CN219610224U - Metal support capacitor assembly jig - Google Patents
Metal support capacitor assembly jig Download PDFInfo
- Publication number
- CN219610224U CN219610224U CN202320496584.0U CN202320496584U CN219610224U CN 219610224 U CN219610224 U CN 219610224U CN 202320496584 U CN202320496584 U CN 202320496584U CN 219610224 U CN219610224 U CN 219610224U
- Authority
- CN
- China
- Prior art keywords
- plate body
- bottom plate
- metal bracket
- ventilation
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The metal bracket capacitor comprises two frames which are oppositely arranged and a plurality of ceramic chips which are stacked between the two frames, wherein the metal bracket capacitor comprises a bottom plate, an upper plate and a positioning plate; the upper plate comprises an upper plate body, a plurality of upper mounting grooves which are arranged on the opposite surface of the upper plate body and the bottom plate at intervals and used for mounting another frame, and an adsorption magnet which is arranged in the upper plate body and used for adsorbing and fixing the frame; the positioning plate is arranged on the bottom plate body, extends along the arrangement direction of the plurality of lower mounting grooves, is embedded in the plurality of lower mounting grooves to limit the patch position of the frame.
Description
Technical Field
The utility model belongs to the field of preparation of bracket capacitors, and particularly relates to a metal bracket capacitor assembly jig.
Background
With the rapid and continuous development of science and technology, the demand of high-capacity high-power capacitors is increasing in the fields of power supply, industry, automobile, military industry, aerospace and the like, and the demand of high-capacity high-power capacitors is difficult to meet with the traditional chip ceramic capacitors, so that the demand of high capacity of the capacitors is realized by a mode of parallel assembly of a plurality of ceramic capacitors.
The non-encapsulated metal bracket capacitor realizes the high-difficulty design of super-large capacity and ultra-low ESL of the ceramic capacitor, can eliminate the linear displacement of the ceramic capacitor and the PCB board caused by different expansion coefficients through special pin design, solves the problem of fatigue of welding spots, eliminates the problem of cracking of the ceramic body of the capacitor caused by bending of the PCB board, improves the use reliability of the product, and is widely applied to high-frequency high-current switching power supply input/output filtering, power bus filtering, DC-DC converters and the like. However, assembling and welding of a plurality of ceramic chip capacitors is always a difficult point, the manual assembly efficiency is low, and the problems of poor welding, such as skew and the like, are easy to occur, so that the ceramic chip capacitors are required to be further improved.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a metal bracket capacitor assembly jig.
The utility model adopts the following technical scheme:
a metal bracket capacitor assembly fixture comprises two frames oppositely arranged and a plurality of ceramic chips stacked between the two frames, comprising a bottom plate, an upper plate and a positioning plate,
the bottom plate comprises a bottom plate body, a plurality of lower mounting grooves which are arranged on the bottom plate body at intervals and used for mounting a frame, and lower ventilation assemblies which are arranged between two adjacent lower mounting grooves;
the upper plate comprises an upper plate body, a plurality of upper mounting grooves which are arranged on the opposite surface of the upper plate body and the bottom plate at intervals and used for mounting another frame, and an adsorption magnet which is arranged in the upper plate body and used for adsorbing and fixing the frame;
the locating plate is arranged on the bottom plate body, extends along the arrangement direction of the plurality of lower mounting grooves and is embedded in the plurality of lower mounting grooves to limit the patch positions of the frame.
Further, the metal bracket capacitor further comprises a supporting block arranged on the side face of the frame and used for supporting the ceramic chips, and the supporting block is positioned outside the lower mounting groove when the frame is arranged in the lower mounting groove.
Further, the lower ventilation assembly comprises two lower ventilation holes and a lower ventilation groove, wherein the two lower ventilation holes are sequentially arranged front and back, and the lower ventilation groove is connected between the two lower installation grooves and communicated with the lower ventilation holes.
Further, the lower ventilation groove comprises a lower communication section which downwards extends from the top surface of the bottom plate body and is communicated with the lower ventilation hole, and two lower extension sections which are oppositely arranged at two sides of the lower communication section and are respectively communicated with the lower installation groove which is opposite to the lower communication section.
Further, the upper plate body is provided with a fixing groove which is opposite to the upper mounting groove and used for mounting the adsorption magnet.
Further, the device also comprises a limiting mechanism arranged between the bottom plate and the upper plate, wherein the limiting mechanism comprises a first limiting hole arranged on the bottom plate body, a second limiting hole arranged on the upper plate body and opposite to the first limiting hole, and a positioning pin embedded between the first limiting hole and the second limiting hole.
Further, the upper plate further comprises an upper ventilation assembly arranged between two adjacent upper mounting grooves, and the upper ventilation assembly comprises two upper ventilation holes and an upper ventilation groove, wherein the two upper ventilation holes are sequentially arranged front and back, and the upper ventilation groove is connected between the two upper mounting grooves and communicated with the upper ventilation holes.
Further, a plurality of uniform heating holes are formed in the bottom plate body.
Further, the bottom plate body is provided with a direction marking hole.
As can be seen from the above description of the present utility model, compared with the prior art, the present utility model has the following beneficial effects: according to the utility model, through limiting the structure of the jig, the upper plate and the bottom plate are clamped up and down, and the chip mounter is matched, so that the accurate positioning assembly of the metal bracket capacitor is realized, and the production efficiency is improved;
the lower ventilation assembly comprises a lower ventilation hole and a lower ventilation hole, when the metal bracket capacitor is subjected to reflow soldering, the lower ventilation hole is matched with the lower ventilation groove, high-temperature gas in the reflow soldering furnace is facilitated to pass through, so that the temperature of the whole bottom plate and a soldering area is increased, the melting point of the high Wen Xigao is reached, and a ceramic chip is soldered on a frame
Drawings
FIG. 1 is a schematic diagram of an assembly fixture;
FIG. 2 is a schematic diagram of a second structure of the assembly fixture;
FIG. 3 is a schematic structural view of a base plate;
FIG. 4 is a schematic view of the structure of the upper plate;
FIG. 5 is a schematic structural diagram of a metal bracket capacitor;
in the figure, a 1-bottom plate, a 2-upper plate, a 3-positioning plate, a 4-limit mechanism, a 5-metal bracket capacitor, an 11-bottom plate body, a 12-lower mounting groove, a 13-lower vent hole, a 14-lower vent groove, a 141-lower communication section, a 142-lower extension section, a 15-uniform first uniform heating hole, a 16-second uniform heating hole, a 17-direction identification hole, a 21-upper plate body, a 22-upper mounting groove, a 23-adsorption magnet, a 24-upper vent hole, a 25-upper vent groove, a 26-fixed groove 41-first limit hole, a 42-second limit hole, a 43-positioning pin, a 51-frame, a 52-ceramic chip and a 53-support block.
Detailed Description
The utility model is further described below by means of specific embodiments.
Referring to fig. 1 to 5, a metal bracket capacitor assembling jig includes a base plate 1, an upper plate 2, a positioning plate 3 and a limiting mechanism 4.
A metal bracket capacitor 5 including two frames 51 disposed opposite to each other, a plurality of ceramic chips 52 stacked between the two frames 51, and a supporting block 53 disposed at an inner side surface of the frames 51 for supporting the plurality of ceramic chips 52; specifically, the ceramic chips 52 are provided with six, and the six ceramic chips 52 are stacked in two rows.
The base plate 1 comprises a base plate body 11, a plurality of lower mounting grooves 12 which are arranged on the base plate body 11 at intervals and used for mounting a frame 51, a plurality of lower ventilation assemblies which are respectively arranged between two adjacent lower mounting grooves 12, a plurality of uniform heating holes which are arranged on the base plate body 11 and a direction marking hole 17 which is arranged on the base plate body 11, wherein the plurality of lower mounting grooves 12 are arranged at intervals along the length direction of the base plate body 11 to form lower mounting groove groups; further, the even hot hole includes a plurality of first even hot holes 15 and a plurality of second even hot holes 16, and first even hot hole 15 sets up along bottom plate body 11 width direction interval, and second even hot hole 16 symmetry sets up on bottom plate body 11, through set up even hot hole on bottom plate body 11, can get rid of unnecessary material on the bottom plate body 11, improves the temperature of whole bottom plate 1, and a plurality of second even hot hole 16 symmetry set up, can make whole bottom plate 1 temperature more even.
The lower ventilation assembly comprises two lower ventilation holes 13 and a lower ventilation groove 14, wherein the two lower ventilation holes 13 are sequentially arranged front and back, the lower ventilation groove 14 is connected between the two lower installation grooves 12 and is communicated with the lower ventilation holes 13, the lower ventilation holes 13 are matched with the lower ventilation groove 14, when the metal bracket capacitor 5 is subjected to reflow soldering, high-temperature gas in a reflow oven is facilitated to pass through, and therefore the temperature of the whole bottom plate 1 and a welding area is increased to reach a high Wen Xigao melting point, and the ceramic chip 52 is welded on the frame 51; specifically, the lower ventilation groove 14 includes a lower communication section 141 extending downward from the top surface of the bottom plate body 11 to communicate with the lower ventilation hole 13, and two lower extension sections 142 disposed opposite to each other on both sides of the lower communication section 141 to communicate with the opposite lower mounting groove 12, respectively.
The upper plate 2 comprises an upper plate body 21, a plurality of upper mounting grooves 22 which are arranged on the upper plate body 21 at intervals and are opposite to the bottom plate 1 for mounting another frame 51, a plurality of adsorption magnets 23 which are arranged in the upper plate body 21 and are used for adsorbing the fixed frame 51, and an upper ventilation assembly which is arranged between the two adjacent upper mounting grooves 22, specifically, the plurality of adsorption magnets 23 and the plurality of upper mounting grooves 22 are in one-to-one correspondence, the upper plate body 21 is provided with a plurality of fixing grooves 26 which are opposite to the plurality of upper mounting grooves 22 one-to-one and are used for mounting the adsorption magnets 23, and the fixing grooves 26 extend downwards along the vertical direction from the top surface of the upper plate body 22.
The upper ventilation assembly comprises two upper ventilation holes 24 which are sequentially arranged front and back and an upper ventilation groove 25 which is connected between the two upper installation grooves 22 and communicated with the upper ventilation holes 24, and the upper ventilation holes 24 are matched with the upper ventilation groove 25, so that high-temperature gas in a reflow oven is facilitated to pass through when the metal bracket capacitor 5 is subjected to reflow soldering, the temperature of the whole bottom plate and a welding area is improved, the melting point of high Wen Xigao is reached, and the ceramic chip 52 is welded on the frame 51.
The positioning block 3 is arranged on the bottom plate body 11, extends along the arrangement direction of the plurality of lower mounting grooves 12, is embedded in the plurality of lower mounting grooves 12 to limit the patch position of the frame 51, and is embedded in the plurality of lower mounting grooves 12 and the plurality of lower ventilation grooves 14 which are arranged along the length direction of the bottom plate 1 when the metal bracket capacitor 5 is assembled, so that the supporting block 53 on the frame 51 is positioned outside the lower mounting grooves 12 when the subsequent frame 51 is mounted, and the supporting block 53 is prevented from influencing the subsequent patch operation; meanwhile, the positioning block 3 is taken out before the patch, so that a space can be reserved, and the patch operation is convenient.
The limiting mechanism 4 is arranged between the bottom plate 1 and the upper plate 2 to limit the position of the upper plate 2, and comprises a first limiting hole 41 arranged on the bottom plate body 11, a second limiting hole 42 arranged on the upper plate body 21 opposite to the first limiting hole 41, and a positioning pin 43 embedded between the first limiting hole 41 and the second limiting hole 42.
The method for assembling the metal bracket capacitor based on the assembly jig comprises the following steps:
step one, embedding a positioning block 3 into a plurality of lower mounting grooves 12 and a plurality of lower ventilation grooves 14 which are arranged along the length direction of a bottom plate 1;
step two, a frame 51 is placed in the lower mounting groove 12, and solder paste is coated on the opposite surfaces of the frame and the other frame by using coating equipment;
step three, taking out the positioning block 3, putting the bottom plate 1 into STM paster equipment, and stacking the required number of ceramic chips 52 on the frame 51;
step four, placing another frame 51 in the upper mounting groove 22 of the upper plate 2, placing the frame on a coating device, and spot-coating solder paste on the frame 51;
step five, inserting the positioning pin 43 into the second limiting hole 42, and then matching with the first limiting hole 41 to tightly attach the upper plate 2 to the bottom plate 1;
and step six, placing the assembled whole jig into reflow soldering, and passing through a furnace for soldering to obtain the metal bracket capacitor 5.
According to the utility model, through limiting the structure of the jig, the upper plate 2 and the bottom plate 1 are clamped up and down, and the chip mounter is matched, so that the accurate positioning assembly of the metal bracket capacitor 5 is realized, and the production efficiency is improved, wherein the positioning plate 3 is additionally arranged on the bottom plate 1 to limit the chip mounting position of the frame 51 in the lower mounting groove 12, and the positioning block 3 is taken out before chip mounting, so that a space is left, the ceramic chip 52 is conveniently mounted, and the accurate positioning assembly of the metal bracket capacitor 5 is ensured.
The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, i.e., the utility model is not to be limited to the details of the claims and the description, but rather is to cover all modifications which are within the scope of the utility model.
Claims (9)
1. The utility model provides a metal support condenser equipment tool, metal support condenser includes two frames that set up relatively and stacks a plurality of ceramic chip between two frames, its characterized in that: the metal bracket capacitor assembling jig comprises a bottom plate, an upper plate and a positioning plate,
the bottom plate comprises a bottom plate body, a plurality of lower mounting grooves which are arranged on the bottom plate body at intervals and used for mounting a frame, and lower ventilation assemblies which are arranged between two adjacent lower mounting grooves;
the upper plate comprises an upper plate body, a plurality of upper mounting grooves which are arranged on the opposite surface of the upper plate body and the bottom plate at intervals and used for mounting another frame, and an adsorption magnet which is arranged in the upper plate body and used for adsorbing and fixing the frame;
the locating plate is arranged on the bottom plate body, extends along the arrangement direction of the plurality of lower mounting grooves and is embedded in the plurality of lower mounting grooves to limit the patch positions of the frame.
2. The metal bracket capacitor assembly jig according to claim 1, wherein: the metal bracket capacitor further comprises a supporting block arranged on the side face of the inner frame for supporting the ceramic chips, and the supporting block is positioned outside the lower mounting groove when the frame is arranged in the lower mounting groove.
3. The metal bracket capacitor assembly jig according to claim 1, wherein: the lower ventilation assembly comprises two lower ventilation holes and a lower ventilation groove, wherein the two lower ventilation holes are sequentially formed in the front and back of the lower ventilation assembly, and the lower ventilation groove is connected between the two lower installation grooves and communicated with the lower ventilation holes.
4. A metal bracket capacitor assembly jig according to claim 3, wherein: the lower ventilation groove comprises a lower communication section which downwards extends from the top surface of the bottom plate body and is communicated with the lower ventilation hole, and two lower extension sections which are oppositely arranged at two sides of the lower communication section and are respectively communicated with the lower installation groove which is opposite to the lower communication section.
5. The metal bracket capacitor assembly jig according to claim 1, wherein: the upper plate body is provided with a fixed slot which is opposite to the upper mounting slot and is used for mounting the adsorption magnet.
6. The metal bracket capacitor assembly jig according to claim 1, wherein: still including setting up the stop gear between bottom plate and upper plate, stop gear is including setting up first spacing hole on the bottom plate body, setting up the second spacing hole that upper plate body and first spacing hole are relative and inlay the locating pin of establishing between first spacing hole and second spacing hole.
7. The metal bracket capacitor assembly jig according to claim 1, wherein: the upper plate further comprises an upper ventilation assembly arranged between two adjacent upper mounting grooves, and the upper ventilation assembly comprises two upper ventilation holes and an upper ventilation groove, wherein the two upper ventilation holes are sequentially arranged front and back, and the upper ventilation groove is connected between the two upper mounting grooves and communicated with the upper ventilation holes.
8. The metal bracket capacitor assembly jig according to claim 1, wherein: the bottom plate body is provided with a plurality of even heating holes.
9. The metal bracket capacitor assembly jig according to claim 1, wherein: the base plate body is provided with a direction marking hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320496584.0U CN219610224U (en) | 2023-03-15 | 2023-03-15 | Metal support capacitor assembly jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320496584.0U CN219610224U (en) | 2023-03-15 | 2023-03-15 | Metal support capacitor assembly jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219610224U true CN219610224U (en) | 2023-08-29 |
Family
ID=87758002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320496584.0U Active CN219610224U (en) | 2023-03-15 | 2023-03-15 | Metal support capacitor assembly jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219610224U (en) |
-
2023
- 2023-03-15 CN CN202320496584.0U patent/CN219610224U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102403419B (en) | Manufacturing technology of high-power LED radiating structure | |
| CN102403418A (en) | Manufacturing method of high-power LED radiating structure | |
| CN109920755B (en) | Nano-silver solder paste low-pressure auxiliary sintering clamp and method | |
| CN100589256C (en) | Method for preparing solar energy cell assembly with printed circuit paster technique | |
| CN219610224U (en) | Metal support capacitor assembly jig | |
| CN218244021U (en) | Whole multilayer pastes dress capacitor equipment tool | |
| CN107365956A (en) | It is a kind of to apply tin copper strips tin furnace module at a slow speed | |
| CN115346798B (en) | Preparation method of whole multilayer mounting capacitor | |
| CN201657519U (en) | PCB braze welding clamp | |
| CN211708330U (en) | Welding tool for copper-clad ceramic substrate inside power semiconductor module | |
| CN112888298A (en) | Backflow fixture structure of large power module | |
| CN1694234A (en) | Preparation method of electronic power integrated module based on metal ball crimping interconnection technique | |
| CN111151838A (en) | Welding tool and method for copper-clad ceramic substrate inside power semiconductor module | |
| CN212652936U (en) | A accurate positioning welding tool for multicore piece equipment | |
| CN111633296B (en) | Welding jig for non-encapsulated metal bracket and welding method thereof | |
| CN220208748U (en) | Metal support ceramic capacitor | |
| CN217740527U (en) | Low-stress copper connecting bridge without softening treatment | |
| CN212277021U (en) | Metal support capacitor | |
| CN216820247U (en) | Reflow soldering furnace carrier | |
| CN220902374U (en) | Assembling and welding tool for sensor | |
| CN212013209U (en) | Tooling bracket for efficiently welding chip and pin elements on PCB | |
| CN220208665U (en) | Resistance-capacitance electronic device | |
| CN216357463U (en) | Circuit board and production device thereof | |
| CN214378378U (en) | Welding tool for surface mount diode | |
| CN220569401U (en) | Long-life embedded memory chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |