CN204302329U - Microelectromechanical-systems testing needle - Google Patents
Microelectromechanical-systems testing needle Download PDFInfo
- Publication number
- CN204302329U CN204302329U CN201420693039.1U CN201420693039U CN204302329U CN 204302329 U CN204302329 U CN 204302329U CN 201420693039 U CN201420693039 U CN 201420693039U CN 204302329 U CN204302329 U CN 204302329U
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- CN
- China
- Prior art keywords
- microelectromechanical
- syringe needle
- needle
- type unit
- testing needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910021118 PdCo Inorganic materials 0.000 description 1
- 229910021069 Pd—Co Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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Abstract
The utility model relates to a kind of microelectromechanical-systems testing needle, belongs to technical field of electronic products.The microelectromechanical-systems testing needle of this structure comprises top syringe needle and bottom syringe needle, and is connected to the serpentine bend part between described top syringe needle and bottom syringe needle, and described serpentine bend part is made up of some end to end S type unit.Before and after when pressurized, the contact of S type unit, reduces resistance during chip detection high frequency, thus effectively improves testing needle service life, reduces chip detection cost, and the structure detection of the microelectromechanical-systems testing needle of this utility model, production technology is easy.
Description
Technical field
The utility model relates to technical field of electronic products, particularly chip technology field, specifically refers to a kind of microelectromechanical-systems testing needle.
Background technology
MEMS (Micro-Electro-Mechanical System, MEMS) testing needle is the common equipment in chip testing.Existing MEMS testing needle has substantially all selected the testing needle of similar Pogo Pin version, the testing needle generally selected mainly comprises 4 parts, Shell (being commonly called as shell), Top Plunger (being commonly called as top syringe needle), Bottom Plunger (being commonly called as bottom syringe needle), Spring (being commonly called as spring).Wherein, Music Wire (being commonly called as piano wire) generally all selected by the material of spring.This clock testing needle parts machining is more difficult, and assembling requires higher, and cost is relative also higher.Due to these limitations, propose stern challenge to developing life-span testing needle that is long and advantage of lower cost.In common chip testing, can simplify traditional testing needle structure, reducing the cost of testing needle, is one of them key point.
Utility model content
The purpose of this utility model overcomes above-mentioned shortcoming of the prior art, provides a kind of structure simple, effectively can improve testing needle service life, the microelectromechanical-systems testing needle reduced costs simultaneously.
In order to realize above-mentioned object, microelectromechanical-systems testing needle of the present utility model has following formation:
This microelectromechanical-systems testing needle comprises top syringe needle and bottom syringe needle, also comprises the serpentine bend part be connected between described top syringe needle and bottom syringe needle, and described serpentine bend part is made up of some end to end S type unit.
In this microelectromechanical-systems testing needle, before described each S type unit comprises one protruding and one after projection, its not subjected to pressure state, between the rear projection of last S type unit and the front projection of a rear S type unit, there is gap, at pressured state, the rear projection of last S type unit and the front projection contacts of a rear S type unit.
In this microelectromechanical-systems testing needle, one end of described top syringe needle connection serpentine bend part is provided with a rear projection, and one end that described bottom syringe needle connects serpentine bend part is provided with a front projection.
The microelectromechanical-systems testing needle that have employed this utility model comprises top syringe needle and bottom syringe needle, also comprises the serpentine bend part be connected between described top syringe needle and bottom syringe needle, and described serpentine bend part is made up of some end to end S type unit.Before and after when pressurized, the contact of S type unit, reduces resistance during chip detection high frequency, thus effectively improves testing needle service life, reduces chip detection cost, and the structure detection of the microelectromechanical-systems testing needle of this utility model, production technology is easy.
Accompanying drawing explanation
Fig. 1 is the structural representation of microelectromechanical-systems testing needle of the present utility model.
Fig. 2 is the partial enlarged drawing (not subjected to pressure state) of part A in Fig. 1.
Fig. 3 is the detailed schematic of the S type unit in microelectromechanical-systems testing needle of the present utility model.
Detailed description of the invention
In order to more clearly understand technology contents of the present utility model, describe in detail especially exemplified by following examples.
Referring to shown in Fig. 1, is the structural representation of microelectromechanical-systems testing needle of the present utility model.
In one embodiment, the serpentine bend part 3 that this microelectromechanical-systems testing needle comprises top syringe needle 1 and bottom syringe needle 2 and is connected between described top syringe needle 1 and bottom syringe needle 2, described serpentine bend part 3 is made up of some end to end S type unit.As shown in Figure 1 and Figure 2, before each S type unit comprises one protruding 4 and one after protruding 5, its not subjected to pressure state, between rear protruding 5 of last S type unit and front protruding 4 of a rear S type unit, there is gap 6, at pressured state, rear protruding 5 of last S type unit contacts (not shown) with front protruding 4 of a rear S type unit.
In preferred embodiment, projection 5 after one end that described top syringe needle 1 connects serpentine bend part 3 is provided with, one end that described bottom syringe needle 2 connects serpentine bend part 3 is provided with one front protruding 4.
In application of the present utility model, the main body one's duty of this microelectromechanical-systems testing needle adopts serpentine configuration, and be attached with two projections in each serpentine sector, while compression, two projections contact with each other, to reduce resistance during high frequency.
The material selection Pd-Co alloy PdCo of this microelectromechanical-systems testing needle.Compared with traditional testing needle, structure is simple, and cost is lower, and the life-span is long.
As shown in Figure 3, get arbitrarily a joint S type unit, the relation of power F and compression distance Δ meets following formula:
β-th in formula
3e/12, b are cross-sectional width, and h is section thickness, and E is the elastic modelling quantity of material; γ=l/R; N is joint number.There is error in actual power and the power of theory calculate, belongs to normal phenomenon.
The microelectromechanical-systems testing needle that have employed this utility model comprises top syringe needle and bottom syringe needle, also comprises the serpentine bend part be connected between described top syringe needle and bottom syringe needle, and described serpentine bend part is made up of some end to end S type unit.Before and after when pressurized, the contact of S type unit, reduces resistance during chip detection high frequency, thus effectively improves testing needle service life, reduces chip detection cost, and the structure detection of the microelectromechanical-systems testing needle of this utility model, production technology is easy.
In this description, the utility model is described with reference to its specific embodiment.But, still can make various amendment and conversion obviously and not deviate from spirit and scope of the present utility model.Therefore, description and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (3)
1. a microelectromechanical-systems testing needle, it comprises top syringe needle and bottom syringe needle, it is characterized in that, also comprise the serpentine bend part be connected between described top syringe needle and bottom syringe needle, described serpentine bend part is made up of some end to end S type unit.
2. microelectromechanical-systems testing needle according to claim 1, it is characterized in that, before described each S type unit comprises one protruding and one after projection, its not subjected to pressure state, between the rear projection of last S type unit and the front projection of a rear S type unit, there is gap, at pressured state, the rear projection of last S type unit and the front projection contacts of a rear S type unit.
3. microelectromechanical-systems testing needle according to claim 2, is characterized in that, one end of described top syringe needle connection serpentine bend part is provided with a rear projection, and one end that described bottom syringe needle connects serpentine bend part is provided with a front projection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420693039.1U CN204302329U (en) | 2014-11-18 | 2014-11-18 | Microelectromechanical-systems testing needle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420693039.1U CN204302329U (en) | 2014-11-18 | 2014-11-18 | Microelectromechanical-systems testing needle |
Publications (1)
Publication Number | Publication Date |
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CN204302329U true CN204302329U (en) | 2015-04-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420693039.1U Expired - Fee Related CN204302329U (en) | 2014-11-18 | 2014-11-18 | Microelectromechanical-systems testing needle |
Country Status (1)
Country | Link |
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CN (1) | CN204302329U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113866464A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
CN113866465A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
-
2014
- 2014-11-18 CN CN201420693039.1U patent/CN204302329U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113866464A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
CN113866465A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150429 |