TWI264541B - Resilient micro-probe structure - Google Patents

Resilient micro-probe structure

Info

Publication number
TWI264541B
TWI264541B TW94125221A TW94125221A TWI264541B TW I264541 B TWI264541 B TW I264541B TW 94125221 A TW94125221 A TW 94125221A TW 94125221 A TW94125221 A TW 94125221A TW I264541 B TWI264541 B TW I264541B
Authority
TW
Taiwan
Prior art keywords
probe
base
resilient
layer
probe base
Prior art date
Application number
TW94125221A
Other languages
Chinese (zh)
Other versions
TW200704936A (en
Inventor
Troy-Chi Chiu
Bor-Gaung Chang
Chien-Ping Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW94125221A priority Critical patent/TWI264541B/en
Application granted granted Critical
Publication of TWI264541B publication Critical patent/TWI264541B/en
Publication of TW200704936A publication Critical patent/TW200704936A/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A resilient micro-probe structure comprises a probe base, a protection layer, and a grounding metal layer. The protection layer surrounds the probe base to enhance insulation and securing of the base. The grounding metal layer surrounds the protection layer to reduce electrical interference and to combine with the probe base to form a probe card. The probe base has a conductive via extending through a conductor layer and a resilient layer to shorten transmission route and to increase probe density. The probe base has a probe portion comprising a probe body and a tip whereby force applied in a test can be supported by the resilient layer. A solder pad of the probe base serves to connect with an external instrument. The resilient micro-probe of the present invention can meet the requirements of high precision and high reliability.
TW94125221A 2005-07-26 2005-07-26 Resilient micro-probe structure TWI264541B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Publications (2)

Publication Number Publication Date
TWI264541B true TWI264541B (en) 2006-10-21
TW200704936A TW200704936A (en) 2007-02-01

Family

ID=37969392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Country Status (1)

Country Link
TW (1) TWI264541B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326085A (en) * 2020-11-23 2021-02-05 西畔(北京)信息技术有限责任公司 Pressure sensor assembly and pressure distribution detection shoe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI593970B (en) * 2016-07-25 2017-08-01 日月光半導體製造股份有限公司 Testing device
CN112327012B (en) * 2020-10-26 2024-07-19 安捷利（番禺）电子实业有限公司 Connector test fixture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326085A (en) * 2020-11-23 2021-02-05 西畔(北京)信息技术有限责任公司 Pressure sensor assembly and pressure distribution detection shoe

Also Published As

Publication number Publication date
TW200704936A (en) 2007-02-01

Similar Documents

Publication Publication Date Title
MY150614A (en) Contact for use in testing integrated circuits
TW200829922A (en) High frequency probe
WO2009013809A1 (en) Contactor, probe card and method of mounting contactor
TW200720665A (en) Jig for inspecting substrate, and inspection probe
WO2008076590A3 (en) Electrical guard structures for protecting a signal trace from electrical interference
SG170718A1 (en) Probe card
MY162914A (en) Wiring board for testing loaded printed circuit board
TW200733475A (en) Module with a built-in antenna, card-formed information device and manufacturing methods thereof
TW200801527A (en) Probe, testing head having a plurality of probes, and circuit board tester having the testing head
TW200622266A (en) Test probe and tester, method for manufacturing the test probe
TW200606543A (en) Electrical conducting structure and liquid crystal display device comprising the same
CN101221194B (en) High-frequency probe
TWI264541B (en) Resilient micro-probe structure
WO2006005304A3 (en) Semiconductor component with a semiconductor chip and electric connecting elements for connecting to a conductor structure
TW200514484A (en) Substrate for electrical device and methods of fabricating the same
US7148713B1 (en) Algoristic spring as probe
US9545002B2 (en) Multilayer circuit board
SG143213A1 (en) Probe card
TW201144814A (en) Probing apparatus for integrated circuit testing
TW200420202A (en) Chip carrier for testing electric performance of passive components and method for testing same
TW201000911A (en) Probe card assembly
KR102598055B1 (en) Socket device for testing an IC
TW200719541A (en) Electrical connector
KR20010047981A (en) Wafer probing socket
TWI334032B (en)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees