JP6770798B2 - Contact probe - Google Patents

Description

The present invention relates to a contact probe.

As for the probe card used for semiconductor inspection, the pitch of the probe arranged on the probe card is required to be narrowed as the pitch of the terminals of the IC chip on the semiconductor substrate to be inspected is narrowed. A probe (see Patent Document 1) formed on a thin film by a MEMS (microelectromechanical system) technology has been proposed to cope with such narrowing of the pitch.

At the time of semiconductor inspection, the probe comes into contact with the terminal of the IC chip, and electrical measurement is performed. As one form of the terminal of the IC chip with which the probe comes into contact, there is a cylindrical one, for example, one in which a hemispherical solder layer is formed at the tip of the cylindrical Cu, which is suitable for contact with such a three-dimensional terminal. Further, a spiral-shaped contactor (see Patent Document 2) is disclosed.

Japanese Unexamined Patent Publication No. 7-113842 JP-A-2002-175859

When the probe comes into contact with the terminal of the cylindrical IC chip as described above, if the surface of the solder layer at the tip is scratched such as a dent, bubbles are generated when the solder layer for mounting the IC chip is mounted on the substrate. There is a problem that it causes mounting failure. To solve this problem, the probe described in Patent Document 1 that presses the tip of the terminal, or the probe (contactor) described in Patent Document 2 that presses the tip of the terminal including the tip so as to embrace it. There is a risk of damaging the tip of the terminal. Further, since the probe (contactor) described in Patent Document 2 uses a spiral shape having a complicated structure, another problem arises that it becomes difficult to form as the miniaturization progresses.

Then, as the pitch of the probe becomes narrower, the number of probes increases, and as a result, there is a problem that the load acting on the terminal of the IC chip at the time of inspection by the probe card increases, and the probe has a low needle. The overdrive margin is large due to pressure, and stable contact is required.

The present invention solves such a conventional problem, prevents damage to the tip of a columnar terminal, has a large overdrive margin at a low stylus pressure, and realizes stable contact, and is suitable for miniaturization. The purpose is to provide.

The contact probe of the present invention has a main surface provided with a recess, a plate-shaped support substrate having a back surface and having insulating properties, and one surface fixed to the main surface of the support substrate to form the recess. A flexible thin film layer having an insulating property and flexibility covering the flexible thin film layer and a contact electrode provided on the other surface of the flexible thin film layer are provided, and the contact electrode is centered from the peripheral edge of the recess. It is characterized in that the portion corresponding to the central region of the recess in the flexible thin film layer is formed so as to be exposed.

The support substrate includes a conductive member that connects the main surface and the back surface and is electrically connected to the contact electrode.

The recess is a through hole penetrating from the main surface of the support substrate to the back surface, and the conductive member is a conductive film formed on the inner surface of the through hole.

A base substrate having a through electrode coupled to the back surface of the support substrate and electrically connected to the conductive member of the support substrate is further provided.

The contact electrode includes a contact portion formed of a material different from that of the contact electrode at a portion protruding toward the center of the recess.

The contact electrode includes a contact portion that protrudes toward the center of the recess and protrudes in a direction away from the flexible thin film layer.

The thickness of the flexible thin film layer is 5.0 to 10.0 μm, and the thickness of the contact electrode is 0.1 to 5.0 μm.

The contact probe of the present invention has a main surface provided with a recess, a plate-shaped support substrate having a back surface and having insulating properties, and one surface fixed to the main surface of the support substrate to form the recess. A flexible thin film layer having an insulating property and flexibility covering the flexible thin film layer and a contact electrode provided on the other surface of the flexible thin film layer are provided, and the contact electrode is centered from the peripheral edge of the recess. By forming the flexible thin film layer so as to expose the portion corresponding to the central region of the recess, damage to the tip of the columnar terminal, which is the object to be inspected, is prevented. In addition, the overdrive margin becomes large at low stylus pressure, and stable contact is possible.

The contact electrode has a contact portion made of a material different from that of the contact electrode formed at a portion protruding toward the center of the recess, or the contact electrode protrudes toward the center of the recess. In addition, by providing the contact portion protruding in the direction away from the flexible thin film layer, stable contact can be achieved by sufficiently scrubbing the inspection object.

When the thickness of the flexible thin film layer is 5.0 to 10.0 μm and the thickness of the contact electrode is 0.1 to 5.0 μm, the flexible thin film layer and the contact Since the electrode is smoothly deformed by the inspection object, it can be applied to the inspection of a fine inspection object having a diameter of 50 μm or less.

It is sectional drawing of the contact probe of 1st Embodiment. It is a bottom view of the contact probe of the first embodiment. (A) is a cross-sectional view before the contact probe comes into contact with the IC chip terminal, and (b) is a cross-sectional view of the state where the probe is in contact with the IC chip terminal. It is sectional drawing of the contact probe of the 2nd Embodiment. It is a bottom view of the contact probe of the second embodiment. (A) is an enlarged plan view showing a bent portion of the contact electrode of the contact probe of the second embodiment, and (b) is an enlarged plan view showing a bent portion of the contact electrode for comparison. It is sectional drawing of the contact probe of the 3rd Embodiment. It is a bottom view of the contact probe of the third embodiment. It is sectional drawing of the contact probe of 4th Embodiment. It is a bottom view of the contact probe of the 4th embodiment. It is a figure which shows the stress simulation when the thickness of a cantilever beam is 50 μm. It is a figure which shows the stress simulation when the thickness of a cantilever beam is 5 μm.

The contact probe of the present invention will be described with reference to the drawings. In the present specification, for convenience, a case where the probe card is arranged above and the inspection object is arranged below will be described, but the posture when the contact probe of the present invention is used is not limited. First, the contact probe 1 of the first embodiment will be described. FIG. 1 is a cross-sectional view of the contact probe 1, and FIG. 2 is a bottom view of the contact probe 1.

As shown in FIGS. 1 and 2, the contact probe 1 of the present invention is laminated on the base substrate 2 on which the through electrode 5 is formed and the lower surface of the base substrate 2, and a plurality of cylindrical recesses 6 are formed at predetermined intervals. The formed support substrate 3, the flexible thin film layer 4 laminated on the lower surface of the support substrate 3 and covering the recess 6 with a substantially flat surface, and the contact electrode 8 laminated on the lower surface of the flexible thin film layer 4. Consists of. The base substrate 2, the support substrate 3, and the flexible thin film layer 4 are laminated in this order from the top, and the contact electrode 8 is formed on the lower surface of the flexible thin film layer 4, which is the bottom surface. The recess 6 is formed as a through hole that vertically penetrates the support substrate 3, and a terminal of a cylindrical IC chip that is an inspection target is inserted into the through hole. Therefore, the IC chip of the IC chip. It has a larger diameter than the terminal.

The flexibility provided in the flexible thin film layer 4 is deformable according to an external force for inserting the terminal of the IC chip into the through hole, and is in the original state after the external force is removed. It means elasticity that can be restored to. The contact electrode 8 has flexibility capable of following the deformation and restoration of the flexible thin film layer 4. As a result, most of the stress on the external force is generated by the flexible thin film layer 4.

In the contact probe 1, a conductive member 7 for connecting the contact electrode 8 and the through electrode 5 is further formed on the support substrate 3. In the present embodiment, the conductive member 7 penetrates the support substrate 3 and the flexible thin film layer 4 on the same straight line as the through electrode 5 and adjacent to the recess 6 at a predetermined interval. It is a through electrode formed so as to. The through electrode 5 is formed so as to penetrate the base substrate 2, and the through electrode 5 and the conductive member 7 are arranged on the same straight line and connected to each other, whereby the surface of the base substrate 2 is formed. The electrical connection from the contact electrode 8 to the contact electrode 8 is secured.

In the contact probe 1, the contact electrode 8 is further formed with a contact portion 9 that comes into contact with an inspection object as a separate member. As shown in FIG. 2, the contact electrode 8 has a shape in which a portion 81 surrounding the peripheral edge of the recess 6 and a portion 82 connected to the conductive member 7 are connected to the lower surface of the flexible thin film layer 4. Further, the portion 81 surrounding the peripheral edge of the recess 6 has four triangular shapes protruding from the peripheral edge of the recess 6 toward the center of the recess 6. In the flexible thin film layer 4, the portion below the recess 6 where the contact electrode 8 is not formed is the opening 10 of the contact electrode 8. Then, at the four triangular tips of the flexible thin film layer 4, the contact portion 9 mainly in contact with the inspection object is formed so as to project in a direction away from the flexible thin film layer 4. ing.

The contact electrode 8 is formed on the lower surface of the flexible thin film layer 4 so as to have a stress that does not hinder the deformation of the flexible thin film layer 4 while ensuring the required conductivity. When the portion of the flexible thin film layer 4 located below the recess 6 is pushed upward by the inspection object and deformed during the inspection, both the contact electrode 8 and the flexible thin film layer 4 are said to be the same. It is deformed so as to move into the recess 6. At this time, the flexible thin film layer 4 is not hindered from stretching because the opening 10 is formed in the contact electrode 8, and the four triangular portions in the contact electrode 8 and the said. It is deformed so as to move into the recess 6 together with the contact portion 9. At this time, since the stress generated by the inspection object is configured so that the contact electrode 8 is smaller than the flexible thin film layer 4, the contact electrode 8 is the inspection object and the inspection object. It does not substantially hinder the movement of the flexible thin film layer 4 into the recess 6.

Regarding the stress generated in the contact electrode 8 deformed by an external force, the thickness of the contact electrode 8 (the object to be inspected from the lower surface of the flexible thin film layer 4) using a cantilever model as shown in FIGS. 11 and 12. The relationship between the direction toward the contact electrode 8 and the maximum stress generated in the contact electrode 8 was simulated. As shown in FIG. 11, as a model of the contact electrode 8, the stress when the tip of a cantilever beam having a length of 500 μm, a width of 50 μm, and a thickness of 50 μm and made of NiCo is pushed down by 50 μm is measured. As shown in FIG. 12, as a model of the contact electrode 8, the stress when the tip of a cantilever beam having a length of 500 μm, a width of 50 μm, and a thickness of 5 μm and made of NiCo is pushed down by 50 μm is simulated. It is what I asked for. In FIG. 12, only the thickness of the model of FIG. 11 is changed, and the thickness is 1/10 of the thickness of the model of FIG. The maximum stress of the contact electrode 8 when the thickness is 50 μm in FIG. 11 is 3,076 MPa, whereas the maximum stress of the contact electrode 8 when the thickness is 5 μm in FIG. 12 is significantly reduced to 243 MPa. There is.

In the contact probe 1 of the present invention, the stress generated by the inspection object preferably makes the contact electrode 8 smaller than the flexible thin film layer 4. In order to reduce the stress of the contact electrode 8, it is necessary to reduce the thickness, in particular, to reduce the thickness of the portion where the maximum stress occurs within a range in which the minimum strength can be secured.

When the object to be inspected is a columnar object having a diameter of 30 μm and the diameter of the recess 6 is 50 μm, the thickness of the flexible thin film layer 4 is 10 μm and the thickness of the contact electrode 8 is 1 μm. The inspection object can be smoothly moved into the recess 6, and an electrical connection between the inspection object and the contact electrode 8 is secured. In this case, if the thickness of the curved portion of the contact electrode 8 is at least 1 μm in FIG. 3 (b), the required flexibility is ensured, and thus the other portion of the contact electrode 8 is obtained. The thickness of the above can be 1 μm or more. Further, in order to make the electrical connection between the inspection object and the contact electrode 8 more reliable, it is also possible to provide the contact portion 9 on the contact electrode 8.

As the material of the base substrate 2 and the support substrate 3, a material having insulating properties and suitable for processing, such as a polymer or ceramic, is used. The material of the through electrode 5 and the through electrode of the conductive member 7 may be any general conductive material used for a substrate or the like, and both may be the same material or different materials. As the material of the flexible thin film layer 4 that is required to be easily deformed, a polymer or elastomer having insulating properties and a high elongation rate is preferable.

The material of the contact electrode 8 is preferably a material having high contact property and toughness. The contact electrode 8 is preferably made of a high-hardness material capable of contacting a copper post, which is an object to be inspected, at the time of inspection, and scraping a copper oxide film on the surface thereof to expose a conductive surface. However, since the high hardness material has low toughness, when the contact portion 9 is provided as a separate member on the contact electrode 8 as in the present embodiment, the contact electrode 8 and the contact portion 9 are different from each other. It corresponds by using the material.

At this time, a high toughness material is used for the contact electrode 8 having a large bending, and the contact portion 9 in contact with the inspection object is formed of a metal layer having a hardness higher than that of the contact electrode 8 and being hard to oxidize. From the above, as the material of the contact electrode 8, iron group elements of Fe, Co, and Ni, copper group elements of Cu, Ag, and Au, and alloys of these elements can be used. As the material of the contact portion 9, a platinum group element of Re, Ru, Rh, Pd, Os, Ir, Pt and an alloy containing the platinum group element can be used.

In the present embodiment, the case where the contact portion 9 is provided on the contact electrode 8 as a separate member has been described, but the contact portion 9 is not a separate member, and a part of the contact electrode 8 is a contact portion. It is also possible, and it is also possible to form a part of the contact electrode 8 so as to project in a direction away from the flexible thin film layer 4.

Next, the operation of the contact probe 1 of the present invention at the time of inspection will be described with reference to FIG. FIG. 3 shows a cross-sectional view of the contact probe 1 fixed to the probe card substrate 200 using solder 201. Then, the cross-sectional view of the state where the IC chip terminal 101 to be inspected is arranged on the wafer 100 is shown.

As shown in FIG. 3A, the probe card is aligned so that the recess 6 of the contact probe 1 is located above the IC chip terminal 101. After that, the wafer 100 is moved upward to perform overdrive toward the state of FIG. 3B, and the IC chip terminal 101 together with the flexible thin film layer 4 and the contact portion 9 is the contact probe. It is pushed up into the recess 6 of 1. At this time, the tip portion of the IC chip terminal 101 first contacts the contact portion 9 and a part of the contact electrode 8, and then the flexible thin film layer 4, the contact portion 9, and the contact electrode 8 are brought into contact with each other. It is pushed up into the recess 6 to be deformed. At this time, the flexible thin film layer 4 is elastically deformed so as not to hinder the movement of the IC chip terminal 101 while generating a constant stress, and the contact electrode 8 is elastically deformed to the flexible thin film layer 4. It will follow and bend.

Then, as shown in FIG. 3B, a part of the IC chip terminal 101 is inserted into the recess 6 together with the contact portion 9 and the flexible thin film layer 4, and the contact probe 1 is inserted into the recess 6. The four contact portions 9 of the contact electrode 8 are mainly in contact with the outer surface of the IC chip terminal 101. As a result, the contact probe 1 is electrically connected to the IC chip terminal 101 and can be inspected.

During the transition from the state of FIG. 3A to the state of FIG. 3B, the IC chip terminal 101 moves upward while the contact portion 9 is in contact with the side surface of the IC chip terminal 101, and the IC Since the oxide film on the side surface of the chip terminal 101 is scraped to expose the conductive surface and come into contact with the contact portion 9, the scrub functions sufficiently to ensure stable electrical contact. .. After that, when the IC chip terminal 101 shifts to a state in which the flexible thin film layer 4 and the contact electrode 8 are not pushed up, the flexible thin film layer 4 together with the contact electrode 8 due to its elastic force (b). The state of FIG. 3A is restored to the state of FIG. 3A.

Further, as shown in FIG. 3B, the tip portion of the IC chip terminal 101 comes into contact with and protected from the flexible thin film layer 4 which is easily elastically deformed, so that further overdrive occurs. Even if it does, it is less likely to be damaged. As described above, the contact probe 1 of the present invention can reduce damage to the IC chip terminal 101 during inspection, can realize stable contact with a low stylus pressure, and can sufficiently function the scrub at this time.

Further, when the contact probe 1 of the present invention is used repeatedly, the flexible thin film layer 4 and the contact electrode 8 of the contact probe 1 are repeatedly deformed, but on the surface of the flexible thin film layer 4. Since the contact electrode 8 having substantially negligible stress is formed, the stress at the time of deformation is mainly borne by the flexible thin film layer 4, and the contact electrode The possibility of damage to 8 can be reduced, and the durability of the contact probe 1 can be improved.

Although the description has been made using a form in which the base substrate 2 and the support substrate 3 are laminated with different substrates, the base substrate 2 and the support substrate 3 can be integrated into one substrate. It is also possible to provide an electrode pad at the position of the through electrode 5 on the surface of the base substrate 2. Various shapes are possible for the shape of the contact electrode 8, and another shape will be described below.

Next, the contact probe 11 of the second embodiment will be described with reference to the drawings. FIG. 4 is a cross-sectional view of the contact probe 11, and FIG. 5 is a bottom view of the contact probe 11. The contact probe 11 of the second embodiment is a form in which the shapes of the contact electrode 8 and the contact portion 9 of the contact probe 1 of the first embodiment are changed.

As shown in FIGS. 4 and 5, the contact probe 11 of the present embodiment includes a base substrate 12 on which a through electrode 15 is formed, a support substrate 13 in which a cylindrical recess 16 is formed as a through hole, and a flexible thin film layer. It is composed of 14 and a contact electrode 18 provided on the lower surface of the flexible thin film layer 14. Regarding the base substrate 12, the support substrate 13, the flexible thin film layer 14, the through electrode 15, the recess 16, and the conductive member 17 formed in the support substrate 13, the contacts of the first embodiment. Since the same structure as each member in the probe 1 is used, detailed description thereof will be omitted.

In the contact probe 11, the contact portion 19 is formed as a separate member on the contact electrode 18. As shown in FIG. 5, the contact electrode 18 extends from the conductive member 17 to the recess 16 on the lower surface of the flexible thin film layer 14, and extends along the peripheral edge of the recess 16 so as to sandwich the recess 16. After being divided into two, each of the two divided portions extends toward the center of the recess 16 while drawing a curve, and contacts the two tip portions located near the center of the recess 16. The portion 19 is made of a material different from that of the contact electrode 18, and is formed so as to project in a direction away from the flexible thin film layer 14. The two contact portions 19 are arranged so as to face each other with the center of the recess 16 interposed therebetween, and have a structure in which they come into contact with the side surface of the IC chip terminal 101, which is an inspection object, at two points.

The contact probe 11 of the present embodiment has a smaller area of the contact electrode 18 than the contact probe 1 of the first embodiment, and the contact probe 11 comes into contact with the IC chip terminal 101 which is an inspection target. At that time, the flexible thin film layer 14 is easily deformed because the region constrained by the contact electrode 18 is reduced.

The flexible thin film layer 14 bends at the peripheral edge of the recess 16 when deformed. At the same time, the contact electrode 18 is also bent at a position located on the peripheral edge of the recess 16, and a bent portion A as shown by a double-headed arrow is formed in FIG. 6A. In the contact probe 11 of the present embodiment, the contact electrode 18 is bent at two points. At this time, the wider the bent portion A of the contact electrode 18 shown in FIG. 6A, the wider the bent portion. The stress acting on A can be dispersed. For example, as shown in FIG. 6B, when the contact electrode 18 is stretched to have substantially the same width and substantially orthogonal to the peripheral edge of the recess 16, the width of the bent portion B is FIG. 6A. It becomes narrower than the bent portion A of the above, and the stress at the time of bending is concentrated, and when the contact electrode 18 is repeatedly deformed, the contact electrode 18 is easily damaged. Therefore, by configuring the shape of the contact electrode 18 so that the width of the bent portion A becomes wider like the contact probe 11 of the present embodiment, it is possible to disperse the stress at the time of bending and improve the durability. it can.

Next, the contact probe 21 of the third embodiment will be described with reference to the drawings. FIG. 7 is a cross-sectional view of the contact probe 21, and FIG. 8 is a bottom view of the contact probe 21. The contact probe 21 of the third embodiment is a form in which the structure of the conductive member 7 of the contact probe 1 of the first embodiment is changed, and the position of the through electrode 5 is changed accordingly.

As shown in FIGS. 7 and 8, the contact probe 21 of the present embodiment includes a base substrate 22 on which a through electrode 25 is formed, a support substrate 23 in which a cylindrical recess 26 is formed as a through hole, and a flexible thin film layer. It is composed of 24 and a contact electrode 28 provided on the lower surface of the flexible thin film layer 24.

The shape of the contact electrode 28 is the same as that of the contact electrode 8 of the contact probe 1 of the first embodiment. As shown in FIG. 8, the contact electrode 28 has a shape in which a portion 83 surrounding the peripheral edge of the recess 26 and a portion 84 connected to the conductive member 27 are connected to the lower surface of the flexible thin film layer 24. Further, the portion 83 surrounding the peripheral edge of the recess 26 has four triangular shapes protruding from the peripheral edge of the recess 26 toward the center of the recess 26. In the flexible thin film layer 24, a portion below the recess 26 where the contact electrode 28 is not formed is an opening 30 of the contact electrode 28. Then, at the four triangular tips of the flexible thin film layer 24, a contact portion 29 that mainly contacts the inspection object is formed so as to project in a direction away from the flexible thin film layer 24. There is.

The through electrode 25 is formed on the base substrate 22 so as to be located above the recess 26. A conductive member 27 that connects the contact electrode 28 and the through electrode 25 is formed on the support substrate 23. In the present embodiment, the conductive member 27 uses a conductive film formed on the inner surface of the recess 26. The conductive film is formed on the inner peripheral surface and the upper surface of the recess 26, and is further formed so as to bend from the inner peripheral surface at an edge and extend to the lower surface of the support substrate 23. Since the upper surface of the recess 26 is the lower surface of the base substrate 22 and the end portion of the through electrode 25 is exposed, the conductive film is electrically connected to the through electrode 25.

The contact electrode 28 has a portion 84 connected to the conductive member 27 that penetrates the flexible thin film layer 24 and is connected to a portion of the conductive member 27 that extends to the lower surface of the support substrate 23 of the conductive film. The contact electrode 28 is electrically connected to the through electrode 25 via the conductive member 27.

As described above, in the present embodiment, since the conductive film provided on the inner surface of the recess 26 is used as the conductive member 27, it is not necessary to provide the through electrode adjacent to the recess 26, and the adjacent recess 26 is eliminated. The interval of 26 can be made narrower than that of the contact probe 1 of the first embodiment, and the contact probe 21 having a narrower pitch can be realized.

Further, as in the other embodiments, the contact probe 21 of the present embodiment also reduces damage to the IC chip terminal during inspection, can realize stable contact with low stylus pressure, and can sufficiently function scrubbing. it can.

Next, the contact probe 31 of the fourth embodiment will be described with reference to the drawings. FIG. 9 is a cross-sectional view of the probe 31, and FIG. 10 is a bottom view of the contact probe 31. The contact probe 31 of the fourth embodiment is based on the contact probe 11 of the second embodiment, and the structure of the conductive member 17 is changed to the conductive film used for the contact probe 21 of the third embodiment. In addition, the position of the through electrode 15 is changed.

As shown in FIGS. 9 and 10, the contact probe 31 of the present embodiment includes a base substrate 32 on which a through electrode 35 is formed, a support substrate 33 in which a cylindrical recess 36 is formed as a through hole, and a flexible thin film layer. It is composed of 34 and a contact electrode 38 provided on the lower surface of the flexible thin film layer 34.

The shape of the contact electrode 38 is the same as that of the contact electrode 18 of the contact probe 11 of the second embodiment. As shown in FIG. 10, the contact electrode 38 is connected to the conductive member 37 on the lower surface of the flexible thin film layer 34 in the vicinity of the recess 36, and the recess is formed from the connection point with the conductive member 37. It is stretched to 36, divided into two along the peripheral edge of the recess 36 so as to sandwich the recess 36, and then the two divided portions are stretched while drawing a curve toward the center of the recess 36. The contact portions 39 are formed as separate members at the two tip ends located near the center of the recess 36 so as to project in a direction away from the flexible thin film layer 34. The two contact portions 39 are arranged so as to face each other with the center of the recess 36 interposed therebetween, and have a structure in which they come into contact with the side surface of the IC chip terminal, which is an inspection object, at two points.

The through electrode 35 is formed on the base substrate 32 so as to be located above the recess 36. The support substrate 33 is formed with the conductive member 37 that connects the contact electrode 38 and the through electrode 35. In the present embodiment, the conductive member 37 uses a conductive film formed on the inner surface of the recess 36. The conductive film is formed on the inner peripheral surface and the upper surface of the recess 36, and is further formed so as to bend from the inner peripheral surface at the edge of the recess 36 and extend to the lower surface of the support substrate 33. Since the upper surface of the recess 36 is the lower surface of the base substrate 32 and the end portion of the through electrode 35 is exposed, the conductive film is electrically connected to the through electrode 35.

A part of the contact electrode 38 penetrates the flexible thin film layer 34 and is connected to a part of a portion of the conductive member 37 extending to the lower surface of the conductive film support substrate 33, whereby the contact electrode 38 is connected. Is electrically connected to the through electrode 35 via the conductive member 37.

As described above, in the present embodiment, since the conductive film provided in the recess 36 is used as the conductive member 37, the through electrode becomes unnecessary, and the distance between the adjacent recesses 36 is set from the second embodiment. Can be narrowed, and a contact probe 31 having a narrower pitch can be realized.

Further, as in the other embodiment, the contact probe 31 of the present embodiment also reduces damage to the IC chip terminal during inspection, can realize stable contact with low stylus pressure, and can sufficiently function scrubbing. it can.

As described above, in the contact probe of the present invention, the contact portion of the contact electrode is formed on the easily deformable flexible thin film layer installed so as to cover the concave portion of the support substrate so as to project from the peripheral edge of the concave portion toward the center. By using a structure provided and in contact with the side surface of the inspection target, damage to the IC chip terminal, which is the inspection target at the time of inspection, is reduced, and stable contact is realized with a low stylus pressure. By using a separate member for the contact portion, scrubbing can be performed reliably, and by selecting the shape of the contact electrode, it is possible to handle a narrow pitch, and it is also possible to improve durability. Is.

1,11,21,31 Contact probe 2,12,22,32 Base substrate 3,13,23,33 Support substrate 4,14,24,34 Flexible thin film layer 5,15,25,35 Through electrode 6, 16,26,36 Recesses 7,17,27,37 Conductive members 8,18,28,38 Contact electrodes 9,19,29,39 Contact parts 10,30 Opening 100 Wafer 101 IC chip terminal 200 Substrate 201 Solder

Claims (7)

A plate-shaped support substrate having a main surface and a back surface in which a plurality of recesses are provided at predetermined intervals and having insulation properties,
An insulating and flexible flexible thin film layer in which one surface is fixed to the main surface of the support substrate to cover the plurality of recesses.
A plurality of contact electrodes provided on the other surface of the flexible thin film layer.
One said contact electrode is arranged so as to correspond to one said recess.
The contact electrode is formed so as to project from the peripheral edge of the concave portion toward the center and to expose a portion of the flexible thin film layer corresponding to the central region of the concave portion.
At the time of inspection, one columnar terminal of the inspection object is inserted into each of the recesses, and the contact electrode comes into contact with the side surface of the terminal .
The thickness of the flexible thin film layer is 5.0 to 10.0 μm, the thickness of the contact electrode is 0.1 to 5.0 μm, and the thickness of the flexible thin film layer is. A contact probe characterized in that it is larger than the thickness of the contact electrode . The contact electrode is characterized in that it has a plurality of portions protruding from the peripheral edge of the concave portion toward the center, and the portion corresponding to the central region of the concave portion in the flexible thin film layer is formed so as to be exposed. The contact probe according to claim 1 . The contact probe according to claim 1 or 2 , wherein the support substrate includes a conductive member that connects the main surface and the back surface and is electrically connected to the contact electrode. The third aspect of the present invention, wherein the recess is a through hole penetrating from the main surface of the support substrate to the back surface, and the conductive member is a conductive film formed on the inner surface of the through hole. Contact probe. The contact probe according to claim 3 or 4 , further comprising a base substrate having a through electrode coupled to the back surface of the support substrate and electrically connected to the conductive member of the support substrate. The contact according to any one of claims 1 to 5 , wherein the contact electrode includes a contact portion formed of a material different from that of the contact electrode at a portion protruding toward the center of the recess. probe. The one according to any one of claims 1 to 6 , wherein the contact electrode includes a contact portion protruding toward the center of the recess so as to protrude in a direction away from the flexible thin film layer. Contact probe.

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