CN107617816B - Soft board pulse hot-press welding method - Google Patents
Soft board pulse hot-press welding method Download PDFInfo
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- CN107617816B CN107617816B CN201711044334.9A CN201711044334A CN107617816B CN 107617816 B CN107617816 B CN 107617816B CN 201711044334 A CN201711044334 A CN 201711044334A CN 107617816 B CN107617816 B CN 107617816B
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- welding
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- fpc board
- hot pressing
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- 238000003466 welding Methods 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000007731 hot pressing Methods 0.000 claims abstract description 55
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 33
- 239000000956 alloy Substances 0.000 claims description 33
- 229910000679 solder Inorganic materials 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soft board pulse hot-press welding method, which comprises the following steps: a pretreatment step, preparing an FPC board and a PCB board to be processed; fixing, namely fixing the FPC board and the PCB board respectively, and enabling the PCB board to be positioned above the FPC board; calibrating the positions of the FPC board and the PCB board, and enabling the FPC board to be abutted against the PCB board, wherein the welding pin part of the FPC board extends out of the PCB board and is bent to be close to a welding pad of the PCB board; welding, namely welding a welding pin extending out of the PCB in the FPC board on a welding pad of the PCB by utilizing a welding head through pulse hot pressing; and a cooling step, cooling the welded FPC board and PCB board to obtain a finished product. The technical scheme of the invention has stable welding parameters, the welded FPC board is relatively flat, tin dragging and tin tip generation are avoided, and the welding stability is better compared with manual welding, and the welding efficiency can be improved.
Description
Technical Field
The invention relates to the technical field of soft board welding, in particular to a soft board pulse hot-press welding method.
Background
At present, in the soft board welding technology, due to the factors that parts are fragile, the parts are inconvenient to fix and the like, manual welding is mostly adopted for operation. Conventional manual soldering is limited by the amount of tin, the height of tin spots, the temperature of soldering iron and the like, which cause the problem of tin spots, thereby affecting the quality. Specifically, because the manual welding control time is different, the FPC is easily damaged by burning for too long time, the virtual welding is easily caused by too short time, the welding tin amount is not uniform, the problems of unevenness, tin tip and the like are easily caused, and the production quality and the production efficiency of products are reduced.
In view of the above, it is necessary to provide further improvements to the current thermocompression bonding technology for flexible printed circuit boards.
Disclosure of Invention
In order to solve at least one of the above technical problems, the present invention provides a soft plate impulse hot-press welding method.
In order to achieve the purpose, the invention adopts a technical scheme that: provided is a soft plate pulse hot-press welding method, including:
a pretreatment step, preparing an FPC board to be processed and a PCB board, wherein the FPC board is provided with welding pins, the PCB board is provided with hole sites, and the welding pins can partially extend out of the hole sites of the PCB board;
fixing, namely fixing the FPC board and the PCB respectively, and enabling the PCB to be positioned above the FPC board;
a calibration step, calibrating the positions of the FPC board and the PCB board, and enabling the FPC board to be abutted against the PCB board, wherein the welding pin part of the FPC board extends out of the PCB board and is bent to be close to a welding pad of the PCB board;
welding, namely welding a welding pin extending out of the PCB in the FPC board on a welding pad of the PCB by a welding head through pulse hot pressing;
and a cooling step, cooling the welded FPC board and PCB board to obtain a finished product.
Wherein, the fixing step specifically comprises:
the FPC board is fixed by the FPC board fixing clamp, the PCB board is fixed by the PCB board fixing clamp, and the fixed FPC board and the fixed PCB board are placed in a mold, wherein the PCB board fixing clamp is positioned above the FPC board fixing clamp.
Wherein, the calibration step specifically comprises:
the FPC board and the PCB board are respectively fixed on the fine adjustment platform, and the horizontal positions of the FPC board fixing clamp and the PCB board fixing clamp are respectively adjusted through a servo motor on the fine adjustment platform so as to calibrate the FPC board and the PCB board.
Wherein the welding head is an alloy hot-pressing head,
the step of welding further comprises, before the step of:
and a preheating step, wherein the PLC is used for controlling pulses to preheat the alloy hot pressing head so as to preheat the alloy hot pressing head to the welding working temperature.
Wherein, still include after the step of preheating:
the alloy hot pressing head alignment step specifically comprises the following steps,
acquiring the moving real-time position of the alloy hot pressing head by using a camera;
projecting the real-time position of the alloy hot pressing head on a display screen, wherein a welding station is preset on the display screen;
and moving the alloy hot pressing head to a welding station.
Wherein, before the step of projecting the real-time position of the alloy hot-pressing head on the display screen, the method further comprises the following steps:
and amplifying the coordinates of the real-time position of the movement of the alloy hot pressing head.
Wherein the hot pressing temperature of the alloy hot pressing head in the welding step is 410-450 ℃, the hot pressing time is 8-12s, and the hot pressing pressure is 0.2-0.5 MPa.
And welding spots are formed between the welding pins of the FPC board and the welding pads of the PCB board in the welding step, and the height of each welding spot is 0.2-0.3 mm.
Wherein, the cooling temperature of the FPC board and the PCB board in the cooling step is 140-160 ℃, so that the welding points are welded on the welding pads of the PCB board.
The technical scheme of the invention comprises a pretreatment step, a fixing step, a calibration step, a welding step and a cooling step, wherein the calibrated FPC board and the PCB board are welded by adopting a welding head in a pulse hot pressing welding mode, compared with manual welding, tin is not required to be added in the welding process, the hot pressing time, the pressure and the hot pressing temperature are stable, the welded FPC board is relatively flat, tin dragging and tin tip generation are avoided, the welding stability is better compared with manual welding, and the welding efficiency can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flow chart of a method of pulse thermocompression bonding of a flexible printed circuit board according to an embodiment of the present invention;
fig. 2 shows a method block diagram of a soft board pulse hot-press welding method according to another embodiment of the invention.
The implementation, functional features and advantages of the objects of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the description of the invention relating to "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
FIG. 1 is a flow chart of a method of pulse thermocompression bonding of a flexible printed circuit board according to an embodiment of the present invention; referring to fig. 1, in the embodiment of the present invention, the method for pulse thermocompression bonding of a flexible printed circuit board specifically includes:
step S10, a preprocessing step, preparing an FPC board to be processed and a PCB board, wherein the FPC board is provided with welding pins, the PCB board is provided with hole sites, and the welding pins can partially extend out of the hole sites of the PCB board; the FPC board is a flexible circuit board, at least two welding pins are formed on three sides of the FPC board respectively, and the welding pins have good winding and folding performance.
Step S20, fixing the FPC board and the PCB board respectively, and enabling the PCB board to be positioned above the FPC board; the fixing step specifically comprises the steps of fixing the FPC board by using an FPC board fixing clamp, fixing the PCB board by using a PCB board fixing clamp, and putting the fixed FPC board and the fixed PCB board into a mold, wherein the PCB board fixing clamp is positioned above the FPC board fixing clamp. Therefore, the welding pins can be directly hot-pressed on the PCB in the front face during welding, and welding is facilitated.
Step S30, a calibration step, namely calibrating the positions of the FPC board and the PCB board and enabling the FPC board to be abutted against the PCB board, wherein the welding foot part of the FPC board extends out of the PCB board and is bent to be close to a welding pad of the PCB board; and the step of calibration, specifically, the FPC board and the PCB board are respectively fixed on the fine tuning platform, and the horizontal positions of the FPC board fixing clamp and the PCB board fixing clamp are respectively adjusted through a servo motor on the fine tuning platform so as to calibrate the FPC board and the PCB board. The servo motor is convenient to move and control, moves stably, can improve welding efficiency, and avoids pressure deviation.
Step S40, a welding step, in which a welding head is utilized to weld the welding pins of the FPC board, which partially extend out of the PCB board, on the welding pads of the PCB board through pulse hot pressing; wherein the hot pressing temperature of the alloy hot pressing head in the welding step is 410-450 ℃, the hot pressing time is 8-12s, and the hot pressing pressure is 0.2-0.5 MPa. Preferably, the hot pressing temperature is 410 deg.C, 420 deg.C, 430 deg.C, 440 deg.C and 450 deg.C. The hot pressing time is preferably 8S, 10S or 12S, and the hot pressing pressure is preferably 0.2MPa, 0.3MPa or 0.5 MPa. The whole hot pressing parameters are stable and convenient to control. Wherein, a welding spot is formed between the welding pin of the FPC board and the welding disc of the PCB board in the welding step, and the height of the welding spot is 0.2-0.3 mm. The height of the welding spot is only 0.2-0.3mm, and the welding spot is small, so that the welding flatness of the FPC board is good, and the FPC board is suitable for being applied to precise gap welding ends and welding structures limited by the height of the tin spot. The welding heads are arranged in the hot-pressing welding machine, the number of the welding heads is multiple, and the welding of multiple parts can be simultaneously realized.
And step S50, cooling, namely cooling the welded FPC board and PCB board to obtain a finished product. Wherein, the cooling temperature of the FPC board and the PCB board in the cooling step is 140-160 ℃, so that the welding points are welded on the welding pads of the PCB board. The cooling temperature is preferably 140 ℃, 150 ℃ and 160 ℃, and the cooling temperature can be selected to enable the welding points to be welded on the welding pads of the PCB, thereby being beneficial to reducing the welding height.
The technical scheme of the invention comprises a pretreatment step, a fixing step, a calibration step, a welding step and a cooling step, wherein the calibrated FPC board and the PCB board are welded by adopting a welding head in a pulse hot pressing welding mode, compared with manual welding, tin is not required to be added in the welding process, the hot pressing time, the pressure and the hot pressing temperature are stable, the welded FPC board is relatively flat, tin dragging and tin tip generation are avoided, the welding stability is better compared with manual welding, and the welding efficiency can be improved.
FIG. 2 is a block diagram of a method of pulse thermocompression bonding of a flexible board according to another embodiment of the present invention; referring to fig. 2, in one embodiment, the bonding head is an alloy hot press head,
the step of welding further comprises, before the step of:
and step S31, preheating the alloy hot pressing head by using the PLC control pulse to preheat the alloy hot pressing head to the welding working temperature. By preheating the alloy hot pressing head in advance, the heating time can be shortened, and the welding work efficiency can be improved.
In one embodiment, the preheating step further comprises:
step S32, aligning the alloy hot pressing head, specifically including,
acquiring the moving real-time position of the alloy hot pressing head by using a camera;
projecting the real-time position of the alloy hot pressing head on a display screen, wherein a welding station is preset on the display screen;
and moving the alloy hot pressing head to a welding station.
In this embodiment, gather the real-time position that the alloy hot pressing head removed through camera or camera system, then throw on the display screen, this display screen can be colored display screen, easily distinguishes, guarantees that the product is clear, accurate counterpoint.
Preferably, before the step of projecting the real-time position of the alloy hot-pressing head onto the display screen, the method further includes:
and amplifying the coordinates of the real-time position of the movement of the alloy hot pressing head.
The coordinates of the real-time position of the large alloy hot pressing head can be amplified to be displayed on the display screen more clearly. In addition, in the scheme, alarm information can be sent when the machine is abnormal so as to remind workers of paying attention.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A soft board pulse hot-press welding method is characterized by comprising the following steps:
a pretreatment step, preparing an FPC board to be processed and a PCB board, wherein welding pins are formed on the FPC board, hole sites are formed on the PCB board, and the welding pins can partially extend out of the hole sites of the PCB board;
fixing, namely fixing the FPC board and the PCB respectively, and enabling the PCB to be positioned above the FPC board;
a calibration step, calibrating the positions of the FPC board and the PCB and enabling the FPC board to abut against the PCB, wherein the welding pin part of the FPC board extends out of the PCB and is bent to be close to a welding pad of the PCB, the FPC board and the PCB are respectively fixed on a fine adjustment platform, and the horizontal positions of a FPC board fixing clamp and a PCB board fixing clamp are respectively adjusted through a servo motor on the fine adjustment platform so as to calibrate the FPC board and the PCB;
preheating, namely preheating the alloy hot pressing head by using PLC (programmable logic controller) control pulses to preheat the alloy hot pressing head to a welding working temperature;
the alloy hot pressing head alignment step specifically comprises the following steps,
acquiring the moving real-time position of the alloy hot pressing head by using a camera;
projecting the real-time position of the alloy hot-pressing head on a display screen, wherein a welding station is preset on the display screen;
moving the alloy hot pressing head to a welding station;
welding, namely welding a welding pin partially extending out of the PCB in the FPC on a welding pad of the PCB by utilizing a welding head through pulse hot pressing, wherein the welding head is an alloy hot pressing head, the hot pressing temperature of the alloy hot pressing head is 410-450 ℃, the hot pressing time is 8-12s, and the hot pressing pressure is 0.2-0.5 MPa;
and a cooling step, cooling the welded FPC board and PCB board to obtain a finished product.
2. The soft plate pulse hot-press welding method according to claim 1, wherein the fixing step specifically comprises:
the FPC board is fixed by the FPC board fixing clamp, the PCB board is fixed by the PCB board fixing clamp, and the fixed FPC board and the fixed PCB board are placed in a mold, wherein the PCB board fixing clamp is positioned above the FPC board fixing clamp.
3. The method of claim 1, wherein the step of projecting the real-time position of the alloy thermal head onto the display screen further comprises:
and amplifying the coordinates of the real-time position of the movement of the alloy hot pressing head.
4. A pulse hot-press welding method for a flexible printed circuit board according to claim 1, wherein a solder joint is formed between the solder leg of the FPC board and the solder pad of the PCB board in the welding step, and the height of the solder joint is 0.2-0.3 mm.
5. The pulse hot-press welding method for the flexible printed circuit board as claimed in claim 1, wherein the cooling temperature of the FPC board and the PCB board in the cooling step is 140-160 ℃, so that the welding point is welded on the welding pad of the PCB board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711044334.9A CN107617816B (en) | 2017-10-31 | 2017-10-31 | Soft board pulse hot-press welding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711044334.9A CN107617816B (en) | 2017-10-31 | 2017-10-31 | Soft board pulse hot-press welding method |
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| CN107617816A CN107617816A (en) | 2018-01-23 |
| CN107617816B true CN107617816B (en) | 2020-04-07 |
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| CN110560992B (en) * | 2019-08-05 | 2021-08-03 | 武汉光迅科技股份有限公司 | Device and method for automatic material taking, alignment and positioning of FPC |
| CN111299800B (en) * | 2020-04-10 | 2022-03-01 | 惠州西文思技术股份有限公司 | Pressure welding device |
| CN111715991A (en) * | 2020-06-28 | 2020-09-29 | 上海创功通讯技术有限公司 | Isolated welding device and method |
| CN114850648B (en) * | 2022-04-25 | 2024-03-26 | 东莞先导先进科技有限公司 | Method for welding semiconductor metal packaging optical lens based on pulse hot pressing |
| CN115502539B (en) * | 2022-09-29 | 2024-05-28 | 江西盛泰精密光学有限公司 | Endoscope assembly method |
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| JP2001222237A (en) * | 2000-02-07 | 2001-08-17 | Kyocera Corp | Display device and its manufacturing method |
| CN1197444C (en) * | 2000-10-10 | 2005-04-13 | 明基电通股份有限公司 | Soldering method between golden fingers on PCB and pins of flexible printed circuit |
| CN100429964C (en) * | 2004-12-09 | 2008-10-29 | 比亚迪股份有限公司 | Flexible printed circuit board and method for connecting printed circuit board thereof |
| CN1805219A (en) * | 2005-01-12 | 2006-07-19 | 华为技术有限公司 | Connecting apparatus |
| CN100477889C (en) * | 2005-09-19 | 2009-04-08 | 金像电子股份有限公司 | Method for manufacturing soft-hard composite board |
| CN101702870B (en) * | 2009-11-16 | 2011-11-16 | 华为终端有限公司 | Interconnection method of flexible board and rigid board and system |
| CN104780721A (en) * | 2015-04-13 | 2015-07-15 | 惠州Tcl移动通信有限公司 | Flexible connection method for PCBs (printed circuit boards) as well as PCB assembly |
| CN106695107A (en) * | 2017-01-19 | 2017-05-24 | 深圳天邦达科技有限公司 | Lithium battery control module thermal compression welding method and lithium battery control module obtained after welding |
| CN206575669U (en) * | 2017-03-16 | 2017-10-20 | 昆山龙腾光电有限公司 | Circuit board assemblies |
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