JP2020119970A - Mounting device and mounting method - Google Patents

Abstract

To provide a mounting apparatus and a mounting method that achieve stable and highly accurate mounting and inspection of 100% mounting position accuracy measurement in the mounting device without increasing costs and decreasing productivity in face-up mounting in which the electrode surface of a board and the electrode surface of a chip component face in the same direction.SOLUTION: In a mounting device, after a chip component is aligned with a board, a mounting head holding the chip component is lowered in the vertical direction with respect to the board, the chip component comes into close contact with the substrate, and then a control unit includes a function to cause a recognition mechanism to start a recognition operation of a chip recognition mark and a board recognition mark in parallel, and recognizes the chip recognition mark and the board recognition mark when the chip component is in close contact with the board through the mounting head to calculate the mounting position accuracy of the chip component and the board, and there is also provide a mounting method.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting device and a mounting method for mounting a chip component on a substrate. In particular, the present invention relates to a mounting apparatus and a mounting method for performing face-up mounting in which an electrode surface of a substrate and an electrode surface of a chip component face the same direction.

As a mounting form for mounting a chip component such as a semiconductor chip on a substrate such as a wiring substrate, face-down mounting in which the electrode face of the chip component is opposed to the electrode face of the substrate, and the electrode face of the substrate and the electrode face of the chip component are mounted. It is well known that there is a face-up implementation that implements in the same direction.

In any of the mounting forms, it is necessary to perform highly accurate alignment for mounting the chip component at a predetermined position on the substrate, and a recognition mark for alignment is attached to the chip component and the substrate. Here, the reason why the chip component is aligned with the predetermined position of the substrate is to mount the positional relationship between the electrode of the substrate and the electrode of the chip component with predetermined accuracy. In the chip component, the recognition mark position is generally arranged on the basis of the electrode position, and is generally attached to the electrode surface side where the relative position is clear.

Here, FIG. 20 shows an example of face-up mounting. In the chip component C, as shown in FIG. 20A, two chip recognition first marks AC1 and two chip recognition second marks AC2 are arranged as chip component recognition marks (hereinafter referred to as chip recognition marks). Is common. (Diagonal arrangement in the example of FIG. 20) On the other hand, on the substrate S, two substrate recognition first marks AS1 and two substrate recognition second marks AS2 are arranged as substrate recognition marks (hereinafter referred to as substrate recognition marks). It is generally done. (Diagonal arrangement in the example of FIG. 20) Therefore, at the time of alignment, the positional relationship between the chip recognition first mark AC1 and the substrate recognition first mark AS1 and the chip recognition first mark AC2 and the substrate recognition second mark AS2 are arranged. A positional deviation amount (position and angle in the in-plane direction of the substrate) with respect to a predetermined mounting position is obtained from the positional relationship, and the relative position is corrected before mounting (FIG. 20B).

By the way, in both the face-down mounting and the face-up mounting, the chip component held from the upper side by the mounting head is pressure-bonded to the substrate for mounting. For this reason, in face-down mounting in which the electrodes of the substrate and the chip component are opposed to each other, a method of directly observing the substrate recognition mark and the chip recognition mark at the same time by using an upper and lower two-view camera is known. On the other hand, in face-up mounting in which the electrodes of the board and the chip component are mounted in the same direction, since the electrode surface of the chip component is in close contact with the mounting head, it is possible to directly observe and align the recognition mark of the chip component. A method has been proposed in which each recognition mark can be observed through the mounting head by devising such as using a transparent member in a portion of the mounting head that holds a chip component. (For example, Patent Documents 1 and 2)

International Publication No. 2003/041478 JP, 2017-208522, A

As semiconductor parts are becoming denser, with more electrodes, and at narrower pitches, mounting equipment performs positioning with higher accuracy than before without significantly increasing costs or decreasing productivity. From the viewpoint of quality control, it is required to perform 100% of the mounting position accuracy measurement inspections of the mounting state. However, Patent Document 2 does not mention the mounting position accuracy measurement inspection in the mounting state.

In addition, when the mounting position accuracy measurement is performed by a device different from the mounting device after the mounting process is completed, there is a problem that the cost is increased, and when defective mounting position accuracy occurs, it takes time to notice it. There is also the problem of being delayed.

The present invention has been made in view of the above problems, and in face-up mounting in which the electrode surface of the substrate and the electrode surface of the chip component face in the same direction, without increasing cost or decreasing productivity, mounting The present invention provides a mounting apparatus and a mounting method for realizing stable and highly accurate mounting by performing all the mounting position accuracy measurement inspections in the apparatus.

In order to solve the above problems, the invention according to claim 1 is
A mounting device for mounting a chip component having a chip recognition mark for position alignment and a substrate having a substrate recognition mark for position alignment face-up with the chip recognition mark and the substrate recognition mark facing upward. ,
A substrate stage for holding the substrate,
A mounting head that holds the chip,
An elevating means for elevating the mounting head in a direction perpendicular to the substrate,
A recognition mechanism that recognizes the chip recognition mark and the substrate recognition mark from the upper side of the mounting head over the mounting head, and is movable in the in-plane direction of the substrate,
The function of calculating the positional deviation amount of the chip component and the board from the positional information of the chip component recognition mark and the board recognition mark, which is connected to the recognition mechanism and obtained from the recognition mechanism, and the positional deviation amount. And a control unit having a function of driving the mounting head unit and/or the substrate stage in accordance with the position adjustment,
After performing the alignment between the chip component and the substrate by the recognition mechanism, the mounting head holding the chip component is lowered in the vertical direction with respect to the substrate, and after the chip component comes into close contact with the substrate. ,
The control unit causes the recognition mechanism to start the recognition operation of the chip recognition mark and the board recognition mark in parallel, and displays the chip recognition mark and the board recognition mark in a mounted state in which the chip component is in close contact with the board. Provided is a mounting apparatus having a function of recognizing through the mounting head and calculating mounting position accuracy of the chip component and the substrate.

The invention described in claim 2 is the mounting apparatus according to claim 1,
In the recognition operation of the chip recognition mark and the board recognition mark performed over the mounting head, in order to calculate the mounting position accuracy that is started in parallel after the chip components are in close contact with the board,
Provided is a mounting device having a function of recognizing the chip recognition mark and the substrate recognition mark at the same time when the optical axis center of the recognition mechanism is near the midpoint of the chip recognition mark and the substrate recognition mark.

The invention described in claim 3 is the mounting apparatus according to claim 2,
A mounting device having a function of feeding back the calculated mounting position accuracy to the mounting position and automatically calibrating and adjusting the mounting position.

The invention according to claim 4 is
A mounting method for mounting a chip component having a chip recognition mark for alignment on a substrate having a substrate recognition mark for alignment, wherein the chip component is arranged with a gap provided between the chip component and the chip A positioning step of recognizing the recognition mark and the board recognition mark from the same direction over the mounting head to match the relative positional relationship between the chip component and the board, and mounting the chip part by closely contacting and pressing the board. And a mounting step in which the chip component is in close contact with the substrate, the chip recognition mark and the substrate recognition mark are recognized from the same direction over the mounting head, and the chip component and the substrate are recognized. Equipped with a mounting accuracy measurement and inspection process that calculates the relative positional relationship,
A mounting method is provided in which the mounting step and the mounting accuracy measurement/inspection step are performed in parallel after the chip component is in close contact with the substrate.

The invention described in claim 5 is the mounting method according to claim 4,
In the mounting accuracy measurement/inspection step, there is provided a mounting method in which the optical axis center of the recognition mechanism is near the midpoint of the chip recognition mark and the board recognition mark, and the chip recognition mark and the board recognition mark are recognized at the same time. ..

The invention according to claim 6 is the mounting method according to claim 5,
A mounting method for feeding back the result of the mounting position accuracy calculated in the mounting accuracy measurement/inspection step to the mounting position and automatically calibrating and adjusting the mounting position.

According to the present invention, in face-up mounting in which the electrode surface of the substrate and the electrode surface of the chip component face in the same direction, all the mounting position accuracy inspections are performed in the mounting device and stable without increasing cost or lowering productivity. Thus, it is possible to realize a mounting apparatus and a mounting method that can be mounted with high accuracy.

It is a figure which shows the external appearance of the mounting apparatus which concerns on embodiment of this invention. (b) It is a figure which shows the external appearance and the component which looked at the same mounting apparatus from another angle. It is a figure explaining the positional relationship at the time of aligning a chip component and a board|substrate with the mounting apparatus which concerns on embodiment of this invention. It is a figure explaining the state which acquires the positional information on the board|substrate 1st recognition mark, when aligning a chip component and a board|substrate with the mounting apparatus which concerns on embodiment of this invention. It is a figure explaining the state which acquires the positional information on the chip 1st recognition mark, when performing the position alignment of a chip component and a board|substrate by the mounting apparatus which concerns on embodiment of this invention. It is a figure explaining the state which acquires the positional information on the chip 2nd recognition mark, when performing the position alignment of a chip component and a board|substrate by the mounting apparatus which concerns on embodiment of this invention. It is a figure explaining the state which is acquiring the position information on the board 2nd recognition mark at the time of aligning a chip part and a board with a mounting device concerning an embodiment of the present invention. It is a figure explaining the mounting accuracy measurement after the mounting process of mounting a chip component on a board|substrate is completed in the mounting apparatus which concerns on embodiment of this invention. FIG. 9 is a diagram illustrating a state in which the mounting head is lowered and the chip component is in close contact with the substrate in the mounting step of mounting the chip component on the substrate in the mounting apparatus according to the embodiment of the present invention. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered and a mounting accuracy measurement is performed in a state where the chip component is in close contact with the substrate. It is a figure which shows the state which has acquired the positional information on a recognition mark. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered and a mounting accuracy measurement is performed when the chip component is in close contact with the substrate. It is a figure which shows the state which has acquired the positional information on a recognition mark. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered and a mounting accuracy measurement in a state where the chip component is in close contact with the substrate is described. It is a figure which shows the state which has acquired the positional information on a recognition mark. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered, and mounting accuracy measurement in a state where the chip component is in close contact with the substrate will be described. It is a figure which shows the state which has acquired the positional information on a recognition mark. In the mounting apparatus according to the embodiment of the present invention, the mounting accuracy measurement at the mounting process step of mounting a chip component on a substrate will be described. When the mounting accuracy is measured, the board first recognition mark and the chip first recognition mark It is a figure which shows the example of an image of the image pick-up means which acquired the position information of the above simultaneously in the same visual field. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered and a mounting accuracy measurement is performed in a state where the chip component is in close contact with the substrate. It is a figure which shows the state which has acquired the positional information on a recognition mark and a chip 1st recognition mark simultaneously. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on a substrate, a mounting head is lowered, and mounting accuracy measurement in a state where the chip component is in close contact with the substrate will be described. It is a figure which shows the state which has acquired the positional information on a recognition mark and a chip 2nd recognition mark simultaneously. FIG. 6 is a view for explaining face-up mounting on an embedded substrate, and (a) is a diagram showing a state in which the chip component is separated from the substrate, and (b) is a diagram showing a state in which the chip component is aligned and mounted on the substrate. It is a figure which shows the state at the time of aligning an embedded substrate and a chip component in the mounting apparatus which concerns on embodiment of this invention. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on an embedded substrate, a mounting head is lowered and a mounting accuracy measurement is performed in a state where the chip component is in close contact with the substrate. It is a figure which shows the state which has simultaneously acquired the positional information on the 1st recognition mark and the chip 1st recognition mark. In a mounting apparatus according to an embodiment of the present invention, in a mounting step of mounting a chip component on an embedded substrate, a mounting head is lowered and a mounting accuracy measurement is performed in a state where the chip component is in close contact with the substrate. It is a figure which shows the state which has simultaneously acquired the positional information on the 2nd recognition mark and the chip 2nd recognition mark. Face-up mounting is described, and (a) is a diagram showing a state in which the chip component is separated from the substrate, and (b) is a diagram showing a state in which the chip component is aligned and mounted on the substrate.

An embodiment of the present invention will be described with reference to the drawings. FIG. 1A shows an appearance of a mounting apparatus 1 according to an embodiment of the present invention, and FIG. 1B is an appearance view seen from a different angle from FIG. 1A, and a configuration including a control system. The elements are also noted.

The mounting device 1 is a device for aligning the chip component C on the substrate S by face-up mounting. For alignment, the chip recognition first mark AC1, the chip recognition second mark AC2, and the substrate The board recognition first mark AS1 and the board recognition second mark AS2 marked S are used. Specifically, after the positional relationship between the chip recognition first mark AC1 and the substrate recognition first mark AS1 and the positional relationship between the chip recognition second mark AC2 and the substrate recognition second mark AS2 are corrected within the allowable range, the chip component is corrected. C is mounted on the substrate S.

The chip component C is generally mounted on the substrate S via a thermosetting adhesive. The thermosetting adhesive is usually provided on the side opposite to the electrode surface of the chip component C (the surface having the chip recognition mark), but it may be provided on the substrate S side.

The mounting apparatus 1 includes a substrate stage 2, a lifting/pressurizing unit 3, a mounting head 4, a recognition mechanism 5, and a controller 10.

The substrate stage 2 has a function of holding the substrate S and moving the substrate S in an in-plane direction (XY directions). Here, the vacuum suction method is suitable for holding the substrate S, but the invention is not limited to this and an electrostatic suction method may be adopted.

The lifting/pressurizing unit 3 has a function of moving the mounting head 4 in the vertical direction (Z direction) of the substrate S and a function of adjusting the pressure applied to the chip component C via the mounting head 4. It is desirable to have a function of adjusting the angle of the head 4 in the rotational direction about the Z direction.

The mounting head 4 holds the chip component C and press-bonds it to the substrate S. The mounting head 4 includes a head body 40, a heater unit 41, and an attachment tool 42 as constituent elements. The head main body 40 is connected to the lifting/pressurizing unit 3, and the heater unit 41 is held and arranged on the lower side. The heater section 41 has a heat generating function, and heats the chip component C via the attachment tool 42. Further, the heater unit 41 has a function of sucking and holding the attachment tool 42 by using a depressurized flow path (not shown). The attachment tool 42 sucks and holds the chip component C. A tool suitable for the shape of the chip component C is selected and sucked and held by the heater unit 41.

In the present invention, the board recognition mark and the chip recognition mark are observed through the mounting head 4. For this reason, in this embodiment, the attachment tool 42 is formed of a transparent member, but a through hole may be provided at the positions of the substrate recognition mark and the chip recognition mark. The heater portion 41 needs to be formed of a transparent member or have an opening so that the substrate recognition mark and the chip recognition mark can be observed. In this embodiment, the through hole 41H is provided. Here, the through hole 41H may be provided in accordance with the positions of the individual board recognition mark and the chip recognition mark, but since it is not necessary to replace the through hole 41H depending on the shape of the chip component C, the hole shape that can cover all dimensional specification ranges. Is desirable. Further, the mounting head 4 needs a space into which the image capturing section 50 for observing the board recognition mark and the chip recognition mark can enter, and in this embodiment, a head space 40V is provided as shown in FIG. .. That is, in the mounting apparatus 1 of FIG. 1, the head main body 40 has a structure including the side plate and the top plate provided on the heater unit 41.

The recognition mechanism 5 is used for recognizing the positions of the board recognition mark and the chip recognition mark through the attachment tool 42 and the heater unit 41 and over the mounting head 4 to acquire position information. In the present embodiment, the recognition mechanism 5 includes the image capturing unit 50, the optical system 52, and the image pickup unit 53 connected to the optical system 52 as constituent elements.

The image capturing unit 50 is arranged above the recognition target acquired by the imaging unit 53, and stores the recognition target within the visual field. The image capturing section 50 has a function of changing the direction of the optical path by the reflection means 510, and the optical system 52 has an optical lens and a function of enlarging an image to obtain high resolution. There is.

The recognition mechanism 5 is configured to be movable in the in-plane direction of the substrate S (and the chip component C) within the head space 40V by a drive mechanism (not shown). Further, the substrate S can be moved in the vertical direction (Z direction) so that the focus position can be adjusted for each recognition mark.

The mounting head 4 is configured to be independently movable in the vertical direction with respect to the substrate S, and the recognition mechanism 5 that has entered the head space 40V does not interfere even if the mounting head 4 moves in the vertical direction. Therefore, the head space 40V is designed.

The control unit 10 controls the operation of the mounting apparatus 1, and is connected to the mounting stage 2, the lifting/pressurizing unit 3, the mounting head 4, and the recognition mechanism 5.

The control unit 10 is essentially composed of a CPU and a storage device as main constituent elements, and is connected to each device through an interface as necessary, and by incorporating a program, the acquired data is used to perform an operation. It is also possible to carry out and output according to the calculation result.

The controller 10 is connected to the substrate stage 2 and has a function of controlling the holding and releasing of the substrate S by the substrate stage 2 and controlling the movement of the substrate S in the in-plane direction.

The control unit 10 is connected to the lifting/pressurizing unit 3 and has a function of driving the mounting head 4 in a direction perpendicular to the substrate S (Z direction) and in a rotational direction about the Z direction, and controlling a pressing force. doing.

The control unit 10 is connected to the mounting head 4 and has a function of suction-holding and releasing the chip component C by the attachment tool 42 and controlling a heating temperature of the heater unit 41.

The control unit 10 is connected to the recognition mechanism 5 and controls the drive of the substrate S (and the chip component C) in the in-plane direction and the drive in the direction perpendicular to the substrate S (Z direction), and also controls the imaging unit 53. It has a function of acquiring image data. Further, the control unit 10 has an image processing function, and has a function of obtaining the position of the recognition target in the image acquired by the imaging unit 53.

Hereinafter, the process of aligning the substrate S and the chip component C to the process of measuring and inspecting the mounting accuracy by the mounting apparatus 1 shown in FIG. 1 will be described.

First, in the pre-process of alignment, the control unit 10 causes the substrate stage 2 to hold the substrate S and the mounting head 4 to hold the chip component C. At that time, the substrate S is arranged within a predetermined range of the substrate stage 2, and the chip component C is held within a predetermined range of the attachment tool 42. That is, the chip component C and the substrate S are roughly aligned. Therefore, through the through hole 41H of the heater 41 and the attachment tool 42, all of the board recognition first mark AS1, the board recognition second mark AS2, the chip recognition first mark AC1, and the chip recognition second mark AC2 are mounted. It is observable over 4 years.

3 to 6 are diagrams for explaining the alignment step, and are diagrams showing a process of obtaining the position information of the substrate recognition mark and the chip recognition mark.

First, FIG. 3 shows a process of acquiring the position information of the substrate recognition first mark AS1 of the substrate S. Here, FIG. 3A is a view of the mounting apparatus 1 viewed from the Y direction, and FIG. 3B is a view of the mounting apparatus 1 viewed from the X direction (partially see through). Note that the relationships shown in FIGS. 3A and 3B are the same for FIGS. 4 to 6 (in addition, FIGS. 7 to 12, 14 to 15, and 17 to 19). Is the same).

In FIG. 3, the control unit 10 lowers the mounting head 4 to bring the chip component C close to the substrate S. In this state, as shown in FIG. 2, the substrate S and the chip component C are provided with a gap D that allows relative movement in the in-plane direction without interference between the two.

In FIG. 3, the control unit 10 controls the recognition mechanism 5 so that the substrate recognition first mark AS1 is located near the center of the optical axis of the image capturing unit 50. In this state, the XY position information of the image capturing section 50 is stored in the control section 10. In addition, the control unit 10 controls the image pickup unit 53 to image the substrate recognition first mark AS1 in a focused state, and uses the image processing function to obtain the XY position information of the substrate recognition first mark AS1 in the visual field. Ask and remember.

Next, the control unit 10 controls the driving means of the recognition mechanism 5 so that the chip recognition first mark AC1 is located near the center of the visual field of the image capturing unit 50 as shown in FIG. Are moved in the XY plane. At that time, since the distance from the image capturing unit 50 to the chip recognition first mark AC1 is different from the distance to the substrate recognition first mark AS1, the image acquired by the imaging unit 53 is out of focus. Therefore, in the present embodiment, the recognition mechanism 5 is moved in the vertical direction (Z direction) with respect to the substrate S by the difference in height between the substrate recognition first mark AS1 and the chip recognition first mark AC1.

In the state of FIG. 4, the XY position information of the image capturing unit 50 is stored in the control unit 10. Further, the control unit 10 controls the imaging unit 53 to image the chip recognition first mark AC1 in a focused state, and obtains the XY position information of the chip recognition first mark AC1 in the visual field by the image processing function. Remember.

Next, the control unit 10 controls the driving unit of the recognition mechanism 5 so that the chip recognition second mark AC2 is positioned near the center of the visual field of the image capturing unit 50 as shown in FIG. Are moved in the XY plane. At that time, since the distance from the image capturing unit 50 to the chip recognition second mark AC2 is the same as the distance to the chip recognition first mark AC1, the recognition mechanism 5 is moved in the vertical direction (Z Direction) need not be moved.

In the state of FIG. 5, the XY position information of the image capturing unit 50 is stored in the control unit 10. Further, the control unit 10 controls the image pickup means 53 to image the chip recognition second mark AC2 in a focused state, and obtains the XY position information of the chip recognition second mark AC2 in the visual field by the image processing function. Remember.

After that, the control unit 10 controls the driving unit of the recognition mechanism 5 so that the board recognition second mark AS2 is positioned near the center of the visual field of the image capturing unit 50 as shown in FIG. Are moved in the XY plane. At that time, in order to adjust the focus, the recognition mechanism 5 is moved in the vertical direction (Z direction) with respect to the substrate S by the difference in height between the chip recognition second mark AC2 and the substrate recognition second mark AS2.

In the state of FIG. 6, the XY position information of the image capturing unit 50 is stored in the control unit 10. Further, the control unit 10 controls the image pickup means 53 to image the substrate recognition second mark AS2 in a focused state, and obtains the XY position information of the substrate recognition second mark AS2 in the visual field by the image processing function. Remember.

As described above, in the present embodiment, the relative positional relationship between the substrate recognition mark and the chip recognition mark is obtained based on the XY position information of the recognition mechanism 5 and the XY position information of the recognition mark within the field of view of the image acquired by the imaging unit 53. Can be done. Further, since the position information is obtained by recognizing the image while focusing on the individual board recognition mark and the chip recognition mark, it is possible to obtain highly accurate position information.

From the relative position information obtained above, the control unit 10 calculates and obtains the amount of positional deviation between the board S and the chip component C.

After that, the control unit 10 calculates the correction movement amount of the substrate S and the chip component C within the substrate surface in order to correct this positional deviation, and drives the substrate stage 2 and/or the mounting head 4 in the in-plane direction. Then, the substrate S and the chip component C are aligned so that the amount of positional deviation is within an allowable range.

After the alignment of the board S and the chip component C is completed, the mounting process is started. In the mounting process, the control unit 10 lowers the mounting head 4 to bring the chip component C into close contact with the substrate S, and mounts the chip component C with a predetermined pressure. At that time, the chip component C is fixed to the substrate S by heating the thermosetting adhesive between the substrate S and the chip component C by the heater portion 41 of the mounting head 4. After pressurizing and heating for a predetermined time, the mounting head 4 releases the suction holding of the chip component C and ascends, and the mounting process is completed.

By the way, from the viewpoint of quality control, it is required to perform 100% mounting position accuracy measurement inspection after the mounting process is completed. However, if the mounting position accuracy measurement is performed by another device after the mounting process is completed, the cost is increased. Further, when a defect in mounting position accuracy occurs, it takes time to notice it, which causes a delay in corrective action. Therefore, as shown in FIG. 7, by using the recognition mechanism 5 of the mounting apparatus 1, the positional information of the board recognition first mark AS1 and the chip recognition first mark AC1 and the board after the mounting step is completed as in the alignment step. A function is added to obtain the position information of the recognition second mark AS2 and the chip recognition second mark AC2 and obtain the mounting position accuracy in the state where the chip component C is mounted on the substrate S. With this method, a device different from the mounting device is unnecessary, and the cost does not increase.

However, when the mounting position accuracy is measured and inspected by using the recognition mechanism 5 of the mounting apparatus 1 after the mounting process is completed, the operation time of the mounting position accuracy measurement is increased. Is accompanied by a marked decrease in productivity.

Therefore, according to the present invention, the chip recognition mark and the board recognition mark can be recognized through the mounting head 4 and the positional relationship between the substrate S and the chip component C is determined when the chip component C is in close contact with the substrate S. Focusing on the determination, the position information of each board recognition mark and chip recognition mark is obtained at the stage of the mounting process, and the measurement and inspection of the mounting position accuracy is realized. That is, the chip component C held and pressed by the mounting head 4 is fixed to the substrate S held by the substrate stage 2 at the stage of close contact, and the state is maintained by the adhesive curing, By starting the measurement and inspection of the mounting position accuracy at the stage during the mounting process, and by performing both processes in parallel, it is possible to perform all the mounting accuracy measurement and inspection without increasing costs and lowering production capacity. It is a thing.

Hereinafter, an embodiment in which the mounting apparatus 1 is used to measure the mounting position accuracy in parallel with the mounting process will be described. FIG. 8 shows a state in which the mounting apparatus 1 lowers the mounting head 4 in the mounting process to bring the chip component C into close contact with the substrate S. The mounting accuracy measurement/inspection step in the present embodiment can be started immediately after the mounting head 4 is lowered and the chip component C is brought into close contact with the substrate S. Here, whether or not the chip component C is in close contact with the substrate S can be determined by a pressure sensor, a displacement sensor, or the like (not shown).

FIG. 9 shows a process in which the mounting apparatus 1 acquires the position information of the substrate recognition first mark AS1 of the substrate S in the mounting process in which the chip component C is brought into close contact with the substrate S. The operation of the recognition mechanism 5 is as follows. This is the same as the alignment step shown in FIG.

The subsequent mounting accuracy measurement/inspection process is similar to the alignment process as shown in FIGS. 10 to 12, and the substrate recognition first mark AS1 and the chip recognition first mark AS1 obtained in the states of FIGS. The mounting position accuracy is obtained from the relative positional relationship between the 1 mark AC1 and the relative positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2. That is, the controller 10 determines the relative positional relationship between the substrate recognition first mark AS1 and the chip recognition first mark AC1 and the positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2 at a predetermined position on the substrate S. The mounting position accuracy of the chip component C on the substrate S is calculated and calculated by comparing the case where the component C is accurately mounted and the position information actually obtained by the recognition using the recognition mechanism 5.

By the way, in the alignment process of FIGS. 3 to 6, since the recognition mechanism 5 finishes in the state of recognizing the board recognition second mark AS2, it is preferable to start the mounting position accuracy measurement/inspection process from the board recognition second mark AS2. Most efficient. Further, since the recognition mechanism 5 is independent of the mounting head 4, even if the mounting head 4 is lowered between the alignment process and the mounting process, the positional relationship between the image capturing unit 50 and the board recognition second mark AS2 is maintained. Since there is no change, focus adjustment is unnecessary.

If the time required for the mounting accuracy measurement/inspection process is longer than the time required for the mounting process, the mounting head 4 rises during the mounting accuracy measurement process, but the recognition mechanism 5 is independent of the mounting head 4. Since there is no change in the distance between the image capturing unit 50 and each recognition target, the operation of the recognition mechanism 5 is not affected by the position of the mounting head 4.
That is, the time of the mounting process (the time from immediately after the mounting head 4 is lowered and the chip component C is brought into close contact with the substrate S until the mounting head 4 is completely lifted)≧the time of the mounting position accuracy measurement/inspection process Therefore, it is possible to measure and inspect all the mounting positions without lowering the productivity.

By the way, when the chip component C is in close contact with the substrate S, the gap D in FIG. 2 is zero, and the vertical difference in height between the substrate recognition mark and the chip recognition mark is “the thickness TC of the chip component C”. That is, as the chip thickness TC becomes smaller, the vertical difference between the substrate recognition mark and the chip recognition mark also becomes smaller. Here, if the vertical difference between the board recognition mark and the chip recognition mark is within the depth of field of the image pickup means 53, as shown in FIG. 13, the board recognition first mark AS1 and the chip recognition first mark AC1 are displayed. This means that both can be clearly and simultaneously imaged.

That is, when the chip thickness TC is small and the vertical difference between the mounted board recognition mark and the chip recognition mark is within the depth of field of the image pickup means 53, as shown in FIG. 50 is the position near the midpoint of the substrate recognition first mark AS1 and the chip recognition first mark AC1, and the image pickup means 53 can simultaneously image and recognize both recognition marks within the depth of focus and within the same field of view. .. Further, as shown in FIG. 15, if the board recognition second mark A2 and the chip recognition second mark AC2 are similarly imaged and recognized at the same time, the number of times of imaging can be reduced by half, which is required in the mounting position accuracy measurement/inspection step. The time can be greatly reduced. Therefore, by adding such a function in advance, the time of the mounting process (the time from immediately after the mounting head 4 is lowered and the chip component C is brought into close contact with the substrate S until the mounting head 4 is completely lifted)≧ There is an extremely high possibility that the mounting position accuracy measurement/inspection process can be completed and that all the mounting position accuracy measurement/inspections can be performed without lowering productivity.

By the way, if it is possible to obtain the mounting position accuracy during the mounting process using the image pickup means 53, the change of the optical axis position or the change of the optical axis inclination of the image pickup means 53 due to the environmental change, or the lifting/pressurizing unit 3 can be performed. It is possible to perform a calibration calculation for a shift of the mounting position due to a change in the inclination of the. That is, in the alignment process in which the image pickup unit 53 images the substrate recognition mark and the chip recognition mark to perform the alignment, even if the positional deviation amount of the calculation result is within the allowable range, the image pickup unit 53 is used to identify the substrate recognition mark. If there is a displacement in the mounting position accuracy measurement result of imaging the chip recognition mark, it is possible that the optical axis position of the imaging means 53 has changed, the optical axis inclination has changed, or the inclination of the lifting/pressurizing unit 3 has changed. It is easy to understand, and by always performing the calibration calculation automatically, it is possible to always stably mount the chip component C within the permissible range of the predetermined position without shifting the mounting position on the substrate S.

In this way, by calculating the mounting position accuracy at the stage during the mounting process, feeding it back to the mounting position, and constantly automatically adjusting and adjusting the mounting position, there is no increase in cost or reduction in production capacity. , Very stable and highly accurate implementation is possible.

In mounting the chip component C on the component-embedded substrate (embedded substrate), the function of simultaneously imaging the substrate recognition mark and the chip recognition mark within the depth of focus and within the same field of view is extremely effective. That is, when the chip component C is mounted in the recess SC of the substrate S having the recess SC as shown in FIGS. 16A and 17, the upper surface of the substrate S and the upper surface of the chip component C are as shown in FIG. It becomes almost the same height like. Therefore, as shown in FIG. 18, from the image capturing unit 50 of the recognition mechanism to the substrate recognition first mark AS1 and the chip recognition first mark AC1 are substantially the same vertical distance, and both of them are in the same visual field. It becomes easy to take images simultaneously with the recognition mark in focus. This is the same in the case of imaging the board recognition second mark A2 and the chip recognition second mark AC2 shown in FIG.

Also, under the condition that the upper surface of the substrate S and the upper surface of the chip component C are at the same height, the vertical height difference between the board recognition mark and the chip recognition mark is zero, and a clearer image can be obtained. It is also most suitable for the function of constantly calibrating and adjusting the mounting position automatically by grasping the change of the optical axis position of the image pickup means 53, the change of the optical axis tilt, the change of the tilt of the lifting/pressurizing unit 3, and the like. It is possible to realize a highly reliable and highly accurate mounting device.

DESCRIPTION OF SYMBOLS 1 Mounting device 2 Substrate stage 3 Lifting/pressurizing unit 4 Mounting head 5 Recognition mechanism 10 Control part 40 Head body 40V Head space 41 Heater part 41H Through hole 42 Attachment tool 50 Image capturing part 52 Optical system 53 Imaging means 510 Reflecting means C Chip component S Substrate AC1, AC2 Chip identification mark AS1, AS2 Substrate identification mark D Gap between chip component and substrate during alignment TC Thickness of chip component TS Thickness of substrate SC Recess of substrate

Claims (6)

A mounting device for mounting a chip component having a chip recognition mark for position alignment and a substrate having a substrate recognition mark for position alignment face-up with the chip recognition mark and the substrate recognition mark facing upward. ,
A substrate stage for holding the substrate,
A mounting head that holds the chip,
An elevating means for elevating and lowering the mounting head in a direction perpendicular to the substrate,
A recognition mechanism that recognizes the chip recognition mark and the substrate recognition mark from the upper side of the mounting head over the mounting head, and is movable in the in-plane direction of the substrate,
The function of calculating the positional deviation amount of the chip component and the substrate from the positional information of the chip component recognition mark and the substrate recognition mark, which is connected to the recognition mechanism and obtained from the recognition mechanism, and the positional deviation amount. And a control unit having a function of driving the mounting head unit and/or the substrate stage to perform position adjustment.
After performing the alignment of the chip component and the substrate by the recognition mechanism, the mounting head holding the chip component is lowered in the vertical direction with respect to the substrate, and after the chip component comes into close contact with the substrate. ,
The control unit causes the recognition mechanism to start the recognition operation of the chip recognition mark and the board recognition mark in parallel, and displays the chip recognition mark and the board recognition mark in a mounted state in which the chip component is in close contact with the board. A mounting apparatus having a function of recognizing through the mounting head and calculating mounting position accuracy of the chip component and the substrate. The mounting apparatus according to claim 1, wherein
In the recognition operation of the chip recognition mark and the board recognition mark performed over the head, in order to calculate the mounting position accuracy that is started in parallel after the chip components are in close contact with the board,
A mounting device having a function of simultaneously recognizing the chip recognition mark and the board recognition mark at a position near the midpoint of the chip recognition mark and the board recognition mark, with the optical axis center of the recognition mechanism. The mounting apparatus according to claim 2, wherein
A mounting device having a function of feeding back the calculated mounting position accuracy to the mounting position and automatically calibrating and adjusting the mounting position. A mounting method for mounting a chip component having a chip recognition mark for alignment on a substrate having a substrate recognition mark for alignment, wherein the chip component is arranged with a gap provided between the chip component and the chip A positioning step of recognizing the recognition mark and the board recognition mark from the same direction over the mounting head to match the relative positional relationship between the chip component and the board, and mounting the chip part by closely contacting and pressing the board. And a mounting step in which the chip component is in close contact with the substrate, the chip recognition mark and the substrate recognition mark are recognized from the same direction over the mounting head, and the chip component and the substrate are recognized. Equipped with a mounting accuracy measurement and inspection process that calculates the relative positional relationship,
A mounting method in which the mounting step and the mounting accuracy measurement/inspection step are performed in parallel after the chip component comes into close contact with the substrate. The mounting method according to claim 4, wherein
The mounting method for recognizing the chip recognition mark and the board recognition mark at the same time in the mounting accuracy measurement/inspection step, where the center of the optical axis of the recognition mechanism is near the midpoint of the chip recognition mark and the board recognition mark. The mounting method according to claim 5, wherein
A mounting method in which the result of the mounting position accuracy calculated in the mounting accuracy measurement/inspection step is fed back to the mounting position to automatically calibrate and adjust the mounting position.