JPH0735775A - Probe card for high temperature test - Google Patents

Abstract

PURPOSE:To prevent a probe card body from expanding or distorting and prevent a probe needle and a pad formed on an IC wafer from being shifted. CONSTITUTION:A probe card for high temperature test comprises a probe card body 100 with an opening 110 provided, a plurality of probe needles 300 provided facing the opening 110 and a plate 400 for preventing convection heat movement provided on a rear face of the probe card body 110, wherein a slit is provided between the probe card body 100 and the plate 400 and the slit is filled with a heat insulating material 600. In addition a distortion suppressing member 500 for suppressing distortion of the probe card body 100 is provided on a surface of the probe card body 100.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to probe cards, and in particular to I
The present invention relates to a high-temperature test probe card used for a test performed with a C wafer in a high temperature state.

[0002]

2. Description of the Related Art A probe card used for a test conducted at room temperature is used as it is for a test conducted with an IC wafer in a high temperature state. The IC wafer is placed in a high temperature state by mounting the IC wafer on the chuck top heated by a heater or the like.

[0003]

The normal probe card used for the test conducted at room temperature has no problems in the high temperature state, and therefore has the following problems. That is, since heat from the IC wafer is transferred to the probe card by natural convection, the probe card main body expands, whereby the probe needle and the pad formed on the IC wafer are displaced, and accurate measurement cannot be performed. Also,
The deviation between the two also occurs when the probe card body is warped.

[0004]

The present invention has been made in view of the above circumstances, in which the probe card body does not expand or warp, and the probe needle and the pad formed on the IC wafer do not shift. It is intended to provide a probe card for high temperature test.

[0005]

1 is a schematic sectional view of a probe card for high temperature test according to an embodiment of the present invention, and FIG. 2 is a schematic rear view of the probe card for high temperature test. Note that the illustration of the probe needle is omitted in FIG.

The high temperature test probe card according to the present embodiment is used for a test performed with the IC wafer 900 in a high temperature state. The probe card main body 100 is provided with an opening 110 and the opening 110 is provided. A plurality of probe needles 300 provided on the probe card body 100, a convection heat transfer prevention plate 400 provided on the back surface side of the probe card body 100, and a warp suppressing member 500 provided on the front surface side of the probe card body 100. have. The probe card body
The front surface side of 100 refers to the surface that faces upward when the probe card main body 100 is attached to the probe card support 800, and the back surface side refers to the surface that faces downward.

The probe card main body 100 is no different from the conventional one, and the IC wafer 900 which is an object to be measured is placed at the center.
An opening 110 corresponding to the shape of the IC chip formed in the above is formed, and a predetermined wiring pattern (not shown) is formed around the opening 110. Furthermore, the opening
A ceramic ring 200 is fitted in 110.

On the other hand, the probe needle 300 is no different from the conventional one, and one end thereof is bent into a hook shape to be in contact with the pad of the IC chip, and the other end thereof is a portion to be connected to the wiring pattern. . The probe needle 300 has an epoxy resin on the inclined surface 210 of the ceramic ring 200.
Fixed at 700.

The convection heat transfer prevention plate 400 is formed of a plate material such as metal or plastic and has an opening having a shape corresponding to the opening 110 of the probe card body 100.
410 has been opened. This convection heat transfer prevention plate 4
00 is thickest on the side of the opening 410 and gradually becomes thinner toward the periphery. The convection heat transfer prevention plate 400 is attached to the back surface side of the probe card body 100 with an attachment member 420 made of a member having a high heat insulating property interposed between the plate 420 and the probe card body 100. In addition, in the gap between the convection heat transfer prevention plate 400 and the probe card body 100, a heat insulating material 600 such as glass wool is provided.
Is filled.

The convective heat transfer prevention plate 400
When the probe is attached to the probe card body 100, the probe needle 300 protrudes from the opening 410 to such an extent that the measurement is not hindered.

The warp suppressing member 500 is a ring-shaped member which is attached to the surface side of the probe card main body 100 so as to be in direct contact therewith and has a certain weight.
The warp suppressing member 500 is attached to the probe card body 100 with a screw (not shown).

The probe card support 800 is formed with a recess into which the probe card body 100 is fitted, and the probe card body 100 fitted into the recess has a screw 81.
Fixed to probe card support 800 at 0.

In the probe card for high temperature test constructed as described above, even if the high temperature air heated by the heater of the chuck top is blown, the convection heat transfer inhibiting plate 400 is only heated first. Therefore, heat is not transferred to the probe card body 100. In addition, the convection heat transfer blocking plate 400 blocks hot air,
Heat will not be transferred to the probe card body 100.
Therefore, the probe card body 100 does not expand. Further, since the probe card body 100 is pressed by the warp suppressing member 500, it does not warp due to heating.

In the above-described embodiment, the gap between the probe card body 100 and the convection heat transfer prevention plate 400 is filled with the heat insulating material 600, but it may not be necessary depending on the temperature of the high temperature air. is there. Further, although the convection heat transfer prevention plate 400 has the largest thickness around the opening 410, the present invention is not limited to this, and may have a uniform thickness.

Further, in the above-mentioned embodiment, the convection heat transfer prevention plate 400 prevents the convection from the IC wafer. However, a plurality of convection heat transfer prevention plates are provided at predetermined intervals. If laminated, the expansion of the probe card body 100 can be prevented more effectively.

[0016]

The probe card for high-temperature test according to the present invention is used for a test performed with an IC wafer in a high temperature state. The probe card main body is provided with an opening, and is provided so as to face the opening. A plurality of probe needles, and a convection heat transfer prevention plate provided on the back side of the probe card body, a heat insulating material in the gap between the probe card body and the convection heat transfer prevention plate. It is filled. Therefore, the high-temperature air that heats the IC wafer is blown to the convection heat transfer prevention plate and cannot be blown to the probe card body, so that expansion due to heating of the probe card body occurs. Hateful. Therefore, the probe needle and the pad formed on the IC wafer are not displaced, and accurate measurement can be performed.

On the front side of the probe card body,
Since the warp suppressing member is provided, the displacement of the probe needle and the pad formed on the IC wafer due to the warp of the probe card body does not occur.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a high temperature test probe card according to an embodiment of the present invention.

FIG. 2 is a schematic rear view of the high temperature test probe card.

[Explanation of symbols]

 100 Probe card body 110 (probe card body) opening 200 Ceramic ring 300 Probe needle 400 Convection heat transfer prevention plate 500 Warp suppression member 600 Insulation material

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takumi Uchida 2-5-13 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Nihon Electronic Materials Co., Ltd.

Claims (5)

[Claims] 1. A high-temperature test probe card used for a test performed while an IC wafer is in a high temperature state, a probe card main body having an opening, a plurality of probe needles provided facing the opening, A probe card for high temperature test, comprising: a convection heat transfer prevention plate provided on the back surface side of the probe card body. 2. The probe card for high temperature test according to claim 1, wherein a gap is provided between the probe card body and the convection heat transfer prevention plate. 3. The probe card for high temperature test according to claim 2, wherein the gap is filled with a heat insulating material. 4. The high temperature test probe card according to claim 1, wherein a plurality of convection heat transfer prevention plates are laminated at a predetermined interval. 5. The surface side of the probe card main body,
The high temperature test probe card according to claim 1, further comprising a warp suppressing member that suppresses a warp of the probe card main body.