KR100493223B1 - Probe and method for inspection of electronic circuit board - Google Patents

Abstract

The present invention provides a novel and improved method that enables an electronic inspection of a circuit board at high speed with reliability, at a low cost.

Inspection probe of an electronic circuit board according to the present invention,

a) a base plate having an opening of electrically insulating plastic resin,

b1) a first group electrode fixedly arranged around the opening of the base plate,

b2) a second group electrode fixedly arranged around an edge of the base plate, wherein the first group electrode and the second group electrode are electrically connected to form an electric circuit;

c) connecting leads, one end of which is connected to one of the first group connections, the other end of which extends down through the opening of the substrate,

d) an elastomer that is generally flexible for inserting connecting leads, with the end extending downwards of each connecting lead facing outwards so as to contact one of the electrodes of the electronic circuit board under test; Elastomer, and

e) an assembly having a reinforcing mold molded from a rigid material covering the elastomer.

Description

Inspection probe and inspection method of electronic circuit board {PROBE AND METHOD FOR INSPECTION OF ELECTRONIC CIRCUIT BOARD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to probes and inspection methods for inspecting electronic circuit boards such as IC package substrates used for mounting semiconductor devices and semiconductor silicon wafers on which chips are formed.

Some of the modern advanced technologies are still in the development stage of the production process, but various innovative technologies are widely used according to the trend of manufacturing electronic equipment which is increasingly demanding more compact design, high density integration or device mounting density, high precision, high performance, etc. It is almost essential for the intermediate assemblies of the substrate to have various tests performed at each processing step.

When semiconductor devices with increasingly high density integration, sophistication and improved performance are mounted on an electronic circuit board, for that circuit board, the number of electrode terminals for electrical connection with the terminals of the semiconductor device must increase with decreasing array pitch. .

In order to meet the strong demand for small electronic equipment, the mounting type using a conventional semiconductor package is a flip chip mounting type in which a semiconductor device is mounted on a circuit board in the form of a chip, and a plurality of devices simultaneously mounted on the circuit board. Development work is underway to replace the chip module. Such mounting technology is expected to contribute to the miniaturization of electronic equipment and the performance of electronic equipment.

Moreover, the circuit wiring of the circuit board on which the semiconductor chip is mounted is made by using finer wiring or filament as the wiring density increases, and thus must follow the tendency of the inspection technique or the wiring. One type of inspection probe for inspecting such an electronic circuit board is provided with a plurality of pins made of steel such as tungsten and arranged to correspond to the number and pitch of the electrodes on the circuit board under test. Such inspection probe fabrication is performed by elaborate manual work and fixed to the probe base under the microscope to correspond to the number and pitch of electrodes on the circuit board under inspection of each tungsten pin. Highly sophisticated microscopy to fabricate inspection probes containing multiple pins can be very labor intensive and time consuming and inevitably increase the cost of production. Such test probes can only be used on one type of circuit board, and each type of circuit board to be tested requires a specially designed test probe.

In addition to the high cost mentioned above, inspection probes with such tungsten pins are not always suitable for high speed inspection of semiconductor devices. The reason is that each tungsten pin has a relatively large length of, for example, about 50 mm from the end of the pin to the end reaching the connection of the circuit board. Moreover, inspection by such inspection probes is performed by continuous measurement on a pin-by-pin basis and many measurements over a long period of time complete a single inspection test. Appropriate connection technologies suitable for fine electrodes and dense pitches arranged at high density are still undeveloped.

As can be seen from the above description, development of high performance inspection probes and inspection technologies is urgently required in order to keep up with the development technology of modern semiconductor devices and the manufacturing technology of circuit boards. The necessity from this point of view includes not only an inspection technique for responding to flip chip mounting or a multi chip module mounting technique, but also an inspection technique for a chip or wafer type semiconductor device. Despite numerous efforts to develop inspection probes and inspection methods for inspecting electronic circuit boards, the inspection probes proposed so far have some problems in the precise connection of the arrangement pitch of electrodes and high speed signal transmission. The emergence of more advanced test probes and test methods for testing is urgently needed.

Accordingly, an object of the present invention is not only an inspection method capable of high-speed inspection even in an electronic circuit board equipped with a plurality of electrodes arranged at an extremely fine pitch, in view of the problems and disadvantages of the above-described prior art, which is quite inexpensive. To provide a new and improved inspection probe for electronic circuit board inspection that can be manufactured at a price.

Inspection probe of an electronic circuit board according to the present invention,

a) a base plate having an opening of electrically insulating plastic resin,

b1) a first group electrode fixedly arranged around the opening of the base plate,

b2) a second group electrode fixedly arranged around an edge of the base plate, wherein the first group electrode and the second group electrode are electrically connected to form an electric circuit;

c) connecting leads, one end of which is connected to one of the first group connections, the other end of which extends down through the opening of the substrate,

d) elastomers molded entirely of insulating elastomers that are flexible for insertion of connecting leads, the ends extending below each of the connecting leads being exposed out of the elastomer and in contact with one of the electrodes of the electronic circuit board under test; To face downwards, so that the elastomer, and

e) an assembly having a reinforcing mold molded from a rigid material covering the elastomer.

The present invention also provides a novel method for inspecting an electronic circuit board using an inspection probe as defined above.

1) connecting the exposed end of the connecting lead to one electrode of the first group of electronic circuit boards under test;

2) electrically connecting each electrode of the second group of electronic circuit boards under test to one of the electrodes on the first base substrate of the test equipment directly or via an elastic connector;

3) electrically connecting an electrode on a second base substrate of the inspection equipment connected by wiring with a first base substrate of the inspection equipment to an electrode of the second group of inspection probes via an elastic connector. do.

In the inspection probe according to the present invention, an electrode terminal group is provided on a base plate of the probe at positions corresponding to one of the electrode terminals on the electronic circuit board under test (hereinafter, the inspection substrate). The base plate of the test probe has at least one opening, the electrodes of the first group are located near or around the opening and the electrodes of the second group are located along the edge or rim of the base plate. Each electrode terminal of the first group is wired and electrically connected to one of the electrode terminals of the second group, for example, in the radial direction. It is advantageous for the arrangement pitch of the electrode terminals of the inspection substrate to be fine in order to use a pitch shifting base plate in which the second electrode of the base plate may have a pitch that converges to match the electrode pitch on the inspection substrate. A plurality of connecting leads are provided, and each of the connecting leads has one end connected to the first group electrode terminal and the other end having a contact terminal. The arrangement pitch of the electrode terminals of the second group may be the same as the arrangement pitch of the electrode terminals of the first group. The electrode terminals of the inspection substrate are advantageously arranged not to exceed 0.5 mm or to be arranged at fine pitches in the range of 0.2 to 0.5 mm, but it is effective even if appropriate modifications are made to the arrangement pitch of the second group electrode terminals. When the inspection probe of the invention is used to inspect an area-array type inspection substrate, it is preferable that the base plate of the inspection probe is made of a multilayer laminate substrate.

Each connecting lead is made of fine metal filament, one end is joined to one electrode terminal of the first group on the base plate by wire bonding method and the other end extends downward through the opening of the base plate. The metal materials forming the metal filaments for the connecting leads are made from metals and alloys which are easy to bond wires such as gold, gold alloys, copper, aluminum, aluminum-silicon alloys, beryllium copper, brass, nickel, molybdenum, tungsten and stainless steel. It may be selected and is not particularly limited. Gold filaments are most preferred unless they are expensive, but it is also advantageous to plate metal filaments that do not contain gold with gold or a gold base alloy to provide corrosion resistance. The diameter of the metal filament is selectively used depending on the arrangement pitch of the electrode terminals on the inspection substrate and the metal material. When the filament is gold, the diameter of the metal filament is generally in the range of 18 to 50 µm, and preferably in the range of about 25 to 30 µm.

At the end of the connection lead extending downward through the opening of the base plate, a hemispherical contact point plated with gold is provided to reduce the contact resistance when the contact point contacts the electrode on the inspection substrate. The assembly of connecting leads extending down through an opening from one of the first group of electrodes on the base plate is an elastomer of electrically insulating elastomeric material which is flexible except for the aforementioned contact points of each end as a whole opposing the electrode terminals. Is inserted into The above-mentioned elastic material may be selected from various kinds of rubber materials including silicone rubber, epoxy rubber, urethane rubber and other synthetic rubbers. The elastic elastomer gives elasticity to the connection lead to elastically match the deformation of the connection lead to ensure proper contact pressure on the connection lead contact point and the inspection substrate. The elastic elastomer is coated with a rigid reinforcing mold molded from rigid metals such as general-purpose industrial plastic resins, ceramics and metals in consideration of the material's heat resistance, dimensional stability, moldability, and the like.

Compared with the conventional inspection probe, the inspection probe of the present invention having the above structure is not only applicable to an inspection substrate having electrode terminals whose electrodes are arranged at very fine pitches, but also results in a short connection distance not exceeding 5 mm. It has the advantage of enabling a high speed inspection of the inspection substrate. In particular, advanced inspection probes formed using multilayer substrates as base plates are suitable for inspection of inspection substrates having a large number of electrode terminals arranged in a matrix arrangement, for example, in order to increase the number of electrode terminals. In addition, since the contact portion is installed at a lower level than the lower surface of the base plate of the probe and the connecting wire is encapsulated with an elastic rubber material as a whole, the elastic force applied to the contact point is not affected by the warpage and vibration of the test substrate. High reliability can be ensured in the contact state between the electrode terminal of the substrate and the contact point of the connecting lead.

According to another aspect of the invention, a novel method for inspecting an electronic circuit board using the above-described inspection probe is provided. Therefore, the method of the present invention,

1) connecting the exposed end of the connecting lead to one of the electrodes of the first group of electronic circuit boards under test;

2) electrically connecting each electrode of the second group of electronic circuit boards under test to the first base substrate of the test equipment directly or via an elastic connector;

3) electrically connecting an electrode on the second base substrate of the inspection equipment connected by wiring with the first base substrate of the inspection equipment to one of the electrodes of the second group of the inspection probes via the elastic connector.

In the step 2) of the above-described method, another method may also be used to electrically connect the electrodes on the first base substrate of the inspection equipment with a plurality of pogo pins and the second group electrodes of the electronic circuit board under investigation. have.

In the inspection method of the present invention using the above-described inspection probe having a conductor extending from the first group electrode around or around the base substrate through the opening of the base plate of the inspection probe and inserted into the elastic elastomer, The contact point of the connecting lead and the inspection substrate according to the connection between the second group electrode and the electrode on the second base substrate of the inspection equipment and the direct connection of the electrode on the first base substrate of the inspection equipment in which the plurality of pogo pins are formed. An elastic connector is used in which electrical connection is made between the first group of electrodes and between the second group of the inspection substrate and the electrode on the first base substrate of the inspection equipment. Since such a connection works with elastic force under pressure, the reliability of the electrical connection is ensured by applying a slight pressure. In addition, since the connection length is greatly reduced, even if the electrodes on the inspection substrate are arranged, electrical connection can be made at a high speed and high reliability can be ensured.

In the case of inspecting an inspection substrate having extremely fine electrodes arranged at a high density, for example, the inspection substrate consists of a multilayer plate having recesses and is provided on each step area of each layer around the recesses. Or in the case of inspecting the IC package substrate, the inspection is carried out using an inspection probe provided with a first group electrode around the opening of the base plate so as to project in a crosswise or zigzag arrangement to match the arrangement of the electrodes on the stepped region of the inspection substrate. Can be.

Alternatively, the inspection probe may be provided with a multilayer base plate having a stepped area around an opening having a connection lead coupled to each stepped area.

In the inspection of an electronic circuit board according to this progressive method, first, an inspection substrate is placed on an electrode on a first base substrate of the inspection equipment such that the second group electrode of the inspection substrate is connected to an electrode on the first base plate of the inspection equipment. Mount it. In this case, the elastic connector can be sandwiched between two groups of electrodes. If the arrangement pitch of the second electrode on the inspection substrate is relatively large, for example, 0.5 mm or more, a large number of pogo pins may be used in the inspection equipment even if it has a small pitch of the second group electrode in the range of 0.18 to 0.20 mm. It is provided in the electrode on the 1st base substrate, and is directly connected with the 2nd group electrode of the test substrate.

Next, the first group electrode of the inspection substrate is connected to the first group electrode on the base plate of the inspection probe by a connecting lead, and the second group electrode of the lower surface of the base plate of the inspection probe is an elastic connector and anisotropic electric. An inspection electronic circuit is formed by being connected to an electrode on a second base substrate of the inspection equipment with a conductive sheet or a plastic sheet having a metal contact point in bump form therebetween.

Among the above-mentioned elastic connectors, anisotropic electrically conductive sheets and plastic sheets having metal contact bumps, elastic connectors are preferred because other means are less reliable at small pitches of 0.5 mm or less in the electrode terminal arrangement. Elastomeric splices are used, including MT-type splicers (produced by Shin-Etsu Polymer Co.) which have micrometallic filaments inserted in parallel with a certain slope in an insulating matrix sheet of rubber elastomer. .

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes in detail various embodiments of the test probes and test methods of the present invention with reference to the drawings in which the test probes are shown in vertical cross-section.

First embodiment

As shown in FIG. 1, which is a vertical cross-sectional view, the inspection probe fabricated in Embodiment 1 is a basic embodiment of the present invention. ) One end of each of the plurality of connecting leads 2 is attached to one of the first group electrodes 3 of the base plate 1 around or around the central opening 4. The second group electrode 3 'is provided on the base plate 1 at the edge or edge of the base plate 1, and each of the second group electrodes 3' is electrically connected to one of the first group electrodes 3; Is connected. Each of the lead wires 2 extends down through the center opening 4 and the lead wires 2 are generally made of electrical material such as rubber, except for the other end 7 which is exposed from the elastic elastomer 5 and directed downward. It is inserted into an elastomer 5 made of an insulating material. The other end 7 is provided with a hemispherical connecting part 8 and plated with gold to ensure electrical connection. The elastic elastomer 5 is entirely covered with a rigid reinforcement mold 6 to serve as a protective barrier.

2A to 2D show manufacturing steps for fabricating the above-described test probe, respectively.

As a first step, as shown in FIG. 2A, a copper space 10 of about 0.5 mm thickness is mounted on the alignment jig substrate 9 by means of the positioning pin 11. The copper spacer 10 is provided as a region of the first and second group electrodes 3 and 3 'of the inspection probe with a pitch of 0.3 mm depth at a position corresponding to the electrode arrangement of the inspection substrate. The surface of the pitch is plated with gold. The base plate 1 is accurately positioned by the positioning pin 11 and mounted on the copper spacer 10. Furthermore, the fixing plate 12 is placed on the base plate 1 to fix the whole assembly.

The base plate 1 having a central opening has a first group electrode 3 around the center opening and a second group electrode 3 'along the periphery of the base plate 1 patterned with the same arrangement and pitch as the electrode terminals for the substrate. ) Is installed.

The gold filaments having a diameter of 25 탆 are connected to the gold plated surfaces of the respective pits of the copper spacer 10 by wire bonding methods, so that each of the connecting wires 2 is positioned at a position corresponding to one of the electrode terminals on the inspection substrate. The other end of is bonded to one of the first group electrodes 3 on the base plate 1. The bonding operation at each end of each of the connecting wires 2 is repeatedly performed by the number of electrode terminals of the inspection substrate. When this bonding operation | work is complete | finished, the fixed plate 12 is removed.

In the next step, as shown in Fig. 2B, the mold reinforcing mold 6 is mounted on the base plate 1 and another fixing plate 13 is mounted to fix the whole assembly. The reinforcement mold 6 is provided with a port (not shown in the drawing) for injecting uncured fluid elastic material for the elastomer and the uncured urethane resin is disposed between the reinforcement mold 6 and the base plate 1. It is injected through the port of the reinforcement mold 6 toward the cavity of. The uncured urethane resin is cured by storage at room temperature for 24 hours and aged at 60 ° C. for a long time for 2 hours to complete the elastomer 5 of the cured urethane rubber. The base plate 1 and the reinforcing mold 6 are integrally joined by sticking to the cured urethane rubber elastomer 5. The reinforcement mold 6 is made from polyphenylene sulfide resin, which is a rigid plastic resin having excellent electrical properties.

The next step is the etching of the copper spacer 10. Therefore, after the base plate 1 and the rigid reinforcement mold 6 are strongly bonded together by adhesion, the fixing plate 1 is removed together with the alignment jig substrate, and the copper space 10 is subjected to etching with an aqueous solution of iron (III) chloride. 2C, each end 7 of each of the connecting wires 2 is exposed on the same plane of the lower surface of the elastic elastomer 5, and the connecting wires 2 are entirely elastic elastomers 5, as shown in FIG. Is fixed to.

The end 7 exposed in the same plane of the lower surface of the elastic elastomer 5 cannot be connected in a reliable contact state when the assembly obtained by the above process is placed on the electrode terminal of the inspection substrate. Each end 7 of the lead wire 2 is provided with a hemispherical contact portion 8 having a height of about 40 μm having a rigid gold plated layer having a thickness of about 3 μm as shown in FIG. 2D. Improves durability.

The above description merely shows one example of the manufacturing process of the test probe of the present invention, and various modifications can be made depending on the material of each part and the design of the test probe.

Second embodiment

The inspection probe manufactured in this embodiment is shown in the vertical side view of FIG. In this embodiment, instead of the base plate 1 made of the single plate described in Example 1, a base plate 14 having a three-layer structure is used. The base plate 14 has a step level difference around the center opening 4 so as to have a stepped area layered downward toward the center opening 4. The connecting leads 2 are divided into three groups, and the connecting leads 2 of each subgroup are arranged on one of the stepped regions of the base plate 14 around the center opening 4 of the first group electrode 3. It is joined by wire bonding one.

The first group electrodes 3 on the lower, middle and upper stepped regions of the steps are patterned in a crosswise or zigzag arrangement with respect to adjacent subgroups of the electrodes 3, so that each electrode is smaller than 100 mu m required for wiring. Even if the wiring connection is successfully performed, the arrangement pitch of the contact points 8 on the lower surface of the elastic elastomer 5 should be as fine as that.

Although not described here, the inspection probe of the modified embodiment described above proceeds in much the same manner as in the first embodiment, except that it uses a multilayer base plate 14 instead of a single layer base plate 1. do.

Third embodiment

This embodiment is shown in the vertical side view of FIG. In this embodiment, the step surface level difference is formed on the lower surface of the elastic elastomer 5 to form the step ring region 15 around the center opening 4 of the base plate 14, and the base plate 14 has a center opening ( 4) It is a two-layer structure having stepped ring regions around it. Therefore, the connecting lead 2 is divided into two groups so that one end of each connecting lead 2 of one group is bonded to the electrode 3 on the step ring region of the base plate 14, and the other end thereof is formed of an elastomer ( The other step ring region 15 on the bottom surface of 5) is exposed.

This model of advanced inspection probes can be easily adapted to the inspection of inspection substrates with electrodes around and under recesses or cavities.

Fourth embodiment

The inspection probe produced in this embodiment is shown in the vertical side view of FIG. 5. This embodiment is a simple modification of the first embodiment, in which the observation hole 16 is installed in the rigid reinforcement mold 6 so that the inspection substrate under the inspection probe is visible, so that the inspection probe is accurately placed on the inspection substrate. Can be mounted correctly.

Although the positioning observation hole 16 is preferably formed in the center of the opening 4 of the base plate 1 as shown in FIG. 5, the positioning of the observation hole 16 is provided unless there is a failure in the circuit wiring or the electrical wiring. Is not limited.

Fifth Embodiment

The test probe produced in this embodiment is shown in the vertical side view of FIG. The inspection probe itself of this embodiment is almost the same as in the first embodiment, but the difference is that the fin-shaped radiator 17 is mounted by direct connection on the upper part of the rigid reinforcement mold 6 to significantly improve the heat dissipation ability during inspection. Even if the test substrate generates heat, the test using the test probe can be safely performed. The radiator 17 has several fins 17A on its upper surface, which greatly increases the surface area for heat dissipation. In addition, the radiator 17 is provided with a central projection 17B extending downward through the opening 4 formed in the rigid reinforcement mold 5 to greatly increase the surface area of the radiator 17.

The material forming the radiator 17 need not necessarily be any particular material and may be used as long as it has a high thermal conductivity and is easy to form. In this regard, aluminum is used as the radiator 17 in this embodiment.

Sixth embodiment

7A and 7B each show the procedure of the inspection test of the electronic circuit board 21 having a generally flat configuration, such as an IC substrate, a semiconductor wafer, as the inspection substrate according to the method of the present invention. 7A and 7B are each composed of an inspection substrate 21, first and second base substrates 22 and 23 of inspection equipment (not shown in this figure), and an inspection probe 24 that is electrically wired. Vertical cross section of the assembly. In the embodiment of FIG. 7A, the first group electrode 3 of the inspection probe 24 is provided around the opening 4 of the base plate. In the embodiment of FIG. 7B, the first group electrode of the inspection probe 24 is provided. (3) It is provided around the edge of the base plate 1.

First, the elastic connector 25 is mounted on the electrode 22A of the first base substrate 22, and the second group electrode 21B of the inspection substrate 21 is used to make the inspection equipment. The inspection substrate 21 is mounted in such a manner as to be electrically connected to the one base substrate 22.

In the next step, the test probe 24 is moved to a position close to the test substrate 21 to electrically connect the end of the connection lead 2 connected to the first group electrode 3 of the test probe 24. Let's do it. Thus, the elastic connector 28 (MT type of Shin-Etsu Polymer Co.) is mounted on the electrode 23B of the second base substrate 23 of the inspection equipment, and is inspected through the elastic connector 28 interposed therebetween. The inspection circuit is completed by electrically connecting between the second group electrode 3 'of the probe 24 and the electrode 23B of the base plate 23.

Seventh embodiment

Fig. 8 shows another embodiment of an advanced inspection method for inspecting the inspection substrate 21. As the first group electrode 21A of the inspection substrate is sometimes used in the IC package substrate, the inspection substrate ( 21), and the same as in Example 6 in other respects.

By applying pressure in the vertical direction indicated by the arrow P on the inspection probe 24, the electrical inspection of the inspection substrate 21 is very reliable and quick.

Eighth embodiment

This embodiment is shown in the vertical side view of FIG. 9, although not shown in the drawings, the electrodes 22A of the first base substrate 22 of the inspection equipment and the second group electrodes 21B of the inspection substrate 21 are Instead of using the elastic connector 25 used in the sixth or seventh embodiment, the plurality of gold-plated pogo pins 32 of 0.5 mm diameter are directly connected by the electrode assembly 22A. In other respects, it is the same method as the method used in the sixth or seventh embodiment. By the spring means of the pogo pins 32, the electrode groups are elastic and in contact with each other to form a reliable electrical connection.

As described above, according to the present invention, a novel and improved electronic circuit board that can be manufactured at a considerably low price as well as an inspection method capable of high-speed inspection even in an electronic circuit board having a plurality of electrodes arranged at extremely fine pitches. There is an effect that can provide a test probe for the test.

1 is a vertical cross-sectional view of an inspection probe of the present invention as a basic embodiment.

2A-2D are each a vertical side view of one of the successive steps of making the test probe of the present invention.

3 is a vertical cross-sectional view of another embodiment of the inspection probe of the present invention in which the base plate has a layer structure having a step on the surface around the opening and the first group electrode is located on the step surface.

4 is a vertical cross-sectional view of another embodiment of an inspection probe of the present invention applicable to an inspection electronic circuit board having a stepped surface.

5 is a vertical cross-sectional view of the test probe of another embodiment of the present invention in which the rigid reinforcement mold has a viewing hole for correctly mounting the test probe on the electronic circuit board under investigation.

6 is a vertical side view of an inspection probe of another embodiment of the present invention in which a fin-shaped radiator is mounted.

7A and 7D are vertical cross-sectional views of connections between an electronic circuit board and inspection equipment in one embodiment.

8 is a vertical sectional view showing a connection between the electronic circuit board and the inspection equipment of another embodiment.

9 is a vertical sectional view showing a connection between the electronic circuit board and the inspection equipment of another embodiment.

※ Explanation of code for main part of drawing

1: base plate

2: connection lead

3: first group electrode

3´: second group electrode

4: opening

5: elastomer

6: reinforcement mold

7: end

8: Hemispherical Connection

Claims (6)

a) a base plate made of electrically insulating plastic resin and having an opening, b1) a first group electrode fixedly arranged around the opening of the base plate, b2) a second group electrode fixedly arranged around an edge of the base plate, the second group electrode electrically connected to the first group electrode to form an electric circuit; c) connecting leads, one end of which is bonded to one of the first group electrodes, the other end of which extends down through the opening of the base plate, d) an elastomer having flexibility substantially embedding the connecting leads, wherein an end extending downward of each of the connecting leads is exposed out of the elastomer so as to be in contact with one of the electrodes of the electronic circuit board under test; Facing, elastomer, and e) an assembly having a reinforcing mold formed by covering said elastomer. 2. The electron of claim 1, wherein the base plate has a stepped area around the opening layered downward toward the opening, and wherein the first group electrode is formed on the stepped area of the base plate. Inspection probes for circuit boards. The inspection probe of claim 1, wherein the reinforcement mold has an observation hole penetrating therethrough to open the opening of the base plate. The test probe of claim 1, wherein the reinforcement mold has a plurality of heat dissipation fins. A method of inspecting an electronic circuit board by mounting an inspection probe as defined in claim 1, Iii) contacting the exposed end of each connection lead with one of the electrodes of the first group of electronic circuit boards under test, Ii) electrically connecting each of the second electrodes on the electronic circuit board under test with one of the electrodes on the first base substrate of the inspection equipment, either directly or via an elastic connector, and Iv) electrically connecting each of the electrodes on the second base substrate of the inspection equipment, which is connected by wiring with the first base substrate of the inspection equipment, to one of the second group electrodes of the inspection probe via an elastic connector. A method for inspecting an electronic circuit board, comprising the steps of: 6. The electronic circuit board of claim 5, wherein a plurality of pogo pins in contact with the second group electrode on the electronic circuit board is provided on the electrode on the first base substrate of the inspection equipment to form an electrical connection. How to.

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