CN100477889C - Method for manufacturing soft-hard composite board - Google Patents
Method for manufacturing soft-hard composite board Download PDFInfo
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- CN100477889C CN100477889C CNB200510103072XA CN200510103072A CN100477889C CN 100477889 C CN100477889 C CN 100477889C CN B200510103072X A CNB200510103072X A CN B200510103072XA CN 200510103072 A CN200510103072 A CN 200510103072A CN 100477889 C CN100477889 C CN 100477889C
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- hard composite
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Abstract
The invention discloses a kind of method of creating soft and hard composite board. Supply many platelet soft board monomers and a big had board, set these soft board monomers on the surface of the hard board, locate precisely by locating columns, fix in the pre-junction way and fix these soft board monomers on the hard board in the hot press way to create the soft and hard composite board. So it solves the problem that the product is defective because the rate of heat expansion is different at hot press. The soft and hard composite board can be used to produce the composite board product of big size.
Description
Technical field
The present invention relates to a kind of manufacture method of combined type plate, refer to a kind of soft-hard composite board manufacture method design that is composited by soft board and hardboard especially.
Background technology
Soft-hard composite board is a kind of joint product that combines hardboard and soft board characteristic, can make the soft-hard composite board characteristics such as pliability, the slimming of type body and weight reduction of holding concurrently, and be widely used in the electronic installation of consumption electronic products or military and national defense purposes.
The manufacturing of present known soft-hard composite board, as shown in Figure 5, soft board 30 and hardboard 40 mainly are provided, be laid with several assembly line units on this soft board 30, and be provided with several registration holes 31 in periphery, these soft board 30 areas are corresponding to hardboard 40 areas again, and soft board 30 contrapositions fit on the hardboard 40, wear therebetween with rivet 41 or reference column between the two, and make both sets together, form soft-hard composite board with the hot pressing means.
Though the manufacture method of aforementioned soft-hard composite board provides one can make soft board be incorporated into technology on the hardboard, yet, the manufacture process of this soft-hard composite board has the higher problem of product fraction defective, because: this soft board and hardboard are to use the plate body of corresponding area size, because the material of soft board and hardboard, the difference of thickness, because of thermogenetic physical change difference big, harmomegathus rate of change difference as soft board and hardboard is big, soft in addition, though periphery has several rivets or reference column to be fixed between hardboard, so in the process of rigid-flex hot pressing, promptly because of soft, the difference of harmomegathus rate of change is big between hardboard, and the uneven problem of harmomegathus, cause the product of hot pressing bad, have a strong impact on the follow-up boring of this composite plate, the accuracy of the accurate contraposition of steps such as exposure, while also makes the fabric width of present soft-hard composite board product only limit to 250mm or the 500mm equidimension is available, and the soft-hard composite board product that is not suitable for the large tracts of land size is arranged.
Summary of the invention
The subject matter that the present invention will solve provides a kind of manufacture method of soft-hard composite board, does not wait the bad problem of product that easily produces because of coefficient of thermal expansion each other during, hardboard hot pressing soft to solve.
In order to address the above problem, the technical scheme of the manufacture method of soft-hard composite board of the present invention is:
Provide several strip soft board monomers and one than the big hardboard of soft board monomer area, again those soft board monomer distribution are positioned on the composition surface of this hardboard, and after accurately locating by several reference columns, fixed earlier with pre-engagement means, with the hot pressing means those soft board monomers are bonded on this hardboard again, make soft-hard composite board.
Get the strip soft board monomer in the soft-hard composite board manufacture method as mentioned above, provide at least one soft board, be formed with several line units group on it, forming the array shape arranges, cut apart means with cutting, die-cut etc. again this soft board is divided into several strip soft board monomers, each soft board monomer comprises the line unit group.
In the aforesaid soft-hard composite board manufacture method, employed pre-engagement means can be fixed forms such as rivet, staple, sewing, ultrasonic waves welding, high frequency welding or thermal welding after each soft board monomer set was positioned at hardboard.
Compared with prior art, the beneficial effect of the manufacture method of soft-hard composite board of the present invention is:
1, improve the product yield: the present invention be by several strip soft board monomer hot pressings on a larger area hardboard, the harmomegathus difference of using large tracts of land soft board size is divided into several units, even each strip soft board monomer has less thermal expansion rate variance when hot pressing and between hardboard, thus, can keep to each other between rigid-flex to have the position precision, makes it have the high product rate.
2, break through the restriction of existing composite board product fabric width: same as above, several strip soft board monomer hot pressings of reason of the present invention are on a larger area hardboard, harmomegathus measures of dispersion when cutting apart with the hardboard hot pressing by most strip soft board monomers, and make this composite plate can as the issuance of materials mode of print circuit plates making, make it can enlarge the product size of this composite plate.
3, reduce cost: as mentioned above, the present invention generally issuance of materials mode of print circuit plates making carries out, and can enlarge product size, its composing operation is had than multi-selection, promote the composing utilance, effectively reduce cost, and, because of the area of setting type can strengthen, thus share with most existing hardboard production equipment, and then reduce extra equipment investment expense.
4, provide good benefiting to configuration design: soft-hard composite board manufacturing technology provided by the present invention can effectively promote the accuracy of contraposition between rigid-flex, and then provides good benefiting to the degree of freedom of the configuration design of this composite plate.
Description of drawings
Fig. 1 is the schematic flow sheet in the soft-hard composite board manufacture method of the present invention preferred embodiment;
Fig. 2 is the soft board floor map that is provided in the soft-hard composite board manufacture method of the present invention preferred embodiment;
Fig. 3 is the schematic perspective view that soft board shown in Figure 2 is divided into several soft board monomers;
Fig. 4 is in the soft-hard composite board manufacture method of the present invention preferred embodiment, several soft board monomers is positioned over the schematic perspective view of a larger area hardboard;
Fig. 5 is the perspective exploded view of previous existing soft-hard composite board.
[primary clustering symbol description]
10: soft board 11: the line unit group
12: assembly line unit 13: the soft board monomer
14: registration holes
20: hardboard 21: composition surface
22: between the component groups positioning area 23: location hole
24: reference column
30: soft board 31: registration holes
40: hardboard 41: rivet
Embodiment
As shown in Figure 1, the specific embodiment of relevant soft-hard composite board manufacture method of the present invention, implementation step comprises:
Several strip soft board monomers 13 are provided, has line unit group 11 respectively on those soft board monomers 13, and periphery has several registration holes 14, described soft board monomer 13 is made, at least one soft board 10 (as shown in Figure 2) can be provided, several line units group 11 is shaped on it, forming the array shape arranges, aforesaid line unit group 11 includes several assembly line units 12 respectively, with partition means this soft board 10 is divided into several strip soft board monomers 13 (as shown in Figure 3) again, has a column line one-element group 11 on those soft board monomers 13 respectively, aforesaid partition means can be cutting, means such as die-cut, and each soft board monomer 13 periphery has several registration holes 14;
A larger area hardboard 20 is provided, this hardboard 20 can be single or multiple lift and hardens to close and form, has composition surface 21 on it, definition has 22 formation array shapes arrangements between several component groups positioning areas on this composition surface 21, has circuit in 22 between each component groups positioning area, and be provided with several location holes 23 in specific location, as shown in Figure 4;
Several soft board monomers 13 are placed on the composition surface 21 of this hardboard 20, lay respectively at 22 places between each component groups positioning area, and wear respectively by several reference columns 24 in the location hole 23 of the registration holes 14 of each soft board monomer 13 and hardboard 20, make those soft board monomers 13 precisely to being positioned at this hardboard 20 preposition places, as shown in Figure 3;
And each soft board monomer 13 is bonded on this hardboard 20 with the hot pressing means, make soft-hard composite board.
In aforementioned, when each soft board monomer set was positioned at behind the hardboard with pre-engagement means fixedly, this pre-engagement means can be utilized modes such as rivet, staple, sewing, ultrasonic waves welding, high frequency welding or thermal welding, and each soft board monomer periphery is fixed with hardboard.
The aforementioned soft-hard composite board of making can carry out the following process processing procedure according to the needs of product, as: steps such as punching, copper facing, image detection, shaping mark make purposes such as its structure that can be applied to electronic building brick dress manufacturing.
The present invention is with the design of aforementioned technical scheme, it mainly is to utilize to be divided into the soft board monomer distribution hot pressing of small size on a large-area hardboard, constitute soft-hard composite board, thus, harmomegathus difference when utilizing the soft board of small size to disperse hot pressing, make on the preferable precalculated position that is positioned at hardboard accurately of each assembly line unit on each soft board monomer, promote the product yield, guarantee the quality level of product, simultaneously, also technical scheme design whereby, make it be applicable to the soft-hard composite board product of making various different wide cut sizes, larger area product particularly, and make this soft-hard composite board can utilize the issuance of materials mode of general print circuit plates making to carry out by this, make its composing operation have more selectivity, and can share existing hardboard production equipment, reduce cost effectively, in the rigid-flex recombination process, can effectively guarantee the accuracy of contraposition to each other in addition, the degree of freedom to the design of the configuration of this composite plate provides good benefiting, therefore, the invention provides a kind of soft-hard composite board method for making design of dark tool industrial utilization.
Claims (10)
1, a kind of soft-hard composite board manufacture method comprises:
Several strip soft board monomers are provided, have the line unit group respectively on those soft board monomers, and periphery have several registration holes;
Provide one to have composition surface on it than the big hardboard of soft board monomer area, definition has between several component groups positioning areas the array of formation shape arrange on this composition surface, has circuit between each component groups positioning area, and is provided with several location holes;
Several soft board monomers are placed on the composition surface of this hardboard, lay respectively between each component groups positioning area and locate, and by reference column wear do accurate contraposition in the registration holes of each soft board monomer and the hardboard location hole after, and fixed with pre-engagement means;
And each soft board monomer is bonded on this hardboard with the hot pressing means, make soft-hard composite board.
2, soft-hard composite board manufacture method as claimed in claim 1, wherein the formation of these several strip soft board monomers provides at least one soft board, is formed with several line units group on it, form the array shape and arrange, with partition means this soft board is divided into several strip soft board monomers again.
3, soft-hard composite board manufacture method as claimed in claim 2, wherein this partition means is die-cut mode.
4, soft-hard composite board manufacture method as claimed in claim 2, wherein this partition means is a cutting mode.
5, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize rivet with each soft board monomer periphery and the fixing mode of hardboard.
6, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize staple with each soft board monomer periphery and the fixing mode of hardboard.
7, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize the sewing means with each soft board monomer periphery and the fixing mode of hardboard.
8, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize ultrasonic waves welding means with each soft board monomer periphery and the fixing mode of hardboard.
9, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize high frequency welding means with each soft board monomer periphery and the fixing mode of hardboard.
10, soft-hard composite board manufacture method as claimed in claim 1, wherein pre-engagement means are to utilize the thermal bonding means with each soft board monomer periphery and the fixing mode of hardboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510103072XA CN100477889C (en) | 2005-09-19 | 2005-09-19 | Method for manufacturing soft-hard composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510103072XA CN100477889C (en) | 2005-09-19 | 2005-09-19 | Method for manufacturing soft-hard composite board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1937890A CN1937890A (en) | 2007-03-28 |
| CN100477889C true CN100477889C (en) | 2009-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200510103072XA Expired - Fee Related CN100477889C (en) | 2005-09-19 | 2005-09-19 | Method for manufacturing soft-hard composite board |
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| CN (1) | CN100477889C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562949B (en) * | 2008-04-18 | 2011-04-13 | 华通电脑股份有限公司 | Manufacturing method of rigid-flexible plate |
| CN101998766B (en) * | 2009-08-25 | 2012-12-26 | 欣兴电子股份有限公司 | Method for manufacturing soft and hard composite board |
| CN103187317B (en) * | 2011-12-31 | 2015-08-05 | 百容电子股份有限公司 | The assemble method of semiconductor element |
| CN106695107A (en) * | 2017-01-19 | 2017-05-24 | 深圳天邦达科技有限公司 | Lithium battery control module thermal compression welding method and lithium battery control module obtained after welding |
| CN107617816B (en) * | 2017-10-31 | 2020-04-07 | 深圳瑞柏科技有限公司 | Soft board pulse hot-press welding method |
| CN114501809B (en) * | 2022-01-13 | 2024-06-21 | 惠州市金百泽电路科技有限公司 | High-precision processing method for size of millimeter wave radar PCB |
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2005
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| CN1937890A (en) | 2007-03-28 |
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Granted publication date: 20090408 Termination date: 20130919 |