CN112327012B - Connector test fixture - Google Patents
Connector test fixture Download PDFInfo
- Publication number
- CN112327012B CN112327012B CN202011157307.4A CN202011157307A CN112327012B CN 112327012 B CN112327012 B CN 112327012B CN 202011157307 A CN202011157307 A CN 202011157307A CN 112327012 B CN112327012 B CN 112327012B
- Authority
- CN
- China
- Prior art keywords
- probe
- connector
- carrier
- signal
- jacks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 59
- 239000000523 sample Substances 0.000 claims abstract description 122
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a connector test fixture, which comprises a carrier and a probe, wherein a plurality of jacks penetrating through the carrier are formed in the carrier, the probe can be inserted into the jacks, a first end of the probe is used for being connected with a tested connector, and a second end of the probe is used for being connected with a circuit board. In the testing process, the probe is connected with the tested connector in a contact way, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When aiming at different types of connectors, the probes are only required to be inserted according to the different types of connectors, and special test clamps are not required to be matched for each type of connector, so that the compatibility of the test clamps is improved, and the test cost is reduced.
Description
Technical Field
The invention relates to the technical field of test fixtures, in particular to a connector test fixture.
Background
Because of rapid technological development and advanced high-tech products, many technological products are advanced toward the directions of strong operation function, small volume and high expansibility, the circuit boards of the current technological products are mostly provided with board-to-board connectors with expansion and connection functions, which are used for jointing and electrical connection between two circuit boards, so that the main circuit board can be additionally connected with one or more additional circuit boards.
Testing the transmission performance of a connector is an important and necessary task due to the engagement and electrical connection between the two circuit boards of the connector.
Existing connector test fixtures typically use test fixtures that mate with pins or receptacles of a connector on a board under test to form a connection fit for testing. However, this method has the following disadvantages: 1. the testing efficiency is low, and particularly when testing backplanes with a large number of connectors, it takes a lot of time to connect the mating connectors. 2. The compatibility is poor, and each time a connector of a different model is adopted, the connector must be replaced with a test fixture matched with the connector for testing, so that the testing cost is increased.
Disclosure of Invention
The embodiment of the invention provides a connector test fixture, which can simplify the connection process of a tested connector, improve the compatibility of the test fixture and reduce the test cost.
The embodiment of the invention provides a connector test fixture, which comprises: the carrier is provided with a plurality of jacks penetrating through the carrier;
The carrier is provided with a plurality of jacks penetrating through the carrier;
the probe can be inserted into the jack, the first end of the probe is used for being connected with a tested connector, and the second end of the probe is used for being connected with a circuit board.
Optionally, the probe includes a ground probe for electrically connecting with a ground contact of the tested connector and a signal probe for electrically connecting with a signal contact of the tested connector;
The jacks comprise signal probe jacks and ground probe jacks, the signal probe jacks are used for inserting signal probes, and the ground probe jacks are used for inserting ground probes.
Optionally, the signal probe jack is disposed between a plurality of the ground probe jacks.
Optionally, the signal probe is used for transmitting high-frequency signals, and the carrier is a conductive metal block.
Optionally, the signal probe jack is filled with a high-frequency medium.
Optionally, the fixture further includes a fixing ring, and the fixing ring is respectively sleeved at the first end and the second end of the probe.
Optionally, the probe includes a fixed portion, a first end, and a second end;
when the probe is inserted into the jack, the fixing part is fixed in the jack, and the first end and the second end at least partially exceed the surface of the carrier.
Optionally, the radius of the fixing portion is greater than the radius of the first end and the second end, and the radius of the fixing portion is less than or equal to the radius of the insertion hole.
Optionally, a positioning structure is disposed on the carrier, and the positioning structure is used for positioning the carrier and the tested connector.
Optionally, the positioning structure includes a positioning slot or a positioning hole.
The connector test fixture provided by the embodiment of the invention comprises a carrier and a probe, wherein a plurality of jacks penetrating through the carrier are formed in the carrier, the probe can be inserted into the jacks, a first end of the probe is used for being connected with a tested connector, and a second end of the probe is used for being connected with a circuit board. In the testing process, the probe is connected with the tested connector in a contact way, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When aiming at different types of connectors, the probes are only required to be inserted according to the different types of connectors, and special test clamps are not required to be matched for each type of connector, so that the compatibility of the test clamps is improved, and the test cost is reduced.
Drawings
The invention is described in further detail below with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of a connector testing fixture according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a carrier according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a probe according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
An embodiment of the present invention provides a connector testing fixture for testing transmission performance of a board-to-board connector, fig. 1 is a schematic structural diagram of the connector testing fixture provided by the embodiment of the present invention, fig. 2 is a schematic structural diagram of a carrier provided by the embodiment of the present invention, fig. 3 is a schematic structural diagram of a probe provided by the embodiment of the present invention, and as shown in fig. 1-3, the fixture includes a carrier 100 and a probe 200.
Wherein, the carrier 100 is provided with a plurality of insertion holes 110 penetrating through the carrier 100. Specifically, in the embodiment of the present invention, the carrier 100 has a flat surface, which may be a hollow shell structure or a solid block, and the embodiment of the present invention is not limited herein. One surface of the carrier 100 is provided with a plurality of through holes penetrating through the carrier 100 as insertion holes 110.
During testing, the probe 200 is inserted into the jack 110, the first end 202 of the probe 200 is used for connecting with a tested connector, and the second end 203 of the probe 200 is used for connecting with a circuit board.
In the testing process, the probe is connected with the tested connector in a contact way, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When aiming at different types of connectors, the probes are only required to be inserted according to the different types of connectors, and special test clamps are not required to be matched for each type of connector, so that the compatibility of the test clamps is improved, and the test cost is reduced.
The connector test fixture provided by the embodiment of the invention comprises a carrier and a probe, wherein a plurality of jacks penetrating through the carrier are formed in the carrier, the probe can be inserted into the jacks, a first end of the probe is used for being connected with a tested connector, and a second end of the probe is used for being connected with a circuit board. In the testing process, the probe is connected with the tested connector in a contact way, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When aiming at different types of connectors, the probes are only required to be inserted according to the different types of connectors, and special test clamps are not required to be matched for each type of connector, so that the compatibility of the test clamps is improved, and the test cost is reduced.
In some embodiments of the present invention, the probes 200 include ground probes 210 and signal probes 220, a first end of the ground probes 210 being configured to be in contact electrical connection with ground contacts of a connector under test, a second end of the ground probes 210 being configured to be in contact electrical connection with ground contacts of a circuit board, the ground probes 210 being configured to transmit ground signals. In another embodiment of the present invention, the connector is provided with a shielding frame, and the shielding frame is grounded and is used for shielding external interference signals. The ground probe 210 is connected to the shield frame of the connector in contact, thereby realizing grounding.
The first end of the signal probe 220 is used for being electrically connected with a signal contact of a tested connector, the second end of the signal probe 220 is used for being electrically connected with a signal contact of a circuit board, and the signal probe 220 is used for transmitting a data signal.
In the embodiment of the present invention, the contact may be a pin of the connector or a wire connected to the pin, which is not limited herein.
The jacks 110 include ground probe jacks 111 and signal probe jacks 112. The ground probe jack 111 is for inserting a ground probe 210, and the signal probe jack 112 is for inserting a signal probe 220.
It should be noted that, in the above embodiment, the apertures of the probe jack 111 and the signal probe jack 112 may be the same or different, and the relative positional relationship between the probe jack 111 and the signal probe jack 112 may be adjusted according to the circuit structure of the tested connector, which is not limited herein.
As the size and pin pitch of connectors become smaller, ground pins are typically disposed around the signal transmission pins in order to avoid signal crosstalk between adjacent signal transmission pins. The signal transmission pin is used for transmitting data signals, and the ground pin is used for transmitting ground signals. The signal transmission pins are isolated by arranging the grounding pins to surround the signal transmission pins, so that the phenomenon of signal crosstalk between adjacent signal transmission pins is avoided. Thus, in some embodiments of the present invention, as shown in fig. 1 and 2, signal probe receptacles 112 are disposed between a plurality of ground probe receptacles 111. Meanwhile, since the signal probe insertion holes 112 are disposed between the plurality of ground probe insertion holes 111, the signal probes 220 are surrounded by the plurality of ground probes 210, so that the signal probes 220 are isolated by the ground probes 210, thereby avoiding signal crosstalk between adjacent signal probes 220 and improving accuracy of test results.
In the above embodiment, since the needle body of the probe 200 is long, the distribution parameter is large, and it is not suitable for measurement of a high-frequency signal. To solve the above problems, in some embodiments of the present invention, the carrier 100 may be a conductive metal block, specifically, a copper block, an aluminum block, etc., which is not limited herein. After the probe 200 is inserted into the metal block, the influence of distribution parameters can be reduced, and the measurable signal frequency and the testing precision are further improved. The distribution parameter means that the effect of the distribution parameter of the transmission line cannot be ignored under high-frequency operation, the electrical characteristics of the transmission line are described by the distribution inductance, the distribution capacitance, the distribution resistance and the distribution conductance on the unit line length, and the transmission line, the series inductance, the resistance, the parallel capacitance and the conductance are integrated, so that a circuit formed by utilizing the distribution parameter characteristic of the transmission line is called a distribution parameter circuit.
In some embodiments of the present invention, in order to reduce the loss of the high-frequency signal during the transmission process, the signal probe jack 112 is filled with the high-frequency medium 113, so as to improve the test accuracy. When the signal probe 220 is inserted into the signal probe insertion hole, the high frequency medium 113 wraps the signal probe. Specifically, the high-frequency medium may be high-frequency glue, high-frequency ceramic, etc., and the embodiment of the present invention is not limited herein. By way of example, the high frequency glue may be an epoxy glue or the like that improves high frequency performance.
On the basis of the above-described embodiment, the ground probe 210 and the signal probe 220 have the same size, and in order to be able to fill the high-frequency medium 113 in the signal probe insertion hole 112, the aperture of the signal probe insertion hole 112 is larger than that of the ground probe insertion hole 111.
In some embodiments of the present invention, as shown in fig. 3, probe 200 includes a fixed portion 201, a first end 202, and a second end 203. When the probe 200 is inserted into the socket 110, the fixing portion 201 is fixed in the socket 110, and in particular, the socket 110 may form an interference fit with the fixing portion 201, so that the probe 200 can be fixed in the socket 110. The first end 202 and the second end 203 are both beyond the surface of the carrier 100, thereby enabling the first end 202 of the probe 200 to be connected to a connector under test and the second end 203 of the probe 200 to be connected to a circuit board.
In some embodiments of the present invention, the radius of the securing portion 201 is greater than the radius of the first end 202 and the second end 203 to increase the structural strength of the probe 200. And the radius of the fixing portion 201 is smaller than or equal to the radius of the insertion hole 110 so that the probe 200 can be inserted into the insertion hole.
In the above embodiment, the connector test fixture may further include a fixing ring 300, where the fixing ring 300 is sleeved with the first end 202 and the second end 203 of the probe 200. Specifically, when the probe 200 is inserted into the receptacle 110, the two retaining rings 300 are nested from the first end 202 and the second end 203, respectively, until the retaining rings 300 are in contact with the surface of the carrier 100. Immobilization is used to immobilize the probe 200, preventing the probe 200 from slipping out of the receptacle 110. The fixing ring 300 may be a rubber ring with a certain elasticity, and the outer diameter of the fixing ring 300 is larger than the diameter of the insertion hole 110, so that the fixing ring 300 is prevented from sinking into the insertion hole 110.
In some embodiments of the present invention, a positioning structure 120 is disposed on the carrier 100, where the positioning structure 120 is used to position the carrier 100 and the tested connector, so as to achieve precise alignment of the probe 200 and the contact.
For example, the positioning structure 120 may include a positioning slot or a positioning hole, and a positioning key or a positioning pin corresponding to the positioning structure 120 is disposed on the tested connector, so as to implement mating positioning.
It should be noted that, the test fixture provided in the above embodiment of the present invention may be used for testing a BGA (Ball GRID ARRAY, ball grid array package technology) chip in addition to a connector. Similarly, when testing the BGA chip, ground probe 210 is contacted with the ground pad of the BGA chip, and signal probe 220 is contacted with the signal pad of the BGA chip.
In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify operation, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (5)
1. A connector test fixture, comprising:
The carrier is provided with a plurality of jacks penetrating through the carrier; the carrier has a flat surface;
the probe can be inserted into the jack, the probe is used for being inserted into the jack during testing, the first end of the probe is used for being connected with a tested connector, and the second end of the probe is used for being connected with a circuit board; the number of the probes inserted into the carrier corresponds to the number of the contacts of the tested connector during testing;
The probe comprises a fixing part, a first end and a second end;
When the probe is inserted into the jack, the fixing part is fixed in the jack, and the first end and the second end at least partially exceed the surface of the carrier;
the probe comprises a grounding probe and a signal probe, wherein the grounding probe is used for being electrically connected with a grounding contact of the tested connector, and the signal probe is used for being electrically connected with a signal contact of the tested connector;
The jacks comprise signal probe jacks and grounding probe jacks, the signal probe jacks are used for inserting signal probes, and the grounding probe jacks are used for inserting grounding probes;
the signal probe jacks are arranged among the plurality of grounding probe jacks;
the signal probe is used for transmitting high-frequency signals, and the carrier is a conductive metal block;
The signal probe jack is filled with a high-frequency medium.
2. The connector test fixture of claim 1, further comprising a retaining ring respectively sleeved on the first and second ends of the probe.
3. The connector test fixture of claim 1, wherein the radius of the securing portion is greater than the radius of the first and second ends and the radius of the securing portion is less than or equal to the radius of the receptacle.
4. The connector test fixture of claim 1, wherein the carrier is provided with a positioning structure for positioning the carrier with the connector under test.
5. The connector test fixture of claim 4, wherein the locating structure comprises a locating slot or a locating hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157307.4A CN112327012B (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157307.4A CN112327012B (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112327012A CN112327012A (en) | 2021-02-05 |
| CN112327012B true CN112327012B (en) | 2024-07-19 |
Family
ID=74310745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011157307.4A Active CN112327012B (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112327012B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2490710Y (en) * | 2001-06-21 | 2002-05-08 | 中国航空工业第六○七研究所 | Input interface device for broadband dual-polarized vertebral horn antenna |
| JP2007178163A (en) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | Inspection unit and outer sheath tube assembly for inspection probe used for it |
| CN111458540A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Connecting device and electronic apparatus |
| CN211127814U (en) * | 2020-02-23 | 2020-07-28 | 电连技术股份有限公司 | Detection connector |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005127891A (en) * | 2003-10-24 | 2005-05-19 | Yokowo Co Ltd | Inductor loaded inspecting probe |
| TWI264541B (en) * | 2005-07-26 | 2006-10-21 | Ind Tech Res Inst | Resilient micro-probe structure |
| JP2010133763A (en) * | 2008-12-03 | 2010-06-17 | Yokogawa Electric Corp | Coaxial probe structure |
| JP2010175371A (en) * | 2009-01-29 | 2010-08-12 | Yokowo Co Ltd | Inspection socket |
| CN204302321U (en) * | 2014-12-02 | 2015-04-29 | 上海韬盛电子科技有限公司 | Be applicable to the chip testing socket of high-frequency test |
| JP2018071999A (en) * | 2016-10-25 | 2018-05-10 | 株式会社村田製作所 | Measuring probe |
| WO2019183254A1 (en) * | 2018-03-23 | 2019-09-26 | Smiths Interconnect Americas, Inc. | Impedance controlled metallized plastic socket |
| TWI678540B (en) * | 2019-01-18 | 2019-12-01 | 佳思科技有限公司 | Semiconductor component test vehicle |
| CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技（苏州）有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
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2020
- 2020-10-26 CN CN202011157307.4A patent/CN112327012B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2490710Y (en) * | 2001-06-21 | 2002-05-08 | 中国航空工业第六○七研究所 | Input interface device for broadband dual-polarized vertebral horn antenna |
| JP2007178163A (en) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | Inspection unit and outer sheath tube assembly for inspection probe used for it |
| CN211127814U (en) * | 2020-02-23 | 2020-07-28 | 电连技术股份有限公司 | Detection connector |
| CN111458540A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Connecting device and electronic apparatus |
Also Published As
| Publication number | Publication date |
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| CN112327012A (en) | 2021-02-05 |
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