CN220305184U - Device for testing chip - Google Patents
Device for testing chip Download PDFInfo
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- CN220305184U CN220305184U CN202321501359.8U CN202321501359U CN220305184U CN 220305184 U CN220305184 U CN 220305184U CN 202321501359 U CN202321501359 U CN 202321501359U CN 220305184 U CN220305184 U CN 220305184U
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- imaging picture
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- 238000003384 imaging method Methods 0.000 claims abstract description 78
- 238000010438 heat treatment Methods 0.000 claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims abstract description 50
- 238000004891 communication Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
The application provides an apparatus for detecting a chip, comprising: a stage 1, a first optical microscope 2, a first photographing device 3, and an electronic device 4; the carrier 1 is used for carrying unpackaged chips 5; the first optical microscope 2 is used for performing enlarged imaging on the end face of the chip 5; the first photographing device 3 is configured to photograph an imaging picture of the first optical microscope 2, obtain a first imaging picture, and send the first imaging picture to the electronic device 4; the electronic device 4 is configured to obtain and display the first imaging picture, so as to detect the chip 5 through the first imaging picture; wherein, a heating device is disposed in the carrier 1, and is used for heating the upper surface of the carrier 1 so as to heat the chip 5.
Description
Technical Field
The present disclosure relates to detection technology, and more particularly, to a device for detecting a chip.
Background
Referring to fig. 1, fig. 1 is a schematic diagram of an alternative structure of a packaged chip in the related art. Semiconductor laser chips are often packaged with transistor outline (TO, transistor Outline). The chip is soldered TO the heat sink of the TO header at high temperature during packaging. The appearance of the end face can be observed when the light-emitting end face of the welded chip faces upwards, and the backlight end face faces downwards, so that the backlight end face cannot be directly observed by a microscope through the base.
Currently, the chip is generally tested after being packaged. However, the backlight end face of the packaged chip is difficult to detect, and in addition, when the chip is scribed from the wafer, the light emitting end face and the backlight end face of the chip can be exposed, and the chip end face is sensitive to the external environment and is susceptible to the influence, so that the reliability is poor, and the crystal structure of the chip end face may be damaged during scribing. Therefore, the difficulty of chip detection after packaging is high and the chip is easy to damage.
Disclosure of Invention
The embodiment of the application provides a device for detecting chips, which can realize the detection of unpackaged chips.
The technical scheme of the embodiment of the application is realized as follows:
an embodiment of the present application provides an apparatus for detecting a chip, including:
a stage 1, a first optical microscope 2, a first photographing device 3, and an electronic device 4;
the carrier 1 is used for carrying unpackaged chips 5;
the first optical microscope 2 is used for performing enlarged imaging on the end face of the chip 5;
the first photographing device 3 is configured to photograph an imaging picture of the first optical microscope 2, obtain a first imaging picture, and send the first imaging picture to the electronic device 4;
the electronic device 4 is configured to obtain and display the first imaging picture, so as to detect the chip 5 through the first imaging picture;
wherein, a heating device is disposed in the carrier 1, and is used for heating the upper surface of the carrier 1 so as to heat the chip 5.
In the scheme, the heating temperature range of the heating device is 20-500 ℃.
In the above scheme, the heating device is provided with a temperature adjusting component, and the temperature adjusting component is used for adjusting the heating temperature of the heating device.
In the above scheme, a temperature measuring device is arranged in the heating device, and a temperature display screen is arranged on the outer side of the heating device;
the temperature measuring device is used for measuring the temperature of the upper surface of the carrying platform 1;
the temperature display screen is used for displaying the temperature measured by the temperature measuring device.
In the above scheme, a vacuum hole is arranged in the center of the carrying platform 1; the vacuum holes are used for vacuum adsorption of the chip 5.
In the above scheme, the device further includes: a second optical microscope 6 and a second photographing device 7, wherein the second optical microscope 6 is arranged at two sides of the stage 1 opposite to the first optical microscope 2;
the second optical microscope 6 is configured to perform magnification imaging on the light emitting end face of the chip 5;
the second photographing device 7 is configured to photograph an imaging picture of the second optical microscope 6, obtain a second imaging picture, and send the second imaging picture to the electronic device 4;
the electronic device 4 is further configured to obtain and display the second imaging picture, so as to detect the chip 5 through the first imaging picture and the second imaging picture.
In the above scheme, the first shooting device 3 and the electronic device 4 establish communication connection through a target interface driver.
In the above-mentioned scheme, the first shooting device 3 and the electronic device 4 establish communication connection through wireless signals.
In the above scheme, the device further includes: a chip pickup device 8 provided with a vacuum nozzle for sucking the chip 5 through the vacuum nozzle to place the chip 5 on the stage 1 or to remove the chip 5 from the stage 1.
In the above solution, the first photographing apparatus 3 is a charge coupled device camera.
The device provided by the embodiment of the application comprises a carrying platform 1 for carrying an unpackaged chip 5, a first optical microscope 2 for carrying out amplification imaging on the end face of the chip 5, a first imaging picture which is obtained by shooting an imaging picture of the first optical microscope 2, a first shooting device 3 for sending the first imaging picture to the electronic device 4, and an electronic device 4 for obtaining and displaying the first imaging picture so as to detect the chip 5 through the first imaging picture, wherein a heating device is arranged in the carrying platform 1 and used for heating the upper surface of the carrying platform 1 so as to heat the chip 5, and the chip is heated through the carrying platform, and the amplified picture (first imaging picture) of the end face of the chip is obtained through the first optical microscope and the first shooting device, so that the unpackaged chip can be conveniently detected.
Drawings
FIG. 1 is a schematic diagram of an alternative structure of a packaged chip in the related art;
FIG. 2 is a schematic diagram of an alternative configuration of an apparatus for detecting a chip according to an embodiment of the present application;
FIG. 3 is a schematic diagram of an alternative configuration of an apparatus for detecting a chip according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an alternative device for detecting a chip according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings, and the described embodiments should not be construed as limiting the present application, and all other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present application.
In the following description, reference is made to "some embodiments" which describe a subset of all possible embodiments, but it is to be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with one another without conflict.
In the following description, the terms "first", "second", "third" and the like are merely used to distinguish similar objects and do not represent a specific ordering of the objects, it being understood that the "first", "second", "third" may be interchanged with a specific order or sequence, as permitted, to enable embodiments of the application described herein to be practiced otherwise than as illustrated or described herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an alternative apparatus for detecting a chip according to an embodiment of the present application. The device for detecting the chip provided by the embodiment of the application comprises: a stage 1, a first optical microscope 2, a first photographing device 3, and an electronic device 4; the carrier 1 is used for carrying unpackaged chips 5; the first optical microscope 2 is used for performing enlarged imaging on the end face of the chip 5; the first photographing device 3 is configured to photograph an imaging picture of the first optical microscope 2, obtain a first imaging picture, and send the first imaging picture to the electronic device 4; the electronic device 4 is configured to obtain and display the first imaging picture, so as to detect the chip 5 through the first imaging picture; wherein, a heating device is disposed in the carrier 1, and is used for heating the upper surface of the carrier 1 so as to heat the chip 5.
In practical implementation, the upper surface of the carrier 1 is a planar structure made of a high-melting-point material, where the melting point of the high-melting-point material is at least higher than 500 ℃, and may be, for example, a high-melting-point metal, such as iron, steel, or tungsten. Wherein, the inside of the carrier 1 is provided with a heating device for heating the upper surface of the carrier 1 to heat the chip 5 placed on the carrier 1, so that the chip 5 reaches a corresponding heating temperature. Preferably, the heating temperature may be 400 ℃, for example. The chip 5 is an unpackaged chip, that is, each end face (including the light emitting end face and the backlight end face) of the chip 5 is exposed and can be directly seen. When the chip 5 is placed on the stage 1 with the end face facing the first optical microscope 2, the end face of the chip 5 is focused by the objective lens of the first optical microscope 2 and magnified-imaged. The lens of the first photographing device 3 faces the eyepiece of the first optical microscope 2, and can photograph an imaging picture in the eyepiece to obtain a first imaging picture. In some embodiments, the first photographing apparatus 3 is a charge coupled device (CCD, charge coupled device) camera.
Here, the first imaged picture is an enlarged picture presented with the end face of the chip 5. The first photographing device 3 is communicatively connected to the electronic device 4, and after photographing to obtain a first imaged picture, the first imaged picture is sent to the electronic device 4. The electronic device 4 has a display screen capable of displaying the first imaged picture. In some embodiments, the electronic device 4 may be a terminal device, such as a notebook, tablet or desktop computer, or the like. The electronic device 4 may also be a separate display for displaying only the first imaged picture. The user can detect the end face of the chip 5 by observing the first imaging picture displayed by the electronic device 4, so as to determine whether the end face of the chip 5 is deformed at the corresponding heating temperature. Here, the number of first imaged pictures is one or more. In practical implementation, a plurality of first imaging pictures can be taken for subsequent chip detection, so that the detection is more accurate. In some embodiments, the electronic device 4 is a terminal device, and after the electronic device 4 obtains the first imaging picture, the electronic device 4 can perform similarity comparison with a standard end face picture, when the similarity is smaller than or equal to a threshold value, it is determined that the detected chip is not qualified, and when the similarity is greater than the threshold value, it is determined that the detected chip is qualified. In practical implementation, one end face of the chip 5 may be faced to the objective lens of the first optical microscope 2, and after the shooting of the end face is completed, the other end face of the chip 5 may be faced to the objective lens of the first optical microscope 2, so as to complete the shooting of the other end face.
In some embodiments, the heating device has a heating temperature in the range of 20 ℃ to 500 ℃. The heating device is provided with a temperature adjusting component which is used for adjusting the heating temperature of the heating device. It should be understood that the temperature adjustment may be performed a plurality of times by the temperature adjustment means to obtain a plurality of heating temperatures, and the chip may be heated based on the plurality of heating temperatures, respectively. For each heating temperature, the amplification imaging of the end face of the chip and the shooting of the imaging picture are correspondingly carried out, that is, each heating temperature corresponds to a group of first imaging pictures. Where the number of group of imaging pictures is one or more. The device provided by the embodiment of the application can detect the deformation condition of the end face of the chip after being heated at different temperatures, so that the quality of the chip is determined.
In actual practice, the user can adjust the heating temperature by the temperature adjusting means. Here, the temperature adjusting means may include at least two temperature steps, each step corresponding to one heating temperature. Illustratively, the at least two temperature steps include several temperature steps of 20 ℃, 100 ℃, 200 ℃, 300 ℃, 400 ℃, 500 ℃, and the like. In some embodiments, the temperature adjustment member may also be in the form of a knob that enables adjustment of the heating temperature within an adjustable range. The adjustable range may be, for example, 20℃to 500 ℃.
In some embodiments, a temperature measuring device is arranged in the heating device, and a temperature display screen is arranged on the outer side of the heating device; the temperature measuring device is used for measuring the temperature of the upper surface of the carrying platform 1; the temperature display screen is used for displaying the temperature measured by the temperature measuring device. In actual practice, a temperature measuring device capable of measuring the temperature of the upper surface of the stage 1 is provided in the heating device. Here, the upper surface of the carrier 1 is a plane that directly carries the chip 5. The temperature of the upper surface of the stage 1 is measured by the temperature measuring means, so that the current actual heating temperature of the chip 5 can be determined. The temperature measuring device transmits the measured temperature to the temperature display screen in real time for display, and the temperature display screen can display the temperature of the upper surface of the carrier 1 in real time. When the user confirms that the temperature displayed on the temperature display screen reaches the required detection temperature, the first photographing device 3 can be controlled to photograph the imaging picture of the first optical microscope 2, so as to obtain a first imaging picture. In some embodiments, after the chip is placed on the stage 1 and the heating temperature is set, the user may start to control the first photographing device 3 to photograph, so as to obtain a picture of an enlarged picture (i.e., a first imaging picture) of the end face corresponding to the chip in the whole heating process, so that the shape of the end face of the chip in the whole heating process can be observed, and whether the chip is deformed after being heated can be determined. If the deformation occurs, the chip is determined to be unqualified.
In some embodiments, the center of the carrier 1 is provided with a vacuum hole; the vacuum holes are used for vacuum adsorption of the chip 5. In this embodiment of the present application, the center of the carrier 1 is provided with a vacuum hole that can vacuum adsorb the chip 5, and through vacuum adsorption, the first imaging picture that takes a picture that avoids the chip to produce displacement and cause is inaccurate, or the inconsistent condition of the shooting angle of different first imaging pictures in a plurality of first imaging pictures that take a picture.
In some embodiments, referring to fig. 3, fig. 3 is a schematic diagram of an alternative structure of an apparatus for detecting a chip according to an embodiment of the present application. The apparatus further comprises: a second optical microscope 6 and a second photographing device 7, wherein the second optical microscope 6 is arranged at two sides of the stage 1 opposite to the first optical microscope 2; the second optical microscope 6 is configured to perform magnification imaging on the light emitting end face of the chip 5; the second photographing device 7 is configured to photograph an imaging picture of the second optical microscope 6, obtain a second imaging picture, and send the second imaging picture to the electronic device 4; the electronic device 4 is further configured to obtain and display the second imaging picture, so as to detect the chip 5 through the first imaging picture and the second imaging picture.
In this embodiment, the second optical microscope 6 is disposed opposite to the first optical microscope 2 at two sides of the stage 1. In practical implementation, the chip 5 may be placed on the stage 1, and one end face (for example, a light emitting end face) of the chip 5 faces the first optical microscope 2, and the other end face (for example, a backlight end face) faces the second optical microscope 6. In some embodiments, the second photographing apparatus 6 is a charge coupled device (CCD, charge coupled device) camera. In practical implementation, the two end faces of the chip 5 can be simultaneously amplified and imaged through the first optical microscope 2 and the second optical microscope 6, imaging pictures of the first optical microscope 2 and the second optical microscope 6 are respectively and simultaneously shot through the first shooting device 3 and the second shooting device 7, a first imaging picture and a second imaging picture are obtained, and the first imaging picture and the second imaging picture are respectively sent to the electronic device 4. In some embodiments, if a magnified image of both end faces of the chip 5 is to be obtained by photographing multiple times during heating, the first optical microscope 2 and the second optical microscope 6 are made to photograph synchronously. Through setting up two optical microscope and corresponding shooting equipment, can be simultaneously to the collection of the amplified image of two terminal surfaces of chip to realize the detection to two terminal surfaces, also avoided the inconvenience and the danger that need move the chip under high temperature in order to detect two terminal surfaces.
In some embodiments, the first photographing apparatus 3 establishes a communication connection with the electronic apparatus 4 through a target interface driver. In this embodiment of the present application, the first photographing device 3 and the electronic device 4 may be connected through a target interface, and establish communication connection through a target interface driver corresponding to the target interface.
In some embodiments, the first photographing apparatus 3 establishes a communication connection with the electronic apparatus 4 through a wireless signal. In this embodiment of the present application, the first capturing device 3 and the electronic device 4 may establish a communication connection through a wireless signal, and implement transmission of data (such as a first imaging picture) through a target application.
In addition, the second photographing apparatus 7 and the electronic apparatus 4 may also establish a communication connection through a target interface driver or a communication connection through a wireless signal.
In some embodiments, referring to fig. 4, fig. 4 is a schematic structural diagram of an alternative apparatus for detecting a chip provided in an embodiment of the present application. The apparatus further comprises: a chip pickup device 8 provided with a vacuum nozzle for sucking the chip 5 through the vacuum nozzle to place the chip 5 on the stage 1 or to remove the chip 5 from the stage 1. In actual implementation, the device further comprises a chip pick-up device 8. The chip pickup device 8 is provided with a vacuum nozzle capable of sucking the chip 5. In the embodiment of the application, the pressure of the vacuum nozzle of the chip pickup device 8 sucking the chip 5 can be adjusted.
The device provided by the embodiment of the application comprises a carrying platform 1 for carrying an unpackaged chip 5, a first optical microscope 2 for carrying out amplification imaging on the end face of the chip 5, a first imaging picture which is obtained by shooting an imaging picture of the first optical microscope 2, a first shooting device 3 for sending the first imaging picture to the electronic device 4, and an electronic device 4 for obtaining and displaying the first imaging picture so as to detect the chip 5 through the first imaging picture, wherein a heating device is arranged in the carrying platform 1 and used for heating the upper surface of the carrying platform 1 so as to heat the chip 5, and the chip is heated through the carrying platform, and the amplified picture (first imaging picture) of the end face of the chip is obtained through the first optical microscope and the first shooting device, so that the unpackaged chip can be conveniently detected.
The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application. Any modifications, equivalent substitutions, improvements, etc. that are within the spirit and scope of the present application are intended to be included within the scope of the present application.
Claims (10)
1. An apparatus for inspecting a chip, comprising: a carrier (1), a first optical microscope (2), a first shooting device (3) and an electronic device (4);
the carrier (1) is used for carrying unpackaged chips (5);
the first optical microscope (2) is used for carrying out enlarged imaging on the end face of the chip (5);
the first shooting device (3) is used for shooting an imaging picture of the first optical microscope (2) to obtain a first imaging picture, and sending the first imaging picture to the electronic device (4);
-the electronic device (4) for obtaining and displaying the first imaged picture for detection of the chip (5) by the first imaged picture;
the chip (5) is arranged on the upper surface of the carrying platform (1), and a heating device is arranged in the carrying platform (1) and used for heating the upper surface of the carrying platform (1) so as to heat the chip.
2. The apparatus of claim 1, wherein the heating means has a heating temperature in the range of 20 ℃ to 500 ℃.
3. The device according to claim 1, wherein a temperature adjusting member is provided on the heating device, and the temperature adjusting member is used for adjusting the heating temperature of the heating device.
4. The device according to claim 1, wherein a temperature measuring device is arranged in the heating device, and a temperature display screen is arranged on the outer side of the heating device;
the temperature measuring device is used for measuring the temperature of the upper surface of the carrying platform (1);
the temperature display screen is used for displaying the temperature measured by the temperature measuring device.
5. The device according to claim 1, characterized in that the centre of the carrier (1) is provided with a vacuum hole; the vacuum holes are used for vacuum adsorption of the chip (5).
6. The apparatus of claim 1, wherein the apparatus further comprises: a second optical microscope (6) and a second photographing device (7), wherein the second optical microscope (6) is arranged on two sides of the carrying platform (1) opposite to the first optical microscope (2);
the second optical microscope (6) is used for amplifying and imaging the light emergent end face of the chip (5);
the second shooting device (7) is used for shooting an imaging picture of the second optical microscope (6) to obtain a second imaging picture, and sending the second imaging picture to the electronic device (4);
the electronic device (4) is further configured to obtain and display the second imaging picture for detection of the chip (5) by the first imaging picture and the second imaging picture.
7. The apparatus according to claim 1, characterized in that the first camera device (3) establishes a communication connection with the electronic device (4) via a target interface drive.
8. The apparatus according to claim 1, characterized in that the first photographing device (3) establishes a communication connection with the electronic device (4) by means of wireless signals.
9. The apparatus of claim 1, wherein the apparatus further comprises: a chip pick-up device (8) provided with a vacuum nozzle for sucking the chip (5) through the vacuum nozzle to place the chip (5) on the stage (1) or to remove the chip (5) from the stage (1).
10. The apparatus according to claim 1, characterized in that the first photographing device (3) is a charge coupled device camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321501359.8U CN220305184U (en) | 2023-06-12 | 2023-06-12 | Device for testing chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321501359.8U CN220305184U (en) | 2023-06-12 | 2023-06-12 | Device for testing chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220305184U true CN220305184U (en) | 2024-01-05 |
Family
ID=89348015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321501359.8U Active CN220305184U (en) | 2023-06-12 | 2023-06-12 | Device for testing chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220305184U (en) |
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2023
- 2023-06-12 CN CN202321501359.8U patent/CN220305184U/en active Active
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