is formed on the sidewall of the opening. Contact with. Thus, interconnect 200 is electrically connected to the printed circuit board.

The third elastic part 240 may be integrally formed with the first and second elastic parts 210 and 230 and the body part 220. Accordingly, since the third elastic part 240 may include a material that is substantially the same as the first and second elastic parts 210 and 230 and the body part 220, a material having a relatively high elastic modulus, eg For example, it may include nickel (Ni), nickel-cobalt (Ni-Co) alloy, beryllium-copper (Be-Cu) alloy, or stainless steel.

In one embodiment of the present invention, the third elastic portion 240 may further include a protrusion 241 formed on the first end 246.

4 is a cross-sectional view illustrating an interconnect assembly according to an embodiment of the present invention.

Referring to FIG. 4, the interconnect assembly 300 according to an embodiment of the present invention may include a first spatial transducer 350, a second spatial transducer 360, an interconnect 310, and a fixing member 370. Include.

The interconnect 310 includes a first elastic portion 311, a body portion 313, and a second elastic portion 315. The interconnect 310 is substantially the same as the interconnect described with reference to FIGS. 2A and 2B. Therefore, detailed description of the interconnect 310 will be omitted.

The first spatial transducer 350 is disposed on top of the first elastic portion 311 of the interconnect 310. The first spatial transducer 350 performs pitch reduction. The first space transducer 350 includes a substrate 355, a first connection terminal 351 disposed on a lower surface of the substrate 355, and a probe 353 on an upper surface of the substrate 355. The first elastic portion 311 of the interconnect 310 is in contact with the first connection terminal 351, so that the interconnect 310 and the first spatial transducer 350 are electrically connected to each other.

The second space transducer 360 is disposed to face the first space transducer 350. The second spatial transducer 360 includes a second connecting terminal 361 in contact with the second elastic portion 315 of the interconnect 310. A plurality of second connection terminals 361 may be formed, and the plurality of second connection terminals 361 may be spaced apart from each other at predetermined intervals. In addition, the second connection terminal 361 is disposed at a position corresponding to the second elastic portion 315 and contacts the end portion of the second elastic portion 315. Thus, the second spatial transducer 360 and the interconnect 310 are electrically connected. Meanwhile, the second space transducer 360 may include a printed circuit board.

The fixing member 370 is interposed between the first and second spatial transducers 350 and 360. The fixing member 370 has a plate shape, for example. The fixing member 370 is formed with a first opening 375 that can receive the body portion 313 of the interconnect 310. As the body portion 313 penetrates through the first opening 375, the fixing member 370 and the interconnect 310 are fastened to each other.

On the other hand, the fixing member 370 is fastened to be detachable to the second space transducer 360. For example, a first fastening groove 377 is formed at a periphery of the fixing member 370, and a second fastening groove 367 is disposed at a position corresponding to the first fastening groove 377 in the second space transformer 360. ) Is formed. The fastening member 380 penetrates the first and second fastening grooves 377 and 367 so that the fastening member 380 fastens the fixing member 370 and the second space transformer 360 to each other. The fastening member 380 includes a guide pin, for example.

The fastening member 380 may be separated from the fixing member 370 and the second space transducer 360 to disassemble the fixing member 370 from the second space transducer 360. In the event of a failure or damage to the interconnect 310, the fixing member 370 is dismantled from the second spatial transducer 360, whereby the damaged or defective interconnect 310 is separated from the interconnect assembly 300. Can be. Thus, repair or replacement of interconnect 310 is facilitated.

5 is a cross-sectional view illustrating an interconnect assembly according to an embodiment of the present invention.

Referring to FIG. 5, an interconnect assembly 400 according to an embodiment of the present invention may include a first spatial transducer 450, a second spatial transducer 460, an interconnect 410, and a fixing member 470. Include.

The interconnect 410 includes a first elastic portion 411, a body portion 413, a second elastic portion 415, and a third elastic portion 417. The interconnect 410 is substantially the same as the interconnect described with reference to FIGS. 3A and 3B. Therefore, detailed description of the interconnect 410 will be omitted.

Since the first space transducer 450 is substantially the same as the first space transducer 350 described with reference to FIG. 4, a detailed description thereof will be omitted.

The second space transducer 460 is disposed to face the first space transducer 450. The second spatial transducer 460 includes a second connecting terminal 461 in contact with the third elastic portion 417 of the interconnect 410. A second opening 465 is disposed in the second space transformer 460 to accommodate the third elastic portion 417. The second connection terminal 461 is disposed on the sidewall of the second opening 465. When there are a plurality of interconnects 410, the second space modifier 460 thus includes a plurality of second openings 465 and is spaced apart from each other by a predetermined interval. The third elastic portion 417 of the interconnect 410 is inserted in the second opening 465 in a force-fit manner so that the second connecting terminal 461 is the third elastic portion 417 of the interconnect 410. Is electrically connected). Meanwhile, the second space transducer 460 may include a printed circuit board.

The fixing member 470 is interposed between the first and second spatial transducers 450 and 460. The fixing member 470 has a plate shape, for example. The fixing member 470 is formed with a first opening 475 that can receive the body portion 413 of the interconnect 410. After the body portion 413 passes through the first opening 475, the second elastic portion 415 is elastically restored so that the fixing member 470 and the interconnect 410 are fastened to each other.

On the other hand, the fixing member 470 is fastened to be detachable to the second space transducer 460. For example, a first fastening groove 475 is formed at a periphery of the fixing member 470, and a second fastening groove 465 is disposed at a position corresponding to the first fastening groove 475 in the second space transformer 460. ) Is formed. The fastening member 480 penetrates the first and second fastening grooves 475 and 465 so that the fastening member 480 fastens the fixing member 470 and the second space transducer 460 to each other. The fastening member 480 includes a guide pin, for example.

The fastening member 480 may be separated from the fixing member 470 and the second space transducer 460 to disassemble the fixing member 470 from the second space transducer 460. In the event of a failure or damage to the interconnect 410, the fixing member 470 is dismantled from the second spatial transducer 460, whereby the damaged or defective interconnect 410 is separated from the interconnect assembly 410. Can be. Thus, repair or replacement of interconnect 410 is facilitated.

In one embodiment of the invention, the interconnect assembly 400 further includes a pressing member 468 that presses an end of the third elastic portion 417 of the interconnect 410. The pressing member 468 is disposed on the lower surface of the second space deformer 460. The pressing member 468 includes a material having electrical insulation. The pressing member 468 has a plate shape, for example.

The pressing member 468 when the third elastic portion 417 of the interconnect 410 is inserted into the second opening 465 of the second space transducer 460 and protrudes from the bottom surface of the second space transducer 460. ) Presses the end of the third elastic portion 417 of the interconnect 410 to ensure electrical connection between the interconnect 410 and the second connecting terminal 461. Thus, the pressing member 468 suppresses electrical opening between the interconnect 410 and the second spatial transducer 460.

As described above, according to the embodiment of the present invention, the interconnect having the first and second elastic portions can maintain a constant elastic force with a relatively short length.

In addition, the interconnect assembly according to the embodiment of the present invention includes a detachable fixing member, thereby facilitating repair and replacement of the interconnect. The interconnect assembly according to the embodiment of the present invention includes a pressing member, thereby ensuring electrical connection between the interconnect and the second space deformation period.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

Claims (15)

delete delete delete delete delete delete delete delete A first spatial transducer having a first connection terminal; A second space transducer facing the space transducer and having a second connection terminal; An interconnect including a body portion, a first elastic portion extending from a first end of the body portion and electrically connected to the first connection terminal, and a second elastic portion extending from a second end opposite to the first end; And Between the first space transducer and the second space transducer, a fixing member having a first opening through which the body portion penetrates to fix the body portion, The interconnect further includes a third elastic part connected to the second elastic part and having a circular ring shape, wherein the second space transformer is formed with a second opening through which the third elastic part passes, And a connecting terminal is formed in the inner wall of the second opening and is electrically connected with the third elastic portion. 10. The interconnect assembly of claim 9, further comprising a fastening member for fastening the fastening member to the second spatial transducer. The method of claim 10, wherein the fixing member is formed with a first fastening groove, the second space transducer is formed with a second fastening groove characterized in that the fastening member penetrates the first and second fastening grooves. Interconnect assembly. delete delete 10. The method of claim 9, further comprising a pressing member disposed on a lower surface of the second space transducer to press an end of the third elastic portion to secure an electrical connection between the third elastic portion and the second connection terminal. Interconnect assembly. 10. The interconnect assembly of claim 9, wherein said second spatial transducer comprises a printed circuit board.

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