KR100696211B1 - Bonding apparatus - Google Patents

Abstract

Bonding apparatus WHEREIN: Position shift in bonding is made less.

The position shift in bonding is calculated | required using the tool monitor 18 which moves integrally with the bonding tool 12. FIG. The deviation of + Xc between the second camera 28 and the first camera 26 and the deviation of + Xn due to the movement in the height direction of the bonding tool 12 are ΔX = (Xn-Xc) in positioning. You can correct it. By using the target 32 and the camera 30 for correction, the first position deviation X ₁ , which is the position of the target 32 as viewed from the camera 30 for correction, and the target 32 as viewed from the second camera 28, respectively. The second positional deviation X ₂ , which is the position, the third positional deviation X ₃ , which is the position of the chip 10u at the height Z ₂ seen from the first camera 26, and the camera 30 for correction. Based on the fourth positional deviation X ₄ , which is the position of the chip 10d at the height Z ₁ , the correction amount ΔX can be obtained.

Bonding tool, bonding object, measuring member, camera, positioning mechanism, bonding apparatus, tool monitor, target, imaging data, measuring means, calculating means, correction means

Description

Bonding Device {BONDING APPARATUS}

1 is a diagram illustrating the principle of the present invention.

It is a block diagram of the bonding apparatus in embodiment which concerns on this invention.

3 is a diagram illustrating an internal configuration of a vertical camera.

4 is a plan view of the target.

It is a figure which shows typically the planar arrangement of the bonding apparatus in embodiment which concerns on this invention.

It is a figure which shows typically the side arrangement of the bonding apparatus in embodiment which concerns on this invention.

Fig. 7 is a side elevation view when the third positional deviation is obtained from the first positional deviation in the embodiment according to the present invention.

Fig. 8 is a diagram showing the shape of the captured image data when the first positional deviation is obtained in the embodiment according to the present invention.

Fig. 9 is a diagram showing the shape of the captured image data when the second positional deviation is obtained in the embodiment according to the present invention.

Fig. 10 is a diagram showing the shape of the captured image data when the third positional deviation is obtained in the embodiment according to the present invention.

Fig. 11 is a side elevation view when the fourth positional deviation is obtained in the embodiment according to the present invention.

Fig. 12 is a diagram showing the shape of the captured image data when the fourth positional deviation is obtained in the embodiment according to the present invention.

FIG. 13 is a diagram showing the shape of image pickup data when positioning is performed by processing correction amounts Δ (X, Y) in the embodiment according to the present invention.

FIG. 14 is a diagram illustrating a positioning method between a chip and a substrate when the optical axes of two cameras are not shifted. FIG.

FIG. 15 is a diagram illustrating a method of positioning a chip and a substrate when the optical axes of two cameras are shifted. FIG.

FIG. 16 is a diagram illustrating a method of positioning a chip and a substrate when the optical axes of the two cameras are not shifted but a shift due to the movement of the bonding tool occurs.

(Explanation of the sign)

10, 10u, 10d chip 12, 12u, 12d bonding tool

14 boards 16 carriers

17 connections 18, 18u, 18d tool monitor

20,60 vertical camera 22, 24, 31 optical axis

26 First Camera 28 Second Camera

30 Calibration camera 32, 33 target

50 bonding devices 52 supply stations

54 Target Shifter 62,64 Reflector

66 Duplex Reflector 90 Pickup Position

92 Positioning and Bonding Position 94 Correction Position

96 evacuation position 100 control unit

102 CPU 104 Input

106 Output 108 Memory

110 Bonding tool control unit 112 Camera control unit for correction

114 Target control unit 116 Up and down camera control unit

120 Position shifter 122 Positioner

124 Bonding Processor 130 First Position Deviation Measurement Module

132 2nd position deviation measurement module 134 3rd position deviation measurement module

136 4th position deviation measurement module 138 Position shift calculation module

150, 156, 162 Image data 152, 158, 164 Cross pattern

Pattern of 154, 160 target 166u, 168d reference pattern

TECHNICAL FIELD This invention relates to a bonding apparatus. Specifically, It is related with the bonding apparatus which has the positioning mechanism of the position of a bonding tool, and the position of a board | substrate.

As a mounting method for connecting a bonding pad of a chip such as an LSI and a bonding lead of a substrate, face down bonding is performed in addition to wire bonding. The face down bonding holds the back side of the chip in the bonding tool, and faces the surface side of the held chip, i.e., the side on which the electrode pad is arranged, and the wiring surface of the substrate, and the position of the electrode pad of the chip and the substrate. Is a method of positioning the bonding lead and connecting using thermal energy or ultrasonic energy. As the face down bonding apparatus, a flip chip bonder, a chip on film (COF) bonder, or the like can be used.

For positioning in face-down bonding, it is necessary to observe the electrode pads on the surface of the chip and the bonding leads on the surface of the substrate facing each other. Therefore, a camera for measuring the chip position and a camera for positioning the substrate can be used. Can be. For example, when mounting a chip by lowering a bonding tool from the upper side of a board | substrate, as a board | substrate position measuring camera, the downward camera which observes the upper side from the top is used, and the chip position measuring camera which observes the upper side from the lower side. Use an upward camera.

One of the arrangement methods regarding two cameras can provide a downward camera above a height position of a board | substrate, and can separate an upward camera below a height position of a board | substrate separately from this. In addition, Patent Document 1 discloses an optical apparatus that can simultaneously observe a chip surface and a substrate surface by dividing light into upper and lower portions of a prism mirror using a prism mirror having two reflecting surfaces. In this case, the optical device can be inserted between the chip and the substrate, and the chip and the substrate can be simultaneously observed. Such a camera is called a probe camera.

In any of the above methods, the optical axis for observing the chip is upward and the optical axis for observing the substrate is downward, and the respective optical axes are shifted, so that if these optical axes are displaced, it affects the positioning. It causes a misalignment in bonding. The deviation of the optical axis is caused by, for example, the setting of the optical system or the like being shifted due to the influence of a temperature rise in the bonding operation or the change with time. The following describes how the deviation of the optical axis affects the positional deviation in bonding.

First, a method of positioning a general chip and a substrate when the optical axis is not shifted is shown in FIG. For simplicity of explanation, only the positioning in the X direction shown in the figure is considered. The chip 10 is held in the bonding tool 12 and the substrate 14 is held in the carrier 16. The bonding tool 12 and the carrier 16 are each movable to an arbitrary position in the X direction by a driving device not shown. The up-and-down camera 20 which observes the chip 10 and the board | substrate 14 is arrange | positioned between the chip | tip 10 and the board | substrate 14, by the 1st camera 26 which has an upward optical axis 22. The position of the chip | tip 10 can measure the position of the board | substrate 14 with the 2nd camera 28 which has the optical axis 24 of the downward direction. In addition, although it is necessary to consider the magnification of each camera at the time of measuring a position or the distance between positions, in the following, the distance between positions measured by a camera is converted into an actual distance, ie, the distance on an object surface, unless it limits in particular. Explain.

14 is a case where the upward optical axis 22 and the downward optical axis 24 are exactly aligned. In this case, since the center of the field of view of the first camera 26 and the center of the field of view of the second camera 28 coincide with each other, the reference position of the chip 10 and the reference position of the substrate 14 respectively correspond to the positions thereof. That's right. As a reference position for bonding, the edge position of the electrode pad of the chip 10, the edge position of the bonding lead of the board | substrate 14 corresponding to it, etc. can be selected. In FIG. 14, for example, the upward optical axis 22 indicates the center position of the visual field of the first camera 26, and the downward optical axis 24 indicates the center of the visual field of the second camera 28. . When the position of the chip | tip 10 and the board | substrate 14 was measured in that state, it shifted as shown by the broken line of FIG. In this case, the carrier 16 is first moved until the reference position of the substrate 14 coincides with the downward optical axis 24 representing the center of the field of view of the second camera 28. The bonding tool 12 is moved until the reference position of the chip 10 coincides with the upward optical axis 22 representing the center of the field of view of the first camera 26. In this way, if the chip | tip 10 and the board | substrate 14 are positioned and there is no other cause, the position shift in bonding will not occur.

If for some reason, the upward optical axis 22 representing the center of the visual field of the first camera 26 and the upward optical axis 24 representing the center of the visual field of the second camera 28 are displaced, the method of FIG. Is insufficient. That is, the reference position of the substrate 14 coincides with the downward optical axis 24 representing the center of the field of view of the second camera 28, and further, the reference position of the chip 10 corresponds to the field of view of the first camera 26. Even if coincident with the upward optical axis 22 representing the center, the chip 10 is not bonded to the position of the desired substrate 14. 15 is a downward optical axis 24 showing the center of the field of view of the second camera 28 as a reference position of the substrate 14 when the optical axis 22 is shifted by + Xc from the optical axis 24 as a reference. It is a figure which shows the state matched to. Even if the chip 10 is in the position of the broken line, even if it coincides with the upward optical axis 22 representing the center of the field of view of the first camera 26, the optical axis 22 is in relation to the optical axis 24. Since the + Xc is shifted, the reference position of the chip 10 fitted therein is + Xc shifted relative to the reference position of the substrate 14.

Therefore, in order to bond to the correct position without causing positional shift in the bonding, the first camera 26 with reference to the optical axis 24 representing the center of the field of view of the second camera 28 in some way is used. It is necessary to measure the shifted amount (+ Xc) of the optical axis 22 representing the center of the field of view. Based on the measured shift amount (+ Xc), the reference position of the chip 10 is adjusted to the position where only -Xc is corrected based on the center of the field of view of the first camera 26, so that the optical axis Even if there is a misalignment, accurate bonding can be performed.

As a measuring method of the shift | offset | difference amount of a 1st camera and a 2nd camera, patent document 2 arrange | positions a reference mark on two surfaces or a reference surface which differ in height, and is previously made between two other reference marks of this height. Disclosed is a method of adjusting and aligning the positional relationship of and aligning the positional relationship. That is, an optical device capable of observing the chip surface and the substrate surface at the same time is inserted between two reference marks in which the positional relationship is aligned in advance, and the amount of deviation of the first camera and the second camera is measured.

In addition, Patent Literature 3 discloses a semiconductor positioning device having a first recognition camera and a second recognition camera having directions in which optical axes face each other, wherein the height of the first recognition camera and the height of the second recognition camera are provided. A method of detecting a change in a reference position in two recognition cameras based on a target is disclosed. That is, they are moved relatively so that the first recognition camera and the second recognition camera can be positioned coaxially with the target inserted, and the reference positions of the first recognition camera and the second recognition camera are measured and stored with respect to the target. Next, a general bonding operation is performed, and then the same measurement as in the previous reference position measurement is performed again to see if the measured position is changed from the stored reference position. Can be detected.

(Patent Document 1) Japanese Unexamined Patent Application Publication No. 2001-176934

(Patent Document 2) Japanese Unexamined Patent Publication No. 6-28272

(Patent Document 3) Japanese Patent No. 2780000

As the trend of multipinning and miniaturization for chips or substrates has advanced, it has been required for face down bonding devices to place high precision along the chip over the substrate. In order to precisely arrange the chip along the substrate, it is necessary to reduce the positional shift in the bonding. Therefore, as described above, it is necessary to more accurately detect the deviation between the two cameras.

Among the prior art methods for detecting the deviation between two cameras, the method of Patent Document 2 requires two targets, and further requires adjustment and alignment of the positional relationship between these targets, which is complicated in construction and takes time for the work. .

Moreover, in the method of patent document 3, the in-focus position of a recognition camera is restrict | limited in order to detect an accurate shift | offset. That is, in this method, the focal position of the first recognition camera and the focal position of the second recognition camera need to be on the target when recognizing the target, and the focal point of the camera that recognizes the chip in positioning at the time of bonding. The position needs to be above the chip and the focal position of the camera that recognizes the substrate is on the substrate.

In the methods of Patent Literature 2 and Patent Literature 3, the reference position can be set by using the target, but the position of the target itself is influenced by, for example, the influence of temperature rise in the bonding operation or the change over time. It may shift | deviate and it may not become a sufficient position reference | standard in some cases.

Furthermore, in the methods of Patent Literature 2 and Patent Literature 3, the process of detecting the deviation between the cameras using the target and the actual bonding process are separated, and the positional shift cannot be obtained in real time during the bonding operation.

In addition, the method of patent document 2 and patent document 3 cannot cope with the position shift accompanying the movement of the bonding tool in the height direction in a bonding operation.

The position shift by the movement of this bonding tool is as follows. That is, in the bonding operation, when the bonding tool does not move parallel to the optical axis from the positioning height to the bonding height on the substrate, positional shift in bonding occurs. As a result, for example, the amount of deviation (+ Xc) between the optical axis of the first camera and the optical axis of the second camera can be accurately measured, and even if the correction is performed, it is not possible to accurately place the chip on the substrate. The shape is shown in FIG.

In FIG. 16, the upward optical axis 22 and the downward optical axis 24 are accurately aligned. In this case, when the bonding tool 12 moves in parallel with the optical axis 22 from the height on the substrate to the height of the focusing position of the first camera 26, as described in FIG. 14, the second camera 28 The reference position of the substrate 14 is aligned to the center of the field of view, and then the reference position of the chip 10 and the reference position of the substrate 14 are aligned to the center of the field of view of the first camera 26. Now, while the bonding tool 12 moves from the height on a board | substrate to the height of the confocal position of the 1st camera 26, the position shall shift + Xn. At this time, the reference position of the substrate 14 coincides with the downward optical axis 24 representing the center of the field of view of the second camera 28, and the reference position of the chip 10 corresponds to the field of view of the first camera 26. Even if coincident with the upward optical axis 22 representing the center of the chip 10, the chip 10 is bonded at the position of -Xn on the substrate 14 instead of the desired position of the substrate 14, thereby causing a position shift in bonding. .

Therefore, in order to arrange the chip 10 at the correct position on the substrate 14, the first camera is based on the shifted amount of the bonding tool 12 in some way, that is, the position on the substrate height. It is necessary to measure the amount (+ Xn) which is shifted between moving to the height of the in-focus position of (26). When the amount of deviation (+ Xn) is measured, only the reference position of the chip 10 is corrected by reference to the center of the field of view of the first camera 26 so that the reference position of the chip 10 is not bonded to the position of -Xn on the substrate 14. By adjusting to one position, the position shift in bonding can be suppressed and the chip | tip 10 can be arrange | positioned in the exact position on the board | substrate 14.

In the method of patent document 1 and patent document 2, the shift | offset | difference amount by the movement of a bonding tool is unknown. However, in general, the amount of deviation (+ Xn) can be measured by performing test bonding. That is, even if the shifted amount (+ Xn) is unknown, the reference position of the substrate 14 is made to coincide with the downward optical axis 24 representing the center of the field of view of the second camera 28, and the reference of the chip 10 is further satisfied. When the bonding is performed while the position coincides with the upward optical axis 22 representing the center of the field of view of the first camera 26, as described above, the chip 10 deviates by -Xn from the substrate 14. Therefore, if the sign of the shifted amount detected by the test bonding is reversed, the shifted amount (+ Xn) due to the movement of the bonding tool can be obtained.

However, what can be measured by test bonding is the amount of the shift between the external shape on the back side of the chip and the substrate, and the amount of the shift between the electrode pad of the chip and the bonding lead of the substrate cannot be accurately measured. In addition, in order to perform test bonding during the bonding operation, there is a possibility of waste of the substrate and the chip, and it is not efficient to carry out the test bonding offline.

As described above, in the prior art, in order to measure the amount of deviation between two cameras, the configuration of the apparatus including the target used for the positional reference is restricted, and the amount of deviation due to the movement of the bonding tool cannot be accurately measured. Therefore, at the time of the positioning of the chip | tip and board | substrate in bonding, more accurate correction of these shift | offset | difference amounts is difficult, and position shift in bonding cannot be made smaller. In addition, it is not possible to detect an amount that is out of sufficient precision due to the change over time of the position of the target. In addition, the amount shifted in the real time during the bonding operation cannot be determined.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art and to provide a bonding apparatus which can reduce the positional shift in bonding. Another object is to provide a bonding apparatus capable of correcting a shifted amount of movement of a bonding tool together with a shifted amount between two cameras for positioning when positioning a chip and a substrate in bonding. Still another object is to provide a bonding apparatus capable of suppressing the influence of the change caused by the passage of time of the target position in correcting the shifted amount. Further, another object is to provide a bonding apparatus that makes it possible to obtain an amount shifted in real time during a bonding operation. Each of the following solutions means contributes to at least one of the said objectives.

(Principle of the present invention)

Below, the shift of the bonding tool with the shift | offset | difference amount between the two cameras for positioning at the time of the positioning of the chip | substrate and board | substrate in bonding, especially the bonding | bonding of the present invention which can reduce the position shift in bonding less, Explain the principle of transfer correction. Here, as described with reference to Figs. 14 to 16, the positioning in the one-dimensional direction, that is, the X direction will be described. However, replacing the one-dimensional vector with the two-dimensional vector and extending to the two-dimensional positioning It is easy. In addition, although it is necessary to consider the magnification of each camera at the time of measuring a position or the distance between positions like FIG. 14-16, also in the following, unless the restriction | limiting in particular is carried out, The distance, that is, the distance on the object plane will be described.

First, in the case where the shift amount of the bonding tool shifts with the shift amount between the two cameras for positioning, in order to eliminate the shift in the bonding, the amount of correction to be corrected for the positioning of the chip and the substrate DELTA X Reveals. Using the coordinate system and symbols as shown in Figs. 14 to 16 for the arrangement, the shifted amount and the correction amount of each element, as described above, the correction amount for the shifted amount (+ Xc) of the two cameras is -Xc. The correction amount for the shifted amount (+ Xn) due to the shift is + Xn. And when these two exist together, even if the shift | offset | difference by the movement of the bonding tool of + Xn occurs further in FIG. 15, even if the optical axis shift | offset of + Xc occurs in FIG. 16, it is understood from the same conclusion. The correction amount to be corrected in that case is (-Xc + Xn). Therefore, when there exists an amount of shift | offset of the movement of a bonding tool with the amount of shift | offset between two cameras for positioning, the correction amount (DELTA) X required for positioning in order to eliminate the position shift in bonding is following Formula (1) Is given in

ΔX = −Xc + Xn... (One)

The bonding apparatus according to the present invention has a correction function for obtaining a correction amount ΔX for correcting the positional shift in bonding in addition to the function of positioning the chip held in the substrate and the bonding tool. In other words, unlike the positioning and bonding positions for positioning and bonding, a correction position for requesting the correction amount DELTA X is set. The correction position is provided with a target which is a position reference for correction, a correction camera, a first camera for measuring the position of the chip, and a second camera for measuring the position of the substrate, which can be moved to the correction position. The tool monitor 18 which moves in unison with this is connected to the bonding tool 12, and the bonding tool 12 moves up and down in positioning and bonding position, and the tool monitor 18 corrects. Shanghai to the position.

1 is a diagram showing the positional relationship of the elements in the positioning / bonding position and the correction position. The elements common to FIGS. 14 to 16 are denoted by the same reference numerals. In the coordinate system, the plane parallel to the bonding surface on which the bonding is made is called the XY plane, and the direction in which the bonding tool 12 moves in the vertical direction is the Z direction perpendicular to the XY plane, and represents the X axis and the Z axis. In FIG. 1, the correction position is shown in detail, and a positioning and bonding position are shown by the position farther from an X-axis direction than a correction position.

The heights Z ₁ and Z _{2 in the} Z-axis direction are the height of the substrate 14 and the height of the chip 10 held in the bonding tool 12 in the positioning and bonding positions, respectively. In addition, when positioning in the positioning and bonding position, the upper and lower cameras 20 move to the position, and the focusing position of the first camera 26 is on the surface of the chip held in the bonding tool, that is, Z ₂ . Set at the height, the focusing position of the second camera 28 is set on the surface of the substrate, that is, at the height of Z ₁ .

In FIG. 1, the height of the chip | tip 10 held by the bonding tool 12 and the height of the front-end | tip part of the tool monitor 18 are the same. That is, when the chip 10 is at the height Z _{1 in the} positioning / bonding position, the tip of the tool monitor 18 is at the height Z _{1 in the} correction position in the positioning / bonding position. When the chip 10 is at the height Z ₂ , the tip of the tool monitor 18 is at the height Z _{2 in the} correction position. Therefore, the movement of the tip of the tool monitor 18 is equal to the movement of the chip 10 held in the bonding tool 12 although the distance between the positioning and bonding position and the correction position is set. That is, the change of the position of the chip 10 in a positioning and bonding position can be acquired in real time by measuring the movement of the tool monitor 18 as it is in a correction position.

As shown in FIG. 1, the correction camera 30 and the target 32 which are the positional standards for correction | amendment are arrange | positioned in the predetermined position with a correction position. The target 32 is provided at a position at the height Z ₁ , that is, at the same height as the bonding height of the substrate 14. The camera 30 for correction | amendment can observe the target 32, and is arrange | positioned upward from the lower side of the target 32 as a focal point position. In addition, in FIG. 1, the target 32 uses the reference pin which has a longitudinal axis in a horizontal plane, ie, an XY plane, and makes the front end into the position reference for correction, As a position reference for correction, the correction camera 30 And what is necessary is just to be able to image a position reference | standard from both of the 2nd cameras 28.

Next, the operation of each element for obtaining the correction amount [Delta] X and the positional relationship on the X axis at that time will be described. The process of calculating correction amount (DELTA) X is performed simultaneously in a correction position in parallel with the bonding process in a positioning and bonding position. First, in the positioning and bonding position, the position of the chip 10u at the height Z ₂ and the substrate 14 at the height Z ₁ is measured by the up-and-down camera 20. That is, pulling up the bonding tool 12 to the upper side from the substrate 14 and the height of the surface of the chip 10 to Z _2. As described above, there is a focusing position of the first camera 26 at this height, which is suitable for accurately photographing the chip 10u. Further, the subscript u is, indicates that the height (Z _2), when in the height (Z ₁₎ which will be described later wihaeseoda to identify and attach a subscript d. At this time, the tool monitor 18 is at the position of Z ₂ equal to the height of the chip 10u held in the bonding tool 12u.

In this state, the first camera 26 and the second camera 28 are moved as a pair from the positioning and bonding position by a predetermined distance to be moved to the correction position, and the second camera 28 and the camera 30 for correction. ), The target 32 is imaged, and the tool monitor 18u at the height Z ₂ is captured by the first camera 26.

Next, in order to calculate the positional relationship of each element, as shown in FIG. 1, the coordinate system sets the right direction of the paper to the + X direction, and the position of each element is considered based on the imaging center of each camera. do. In FIG. 1, X ₁ , X ₂ , X ₃ , X ₄ , Xc, and Xn described below are indicated as arrows, and the forward direction thereof is indicated by an arrow. Here, let the position of the optical axis 24 which shows the imaging center of the 2nd camera 28 be X _b , and let it show the positional relationship on the X axis of each element based on this. If X ₂ is the distance from the position X _b of the optical axis 24 to the tip position of the target 32, the line unit value of the target 32 is X _b + X ₂ . X ₂ can be obtained from the imaging data of the second camera 28.

Further, when X ₁ is the distance from the optical axis 31 indicating the imaging center of the correction camera 30 to the tip position of the target 32, the position of the optical axis 31 indicating the imaging center of the correction camera 30 is , X _b + X ₂ -X ₁ . The sign of X ₁ is negative because the positive direction of the vector X ₁ is the -X direction in the example of FIG. 1. X ₃ can be obtained from the imaging data of the camera 30 for correction.

Moreover, supposing Xc is the distance from the optical axis 24 which shows the imaging center of the 2nd camera 28 to the optical axis 22 which shows the imaging center of the 1st camera 26, imaging of the 1st camera 26 is carried out. The position of the optical axis 22 which shows the center is Xb + Xc. Then, when said distance to the reference position of the tool monitor (18u) in the height (Z _2), the X ₃ from the optical axis 22 of the upstream showing an imaging center of the first camera 26 and a height (Z ₂ ), The reference position of the tool monitor 18u is X _b + X _c + X ₃ . X ₃ can be obtained from the imaging data of the first camera 26.

When these processes are complete | bonded, bonding is performed in a positioning / bonding position, but before that, the 1st camera 26, the 2nd camera 28, and the target 32 are retracted suitably. In the positioning and bonding position, the bonding tool 12 is lowered and the height of the chip 10d held in the bonding tool 12d is brought to the same height as the height Z ₁ of the substrate 14. The chip 10d is brought into contact with the substrate 14 to be bonded by pressure heating or the like.

At this time, the position shift Xn occurs due to the movement in the Z-axis direction of the bonding tool 12, but the position shift Xn is faithfully reflected in the movement of the tool monitor 18. That is, in response to the position of the chip 10d at the height Z ₁ where the position shift Xn occurs, the tool monitor 18d at the height Z ₁ also shows the position shift of Xn. In that state, the tool monitor 18d is picked up by the correction camera 30. When the X ₄ as the distance to the reference position of the tool monitor (18d) in the height (Z ₁₎ from the optical axis 31 represents the image sensing center of the calibration camera 30, the tool according to the height (Z ₁₎ The reference position of the monitor 18d is X _b + X ₂ -X ₁ + X ₄ . X ₄ can be obtained from the imaging data of the camera 30 for correction.

Here, the position shift Xn due to the movement of the bonding tool 12, that is, the position shift Xn due to the movement of the tool monitor 18 moving in unison with this, is measured at the height Z ₁ . Suppose the distance from the reference position (X _b + X ₂ -X ₁ + X ₄ ) of the tool monitor 18d to the reference position of the tool monitor 18u at the height Z _{2 as} seen from the height Z ₂ . The reference position of the tool monitor 18u in is X _b + X ₂ -X ₁ + X ₄ + Xn.

Since the reference position of the tool monitor 18u at the height Z ₂ obtained by the first camera 26 is X _b + X _c + X ₃ , this is X _b + X _2- X ₁ + X. Equal to ₄ + x _n ,

X _b + X _c + X ₃ = Xb + X ₂ -X ₁ + X ₄ + X _n

And, moreover, X _c = X ₂ -X ₁ + X ₄ + X _n -X ₃

Becomes

Here, if the correction amount DELTA X = -X _c + X _n is derived, equation (2) is obtained.

-X _c + X _n = DELTA X = X _3- (X ₂ -X ₁ + X ₄ ). (2)

Since X ₃ , X ₂ , X ₁ , and X ₄ , which are components on the right side of the formula (2), are positions shift amounts requested from the imaging data, respectively, the correction amount ΔX = −X _c + X _n is based on the respective imaging data. Can be obtained. To do this, the structure according to the present invention, the second amount is deviated in the camera (+ X _c) and the bonding amount is deviated due to the movement of the tool (+ X _n) do not need an independent measure of, a tool by using the movement of the monitor 18 The necessary correction amount (DELTA) X can be calculated | required from the measurement of the four position shift amounts obtained.

Further, X ₃ , X ₂ , X ₁ , and X ₄ are obtained from the imaging data of each camera by using one position reference and a reference position on the tool monitor 18 which moves in unison with the bonding tool 12. Can be. Therefore, as in the prior art, there is no need to use two targets in which the positional relationship is adjusted in advance, or there is no restriction on the focusing position of the first camera and the second camera with respect to the target.

Moreover, by using the target 32 of the above structure, in the correction of the shift | offset | difference amount, the influence of the change according to the passage of time of a target position can be suppressed. That is, first, the measurement of the tip position of the target 32 is performed by the correction camera 30 and the second camera 28 in the correction position, but this is the line unit value of the same target 32 in the vertical direction. Image processing can be performed by imaging from the camera, so that the processing can be performed at substantially the same time. In addition, since the measurement of the target 32 is not necessary, the position of the target tool 32 is not largely changed between these two imaging processes, and therefore, the change of the change over time in the position of the target 32 is determined. The influence can be suppressed.

Secondly, when the imaging process of the tip position of the target 32 is completed, the tip position of the target 32 is obtained, and the calculated value is stored and used for the subsequent misalignment calculation. You may evacuate to a suitable position. In other words, the target 32 can be retracted out of the place where the temperature of the bonding operation is not affected, or the like, so as not to affect the reproduction accuracy of the tip position of the target 32.

Moreover, since the tool monitor 18 connected integrally with the bonding tool 12 moving in a positioning / bonding position is set to move in a correction position as mentioned above, bonding is performed in a positioning / bonding position. At the same time, the position shift can be obtained simultaneously and in parallel in the correction position. In this way, the amount shifted in real time during the bonding operation can be obtained.

In addition, in the measurement of X ₁ , even if the height position of the bonding tool is not set to the height position Z ₁ of the substrate 14, X ₃ , X ₂ , X ₁ , and X ₄ are obtained from the imaging data and the equation (2) is obtained. ) Can be calculated. As described above, since X ₃ , X ₂ , X ₁ , and X ₄ are not limited in the same apparatus as in the prior art, even in this case, the correction of the positioning is performed based on the calculated value of Equation (2). Since the correction can be performed more accurately than in the related art, the positional shift in bonding can be suppressed more.

However, when the height position of the bonding tool is not set to the height position Z ₁ of the substrate 14, the correction due to the shift due to the vertical movement of the bonding tool is not sufficient, and more preferably test bonding is performed. It is used together. For example, the positioning is corrected based on the correction amount requested in Equation (2), and furthermore, test bonding is performed while the correction is performed, and the deviation caused by the shift of the bonding tool in the vertical direction after the correction is caused. Obtain the correction amount separately. By using test bonding together in this way, position shift in bonding can be further suppressed.

(Solution Solution)

The bonding apparatus which concerns on this invention is a bonding tool or the 1st which measures the position of the object with respect to a bonding tool by making the at least one of the bonding object hold | maintained by the bonding tool, or the measuring member held by the bonding tool as an object regarding a bonding tool. It has a positioning mechanism which includes a camera and a 2nd camera which measures a position of a board | substrate, The positioning mechanism holds the bonding object hold | maintained by a bonding tool at the determined position of the board | substrate arrange | positioned at the bonding work surface, and bonds In the bonding apparatus for performing the positioning, the positioning mechanism is further a tool monitor which moves in unison with the bonding tool, maintains a predetermined positional relationship with the bonding tool, and performs a movement such as movement of the bonding object; A target which can be observed from both sides with a positional reference, a correction camera arranged at a predetermined positional relationship on one side of the target, and a beam A first measuring means for imaging the target by the camera for obtaining a first position deviation between the target position reference and the image pickup reference position of the correction camera in the image pickup data, and the second camera in a predetermined positional relationship. A second measuring means arranged on the other side and picking up a target by a second camera and obtaining a second positional deviation between the target position reference and the image pickup reference position of the second camera in the image pickup data; A third measurement that opposes the first camera at the tool monitor, captures the tool monitor with the first camera, and obtains a third positional deviation between the reference position of the tool monitor and the imaging reference position of the first camera in the imaging data; The tool monitor is disposed on the other side of the target in a predetermined positional relationship with the means, and the tool monitor is picked up by the camera for correction, and the reference position of the tool monitor in the imaging data. Position shift in bonding on the basis of the fourth measuring means for obtaining a fourth positional deviation between the imaging reference positions of the correction camera and the first positional deviation, the second positional deviation, the third positional deviation and the fourth positional deviation; Calculation means for calculating a value and correction means for correcting the positional shift in bonding based on the calculation result, and imaging of the target in the first measurement means and imaging of the target in the second measurement means include: And is carried out at about the same time.

Moreover, in the bonding apparatus which concerns on this invention, a bonding position in which a bonding tool performs a bonding operation | movement by shanghai-dong, and a tool monitor are provided in a place where shanghai-dong is carried out, and a 4th position from a 1st position deviation according to the bonding operation of a bonding tool. A retraction position for retracting the first camera and the second camera at a position that does not disturb the movement of the bonding tool in the bonding position and the movement of the bonding tool in the bonding position and the movement of the tool monitor in the correcting position. It is preferable to be installed.

Further, the first measuring means, the second measuring means and the third measuring means obtain the first position deviation, the second position deviation, and the third position deviation, respectively, when the bonding tool is in the position where the bonding tool is lifted up from the substrate. The fourth measuring means preferably obtains the fourth positional deviation when the bonding tool is at the position of the height of the substrate.

In the bonding apparatus according to the present invention, there is provided a storage means for storing the imaging data of the target or the data based thereon, and the target can be evacuated from the imaging position after the imaging data or the data based thereon is stored. It is preferable.

Moreover, it is preferable that a target is arrange | positioned at the height substantially equal to the height in which a board | substrate is arrange | positioned.

Moreover, it is preferable that a 4th measuring means calculate | requires a 4th positional deviation using the position of the tool monitor at the time of arrange | positioning the object with respect to a bonding tool at the height substantially equal to the height where a board | substrate is arrange | positioned.

According to the above configuration, the positioning mechanism having the first camera and the second camera further includes a target having a position reference, a correction camera, and a tool which moves in unison with the bonding tool in order to correct the position shift. Use a monitor. The first positional deviation between the target positional reference and the imaging reference position of the camera for correction, the second positional deviation between the target positional reference and the imaging reference position of the second camera, the reference position of the tool monitor and the first positional deviation The third positional deviation between the imaging reference positions of one camera and the fourth positional deviation between the reference position of the tool monitor and the imaging reference position of the camera for correction is obtained. Since the fourth positional deviation from the first positional deviation corresponds to X ₁ , X ₂ , X ₃ , and X ₄ described in the principles of the present invention, the positional shift in bonding is calculated and corrected based on these. Therefore, positional shift in bonding can be made smaller.

At this time, the target is picked up by the second camera and the correction camera, but the imaging is performed at substantially the same time. Therefore, the change in the position of the target over time during the correction operation is based on the positional deviation based on the image data. Influences on output can be suppressed. For example, in the case where the bonding apparatus is provided with a heater or the like, the position of the target will change even during the correction operation by the high environmental temperature. Regarding such a change over time, by performing all of the imaging required for the target at about the same time, the influence due to the difference in the acquisition time of the imaging data can be eliminated.

Since the bonding position to which the bonding tool is moved, the correction position to which the tool monitor is moved, and the retracted positions of the first and second cameras are provided, the imaging operation is performed according to the bonding operation of the bonding tool. Position shift in bonding can be obtained in real time.

In addition, since each position deviation is calculated | required using when the bonding tool is in the raised position, and when it is at the height position of a board | substrate, it positions in correspondence with the actual position of the bonding tool in a bonding operation. The deviation can be obtained. In addition, since the target is to be retracted from the imaging position after the imaging data and the like are stored, when the fourth position deviation is obtained, the target does not interfere with the setting of the height position of the object with respect to the bonding tool, for example, the imaging position of the target. It is also possible to accurately set the height of the object with respect to the bonding tool at the height of. Furthermore, by retracting the target sufficiently from the bonding tool and retracting, it is possible to prevent the influence of temperature, for example, when the bonding tool is at a high temperature, from reaching the target.

Moreover, a target is arrange | positioned at the height substantially equal to the height where a board | substrate is arrange | positioned. The fourth positional deviation is obtained using the position of the tool monitor when the object relating to the bonding tool is placed at a height approximately equal to the height at which the substrate is placed. Thereby, as explained in the principle of the present invention, the deviation (+ Xn) due to the movement in the height direction of the bonding tool and the deviation (+ Xc) between the two cameras for positioning are measured through the measurement of the tool monitor. The correction amount ΔX = -Xc + Xn when present is found, and these are corrected. Therefore, positional shift in bonding can be made smaller.

(The best mode for carrying out the invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described in detail using drawing. In addition, in the following description, the same code | symbol is attached | subjected to the element similar to FIGS. 14-16 and FIG. In the following, the bonding apparatus is described as a COF (Chip On Film) bonding apparatus for face-down bonding an LSI chip having a bump to a film substrate, but the chip may be a semiconductor device or an electronic device other than the LSI chip, and the substrate is thin. You may use an epo substrate, a tape substrate, etc. which extended the bonding lead to the opening area | region of a film. Although a COF (Chip On Film) bonding apparatus heats a bonding tool and demonstrates that a bump and a board | substrate are bonded by the heat | fever, it may heat the board | substrate side elsewhere, and may heat both a bonding tool and a board | substrate. . Moreover, the bonding apparatus which uses ultrasonic energy together and lowers a heating temperature may be sufficient.

2 is a configuration diagram of a bonding device 50 for COF. The bonding apparatus 50 includes a bonding tool 12 for holding the back side of the chip 10 by suction or the like, a tool monitor 18 that moves integrally through the bonding tool 12 and the connecting portion 17, and a substrate. A carrier 16 for holding and conveying 14, a supply station 52 for supplying the chip 10, an up-and-down camera 60 for detecting a position between the substrate 14 and the chip 10, Correcting camera 30 that can be used to correct positional shift in bonding, target 32 serving as the position reference held by target moving mechanism 54, and a control device unit for controlling the operation of these elements. 100 is provided.

The chip 10 is an LSI chip, and bumps containing gold as a main component are provided on the pads of the in-output terminals. The board | substrate 14 is a film board | substrate with which the conductor pattern is wired to the plastic film for electronic components, The metal layer which has tin as a main component is provided in the wiring pattern part to which the bump of the chip 10 is connected. Bonding can be performed by positioning a bump containing gold as a main component on the metal layer containing tin as a main component and pressing it at a temperature of about 500 ° C. That is, the bonding apparatus 50 for COF has the function of bonding the chip | tip 10 to the board | substrate 14 by positioning between the chip | tip 10 and the board | substrate 4, and heating pressurization. to be.

The bonding tool 12 is a quadrangular pyramid-shaped member having a chip holding portion at its tip, and is provided with a vacuum suction hole through the chip holding portion at the center thereof, and is controlled at the chip holding portion under the control of the control device 100. Therefore, suction holding of the chip 10 can be performed. In addition, the bonding tool 12 may incorporate a heater therein and heat the chip 10 at about 500 ° C, for example. The control of the temperature is also performed by the controller 100.

The bonding tool 12 is mounted in a moving mechanism (not shown) and can move in the X, Y, and Z directions shown in FIG. 2 under the control of the control device unit 100. Specifically, the position where the pick-up position 90 which is the position which picks up the chip 10 from the supply station 52, and the chip 10 and the board | substrate 14 are positioned, and the bonding is performed after that It can move between the in-position and bonding positions 92. In each position, the bonding tool 12 can perform the shank movement of Z direction, and can perform a horizontal movement or inclination movement between each position.

The tool monitor 18 is a member having a function of reproducing the movement of the position of the chip 10 held in the bonding tool 12 at the correction position 94. The correction position 94 is a position which calculates the position shift in bonding. The tool monitor 18 integrates with the bonding tool 12 via the connecting portion 17, and therefore, in the correction position 94 as the bonding tool 12 moves up and down at the positioning and bonding position 92. It moves up and down.

The tool monitor 18 has a shape in which the rough bonding tool 12 is made smaller, and its tip is spherical in shape and is set substantially equal to the height of the chip 10. The tip is processed into a flat surface, and may form an appropriate reference mark if necessary. What is necessary is just to set it as the dimension and shape which can reproduce faithfully the change of the position of the chip | tip 10 even if it is other than the front-end | tip of the tool monitor 18. FIG. For example, it can be set as a hemispherical tip. Such a tool monitor 18 can use a metal material, a ceramic material, etc. by predetermined process.

The carrier 16 is a jig holding the substrate 14 and is conveyed in the Y direction by a conveyance mechanism such as a conveyor (not shown). The control of conveyance is performed by the control apparatus part 100, and the board | substrate 14 is conveyed from a supply hole and stops at the positioning and bonding position 92. FIG. After the positioning between the chip 10 and the substrate 14 and the bonding of the chip 10 are performed in the positioning and bonding position 92, the substrate is conveyed toward the discharge port and the next substrate is conveyed at the same time. It comes to a stop at the positioning and bonding position 92.

The up-and-down camera 60 is an optical component provided with two cameras inside. 3 shows an internal configuration of the vertical camera 60. The upper and lower cameras 60 include a first camera 26, a second camera 28, reflectors 62 and 64, and a double-sided reflector 66 inside a suitable housing. The first camera 26 and the second camera 28 are imaging devices having a Charge Coupled Device (CCD), the openings of which can be directed together in the + X-axis direction, and the center of the X-direction of the up-and-down camera 60 in the X-direction. It is placed in a position symmetrical about the axis. The reflecting mirrors 62 and 64 have inclinations of -45 degrees and +45 degrees with respect to the X axis with respect to the X axis, respectively, and are disposed symmetrically with respect to the central axis of the X direction of the up-and-down camera 60. The double-sided reflector 66 has a 45-degree inclination with respect to the XY plane, and the position where the center axis in the X direction of the up-and-down camera 60 intersects the line connecting the reflector 62 and the reflector 64. Is placed on.

The operation of the upper and lower cameras 60 of such an internal configuration will be described. The optical axis representing the imaging center of the first camera 26 is changed from the opening portion to the + X direction, the 90 degree direction is changed in the reflecting mirror 62, and toward the -Y direction, on the upper reflecting surface of the double-sided reflecting mirror 66. The 90 degree direction is changed to face the + Z direction. That is, it becomes the upward optical axis 22, and faces the exterior of the up-and-down camera 60. FIG. On the other hand, the optical axis indicating the imaging center of the second camera 28 faces the + X direction from the opening, the 90 degree direction is changed in the reflecting mirror 62 to the + Y direction, and the lower half of the double-sided reflecting mirror 66. The 90 degree direction changes from the slope to the -Z direction. That is, it becomes the downward optical axis 24 and faces the exterior of the up-and-down camera 60.

Thus, the up-and-down camera 60 faces the optical axis 22 which shows the imaging center of the 1st camera 26 upward, and the optical axis 24 which shows the imaging center of the 2nd camera 28 downward. Has the function. The up-and-down camera 60 has a direction opposite to the optical axis 22 and the optical axis 24 in advance, and can be assembled in the housing so that the axes coincide with each other when assembling.

When the first camera 26 and the second camera 28 have the same performance, the height position of the upper and lower cameras 60 is the height position Z _{1 of the} substrate 14 and the substrate 14. It is set at the mid-height position of the height position (Z ₂₎ of the chip 10 in the positioning. In the positioning of the chip 10 held by the substrate 14 and the bonding tool 12, the first camera 26 is in focus with the surface of the chip 10, and the second camera 28 is a substrate. The whole optical system is designed to focus on the surface of (14).

The up-and-down camera 60 is evacuated to the retracted position 96 which normally does not interfere with a bonding operation, and can move to the X direction from the position by control of the control apparatus part 100. FIG. Specifically, it can move to the positioning and bonding position 92 and the correction position 94. FIG.

The camera 30 for correction is arrange | positioned in the correction position 94 in the imaging device which has a CCD. The opening faces upward, that is, in the + Z direction, and the height position is set so that the focusing position is at the height Z ₁ of the surface of the substrate 14. Alternatively, the correction camera 30 may be a telecentric optical system.

The target 32 is a reference pin held by the target movement mechanism 54 and whose tip is the position reference. The target 32 is a tapered pin with a tapered tip, such as a capillary that can be used for wire bonding, and the tip is precisely finished in a circular or hemispherical shape having a diameter of about 15 μm, for example. Can be used. The target 32 is arranged such that its longitudinal axis is parallel to the XY plane. The direction of the longitudinal axis of the target 32 can be made parallel to the Y axis, for example, as shown in FIG. As the target 32, a metal material or a ceramic material processed into a predetermined shape can be used.

The target moving mechanism 54 is a mechanism for moving the target 32 in the Z direction under the control of the control device unit 100, and for example, a motor or the like can be used. The movement range of the target 32 is between the height position Z ₁ of the substrate 14 and the upper portion of the correction camera 30.

The target may be other than the reference pin shape as long as the target can be observed as a position reference from both the correction camera 30 and the second camera 28. As another example, you may use the target 33 in which the cross hair pattern used as a position reference | standard is provided on the thin transparent board shown in FIG. The target 33 is provided with a cross hair pattern by etching or the like on a thin transparent plate such as a thin plastic plate or a thin glass plate. The position reference may be a pattern other than the cross hair pattern as long as it is a stable pattern that can be measured with sufficient accuracy. The position reference of the cross hair pattern or the like is that the upper surface of the target 33, that is, the bonding tool 12 is provided on the surface facing each other, and the height position is set at the height position Z ₁ of the substrate 14. good. As another target, for example, the base material of the target 32 may be used as a thinly opaque plate, and a position reference may be provided on both surfaces thereof.

Next, the structure of the control apparatus part 100 is demonstrated. The control device 100 has a function of controlling each element constituting the bonding device, and in particular, from the first camera 26 and the second camera 28 and the correction camera 30 inside the upper and lower cameras 60. A device having a function of acquiring the imaging data and correcting the positioning and the correction in the positioning based on these data can be configured by a general computer.

Specifically, in conjunction with the function of performing the positioning process and the bonding process in the positioning and bonding position 92, and in conjunction with this, the operation of the upper and lower cameras 60 is controlled, It has a function of acquiring necessary imaging data from three cameras of the correction camera 30 and the up-and-down camera 60, processing these data, and calculating the position shift in bonding. The target movement mechanism 54 has a function of evacuating the target 32 after the imaging is completed by controlling the operation of the target movement mechanism 54. Here, the function in the positioning and bonding position 92 controls the operation of the carrier 16 when necessary by the up-and-down camera 60 and the bonding tool 12, and the imaging data required from the up-and-down camera 60 is performed. , The relative positioning of the chip 10 held by the substrate 14 and the bonding tool 12 is performed to correct the positional shift in the bonding calculated at the correction position 94 to perform the bonding operation. Contains the function to execute. In order to perform the processing corresponding to these functions, software can be used, and predetermined processing can be performed by executing a corresponding position shift correction program and a bonding program. Some of the processing may be performed in hardware.

The control unit 100 includes a CPU 102, an input unit 104 such as a keyboard, an output unit 106 that is a display such as a display panel, a storage device 108, and a bonding tool 12. A bonding control unit 110 for controlling the operation of the control unit, a correction camera control unit 112 for controlling the imaging operation of the correction camera 30 to receive the imaging data, and a target control unit for controlling the movement of the target 32. And an upper and lower camera controller 116 which controls the operation of the upper and lower cameras 60 and controls the imaging operation of the first camera 26 and the second camera 28 therein to receive the imaging data. Thus, they are joined together in an internal bus.

The CPU 102 includes a position shift correction unit 120, a positioning unit 122, and a bonding processing unit 124. The first position deviation measurement module 130 to the position shift calculation module 138 in the position shift correction unit 120 include four positions corresponding to X ₁ , X ₂ , X ₃ , and X ₄ described in the principles of the present invention. The deviation vector is calculated to obtain a two-dimensional correction amount? (X, Y). These are demonstrated using FIGS. 5-13.

FIG. 5 shows the top and bottom cameras 60, the substrate 14 held in the carrier 16, the target 32, and the calibration camera 30 and the chip 10 underneath the components of the bonding apparatus 50. Is a diagram schematically showing a planar arrangement of a bonding tool 12 having a) and a tool monitor 18 connected integrally thereto. Fig. 6 is a diagram schematically showing the side arrangement of these components. 5 and 6 show an initial state of the bonding apparatus 50. That is, in the positioning and bonding position 92, the board | substrate 14 is provided in the correction position 94 with the target 32 and the camera 30 for correction | amendment. In addition, the upper and lower cameras 60 may be in the retracted position 96, and the bonding tool 12 may be in the pickup position 90 or the like. However, the upper and lower cameras 60 retreat to the neighboring position of the positioning and bonding position 92 to indicate that the initial state. I'm doing it.

From this initial state, the bonding tool 12 is first moved to the positioning and bonding position 92 by the function of the bonding processing unit 124 of the CPU 102. At the same time, it can be pulled up to the height Z ₂ , and then, by the function of the positioning unit 122, the upper and lower cameras 60 are disposed in the positioning and bonding position 92, and the second camera 28 is provided. And the positions of the substrate 14 and the chip 10u held in the bonding tool 12u by the first camera 26, respectively, and are measured using the previously obtained position shift correction amount ΔX (X, Y). Positioning is performed. At this time, in the correction position 94, the tip of the tool monitor 18u is positioned at the height Z ₂ in conjunction with the movement of the bonding tool 12u. The arrangement | positioning state of the bonding tool 12, the tool monitor 18, and the up-and-down camera 60 in the positioning and bonding position 92 is shown with the broken line in FIG. In addition, the detail of positioning is mentioned later using correction amount (DELTA) X (X, Y).

Subsequently, the first position deviation measurement module 130, the second position deviation measurement module 132, and the third position deviation measurement module 134 are used to calculate the position shift in the correction position 94. The process is performed. Although these processes are performed at substantially the same time, it is explained that the processes are performed in the order of the second position deviation measurement and the third position deviation measurement from the first position deviation measurement module 130 for convenience.

Because of these processes, the upper and lower cameras 60 are moved to the correction position 94, and the target 32 is set to the height of the height Z ₁ of the substrate 14. Specifically, the following is executed by the function of the control device unit 100, in particular, by the function of the first position deviation measurement module 130 that first performs a process relating to correction. That is, a command is given to the up-and-down camera control unit 116 to move the up-and-down camera 60 to the correction position 94. The height position of the up-and-down camera 60 is in combination with the height Z ₂ of the front end surface of the tool monitor 18u as described above, so that the second camera 28 is the substrate 14. It is set to focus on the height Z _{1 of} . Further, the target control unit 114 is commanded to drive the target moving mechanism 54 to set the target 32 at the height of Z ₁ , which is the height position of the substrate 14. FIG. 7 is a diagram showing the arrangement of elements in the correction position 94 thus set.

In this state, the first position deviation measurement module 130 further has a function of imaging the target 32 with the correction camera 30 and calculating the first position deviation based on the captured image data. Specifically, a command is given to the correction camera control unit 112 to issue an imaging instruction, to acquire the imaging data, and to transmit the acquired imaging data to the first position deviation measurement module 130. Then, the first positional deviation is obtained based on the transferred image data.

8 is a view from the image pickup data obtained by the correction camera 30 describes the image to obtain the first position deviation (X _1, Y _1). Although the imaging data is actually the data which the correction camera 30 image | photographed the target 32 and the chip 10 in the upward direction (+ Z direction), In FIG. 8, it was seen from the upper side of the correction position 94 for convenience of description. It shows the data converted to the time. Similarly, also in the imaging data of FIG. 10, FIG. 12, etc. below, it showed uniformly to the data when it sees from the upper side of the correction position 94. As shown in FIG. In the imaging data 150 of FIG. 8, there is a cross pattern 152 showing the imaging center of the correction camera 30 at the center of the field of view, and at the lower left of the substrate 14 at the height position Z ₁ of the substrate 14. There is an image picked up pattern 154 of the target 32. The intersection of the cross pattern 152 showing the imaging center of the correction camera 30 is the imaging reference position of the correction camera 30, and the tip of the target pattern 154 is the position reference of the target 32 ( P ₀ ).

The first positional deviations X1 and Y1 are given as the reference position at the intersection point of the cross pattern 152 as a vector toward the position reference P ₀ of the pattern 154 of the target at the reference position. For one-dimensional, then the distance to the reference position of the target 32 from the position of the optical axis 31 represents the image sensing center of the correction camera 30, and X ₁ is described in the principles of the invention.

In the state of FIG. 7 of the correction position 94, the 2nd position deviation measuring module 132 picks up the target 32 with the 2nd camera 28, and makes the 2nd position deviation based on the imaging data. Has the function to obtain. Specifically, a command is given to the upper and lower camera control unit 116, an imaging instruction is sent to the second camera 28, the imaging data is acquired, and the acquired imaging data is transmitted to the second position deviation measurement module 132. . Then, the second positional deviation is obtained based on the transferred image data.

9 is a second diagram from the image pickup data obtained by the camera 28 is described for the shape to obtain a second position deviation (X _2, Y _2). In the imaging data 156 of FIG. 9, there is a cross pattern 158 showing the imaging center of the second camera 28 at the center of the field of view, and the image 160 of the target 32 is imaged on the upper right side thereof. have. The intersection of the cross pattern 158 showing the imaging center of the second camera 28 is the imaging reference position of the second camera 28, and the tip of the target pattern 160 is the reference of the position of the target 32. (P1) is shown.

The second positional deviations X ₂ and Y ₂ are based on the intersection of the cross pattern 158 showing the imaging center of the second camera 28 as a reference position, from the reference position to the position reference of the pattern 160 of the target. Given as a vector towards (P ₁ ). For one-dimensional, the second is the distance to the reference position of the target 32 from the position of the optical axis (24) indicating the image pickup center of the second camera 28, and the X ₂ described in the principles of the invention.

In the state of FIG. 7 of the correction position 94, the 3rd position deviation measuring module 134 picks up the tip of the tool monitor 18u with the 1st camera 26, and based on the imaging data, It has the function to find the positional deviation. Specifically, a command is given to the upper and lower camera control unit 116, an imaging instruction is given to the first camera 26, the imaging data is acquired, and the acquired imaging data is transmitted to the third position deviation measurement module 134. . Then, the third positional deviation is obtained based on the transferred image data.

10 is a view for explaining the first to obtain a third position error (X _3, Y ₃₎ from the image pickup data obtained by the camera (26) shape. In the imaging data 162 of FIG. 10, there is a cross pattern 164 showing the imaging center of the first camera 26 at the center of the field of view, and on the upper right, a tool monitor at the height Z ₂ ( 18u) is the edge of the captured reference pattern 166u. As described above, the subscript u is used to distinguish between the chip and the height position when determining the fourth positional deviation described later. As a reference pattern of the tool monitor 18u, the same thing as the case of the 4th position deviation measurement mentioned later may be used. For example, the specific shape pattern carved in the front end surface of the tool monitor 18, or the specific edge shape pattern of the tool monitor 18 can be used. The intersection of the cross pattern 164 showing the imaging center of the 1st camera 26 is the imaging reference position of the 1st camera 26, and the edge of the reference pattern 166u of the tool monitor is the tool monitor 18u. It shows the reference position of.

The third position deviation X ₃ , Y ₃ is a tool at the height Z ₂ from the reference position with the intersection of the cross pattern 164 showing the imaging center of the first camera 26 as a reference position. It is given as a vector facing the edge of the reference pattern 166u of the monitor 18u. For one dimension, is the length of the to the reference position of the first camera 26, the tool monitor (18u) in the height (Z ₂₎ from the position of the optical axis 22 represents the image sensing center of the of the present invention X ₃ is explained in principle.

In the above, the process of calculating the first positional deviation and the process of calculating the second positional deviation include the imaging process of the target 32 at the height Z ₁ . As described in the principles of the present invention, the target 32 includes the position shift Xc between the optical axis 22 of the first camera 26 and the optical axis 24 of the second camera, and the bonding tool 12. Since it becomes a position reference | standard when calculating the position shift Xn of the tool monitor corresponding to this position shift Xn at the time of up-down, it is calculated | required that the position does not change between position shift correction processes.

In practice, the position of the target 32 is changed during the position shift correction processing due to the change in the time course of the holding of the target moving mechanism 54 holding the target 32 and the heat from the high temperature bonding tool 12. This can cause a change in the degree that affects the correction process. There, it is preferable to simultaneously perform the imaging process of the target 32 for obtaining the 1st position deviation, and the imaging process of the target 32 for requesting the 2nd position deviation. Specifically, simultaneous image processing instruction for the second camera 28 from the upper and lower camera control unit 116 and the imaging instruction for the camera 30 for correction from the camera control unit 112 for correction are simultaneously and simultaneously performed. If this is not possible, it should be done in as close a time as possible. Then, the captured data is stored once in the storage device 108 or the like, and thereafter, image data processing for obtaining each positional deviation and necessary arithmetic processing are performed.

Subsequent to the processing for obtaining the third positional deviation from the first positional deviation, after each imaging process for obtaining the third positional deviation from at least the first positional deviation, bonding processing is performed at the positioning / bonding position 92, In the correction position 94, a process for finding the fourth positional deviation is performed. In the bonding process, the bonding tool 12 lowers toward the substrate, but the tool monitor 18 also lowers in the correction position. Therefore, first, a process that does not disturb the lowering of the tool monitor 18 in the correction position 94 is performed, and then the lowering process of the bonding tool 12 is performed.

Specifically, the upper and lower camera control unit 116 is instructed to move the upper and lower cameras 60 to the retracted position 96. Then, the target control unit 114 is instructed to drive the target moving mechanism 54 to lower the target 32 closer to the upper side of the correction camera 30. Thereafter, a command is given to the bonding tool control unit 110, and the bonding tool 12 is lowered so that the bonding surface of the chip 10 reaches the Z ₁ , which is the height of the substrate 14. Thereafter, bonding is performed by pressure heating. In addition, the detail of bonding is mentioned later. At this time, in the correction position 94, the tip of the tool monitor 18d is positioned at the height Z ₁ in conjunction with the movement of the bonding tool 12d. Fig. 11 is a diagram showing the arrangement status of each element in the correction position 94 thus set.

Dropping the target 32 as close to the upper side of the correction camera 30 as possible from the height Z ₁ of the substrate 14 prevents the bonding tool 12 from descending at a height Z ₁ . In order not to As a result, the bonding surface of the chip 10 can be set accurately at the height Z ₁ . One more object is to separate the target 32 as much as possible from the descending bonding tool 12 and to reduce the influence of heat from the high temperature bonding tool 12 even if it is evacuating. Moreover, even if it is close to the upper side of the correction | amendment camera 30, even if it does in this way, the target 32 will not match from the confocal position of the correction | amendment camera 30, and the bonding tool 12 of the correction camera 30 This is because it does not interfere with imaging. In addition, the evacuation of the target 32 is performed by the movement in the height direction instead of the movement in the horizontal direction, so that the reproducibility of the position in the XY plane before and after the evacuation of the target 32 is the movement in the horizontal direction. Compared to the method, because it is better.

Subsequently, the fourth position deviation measurement module 136 further has a function of imaging the tip of the tool monitor 18d with the correction camera 30 to obtain a fourth position deviation based on the captured image data. . Specifically, a command is given to the correction camera control unit 112, an image capturing instruction is issued to the correction camera 30, the image capturing data is acquired, and the captured image data is transmitted to the fourth position deviation measurement module 134. Then, the fourth positional deviation is obtained based on the transferred image data.

FIG. 12: is a figure explaining the shape which pursues 4th positional deviation X4, Y4 from the imaging data picked up by the correction camera 30. FIG. In the imaging data 150 of FIG. 12, there is a cross pattern 152 showing the imaging center of the correction camera 30 at the center of the field of view. This is the same as the case of the field of view of the correction camera 30 in FIG. And, in the upper right, the edge of the tool monitor the captured reference pattern (168d) in (18d) of the height (Z _1). Here, the subscript d is used to distinguish between the chip and the height position when the above third positional deviation is obtained. As a reference pattern of the tool monitor 18d, the same thing as that of the said 3rd positional deviation measurement is used. The intersection of the cross pattern 152 showing the imaging center of the correction camera 30 is the imaging reference position of the correction camera 30, and the edge of the reference pattern 168d of the tool monitor is the reference of the tool monitor 18d. To show the location. Also, shown in order to refer to the reference position (P ₀₎ of the target 32 it is measured in Fig.

The fourth position deviation X ₄ , Y ₄ is a tool monitor at the height Z ₁ from the reference position using the intersection of the cross pattern 152 showing the imaging center of the correction camera 30 as a reference position. It is given as a vector facing the edge of the reference pattern 168d of 18d. For one-dimensional, then the distance from the position of the optical axis 31 represents the image sensing center of the calibration camera 30 to the reference position of the tool monitor (18d) in the height (Z _1), the principles of the present invention X ₄ is explained.

In this way, the first positional deviations (X ₁ , Y ₁ ), the second positional deviations (X ₂ , Y ₂ ), the third positional deviations (X ₃ , Y ₃ ), and the first requested in real time in parallel with the bonding process. The four positional deviations X ₄ and Y ₄ are sent to the position shift calculation module 138. The position shift calculation module 138 has a function of calculating the correction amounts Δ (X, Y) for correcting the position shift in bonding using these data. Correction amount (DELTA) (X, Y) is given by Formula (3) which extended Formula (2) demonstrated by the principle of this invention to two dimensions.

Δ (X, Y) = (X ₃ , Y ₃ )-[(X ₂ , Y ₂ )-(X ₁ , Y ₁ ) + (X ₄ , Y ₄ )]. (3)

Next, the positioning part 122 positions the board | substrate 14 and the chip 10 using the correction amount (DELTA) (X, Y) requested as mentioned above so that there may be no positional shift in bonding. Has the function to Specifically, it is reflected in the next bonding operation. That is, when correction amount (DELTA) (X, Y) is calculated | required and a bonding process is complete | finished, the bonding processing part 124 gives a command to the bonding tool control part 110, releases chip holding, and raises the bonding tool 12. FIG. . Thus, the chip 10 remains bonded over the substrate 14. Then, the bonding tool 12 is moved to the pickup position 90, the next new chip 10 is picked up from the supply station 52 in a predetermined sequence, and returned to the positioning / bonding position 92 again. In addition, an instruction is given to a carrier controller (not shown) to discharge the bonded substrate 14 in the positioning and bonding position 92 so as to supply a new substrate 14.

Then, the height position of the surface of the chip 10 held in the bonding tool 12 is set to Z ₂ . Moreover, a command is given to the up-and-down camera control part 116, and the up-and-down camera 60 is also moved to the positioning and bonding position 92. FIG. Then, the imaging instruction is given to the first camera 26 and the second camera 28 included in the up and down camera 60, and the chip 10 held in the bonding tool 12 with respect to the first camera 26. Imaging of the substrate 14 is performed by the second camera 28 and the imaging data is transmitted to the positioning unit 122. Based on the transferred image data and the correction amount Δ (X, Y) requested a while ago, the position shift is corrected, and the result is commanded to the bonding tool control unit 110, whereby the reference of the substrate 14 The position and the reference position of the chip 10 held in the bonding tool 12 are positioned. In addition, the positional relationship of the bonding tool 12 holding the chip 10 at the time of positioning, the board | substrate 14, and the up-and-down camera 60 is shown with the broken line in FIG.

FIG. 13: is a figure explaining the shape which positions and processes correction amount (DELTA) (X, Y) in the visual field of the 1st camera 26. FIG. In reality, the reference pattern of the chip 10u in the field of view of the first camera 26 in the positioning and bonding position 92, and the field of view of the first camera 26 in the correction position 94. Although the reference patterns of the tool monitor 18u in FIG. 8 are not the same in many cases, for convenience of explanation, these are called the same. That is, when moving from the correction position 94 to the positioning bonding position 92, the imaging data of the 1st camera 26 in the positioning bonding position 92 is corrected in the correction position 94. FIG. To be equal to FIG. 10.

In this case, the intersection between the intersection of the cross pattern 164 indicating the imaging center of the first camera 26 and the edge of the reference pattern 166u which is the reference position of the chip 10u (tool monitor 18u) is first. Only three positional deviations (X ₃ , Y ₃ ) are apart. Now, for the sake of simplicity, it is assumed that the reference position of the substrate 14 coincides with the imaging center of the second camera 28. In this case, the positioning of the imaging center of the first camera 26 and the reference position of the chip 10 does not correct only the third positional deviations X ₃ and Y ₃ , but rather the correction of the first camera 26. From the imaging center, the reference position of the chip 10 is moved to the position of the correction amounts Δ (X, Y). By doing in this way, the positioning which correct | amends the position shift in bonding according to Formula (3) can be performed.

In order to show the relationship with the correction amounts Δ (X, Y), the first position deviations X _{1 ,} Y ₁ and second position deviations X ₂ requested in FIGS. 13, 8, 9, and 12, respectively, are shown in FIG. 13. , X ₂ ) and the fourth positional deviation (X ₄ , X ₄ ) are also shown. When the reference position of the substrate 14 does not coincide with the imaging center of the second camera 28, the same correction can be performed by moving the reference position of the first camera 26 only by the mismatch.

After performing the positioning to correct the positional shift in the bonding, the bonding processing unit 124 has a function of bonding the chip 10 to the substrate 14. Specifically, the following several functions are included. After the above positioning is performed in the positioning and bonding position 92, the upper and lower camera control unit 116 is instructed, and the upper and lower camera 60 is retracted to the retracted position 96. Next, a command is given to the bonding tool control unit 110, the bonding tool 12 holding the chip 10 is dropped, the bumps of the chip 10 are brought into contact with the substrate 14, and bonding is performed by pressure heating. To do it. When the bonding process is finished, vacuum suction of the bonding tool 12 is stopped and the bonding tool 12 is raised.

Thus, since the tool monitor 18 which moves integrally with the bonding tool 12 and moves in the correction position 94 is used, bonding is performed in real time in parallel with the bonding process in the positioning and bonding position 92. The positional shift in a can be calculated | required. Therefore, the entire bonding process can be performed at high speed, and the positioning of the bonding can be performed with high accuracy.

In addition, by carrying out the imaging process of the target 32 substantially simultaneously, the influence of the change with the passage of time of the position between the correction processes of the target 32 which is a positional reference can be suppressed. That is, once data collection about the position of the target 32 is completed, the position of the virtually universal target 32 which does not change in the environment or time can be determined by the data. Subsequently, a correction amount of position shift can be obtained based on the position of this virtual target 32.

In addition, once the position of the virtual target 32 is determined in this way, the target 32 may be evacuated to an arbitrary position. Therefore, the target 32 can be retracted where it does not prevent the tool monitor 18 from descending to the position of the height Z ₁ of the substrate 14. As a result, when the fourth positional deviation is obtained, the tool monitor 18 and the bonding tool 12 having the chip 10 can be accurately lowered to the position of the height Z ₁ of the substrate 14. Moreover, the target 32 does not go near the high temperature bonding tool 12 by this, and it does not deteriorate the position precision.

Therefore, at the time of positioning a chip and a board | substrate in bonding, the amount of shift | offset | difference between two cameras and the amount of shift | offset | difference by the movement of a bonding tool can be corrected correctly, and the position shift in bonding can be made smaller.

According to the above configuration, the positioning mechanism having the first camera and the second camera further includes a target having a position reference, a correction camera, and a tool which moves in unison with the bonding tool in order to correct the position shift. Use a monitor. The first positional deviation between the target positional reference and the imaging reference position of the camera for correction, the second positional deviation between the target positional reference and the imaging reference position of the second camera, the reference position of the tool monitor and the first positional deviation The third positional deviation between the imaging reference positions of one camera and the fourth positional deviation between the reference position of the tool monitor and the imaging reference position of the camera for correction is obtained. Since the fourth positional deviation from the first positional deviation corresponds to X ₁ , X ₂ , X ₃ , and X ₄ described in the principles of the present invention, the positional shift in bonding is calculated and corrected based on these. Therefore, positional shift in bonding can be made smaller.

At this time, the target is picked up by the second camera and the correction camera, but the imaging is performed at substantially the same time. Influence on output can be suppressed. For example, in the case where the bonding apparatus is provided with a heater or the like, the position of the target may change even during the correction operation by the high environmental temperature. Regarding such a change over time, by performing all of the imaging required for the target at about the same time, the influence by the difference in the acquisition time of the imaging data can be eliminated.

Since the bonding position to which the bonding tool is moved, the correction position to which the tool monitor is moved, and the retracted positions of the first and second cameras are provided, the imaging operation is performed according to the bonding operation of the bonding tool. Position shift in bonding can be obtained in real time.

In addition, since each position deviation is calculated | required using when the bonding tool is in the raised position, and when it is at the height position of a board | substrate, it positions in correspondence with the actual position of the bonding tool in a bonding operation. The deviation can be obtained. In addition, since the target is to be retracted from the imaging position after the imaging data and the like are stored, when the fourth position deviation is obtained, the target does not interfere with the setting of the height position of the object with respect to the bonding tool, for example, the imaging position of the target. It is also possible to accurately set the height of the object with respect to the bonding tool at the height of. Furthermore, by retracting the target sufficiently from the bonding tool and retracting, it is possible to prevent the influence of temperature, for example, when the bonding tool is at a high temperature, from reaching the target.

Moreover, a target is arrange | positioned at the height substantially equal to the height where a board | substrate is arrange | positioned. The fourth positional deviation is obtained using the position of the tool monitor when the object relating to the bonding tool is placed at a height approximately equal to the height at which the substrate is placed. Thereby, as explained in the principle of the present invention, the deviation (+ Xn) due to the movement in the height direction of the bonding tool and the deviation (+ Xc) between the two cameras for positioning are measured through the measurement of the tool monitor. The correction amount ΔX = -Xc + Xn when present is found, and these are corrected. Therefore, positional shift in bonding can be made smaller.

Claims (6)

The position of the first camera and the substrate for measuring the position of the object with respect to the bonding tool, using at least one of the bonding tool or the bonding object held in the bonding tool or the measuring member held in the bonding tool as the object for the bonding tool. In the bonding apparatus which has a positioning mechanism containing a 2nd camera to measure, and performs a bonding by positioning by the positioning mechanism the bonding object hold | maintained by a bonding tool at the determined position of the board | substrate arrange | positioned on a bonding work surface, and bonding. , Positioning mechanism, moreover, A tool monitor which moves in unison with a bonding tool, maintains a predetermined positional relationship with the bonding tool, and performs a movement such as movement of a bonding object; A target that can be observed from both sides with positional criteria, A camera for correction arranged in a predetermined positional relationship on one side of the target, First measuring means for picking up the target by the correction camera and obtaining a first positional deviation between the target position reference and the image pickup reference position of the correction camera in the image pickup data; The second camera is placed on the other side of the target in a predetermined positional relationship, the target is imaged by the second camera, and the second positional deviation between the positional reference of the target and the imaging reference position of the second camera in the imaging data. The second measuring means obtained; The first camera is opposed to the tool monitor in a predetermined positional relationship, the tool monitor is picked up by the first camera, and the third positional deviation between the reference position of the tool monitor and the imaging reference position of the first camera is captured in the imaging data. Third measurement means to obtain, The tool monitor is arranged on the other side of the target in a predetermined positional relationship, the tool monitor is picked up by the correction camera, and the fourth positional deviation between the reference position of the tool monitor and the pick-up reference position of the correction camera is captured in the image data. The fourth measuring means obtained; Calculating means for calculating a positional shift in bonding based on the first positional deviation, the second positional deviation, the third positional deviation, and the fourth positional deviation; And correction means for correcting the positional shift in bonding based on the calculation result, Bonding apparatus characterized in that imaging of the target in a 1st measuring means and imaging of the target in a 2nd measuring means are performed simultaneously. The method of claim 1, A bonding position where the bonding tool is in motion and performs a bonding operation; A correction position in which the tool monitor is installed in the east and east, where each imaging is performed to obtain a fourth position deviation from the first position deviation in accordance with the bonding operation of the bonding tool; A bonding apparatus for retracting the first camera and the second camera at a position which does not prevent movement of the bonding tool in the bonding position and movement of the tool monitor in the correction position. The method of claim 2, The first measuring means, the second measuring means and the third measuring means obtain the first position deviation, the second position deviation, and the third position deviation, respectively, when the bonding tool is at the position where the bonding tool is lifted up from the substrate, The fourth measuring means obtains the fourth positional deviation when the bonding tool is at the position of the height of the substrate. The method of claim 1, Storage means for storing the imaging data of the target or data based thereon; The target device can be retracted from an imaging position after the imaging data or the data based thereon is stored. The method of claim 1, The target is arranged at the same height as the height of the substrate is placed bonding apparatus. The method of claim 1, The fourth measuring means obtains the fourth positional deviation using the position of the tool monitor when the object relating to the bonding tool is placed at the same height as the height at which the substrate is placed.

Images