WO2024016568A1

WO2024016568A1 - Probe and integrated circuit test device

Info

Publication number: WO2024016568A1
Application number: PCT/CN2022/138037
Authority: WO
Inventors: 陶杉; 段超毅; 蒋伟; 周闯
Original assignee: 深圳凯智通微电子技术有限公司
Priority date: 2022-07-22
Filing date: 2022-12-09
Publication date: 2024-01-25
Also published as: CN218567436U

Abstract

A probe and an integrated circuit test device. The probe comprises two first contact sections, a first connecting section, a second connecting section, and a second contact section, the two first contact sections being spaced apart. The upper ends of the two first contact sections are each provided with a contact surface used for making contact with a tested IC, and the two first contact sections can both elastically deform in the horizontal direction. The second connecting section comprises a plurality of straight sections and a plurality of bent sections, the plurality of straight sections and the plurality of bent sections being successively connected end to end, and the plurality of straight sections all extending in the length direction of the first connecting section. The bent section at the head end of the second connecting section is connected to the first connecting section, the second connecting section being elastically arranged.

Description

Probes and integrated circuit test equipment

Related applications

This application claims priority to the Chinese patent application with application number 202221929758.

Technical field

The present application relates to the technical field of testing equipment, and in particular to a probe and integrated circuit testing equipment.

Background technique

When testing the electrical performance of integrated circuits, conductors such as test probes or conductive glue are generally used. Test probes are used in test sockets or test contacts to provide electrical interconnection between a test circuit board and a device under test (DUT), such as an electronic package.

The probe in the prior art is composed of a needle, a needle tube and a spring assembly, so that the needle is in compressed contact with the spring and the needle tube. There will be a certain amount of friction during compression, which will have a certain impact on the life of the probe and cause the current to pass through during testing. The path is long, and multiple components are in contact with each other, making the contact resistance larger, affecting the actual testing effect of the integrated circuit, thus not meeting the existing needs.

Technical solutions

The main purpose of this application is to provide a probe that is designed to reduce the impedance of the probe during testing and improve the testing effect of the probe.

In order to achieve the above purpose, the probes proposed in this application include:

Two first contact segments, the two first contact segments are spaced apart, and the upper ends of the two first contact segments are each provided with a contact surface for contact with the test IC. Both of the two first contact segments can Elastic deformation occurs in the horizontal direction;

A first connecting section is connected to the lower ends of the two first contact sections;

The second connecting section includes a plurality of straight sections and a plurality of bent sections. The plurality of straight sections and the plurality of bent sections are connected end to end, and the plurality of straight sections are all facing the first connecting section. Extending in the length direction, the bent section at the first end of the second connecting section is connected to the first connecting section; and

a second contact section, the second contact section is connected to the straight section at the end of the second connection section, and is used to contact the test PCB;

Wherein, the second connecting sections are all elastically arranged, so that the probe has elasticity and comes into contact with the test PCB.

In one embodiment, a reinforcing protrusion is provided on each of the two first contact segments, and the two reinforcing protrusions are respectively provided on the sides of the two first contact segments facing each other.

In one embodiment, the test IC includes a solder ball, and the solder ball squeezes the two contact surfaces, so that the two first contact segments are deformed in a horizontal direction.

In one embodiment, each of the two first contact segments is provided with a positioning piece, and the contact surface is provided on the positioning piece. The two positioning pieces can be close to and away from each other for clamping and loosening. Open the solder ball.

In one embodiment, the sides of the two contact surfaces facing each other are arranged in an outwardly convex arc.

In one embodiment, in the test state, the second contact segment is in contact with the adjacent straight segment.

In one embodiment, the probe further includes a first limiting part, a support plate is provided between the test IC and the test PCB, and a second limiting part is provided on the supporting plate. The probe is limited to the second limiting part through the first limiting part.

In one embodiment, the first limiting part is a limiting protrusion, the second limiting part is a limiting groove, and the limiting protrusion is inserted into the limiting groove.

In one embodiment, there are two limiting protrusions and two limiting grooves, and the two limiting protrusions are respectively located at both ends of the first connecting section and are oriented toward the contact point. Extend in the direction of the face.

This application also proposes an integrated circuit testing equipment, including the probe as mentioned above.

The technical solution of this application is to provide an elastic second connecting section, and to connect the straight section and the bent section end to end, so that when the probe is in the testing state, the two adjacent straight sections are in contact, thereby shortening the length of the probe. The path that the current needs to pass through is reduced, thereby reducing the impedance of the probe during the test process, thereby improving the test effect of the probe.

Description of drawings

In order to explain the embodiments of the present application or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without exerting creative efforts.

Figure 1 is a schematic structural diagram of an embodiment of the probe of the present application;

Figure 2 is a schematic structural diagram of an embodiment of the probe of the present application after assembly;

Figure 3 is a schematic structural diagram of another embodiment of the probe of the present application;

Figure 4 is a schematic structural diagram of another embodiment of the probe of the present application after assembly.

Explanation of reference numbers:

标号 label	名称 name	标号 label	名称 name
10 10	测试IC Test IC	23 twenty three	第二连接段 second connecting section
11 11	锡球 Solder balls	231 231	平直段 straight section
20 20	探针 probe	232 232	折弯段 Bend section
21 twenty one	第一接触段 first contact stage	24 twenty four	第二接触段 second contact section
211 211	定位件 Positioning parts	25 25	第一限位部 The first limiting part
212 212	接触面 Contact surfaces	30 30	测试PCB Test PCB
213 213	加强凸起 Strengthen the bulge	40 40	支撑板 support plate
22 twenty two	第一连接段 first connecting section

The realization of the purpose, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

Embodiments of the invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relationship between components in a specific posture (as shown in the drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

In this application, unless otherwise clearly stated and limited, the terms "connection", "fixing", etc. should be understood in a broad sense. For example, "fixing" can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In addition, descriptions involving "first", "second", etc. in this application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, "and/or" in the full text includes three solutions, taking A and/or B as an example, including technical solution A, technical solution B, and technical solutions that satisfy both A and B at the same time; in addition, between various embodiments, The technical solutions can be combined with each other, but it must be based on what a person of ordinary skill in the art can realize. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions does not exist and is not required by this application. within the scope of protection.

Referring to Figures 1 to 4, this application proposes a probe 20, including:

Two first contact segments 21 are arranged at intervals. The upper ends of the two first contact segments 21 are each provided with a contact surface 212 for contacting the test IC 10. The two first contact segments 21 are arranged at intervals. The contact segments 21 can all undergo elastic deformation in the horizontal direction;

The first connecting section 22 is connected to the lower ends of the two first contact sections 21;

The second connecting section 23 includes a plurality of straight sections 231 and a plurality of bent sections 232 . The plurality of straight sections 231 and the plurality of bent sections 232 are connected end to end in sequence. The plurality of straight sections 231 Both extend in the length direction of the first connecting section 22, and the bent section 232 at the first end of the second connecting section 23 is connected to the first connecting section 22; and

The second contact section 24 is connected to the straight section 231 at the end of the second connection section 23 for contact with the test PCB 30;

Wherein, the second connecting sections 23 are all elastically arranged so that the probe 20 has an initial state and a test state. In the initial state, any two adjacent straight sections 231 are arranged at intervals. In the test state, any two adjacent straight sections 231 are arranged at intervals. In this state, any two adjacent straight sections 231 are in contact.

The technical solution of the present application provides an elastic second connecting section 23 and connects the straight section 231 and the bent section 232 end to end, so that when the probe 20 is in the testing state, there is no gap between the two adjacent straight sections 231 The contact shortens the path that the current needs to pass, thereby reducing the impedance of the probe 20 during the test process, thereby improving the test effect of the probe 20 .

In one embodiment, each of the two first contact segments 21 is provided with a reinforcing protrusion 213, and the two reinforcing protrusions 213 are respectively provided on the sides of the two first contact segments 21 facing each other; By providing the reinforcing protrusions 213, the strength of the first contact section 21 is enhanced, and the risk of the first contact section 21 being broken due to the extrusion of the solder ball 11 is reduced.

The probe 20 is used in integrated circuit testing equipment and is disposed between the test IC 10 and the test PCB 30. In order to further reduce the impedance of the probe 20 and improve the fixing effect between various parts of the probe 20, in this embodiment, The first contact section 21 , the first connection section 22 , the second connection section 23 and the second contact section 24 are integrally arranged; through the integrated arrangement, compared with other general fixed connection methods, the integrated There is no contact resistance produced by other fixed connection methods, thereby reducing the impedance of the probe 20. At the same time, the cost of the integrated molding is tighter and lower than other fixing methods.

In this embodiment, the test IC 10 includes a solder ball 11, and the solder ball 11 squeezes the two contact surfaces 212, so that the two contact surfaces 212 are deformed in the horizontal direction; in the test state, the solder ball 11 The ball 11 is squeezed between the two contact surfaces 212, and then moves the two contact surfaces 212 in the horizontal direction away from each other; by providing the elastic contact surface 212, the probe 20 can be used to adapt to solder balls of different sizes. 11. Improve the practicality of the probe 20. At the same time, compared with the solution in which the contact surface 212 is arranged parallel to both sides of the solder ball 11, the arrangement of the contact surface 212 can increase the size of the first contact section 21 of the probe 20 and the solder ball 11. The contact area; in one embodiment, the contact surface 212 in this embodiment can be arranged in a plane or in an arc shape.

It can be understood that the first contact section 21 is deformed in the horizontal direction, and the second connecting section 23 is deformed in the vertical direction, so that the probe 20 is in a squeezed state during the test state, so that the test IC 10 and The connection between the test PCB 30 and the probe 20 is tighter, and at the same time, the probe 20 can be applied to integrated circuits of different sizes, thereby improving the practicality of the probe 20 .

In one embodiment, each of the two first contact segments 21 is provided with a positioning member 211, and the contact surface 212 is provided on the positioning member 211. The two positioning members 211 can be close to and away from each other. To clamp and loosen the solder balls 11.

In one embodiment, the sides of the two contact surfaces 212 facing each other are arranged in an outwardly protruding arc; the outwardly protruding arcuate arrangement enhances the structural strength of the two positioning members 211 and increases the The toughness of the positioning member 211 and the arc-shaped arrangement increase the contact area between the cross-section and the solder ball 11, thereby improving the testing effect of the integrated circuit testing equipment.

In this embodiment, the second contact segment 24 is in a convex shape and extends in the direction of the second connecting segment 23 away from the first contact segment 21; since the second contact segment 24 is provided on the second connecting segment, At the end of the section 23, the second connecting section 23 will produce a certain vertical deformation during the test state, and the second connecting section 23 is arranged in an S shape, so the second contact section 24 is provided on the second connecting section 23 on the center line in the vertical direction, so that the distance between the second contact section 24 and the test PCB 30 when compressed is closer than the distance between the second connection section 23 and the test PCB 30, preventing the second connection section from 23 is in direct contact with the test PCB 30, while the second contact segment 24 is suspended.

In one embodiment, in order to reduce the shaking of the probe 20 during testing and extrusion, the probe 20 further includes a first limiting portion 25 , and is provided between the test IC 10 and the test PCB 30 . There is a support plate 40, and a second limiting part is provided on the supporting plate 40. The probe 20 is limited to the second limiting part through the first limiting part 25. When in the test state, the probe 20 The needle 20 is firmly fixed between the test IC 10 and the test PCB 30 through the cooperation of the first limit part 25 and the second limit part, thereby reducing the shaking of the probe 20, increasing the fixing effect of the probe 20, and improving Test efficiency and accuracy of probe 20.

Specifically, the first limiting part 25 is a limiting protrusion, the second limiting part is a limiting groove, and the limiting protrusion is stuck into the limiting groove; the limiting protrusion and the limiting groove are The size of the position grooves is consistent, so that when the probe 20 is in the test state, the limit protrusion of the probe 20 is just limited to the limit groove, thereby reducing the shaking of the probe 20, and the limit protrusion and the limit groove are The structure is simple and easy to manufacture; of course, in other embodiments, the first limiting part 25 and the second limiting part can also be configured as a snap-in structure for snap-connection.

In one embodiment, in order to further increase the limiting effect of the probe 20, in this embodiment, two limiting protrusions and two limiting grooves are provided, and the two limiting protrusions are respectively They are located at both ends of the first connecting section 22 and extend in a direction close to the contact surface 212 .

This application also proposes an integrated circuit testing equipment, which includes the probe 20 mentioned above. The specific structure of the probe 20 refers to the above-mentioned embodiments. Since this integrated circuit test equipment adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be discussed here. Let’s go over them one by one.

The above are only optional embodiments of the present application, and are not intended to limit the patent scope of the present application. Under the inventive concept of the present application, any equivalent structural transformation made by using the contents of the description and drawings of the present application, or direct/indirect Application in other related technical fields is included in the scope of patent protection of this application.

Claims

A probe consisting of:

Two first contact segments, the two first contact segments are spaced apart, and the upper ends of the two first contact segments are each provided with a contact surface for contact with the test IC. Both of the two first contact segments can Elastic deformation occurs in the horizontal direction;

A first connecting section is connected to the lower ends of the two first contact sections;

The second connecting section includes a plurality of straight sections and a plurality of bent sections. The plurality of straight sections and the plurality of bent sections are connected end to end, and the plurality of straight sections are all facing the first connecting section. Extending in the length direction, the bent section at the first end of the second connecting section is connected to the first connecting section; and

a second contact section, the second contact section is connected to the section at the end of the second connection section, and is used for contacting the test PCB;
The probe according to claim 1, wherein each of the two first contact segments is provided with a reinforcing protrusion, and the two reinforcing protrusions are respectively provided on one side of the two first contact segments facing each other. side.
The probe of claim 1, wherein the test IC includes a solder ball, and the solder ball squeezes the two contact surfaces to deform the two first contact segments in a horizontal direction.
The probe according to claim 3, wherein each of the two first contact segments is provided with a positioning piece, the contact surface is provided on the positioning piece, and the two positioning pieces can be close to and away from each other. , to clamp and loosen the solder balls.
The probe according to claim 4, wherein the sides of the two contact surfaces facing each other are in an outwardly convex arc-shaped arrangement or a bell mouth shape, so that the solder balls can be guided to fall into the contact position.
The probe of claim 1, wherein the probe further includes a first limiter, a support plate is provided between the test IC and the test PCB, and a second limiter is provided on the support plate. position part, the probe is limited to the second limiting part through the first limiting part.
The probe according to claim 6, wherein the first limiting part is a limiting protrusion, the second limiting part is a limiting groove, and the limiting protrusion snaps into the limiting groove. Inside.
The probe according to claim 7, wherein there are two limiting protrusions and two limiting grooves, and the two limiting protrusions are respectively located at both ends of the first connecting section, and extends toward the direction close to the contact surface.
An integrated circuit testing equipment, wherein the integrated circuit testing equipment includes the probe according to any one of claims 1 to 8.