CN100589256C - Method for preparing solar energy cell assembly with printed circuit paster technique - Google Patents
Method for preparing solar energy cell assembly with printed circuit paster technique Download PDFInfo
- Publication number
- CN100589256C CN100589256C CN200810047308A CN200810047308A CN100589256C CN 100589256 C CN100589256 C CN 100589256C CN 200810047308 A CN200810047308 A CN 200810047308A CN 200810047308 A CN200810047308 A CN 200810047308A CN 100589256 C CN100589256 C CN 100589256C
- Authority
- CN
- China
- Prior art keywords
- battery sheet
- pcb
- solar energy
- cell assembly
- energy cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 230000007547 defect Effects 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 2
- 238000003754 machining Methods 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 238000012802 pre-warming Methods 0.000 abstract 1
- 238000010992 reflux Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Abstract
The present invention discloses a method for producing solar energy cell assembly by copper-surfaced circuit paster technique, the steps are: A. the corresponding missed soldering tin paste of each solder pad is brushed by the open pore of steel net on PCB; the needed battery piece of the PCB is pasted on the solder pad by a paster machine or a manual paster tools; C, soldering tin paste being prewarming, reflow soldering, cooling down curing, by using circulation reflux solder to forming circuit connection between the battery piece and the circuit solder pad; D, testing weld defects by magnifying glasses or microscope; E, the battery piece with weld(ing) defect or unhealthy weld is executed re-prepare by using a hot hair drier. The method improve the welding quality of the solar cell piece, improving the machining efficiency, improving the actinoelectricity conversion ratio of the solar energy cell assembly, thereby, the appearance of the solar energy cell assembly and productive labor condition are improved.
Description
Technical field
The present invention relates to the solar photovoltaic battery component processing technique field, more specifically relate to and a kind ofly prepare the method for solar module, be applicable to solar photovoltaic battery component processing with printed circuit paster technique.
Background technology
General solar module preparation technology key step comprises at present: earlier copper tin tape welding is connected on the solar battery sheet, carry out the welding of solar cell back face again, then the battery strings that connects is carried out the serial or parallel connection conducting by designing requirement and draw.Its process flow steps is many, and welding quality is wayward, and outward appearance is not good, and the bigger than normal and heterogeneity in the gap between solar battery sheet is low less than the circuit connection production efficiency of the battery sheet of the fine size of 5mm to width, and working condition is poor.
Therefore, but the production of solar module is badly in need of, and automaticity height, quality are easy to control, product appearance is good, the little and small size battery sheet of homogeneous high efficiency production width below 5mm in gap between solar battery sheet, the manufacturing technology that production efficiency height and working condition are good.
Summary of the invention
The objective of the invention is to be to provide a kind of method for preparing solar module with printed circuit paster technique.Easy to implement the method, easy to operate, have automaticity height, quality and be easy to control, production efficiency height, and advantage such as working condition is good.
By printed circuit paster technique being applied to the production of solar module, the invention provides a kind of new solar module preparation method.
Below the present invention is described in detail, the present invention is not limited only to this, the explanation before each term is explained orally.
1, so-called PCB (Printed Circuit Board) is a printed circuit board (PCB).Printed circuit board (PCB) through after the careful neat planning, is etched in circuit copper cash complicated between the part on the plank.Printed circuit board (PCB) is made flat board with electrically non-conductive material, the design prebored hole is all arranged usually so that electronic component to be installed on this flat board.The metal path that the hole of element helps to allow preliminary election be defined in and prints on the plate face couples together in the electronics mode, the pin of electronic component is passed PCB after, be attached on PCB with the metal electrode of conductivity again and go up and form circuit.
2. so-called printed circuit paster technique SMT (Surface Mount Technology) is a surface mounting technology.It is that the circuit that Surface Mount Component, pastes, is soldered on the assigned position of printed circuit board surface is adorned the connection technology.Used responsibility system circuit board does not have unprincipled boring.Specifically, be exactly at first on the printed circuit board dish, to be coated with solder(ing) paste, again Surface Mount Component, is put on the pad that scribbles solder(ing) paste exactly, melts until solder(ing) paste, just realized being connected between first device and the printed board after the cooling by the heating printed circuit board.The eighties in 20th century, surface mounting technology is gradually improved, the components and parts that are used for surface mounting technology are produced in a large number, price descends significantly, various technological performance, the equipment that price is low emerges one after another, electronic product with the surface mounting technology assembling has the advantage that volume is little, performance good, function is complete, price is low, so SMT as circuit assembly technology of new generation, is widely used in the electronic product multi pack of every field such as Aeronautics and Astronautics, communication, computer, medical electronics, automobile, office automation, household electrical appliance.
The step that the present invention relates to comprises:
1, goes up corresponding each pad by the perforate on the steel mesh to PCB and leak brush solder(ing) paste, the wherein thickness of steel mesh employing≤0.08mm.Perforate requirement corresponding on the steel mesh is: anodal perforate is the 85-95% of former positive terminal pad size, and the negative pole perforate is the 60-80% of former negative terminal pad size;
2, be mounted on required battery sheet on the pcb board on the pad one to one with chip mounter or manual paster instrument;
3, utilize Reflow Soldering that solder(ing) paste is preheated to 100 ℃, 80-230 ℃ of reflow soldering is cooled to normal temperature (15-35 ℃) then and solidifies, and makes battery sheet and line pad form circuit and is connected.
4, by magnifying glass or microscopic examination weld defect;
5, use hot hair dryer (leaving air temp is 80-230 ℃) that the battery sheet that weld defect or bad welding are arranged is reprocessed, obtain the solar module semi-finished product.
The present invention compared with prior art, have the following advantages and effect: easy to implement the method, the solar cell welding quality is good, and the solar battery sheet gap is little, the photoelectric conversion efficiency height of solar module, outward appearance U.S., product quality is excellent, the production efficiency height, and production cost is low, and improved the working condition that solar module is produced effectively, be applicable to large-scale production.
Description of drawings
Fig. 1 is the PCB schematic layout pattern of JW60602007 for a kind of model
PCB comprises substrate, establishes the positive and negative electrode lead that is distributed on the real estate, and lead is provided with Copper Foil line pad.
Fig. 2 is 2007 battery cutting blade schematic diagram for a kind of model
Cutting blade is that single face is referred to that the staggered form solar cell forms through laser cutting machine cutting according to designing requirement, and it includes three positive poles and three negative poles, and cutting should be cut from the insulated wire centre position, must guarantee precision.
Embodiment
To help to understand essence of the present invention more by example given below, but example can not be used for being construed as limiting the invention.
Embodiment 1:
Need be that 2007 battery cutting blade (as shown in Figure 2) mounts on the PCB circuit board that model is JW60602007 (as shown in Figure 1) with model
A, be that the PCB of JW60602007 goes up corresponding each pad and leaks brush solder(ing) paste to model by the perforate on the steel mesh;
B, be that 2007 battery sheet is mounted on the PCB corresponding bonding pad one to one with model with chip mounter;
C, utilize Reflow Soldering that solder(ing) paste is preheated to 100 ℃, 80-230 ℃ of reflow soldering is cooled to normal temperature cure then, makes battery sheet and line pad form circuit and is connected;
D, by magnifying glass or microscopic examination weld defect;
E, use hot hair dryer (leaving air temp is 80-230 ℃) that the battery sheet that weld defect or bad welding are arranged is reprocessed, obtain the solar module semi-finished product.
Described solar module semi-finished product can come into operation through lamination or after dripping the glue encapsulation.
Claims (1)
1, a kind ofly prepares the method for solar module, the steps include: with printed circuit paster technique
A, go up corresponding each pad by the perforate on the steel mesh to PCB and leak brush solder(ing) paste, the thickness of steel mesh employing≤0.08mm wherein, corresponding perforate is on the steel mesh: the 85-95% of corresponding positive terminal pad size on the anodal Kong Kaiwei battery sheet, and the negative pole perforate is the 60-80% of the negative terminal pad size of correspondence on the battery sheet;
B, with chip mounter or manually the paster instrument PCB gone up required battery sheet be mounted on the pad one to one;
C, utilize Reflow Soldering that solder(ing) paste is preheated to 100 ℃, 80-230 ℃ reflow soldering, is cooled to normal temperature cure, make battery sheet and line pad form circuit and be connected;
D, by magnifying glass or microscopic examination weld defect;
E, use hot hair dryer, leaving air temp to be 80-230 ℃ the battery sheet that weld defect or bad welding are arranged reprocessed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810047308A CN100589256C (en) | 2008-04-11 | 2008-04-11 | Method for preparing solar energy cell assembly with printed circuit paster technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810047308A CN100589256C (en) | 2008-04-11 | 2008-04-11 | Method for preparing solar energy cell assembly with printed circuit paster technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101257062A CN101257062A (en) | 2008-09-03 |
| CN100589256C true CN100589256C (en) | 2010-02-10 |
Family
ID=39891662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810047308A Active CN100589256C (en) | 2008-04-11 | 2008-04-11 | Method for preparing solar energy cell assembly with printed circuit paster technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100589256C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937937B (en) * | 2010-08-27 | 2012-06-27 | 成都钟顺科技发展有限公司 | Compound eye type concentrator solar cell assembly and manufacturing process thereof |
| CN102717160A (en) * | 2012-06-24 | 2012-10-10 | 成都聚合科技有限公司 | Manufacturing process for heating and curing photovoltaic concentrator cell chip and circuit substrate |
| CN102723402A (en) * | 2012-06-24 | 2012-10-10 | 成都聚合科技有限公司 | Manufacturing process for fixing concentrating photovoltaic battery chip with circuit board through steel mesh |
| CN103594554B (en) * | 2013-11-01 | 2016-07-20 | 文创科技股份有限公司 | A kind of production technology of solar energy widgets |
| CN105336813A (en) * | 2015-09-08 | 2016-02-17 | 深圳市迪晟能源技术有限公司 | Manufacturing method for solar cell module |
| CN106612098A (en) * | 2017-03-03 | 2017-05-03 | 深圳市富友昌科技股份有限公司 | Millimicro power consumption collector of compound photovoltaic cells |
| CN106898669B (en) * | 2017-03-13 | 2018-08-31 | 南京日托光伏科技股份有限公司 | A kind of MWT photovoltaic modulies conduction core plate and the compound method of backboard |
| CN114284392B (en) * | 2022-01-04 | 2022-10-18 | 武汉美格科技股份有限公司 | Solar cell module and preparation method and device thereof |
-
2008
- 2008-04-11 CN CN200810047308A patent/CN100589256C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101257062A (en) | 2008-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100589256C (en) | Method for preparing solar energy cell assembly with printed circuit paster technique | |
| CN101427385B (en) | Method of coupling photovoltaic cells and film for implementing it | |
| CN104228316B (en) | Machining technology for conducting printing and surface mounting on substrates made of various materials simultaneously and jig structure thereof | |
| CN102740595B (en) | Solar cell panel having serial connection or parallel connection structure and manufacturing method for solar cell panel | |
| CN111642081A (en) | PCB solder mask production process | |
| CN102123562B (en) | Method for manufacturing metal substrate by adopting reflow soldering | |
| CN101533887B (en) | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof | |
| CN105308756B (en) | Solar panel and the method for manufacturing this solar panel | |
| CN108040438A (en) | A kind of manufacture craft of circuit board metallization half bore | |
| CN112635604B (en) | Photovoltaic glass and preparation method thereof, photovoltaic module and preparation method thereof | |
| CN202697046U (en) | Tool for copper-covered substrate printing and reflow technology | |
| KR20120126224A (en) | Method for Manufacturing Dye Sensitized Solar Cell | |
| CN108307593A (en) | A kind of thin plate core plate beats rivet fixture | |
| CN204596786U (en) | A kind of power model | |
| CN109348642A (en) | A kind of golden method of wiring board whole plate electricity | |
| CN111774682B (en) | Welding method for special-shaped porous printed board | |
| CN101516161B (en) | Manufacturing method of projection PCB circuit board | |
| CN114823353A (en) | Method for manufacturing BGA process device of glass substrate | |
| CN218300148U (en) | Energy storage battery module integrated circuit board | |
| CN102332832A (en) | Automobile rectification regulator and production process thereof | |
| CN104916612A (en) | Power module and making method thereof | |
| CN110181187A (en) | High reliability millimeter wave component Stepped welding assemble method | |
| CN104241939A (en) | Modular power socket with circuit board for wiring power supply and manufacturing method thereof | |
| CN219610224U (en) | Metal support capacitor assembly jig | |
| CN203057706U (en) | Solder paste coating device for metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN JIAWEI SOLAR SOLUTION PROVIDER CO., LTD. Free format text: FORMER OWNER: JIAWEI SOLAR ENERGY ( WUHAN ) CO., LTD. Effective date: 20100621 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430063 NO.22, TIEJI ROAD, WUCHANG DISTRICT, WUHAN CITY, HUBEI PROVINCE TO: 518000 1, XINFA INDUSTRIAL DISTRICT, ZHONGXIN COMMUNITY, PINGDI STREET, LONGGANG DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE,2,3, NO.4 |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100621 Address after: 518000 Xinfa Industrial Zone, central community, Longgang District, Guangdong City, Shenzhen Province, 1, 2, 3 and 4 Patentee after: Shenzhen Jiawei Industries Co., Ltd. Address before: 430063 No. 22 iron road, Wuchang District, Hubei, Wuhan Patentee before: Jiawei Solar (Wuhan) Co., Ltd. |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JIAWEI PHOTOVOLTAIC LIGHTING CO., LTD. Free format text: FORMER NAME: SHENZHEN JIAWEI SOLAR SOLUTION PROVIDER CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Xinfa Industrial Zone, central community, Longgang District, Guangdong City, Shenzhen Province, 1, 2, 3 and 4 Patentee after: Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. Address before: 518000 Xinfa Industrial Zone, central community, Longgang District, Guangdong City, Shenzhen Province, 1, 2, 3 and 4 Patentee before: Shenzhen Jiawei Industries Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 New Industrial Zone No. 1, 2, 3 and 4, Pingdi Street Center Community, Longgang District, Shenzhen City, Guangdong Province Patentee after: Jiawei New Energy Co., Ltd. Address before: 518000 New Industrial Zone No. 1, 2, 3 and 4, Pingdi Street Center Community, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |