CN112327012A - Connector test fixture - Google Patents
Connector test fixture Download PDFInfo
- Publication number
- CN112327012A CN112327012A CN202011157307.4A CN202011157307A CN112327012A CN 112327012 A CN112327012 A CN 112327012A CN 202011157307 A CN202011157307 A CN 202011157307A CN 112327012 A CN112327012 A CN 112327012A
- Authority
- CN
- China
- Prior art keywords
- probe
- connector
- signal
- carrier
- test fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 69
- 239000000523 sample Substances 0.000 claims abstract description 121
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 description 21
- 230000037431 insertion Effects 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The invention discloses a connector test fixture which comprises a carrier and a probe, wherein the carrier is provided with a plurality of jacks penetrating through the carrier, the probe can be inserted into the jacks, the first end of the probe is used for connecting a tested connector, and the second end of the probe is used for connecting a circuit board. In the test process, the probe is in contact connection with the tested connector, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When the connector testing fixture is used for different types of connectors, only the corresponding number of probes are inserted according to the different types of connectors, and a special testing fixture does not need to be matched for each type of connector, so that the compatibility of the testing fixture is improved, and the testing cost is reduced.
Description
Technical Field
The invention relates to the technical field of test fixtures, in particular to a connector test fixture.
Background
Since the technology is developed rapidly, the technology products are new, and many technology products are moving toward the direction of strong operation function, small volume and high expandability, the circuit boards of the technology products are mostly provided with board-to-board connectors with expansion and connection functions as the joint and electrical connection between two circuit boards, so that the main circuit board can be additionally connected with one or more additional circuit boards.
Testing the transmission performance of the connector is an important and necessary task due to the engagement and electrical connection between the two circuit boards of the connector.
Existing connector test fixtures are typically tested using a test fixture that mates with pins or sockets of a connector on the board under test to form a connection fit. However, this method has the following disadvantages: 1. testing is inefficient, especially when testing backplanes having a large number of connectors, and takes a significant amount of time to connect mating connectors. 2. The compatibility is poor, and when connectors of different models are adopted, the connectors must be replaced by a matched test fixture for testing, so that the test cost is increased.
Disclosure of Invention
The embodiment of the invention provides a connector test fixture, which can simplify the connection process of a tested connector, improve the compatibility of the test fixture and reduce the test cost.
The embodiment of the invention provides a connector test fixture, which comprises: the carrier is provided with a plurality of jacks penetrating through the carrier;
the carrier is provided with a plurality of jacks penetrating through the carrier;
the probe can be inserted into the jack, the first end of the probe is used for connecting a tested connector, and the second end of the probe is used for connecting a circuit board.
Optionally, the probe includes a ground probe and a signal probe, the ground probe is used for electrically connecting with the ground contact of the connector under test, and the signal probe is used for electrically connecting with the signal contact of the connector under test;
the jacks comprise a signal probe jack and a grounding probe jack, the signal probe jack is used for inserting a signal probe, and the grounding probe jack is used for inserting the grounding probe.
Optionally, the signal probe jacks are disposed between a plurality of ground probe jacks.
Optionally, the signal probe is used for transmitting a high-frequency signal, and the carrier is a conductive metal block.
Optionally, the signal probe jack is filled with a high-frequency medium.
Optionally, the clamp further comprises a fixing ring, and the fixing ring is respectively sleeved at the first end and the second end of the probe.
Optionally, the probe comprises a fixing portion, a first end and a second end;
when the probe is inserted into the jack, the fixing part is fixed in the jack, and the first end and the second end at least partially exceed the surface of the carrier.
Optionally, the radius of the fixing portion is greater than the radius of the first end and the radius of the second end, and the radius of the fixing portion is smaller than or equal to the radius of the insertion hole.
Optionally, a positioning structure is arranged on the carrier, and the positioning structure is used for positioning the carrier and the tested connector.
Optionally, the positioning structure includes a positioning groove or a positioning hole.
The connector test fixture provided by the embodiment of the invention comprises a carrier and a probe, wherein the carrier is provided with a plurality of jacks penetrating through the carrier, the probe can be inserted into the jacks, the first end of the probe is used for connecting a tested connector, and the second end of the probe is used for connecting a circuit board. In the test process, the probe is in contact connection with the tested connector, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When the connector testing fixture is used for different types of connectors, only the corresponding number of probes are inserted according to the different types of connectors, and a special testing fixture does not need to be matched for each type of connector, so that the compatibility of the testing fixture is improved, and the testing cost is reduced.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a schematic structural diagram of a connector testing fixture according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a carrier according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a probe according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
An embodiment of the present invention provides a connector test fixture, configured to test transmission performance of a board to board connector, where fig. 1 is a schematic structural diagram of the connector test fixture provided in the embodiment of the present invention, fig. 2 is a schematic structural diagram of a carrier provided in the embodiment of the present invention, and fig. 3 is a schematic structural diagram of a probe provided in the embodiment of the present invention, as shown in fig. 1 to fig. 3, the fixture includes a carrier 100 and a probe 200.
The carrier 100 is provided with a plurality of insertion holes 110 penetrating through the carrier 100. Specifically, in the embodiment of the present invention, the carrier 100 has a flat surface, which may be a hollow shell structure or a solid block, and the embodiment of the present invention is not limited herein. One surface of the carrier 100 is formed with a plurality of through holes penetrating the carrier 100 as insertion holes 110.
During testing, the probe 200 is inserted into the jack 110, a first end 202 of the probe 200 is used for connecting with a tested connector, and a second end 203 of the probe 200 is used for connecting with a circuit board.
In the test process, the probe is in contact connection with the tested connector, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When the connector testing fixture is used for different types of connectors, only the corresponding number of probes are inserted according to the different types of connectors, and a special testing fixture does not need to be matched for each type of connector, so that the compatibility of the testing fixture is improved, and the testing cost is reduced.
The connector test fixture provided by the embodiment of the invention comprises a carrier and a probe, wherein the carrier is provided with a plurality of jacks penetrating through the carrier, the probe can be inserted into the jacks, the first end of the probe is used for connecting a tested connector, and the second end of the probe is used for connecting a circuit board. In the test process, the probe is in contact connection with the tested connector, so that the matched connection with the tested connector is avoided, the connection process with the tested connector is simplified, and the time cost is saved. When the connector testing fixture is used for different types of connectors, only the corresponding number of probes are inserted according to the different types of connectors, and a special testing fixture does not need to be matched for each type of connector, so that the compatibility of the testing fixture is improved, and the testing cost is reduced.
In some embodiments of the present invention, the probe 200 includes a ground probe 210 and a signal probe 220, wherein a first end of the ground probe 210 is used for contacting and electrically connecting with a ground contact of a connector under test, a second end of the ground probe 210 is used for contacting and electrically connecting with a ground contact of a circuit board, and the ground probe 210 is used for transmitting a ground signal. In another embodiment of the present invention, the connector is provided with a shielding frame, and the shielding frame is grounded and used for shielding external interference signals. The ground probe 210 is connected to the shield frame of the connector in contact therewith to achieve grounding.
The first end of the signal probe 220 is used for electrically connecting with the signal contact of the connector to be tested, the second end of the signal probe 220 is used for electrically connecting with the signal contact of the circuit board, and the signal probe 220 is used for transmitting data signals.
In the embodiment of the present invention, the contact may be a pin of a connector or a wire connected to the pin, and the embodiment of the present invention is not limited herein.
The jacks 110 include ground probe jacks 111 and signal probe jacks 112. The ground probe insertion holes 111 are for inserting the ground probes 210, and the signal probe insertion holes 112 are for inserting the signal probes 220.
It should be noted that, in the above embodiments, the apertures of the probe insertion holes 111 and the signal probe insertion holes 112 may be the same or different, and the relative position relationship between the probe insertion holes 111 and the signal probe insertion holes 112 may be adjusted according to the circuit structure of the tested connector, which is not limited herein in the embodiments of the present invention.
As the size of connectors and pin pitch become smaller and smaller, ground pins are often provided around signal transmission pins in order to avoid signal crosstalk between adjacent signal transmission pins. The signal transmission pin is used for transmitting data signals, and the grounding pin is used for transmitting grounding signals. The signal transmission pins are isolated by arranging the grounding pins to surround the signal transmission pins, so that the phenomenon of signal crosstalk between adjacent signal transmission pins is avoided. Accordingly, in some embodiments of the present invention, as shown in fig. 1 and 2, the signal probe jacks 112 are disposed between a plurality of ground probe jacks 111. Meanwhile, the signal probe jacks 112 are arranged among the plurality of grounding probe jacks 111, so that the signal probes 220 are surrounded by the plurality of grounding probes 210, the signal probes 220 are isolated by the grounding probes 210, signal crosstalk between adjacent signal probes 220 is avoided, and the accuracy of a test result is improved.
In the above embodiment, the probe 200 has a longer probe body, and therefore, the distribution parameter is larger, which is not suitable for the measurement of the high frequency signal. In order to solve the above problem, in some embodiments of the present invention, the carrier 100 may be a conductive metal block, specifically, a copper block, an aluminum block, and the like, and the embodiments of the present invention are not limited herein. After the probe 200 is inserted into the metal block, the influence of the distribution parameters can be reduced, and the measurable signal frequency and the measurable test precision are further improved. The distributed parameters mean that under high-frequency work, the distributed parameter effect of the transmission line cannot be ignored, the electrical characteristics of the transmission line are described by distributed inductance, distributed capacitance, distributed resistance and distributed conductance on a unit line length, at this time, the transmission line is integrated with the series inductance and resistance, the parallel capacitance and the conductance, and a circuit formed by utilizing the distributed parameter characteristics of the transmission line is called a distributed parameter circuit.
In some embodiments of the present invention, in order to reduce the loss of the high-frequency signal during transmission, the signal probe jack 112 is filled with a high-frequency medium 113 to improve the test accuracy. When the signal probe 220 is inserted into the signal probe receptacle, the high frequency medium 113 surrounds the signal probe. Specifically, the high-frequency medium may be a high-frequency adhesive, a high-frequency ceramic, or the like, and the embodiment of the present invention is not limited herein. Illustratively, the high frequency glue may be an epoxy glue or the like that improves high frequency performance.
On the basis of the above embodiment, the ground probe 210 and the signal probe 220 have the same size, and in order to fill the high-frequency medium 113 in the signal probe insertion hole 112, the aperture of the signal probe insertion hole 112 is larger than that of the ground probe insertion hole 111.
In some embodiments of the present invention, as shown in FIG. 3, probe 200 includes a fixture 201, a first end 202, and a second end 203. When the probe 200 is inserted into the insertion hole 110, the fixing portion 201 is fixed in the insertion hole 110, and specifically, the insertion hole 110 may form an interference fit with the fixing portion 201, so that the probe 200 can be fixed in the insertion hole 110. Both the first end 202 and the second end 203 extend beyond the surface of the carrier 100, thereby enabling the first end 202 of the probe 200 to be connected to a connector under test and the second end 203 of the probe 200 to be connected to a circuit board.
In some embodiments of the present invention, the radius of the fixing portion 201 is greater than the radius of the first end 202 and the second end 203 to improve the structural strength of the probe 200. And the radius of the fixing portion 201 is less than or equal to that of the insertion hole 110 so that the probe 200 can be inserted into the insertion hole.
In the above embodiment, the connector test fixture may further include a fixing ring 300, and the fixing ring 300 is sleeved on the first end 202 and the second end 203 of the probe 200. Specifically, when the probe 200 is inserted into the insertion hole 110, the two fixing rings 300 are respectively sleeved from the first end 202 and the second end 203 until the fixing rings 300 contact the surface of the carrier 100. Immobilization is used to immobilize the probe 200 and prevent the probe 200 from slipping out of the socket 110. The fixing ring 300 may be a rubber ring having a certain elasticity, and the outer diameter of the fixing ring 300 is larger than the diameter of the insertion hole 110, so as to prevent the fixing ring 300 from sinking into the insertion hole 110.
In some embodiments of the present invention, the carrier 100 is provided with a positioning structure 120, and the positioning structure 120 is used to position the carrier 100 and the connector to be tested, so as to achieve accurate alignment between the probe 200 and the contact.
For example, the positioning structure 120 may include a positioning groove or a positioning hole, and a positioning key or a positioning pin corresponding to the positioning structure 120 is provided on the tested connector, so as to achieve the matching positioning.
It should be noted that the test fixture provided in the above embodiments of the present invention may be used for testing a BGA (Ball Grid Array) chip, in addition to the connector. Similarly, when testing the BGA chip, the ground probe 210 is connected to the ground pad of the BGA chip, and the signal probe 220 is connected to the signal pad of the BGA chip.
In the description herein, it is to be understood that the terms "upper", "lower", "left", "right", and the like are used in a descriptive sense or positional relationship based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A connector test fixture, comprising:
the carrier is provided with a plurality of jacks penetrating through the carrier;
the probe can be inserted into the jack, the first end of the probe is used for connecting a tested connector, and the second end of the probe is used for connecting a circuit board.
2. The connector test fixture of claim 1, wherein the probes comprise ground probes for electrically connecting with ground contacts of the connector under test and signal probes for electrically connecting with signal contacts of the connector under test;
the jacks comprise a signal probe jack and a grounding probe jack, the signal probe jack is used for inserting a signal probe, and the grounding probe jack is used for inserting the grounding probe.
3. The connector test fixture of claim 2, wherein the signal probe receptacles are disposed between a plurality of the ground probe receptacles.
4. The connector test fixture of claim 2 or 3, wherein the signal probes are for transmitting high frequency signals and the carrier is a conductive metal block.
5. The connector test fixture of claim 4, wherein the signal probe receptacles are filled with a high frequency dielectric.
6. The connector test fixture of any one of claims 1-3, further comprising a retaining ring, wherein the retaining ring is respectively sleeved on the first end and the second end of the probe.
7. The connector test fixture of any of claims 1-3, wherein the probe includes a retention portion, a first end, and a second end;
when the probe is inserted into the jack, the fixing part is fixed in the jack, and the first end and the second end at least partially exceed the surface of the carrier.
8. The connector test fixture of claim 7, wherein the radius of the retention portion is greater than the radius of the first and second ends, and the radius of the retention portion is less than or equal to the radius of the receptacle.
9. The connector test fixture of any one of claims 1-3, wherein the carrier is provided with a positioning structure, and the positioning structure is used for positioning the carrier and the connector under test.
10. The connector test fixture of claim 9, wherein the locating feature comprises a detent or locating hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157307.4A CN112327012A (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157307.4A CN112327012A (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112327012A true CN112327012A (en) | 2021-02-05 |
Family
ID=74310745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011157307.4A Pending CN112327012A (en) | 2020-10-26 | 2020-10-26 | Connector test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112327012A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2490710Y (en) * | 2001-06-21 | 2002-05-08 | 中国航空工业第六○七研究所 | Input interface device for broadband dual-polarized vertebral horn antenna |
| JP2005127891A (en) * | 2003-10-24 | 2005-05-19 | Yokowo Co Ltd | Inductor loaded inspecting probe |
| TW200704936A (en) * | 2005-07-26 | 2007-02-01 | Ind Tech Res Inst | Resilient micro-probe structure |
| JP2007178163A (en) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | Inspection unit and outer sheath tube assembly for inspection probe used for it |
| JP2010133763A (en) * | 2008-12-03 | 2010-06-17 | Yokogawa Electric Corp | Coaxial probe structure |
| US20100188112A1 (en) * | 2009-01-29 | 2010-07-29 | Yokowo Co., Ltd. | Inspection socket |
| CN204302321U (en) * | 2014-12-02 | 2015-04-29 | 上海韬盛电子科技有限公司 | Be applicable to the chip testing socket of high-frequency test |
| JP2018071999A (en) * | 2016-10-25 | 2018-05-10 | 株式会社村田製作所 | Measuring probe |
| CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技（苏州）有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
| WO2019183254A1 (en) * | 2018-03-23 | 2019-09-26 | Smiths Interconnect Americas, Inc. | Impedance controlled metallized plastic socket |
| TWI678540B (en) * | 2019-01-18 | 2019-12-01 | 佳思科技有限公司 | Semiconductor component test vehicle |
| CN111458540A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Connecting device and electronic apparatus |
| CN211127814U (en) * | 2020-02-23 | 2020-07-28 | 电连技术股份有限公司 | Detection connector |
-
2020
- 2020-10-26 CN CN202011157307.4A patent/CN112327012A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2490710Y (en) * | 2001-06-21 | 2002-05-08 | 中国航空工业第六○七研究所 | Input interface device for broadband dual-polarized vertebral horn antenna |
| JP2005127891A (en) * | 2003-10-24 | 2005-05-19 | Yokowo Co Ltd | Inductor loaded inspecting probe |
| TW200704936A (en) * | 2005-07-26 | 2007-02-01 | Ind Tech Res Inst | Resilient micro-probe structure |
| JP2007178163A (en) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | Inspection unit and outer sheath tube assembly for inspection probe used for it |
| JP2010133763A (en) * | 2008-12-03 | 2010-06-17 | Yokogawa Electric Corp | Coaxial probe structure |
| US20100188112A1 (en) * | 2009-01-29 | 2010-07-29 | Yokowo Co., Ltd. | Inspection socket |
| CN204302321U (en) * | 2014-12-02 | 2015-04-29 | 上海韬盛电子科技有限公司 | Be applicable to the chip testing socket of high-frequency test |
| JP2018071999A (en) * | 2016-10-25 | 2018-05-10 | 株式会社村田製作所 | Measuring probe |
| WO2019183254A1 (en) * | 2018-03-23 | 2019-09-26 | Smiths Interconnect Americas, Inc. | Impedance controlled metallized plastic socket |
| TWI678540B (en) * | 2019-01-18 | 2019-12-01 | 佳思科技有限公司 | Semiconductor component test vehicle |
| CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技（苏州）有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
| CN211127814U (en) * | 2020-02-23 | 2020-07-28 | 电连技术股份有限公司 | Detection connector |
| CN111458540A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Connecting device and electronic apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 孙兵 等: "太阳能风能电站远程监控技术", 中国铁道出版社, pages: 206 - 207 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7654847B2 (en) | Probe having a field-replaceable tip | |
| US20030195713A1 (en) | Systems and methods for wideband active probing of devices and circuits in operation | |
| US20100073018A1 (en) | Adjustable probe head | |
| TW521151B (en) | Pin block structure for mounting contact pins | |
| CN111965524B (en) | Chip testing device | |
| CN213023255U (en) | Radio frequency test probe structure, radio frequency test device and system | |
| KR20030024668A (en) | Universal test interface between a device under test and a test head | |
| KR20040005828A (en) | High performance tester interface module | |
| TWI438438B (en) | Test system with high frequency interposer | |
| GB2049313A (en) | High frequency etched circuit board connector method | |
| US10481176B2 (en) | High bandwidth differential lead with device connection | |
| US7724106B2 (en) | Coaxial connecting part | |
| CN111707929A (en) | PGA packaging microwave test fixture | |
| US6717398B2 (en) | Signal launch connecting techniques | |
| JP7097452B2 (en) | Inspection equipment | |
| JP2006343316A (en) | Semiconductor test interface | |
| CN112327012A (en) | Connector test fixture | |
| CN212514903U (en) | Chip testing device | |
| TW202045932A (en) | Test device | |
| CN111830400A (en) | Chip testing device | |
| TWI325500B (en) | Integrated circuit testing apparatus | |
| CN115541943B (en) | Radio frequency test probe structure, radio frequency test device and system | |
| CN213581203U (en) | Circulator test fixture | |
| US20230335960A1 (en) | Twinaxial cable splitter | |
| CN114966259A (en) | Device and method for testing loss of chip device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |