CN114850648B - Method for welding semiconductor metal packaging optical lens based on pulse hot pressing - Google Patents
Method for welding semiconductor metal packaging optical lens based on pulse hot pressing Download PDFInfo
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- CN114850648B CN114850648B CN202210442356.5A CN202210442356A CN114850648B CN 114850648 B CN114850648 B CN 114850648B CN 202210442356 A CN202210442356 A CN 202210442356A CN 114850648 B CN114850648 B CN 114850648B
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- 238000003466 welding Methods 0.000 title claims abstract description 79
- 230000003287 optical effect Effects 0.000 title claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 238000007731 hot pressing Methods 0.000 title abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000004021 metal welding Methods 0.000 claims abstract description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 4
- 238000009461 vacuum packaging Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 11
- 239000011800 void material Substances 0.000 description 7
- 238000001931 thermography Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention belongs to the technical field of semiconductor vacuum packaging, and discloses a method for packaging an optical lens based on semiconductor metal by pulse thermocompression bonding. The method comprises the following steps: stacking solder and an optical lens in a metal welding area, placing pressure sensitive paper between the optical lens and the solder, adjusting parameters to press, and adjusting to balance the pressed solder; placing a temperature sensor at the same position, enabling the pulse hot-pressing head to descend to contact with the welding part area of the optical lens, enabling the temperature sensor to receive temperature information and display actual temperature curve parameters of the solder, and adjusting the temperature parameters of the pulse hot-pressing head to be consistent with the actual temperature curve of the solder; and then carrying out pulse hot-press welding operation production under the condition of the adjusted parameters. According to the invention, through pressure balance adjustment and temperature adjustment of the welding area in advance, the problems of uneven welding stress and temperature curve matching of the welding flux can be solved, and the air tightness, precision and reliability of the metal welding package are improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor vacuum packaging, and particularly relates to a method for packaging an optical lens based on semiconductor metal by pulse thermocompression bonding.
Background
The existing semiconductor infrared thermal imaging metal package mainly comprises a metal tube shell, an optical lens (a main flow germanium sheet and a silicon chip, wherein the infrared wavelength transmittance of the germanium sheet is higher), an infrared thermal imaging sensor, a getter and a semiconductor refrigerator (TEC), wherein the optical lens is connected with the metal tube shell through a eutectic welding high-temperature mode, the optical lens is easily influenced by the flatness of the optical lens when being welded with the tube shell and a cap, the bending and warping of the optical lens easily cause the occurrence of cavities in the part of the eutectic, particularly the occurrence of fan-shaped cavities in the four corners of the tube shell due to uneven stress, and the air tightness of package welding is influenced.
At present, the welding of the semiconductor metal package mainly adopts a reflow soldering mode, but the reflow soldering price is relatively high, the occupied area is large, the temperature is required to be kept to be constant during the production of equipment, so the energy consumption is very high, the temperature and the pressure of a stress point at the welding position before the production are inconvenient to debug, whether the stress is applied to each welding position is difficult to know, the temperature curve test is inconvenient, and the phenomenon of welding hollowness is easy to occur. In addition, the parallel welding mode mainly utilizes joule heat generated by short circuit to melt the tube shell, the welding temperature is extremely poorly controlled, and the temperature curve and the stress condition of each area are difficult to accurately monitor. When in welding, the optical lenses are prevented from moving by pre-welding, the optical lenses are welded through an X axis and a Y axis respectively, the welding efficiency is low, and the molten metal tube shell can achieve the connection effect when in welding, and can be only used for the metal tube shell and the metal cap, so that certain locality requirements are met.
The principle of pulse hot pressing is through the transformation principle, changes voltage into electric current, forms temperature at pressure head bottom surface short circuit, and the pressure head descends and touches the product and just begins the heating intensification, and the temperature of hot press can adopt real-time temperature curve to represent, and is simple and easy to understand, and the temperature control to the welding point is accurate, has made things convenient for operating personnel's work greatly.
Patent CN 113399856A discloses a CCD para-pulse hot-press welding method, comprising: s1, respectively shooting images of a flexible circuit board and a rigid circuit board through a CCD alignment mechanism and a laser flatness measuring instrument; s2, analyzing images shot by a CCD alignment mechanism and a laser flatness measuring instrument through an image analysis module, establishing a coordinate system by taking the images shot by the CCD alignment mechanism as a reference plane and taking the geometric center of a circuit board as an origin, comparing whether the positions of all welding spots of the flexible circuit board image and the rigid circuit board image correspond or not, extracting the actual flatness and the actual thickness of all the welding spots from the images shot by the laser flatness measuring instrument, and respectively comparing the actual flatness and the actual thickness with a preset flatness U0 and a preset welding spot thickness range G0 which are arranged in the image analysis module; and step S3, outputting an analysis result of the image analysis module to the control module, controlling the welding mechanism to weld through the control module when the welding requirement is judged to be met, and controlling the welding mechanism to adjust through the control module when the welding requirement is judged not to be met. Patent CN 107617816A discloses a soft board pulse hot-press welding method, comprising: a pretreatment step of preparing an FPC board to be processed and a PCB board, wherein the FPC board is provided with welding pins, the PCB board is provided with hole sites, and the welding pins can partially extend out of the hole sites of the PCB board; fixing the FPC board and the PCB board respectively, and enabling the PCB board to be positioned above the FPC; the method comprises the steps of calibrating positions of an FPC board and a PCB board, and enabling the FPC board to be in butt joint with the PCB board, wherein welding foot parts of the FPC board extend out of the PCB board and are bent to be close to a bonding pad of the PCB board; welding, namely welding pins which partially extend out of the PCB on a bonding pad of the PCB through pulse hot pressing by utilizing a welding head; and cooling, namely cooling the welded FPC board and the welded PCB board to obtain a finished product.
The above-mentioned prior art has all utilized pulse hot-pressing to weld and has realized the welding of circuit board, but only simple to carry out analysis processing and calibration to the welding position, and to the problem that the semiconductor metal encapsulation optical lens in-process is because of roughness or atress uneven easily appears, above-mentioned prior art does not give the solution. And the corresponding temperature parameters are not matched for specific solder, so that the welding reliability cannot be ensured.
Disclosure of Invention
The invention aims to solve the problem that holes appear in eutectic welding with uneven stress, improve the air tightness of metal welding packaging and improve the packaging welding reliability.
The invention aims at realizing the following technical scheme:
a method for welding a semiconductor metal packaging optical lens based on pulse thermocompression comprises the following steps:
(1) And (3) pressure balance debugging of a welding area: fixing a metal part to be welded on a platform bracket, stacking solder and an optical lens or an optical lens welded with a cap shell in a metal welding area, placing pressure sensing paper between the optical lens and the solder, setting the temperature and the pressure of a pulse hot press head according to parameters of the pressure sensing paper, then pressing the optical lens, and adjusting the platform bracket according to the color depth of the pressure sensing paper to balance the pressure of the solder;
(2) Temperature debugging of a welding area: placing a temperature sensor at the same position of the pressure sensitive paper in the step (1), setting the temperature parameter of a pulse hot press head according to a solder theoretical temperature curve, enabling the pulse hot press head to descend to contact with a welding part area of the optical lens, enabling the temperature sensor to receive temperature information to display the actual temperature curve parameter of the solder, checking whether the actual temperature curve of the solder is consistent with the solder theoretical temperature curve, and if the actual temperature curve of the solder is different, adjusting the temperature parameter of the pulse hot press head to be consistent with the actual temperature curve of the solder;
(3) And (3) performing pulse hot-press welding operation production on the platform support adjusted in the step (1) according to the temperature parameters adjusted in the step (2).
Further, in the step (1), the metal parts to be welded are fixed on the platform support by adopting screws, four corners of the metal parts are fixed, and the welding flux is pressed uniformly by adjusting the screws in the subsequent pressure debugging process. The platform support mainly plays a role in supporting the metal cavity and stabilizing the optical lens, the metal cavity is placed on the platform support, the solder sheet is placed on the side wall surface of the metal cavity, the optical lens such as the germanium sheet and the silicon wafer is pressed on the metal cavity, the metal cavity is manufactured into a platform with the same shape as the metal cavity, the shape design of the metal cavity enables the middle area of the platform to be more stable, and pressure balance of all angles of the platform is facilitated through adjusting screws.
Further, the solder in step (1) is selected from AuSn20 solder or InAg3 solder, more preferably AuSn20 solder. The AuSn20 solder has good stability and high air tightness after welding, and usually uses an application place with higher requirements on the performance of devices, but has strict requirements on time precision of a welding temperature curve. The temperature of the pulse high-temperature pressure head of the pulse hot-pressing welding changes the voltage into large current through voltage transformation, and the accurate temperature control mode can meet the accurate requirement of AuSn20 solder on a temperature curve. The pressure head is mainly made of tungsten steel alloy into a special pressure head shape.
Further, in the step (1), the optical lens is a germanium sheet or a silicon wafer, preferably a germanium sheet. More preferably, the germanium sheet has high infrared wavelength transmittance and 8-12um wavelength transmittance of more than 95%.
Further, in the step (1), a metal layer is formed on the surface of the welding part of the optical lens by means of magnetron sputtering (PVD) or electroless plating. Preferably, the metal layer is a metal layer containing at least one metal of Cr, ni, au. A metal layer is prepared in advance on the surface of the welding part of the optical lens, so that the optical lens and the metal welding surface are favorably firmly fused together by adopting pulse hot-press welding through welding materials (AuSn 20 and InAg 3).
Further, in the step (1), the temperature of the pulse hot press head is set to be 70-100 ℃ according to the parameters of the pressure sensitive paper, the pressure is 0.8-1.2 Kg.f, and the time is controlled to be 3-7S.
Further, during the production of the pulse hot-press welding operation in the step (3), a piece of silica gel sheet or teflon cloth with the same shape as the pulse hot-press head is placed between the pulse hot-press head and the optical lens, so that the surface roughness of the pulse hot-press head and the optical lens and the impact force of the pressure head are reduced.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the invention, the welding area is subjected to pressure debugging in advance, so that the welding flux is pressed uniformly, and the problem that holes appear in the eutectic welding due to uneven stress can be solved by combining with the subsequent pulse hot-press welding operation, so that the air tightness of the metal welding package is improved.
(2) According to the invention, through pre-debugging the temperature of the welding area, the temperature curve parameters of the welding flux can be accurately matched, and the welding accuracy and stability can be improved by combining with the accurate temperature control of the subsequent pulse hot-press welding operation.
Drawings
FIG. 1 is a graph of the actual temperature after adjustment in example 1.
Fig. 2 is a schematic diagram of the pulse thermocompression bonding packaging operation in embodiment 1.
Fig. 3 is a graph showing the result of detecting solder voids in the product obtained by encapsulation in example 1.
Fig. 4 is a graph showing the results of the solder void detection of the product obtained by the encapsulation in comparative example 1.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
Example 1
The process for metal packaging an optical lens of a thermal imaging infrared sensor in the embodiment comprises the following steps:
(1) And (3) fixing a platform bracket: the thermal imaging infrared sensor metal tube shell is fixed on a platform bracket through a platform screw, an infrared thermal imaging sensor, a TEC (semiconductor cooler) and a getter are placed in a metal cavity, support is provided for packaging process processing, the semiconductor cooler is welded on the metal cavity, the infrared thermal imaging sensor is placed on the cold face of the semiconductor cooler, and after heating and exhausting are carried out for a certain time, subsequent pressure debugging and temperature debugging are carried out.
(2) Pressure balance debugging: and (3) stacking AuSn20 solder and an optical lens (a germanium sheet with high infrared wavelength transmittance and 8-12um wavelength transmittance of more than 95 percent is adopted, wherein a Cr metal layer is formed on the surface of a welded part of the germanium sheet in a magnetron sputtering (PVD) mode), placing pressure sensitive paper between the optical lens and the solder, setting the temperature of a pulse hot press head to be 80 ℃ according to the parameters of the pressure sensitive paper, setting the pressure to be 1.0Kg.f, then pressing the optical lens, controlling the time to be 5s, lifting the pulse press head, and adjusting a platform screw according to the color depth of the pressure sensitive paper to balance the pressure of the solder.
(3) Temperature debugging: and (3) placing a temperature sensor at the same position of the pressure sensitive paper in the step (2), setting the temperature parameters of the pulse hot press head according to a solder theoretical temperature curve, enabling the pulse hot press head to descend to contact with the welding part area of the optical lens, displaying the actual temperature curve parameters of the solder by the temperature sensor after receiving the temperature information, checking whether the actual temperature curve of the solder is consistent with the solder theoretical temperature curve, and if the actual temperature curve of the solder is different from the solder theoretical temperature curve, adjusting the temperature parameters on the pulse hot equipment until the tested temperature is consistent with the temperature curve required by the solder. The actual temperature profile after adjustment in this example is shown in fig. 1.
(4) After the pressure and the temperature meet the technological parameter requirements, starting pulse hot-press welding packaging operation production, reducing the occurrence of void phenomenon caused by uneven stress during welding, and improving the air tightness of metal welding packaging; and ensuring that the temperature before the production starts accords with the specification parameters of the solder so as to improve the welding precision and stability. During production, a piece of silica gel sheet or teflon cloth with the same shape as the pulse hot-pressing head is placed between the pulse hot-pressing head and the optical lens, so that the surface roughness of the pulse hot-pressing head and the optical lens and the impact force of the pressing head are reduced. A schematic diagram of the pulse thermocompression bonding operation is shown in fig. 2.
The welding cavity detection result of the product obtained by adopting the pulse hot-press welding package of the embodiment is shown in fig. 3. The data shows that the welding void ratio occupies 0.7% of the welding area, and the maximum occupied area occupies 0.3%.
Comparative example 1
This comparative example encapsulates the same materials as in example 1 using conventional reflow soldering.
The solder void detection results of the product obtained by reflow soldering packaging according to this comparative example are shown in fig. 4. The data shows that the welding void ratio occupies 10% of the welding area, and the maximum occupied area occupies 3.8%.
The reflow soldering is a temperature curve set to a soldering piece, after the temperature of the cavity of each area reaches a designed temperature curve, a prepared product is placed, and the reflow soldering conveyor belt uniformly flows through the cavity of each temperature area, wherein nitrogen can be filled to control the temperature to float, the measured or displayed temperature is only the temperature in the cavity and is not the temperature curve between the soldering piece and the optical lens, but the temperature between the soldering piece and the optical lens can be measured by pulse hot pressing; secondly, the height of each region is adjusted to adjust the stress by the depth of the color of the pressure sensitive paper in advance, so that the stress of each region is balanced, the phenomenon of hollowness caused by uneven stress of each region is avoided, and the reflow soldering and the parallel soldering do not have the function. By the technical scheme, the welding void ratio and the welding void area of the packaged product of the embodiment 1 are obviously reduced compared with those of the packaged product of the comparative example 1.
The above examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present invention should be made in the equivalent manner, and the embodiments are included in the protection scope of the present invention.
Claims (7)
1. The method for welding the semiconductor metal packaging optical lens based on the pulse thermocompression is characterized by comprising the following steps of:
(1) And (3) pressure balance debugging of a welding area: fixing a metal part to be welded on a platform bracket, stacking solder and an optical lens or an optical lens welded with a cap shell in a metal welding area, placing pressure sensing paper between the optical lens and the solder, setting the temperature and the pressure of a pulse hot press head according to parameters of the pressure sensing paper, then pressing the optical lens, and adjusting the platform bracket according to the color depth of the pressure sensing paper to balance the pressure of the solder;
(2) Temperature debugging of a welding area: placing a temperature sensor at the same position of the pressure sensitive paper in the step (1), setting the temperature parameter of a pulse hot press head according to a solder theoretical temperature curve, enabling the pulse hot press head to descend to contact with a welding part area of the optical lens, enabling the temperature sensor to receive temperature information to display the actual temperature curve parameter of the solder, checking whether the actual temperature curve of the solder is consistent with the solder theoretical temperature curve, and if the actual temperature curve of the solder is different, adjusting the temperature parameter of the pulse hot press head to be consistent with the actual temperature curve of the solder;
(3) Performing pulse hot-press welding operation production on the platform bracket debugged in the step (1) according to the temperature parameters debugged in the step (2);
the solder in the step (1) is selected from AuSn20 solder or InAg3 solder; the optical lens is a germanium sheet or a silicon sheet; and setting the temperature of the pulse thermal pressure head to be 70-100 ℃ according to the parameters of the pressure sensing paper, setting the pressure to be 0.8-1.2 Kg.f, and controlling the time to be 3-7S.
2. The method for pulse thermocompression bonding of a semiconductor metal packaging optical lens according to claim 1, wherein in the step (1), the metal parts to be soldered are fixed on the platform support by four corners of screws, and the solder is pressed and balanced by adjusting the screws in the subsequent pressure debugging process.
3. The method of pulse based thermocompression bonding a semiconductor metal packaged optical lens of claim 1, wherein the solder in step (1) is selected from AuSn20 solder.
4. The method for pulse thermocompression bonding of a semiconductor metal packaging optical lens according to claim 1, wherein in the step (1), the optical lens is a germanium sheet with high infrared wavelength transmittance and 8-12um wavelength transmittance of > 95%.
5. The method for packaging an optical lens based on semiconductor metal by pulse thermocompression bonding according to claim 1, wherein in the step (1), a metal layer is formed on the surface of the soldered portion of the optical lens by magnetron sputtering or electroless plating.
6. The method of claim 5, wherein the metal layer is a metal layer containing at least one of Cr, ni, au.
7. The method for packaging the optical lens based on the semiconductor metal package by pulse thermocompression bonding according to claim 1, wherein in the step (3), when the pulse thermocompression bonding operation is performed, a piece of silicon sheet or teflon cloth with the same shape as the pulse thermocompression bonding head is placed between the pulse thermocompression bonding head and the optical lens, so as to reduce the surface roughness of the pulse thermocompression bonding head and the optical lens and the impact force of the pressure head.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210442356.5A CN114850648B (en) | 2022-04-25 | 2022-04-25 | Method for welding semiconductor metal packaging optical lens based on pulse hot pressing |
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| CN202210442356.5A CN114850648B (en) | 2022-04-25 | 2022-04-25 | Method for welding semiconductor metal packaging optical lens based on pulse hot pressing |
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| CN114850648B true CN114850648B (en) | 2024-03-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006031358A1 (en) * | 2006-07-05 | 2008-01-17 | Schott Ag | Method for housing optical or optoelectronic components, as well as according to the method manufacturable optical or optoelectronic housing element |
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| CN108213785A (en) * | 2017-12-08 | 2018-06-29 | 浙江工业大学之江学院 | A kind of integral type pulse hot press |
| CN208929443U (en) * | 2018-07-31 | 2019-06-04 | 福州捷飞商业设备有限公司 | A kind of pulse hot pressing welding machine |
| CN113399856A (en) * | 2021-06-29 | 2021-09-17 | 深圳市泰科盛自动化系统有限公司 | CCD (Charge coupled device) alignment pulse hot-press welding system and welding method |
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