CN108595839A - A kind of generation method and system of the crimp back drill via file based on Cadence Skill - Google Patents
A kind of generation method and system of the crimp back drill via file based on Cadence Skill Download PDFInfo
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- CN108595839A CN108595839A CN201810377352.7A CN201810377352A CN108595839A CN 108595839 A CN108595839 A CN 108595839A CN 201810377352 A CN201810377352 A CN 201810377352A CN 108595839 A CN108595839 A CN 108595839A
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- crimp
- back drill
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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Abstract
The present invention provides a kind of generation method and system of the crimp back drill via file based on Cadence Skill, the method includes：S1, operation Cadence Skill acquire crimp relevant information；The length information of S2, input crimp position number and crimp flake；The crimp differential pair via that S3, automatic selection meet setting condition is added back drill；S4, crimp back drill file is generated.It solves PCB factories to carry out needing to confirm a large amount of back drill information back and forth when back drill, workload is larger, the relatively low problem of design efficiency, it realizes and improves design efficiency, avoid the problem that leakage is easy when pcb board factory carries out back drill bores and bore more, the accuracy for improving engineers design, greatly shortens the timeliness of validation of information, effectively improves quality when pcb board factory re-packs.
Description
Technical field
The present invention relates to PCB design field, especially a kind of crimp back drill via file based on Cadence Skill
Generation method and system.
Background technology
Server board is stuck in PCB design phase, is wanted at present to the efficiency and quality of the quality of board and signal transmission
Ask very high, it is then very big to the selection of some materials test, it needs to consider cost, the ability for transmitting signal quality and life
Some destabilizing factors when production.At this stage for PCB layout very dense, plate layer is more, in order to ensure that high speed signal passes through
More functions, data sharing etc. are realized in the interconnection of distinct device, so the crimp of some high quality is selected, to improve signal
The ability of transmission.
However, multi-layer board crimp cannot avoid the problem that HW High Way forms stub (stub) well when connecting up,
It needs to carry out back drill to differential pair via in the design.Back drill is exactly not connected by a drill bit bigger than via internal diameter
The outermost layer connect bores inward, until boring to fall to be not connected to layer, due to technology problem, will not bore this stub completely, pass through
Back drill, electrodissolution can generally control between 2mil-6mil.And back drill depth size also needs to consider that the flake of crimp is long
Degree, when back drill, also need to certain safe distance, just can guarantee that the smaller signal of back drill differential pair stub has integrity.
The back drill file that usual tool addition back drill differential pair via generates is not related to crimp flake length, leads to PCB
Factory carries out needing to confirm a large amount of back drill information back and forth when back drill, and workload is larger, and design efficiency is relatively low, pcb board factory back drill
When be also easy to leakage and bore and bore more.Therefore it needs to consider that the flake length of crimp causes wiring installation teacher that can not finally generate the back of the body
The accurate back drill file of differential pair via is bored, the unnecessary quality problems such as leakage brill and more brills when PCB can be caused to re-pack.
Invention content
The generation method of the object of the present invention is to provide a kind of crimp back drill via file based on Cadence Skill
With system, it is intended to solve PCB factories and carry out needing to confirm a large amount of back drill information back and forth when back drill, workload is larger, design effect
The relatively low problem of rate is realized and improves design efficiency, the accuracy of design.
To reach above-mentioned technical purpose, the present invention provides a kind of crimp back drill via based on Cadence Skill
The generation method of file, includes the following steps：
S1, operation Cadence Skill acquire crimp relevant information；
The length information of S2, input crimp position number and crimp flake；
The crimp differential pair via that S3, automatic selection meet setting condition is added back drill；
S4, crimp back drill file is generated.
Preferably, the acquisition crimp relevant information includes crawl Backdrill_Max_Pth_Stub setting informations.
Preferably, Backdrill_Max_Pth_Stub setting informations back drill information for identification.
Preferably, the crimp position number and crimp flake length information are for capturing laminated thickness information.
Preferably, the step S3 concrete operations are as follows：
S301, automatic crawl flake length, calculate the level for the back drill of being carried out；
S302, corresponding back drill mark is added in place level.
The generation system of the present invention also provides a kind of crimp back drill via file based on Cadence Skill, packet
It includes：
Crimp information acquisition module acquires crimp relevant information for running Cadence Skill；
Flake length input module, the length information for inputting crimp position number and crimp flake；
Back drill add module meets the crimp differential pair via of setting condition and is added back drill for choosing automatically；
Back drill file generating module, for generating crimp back drill file.
Preferably, the crimp information acquisition module includes setting information placement unit, for capturing Backdrill_
Max_Pth_Stub setting informations.
Preferably, Backdrill_Max_Pth_Stub setting informations back drill information for identification.
Preferably, the crimp position number and crimp flake length information are for capturing laminated thickness information.
Preferably, the back drill add module includes：
Flake length placement unit calculates the level for the back drill of being carried out for capturing flake length automatically；
Back drill identifies adding device, for adding corresponding back drill mark in place level.
The effect provided in invention content is only the effect of embodiment, rather than invents all whole effects, above-mentioned
A technical solution in technical solution has the following advantages that or advantageous effect：
Compared with prior art, the present invention is by the length information according to crimp position number and crimp flake, automatically
The crimp differential pair via that selection meets setting condition is added back drill, and above method is carried out programming, passes through
The Skill programs are executed, crimp back drill differential pair via back drill file and back drill symbol can be generated with a key, solved
PCB factories carry out needing to confirm a large amount of back drill information back and forth when back drill, and workload is larger, the relatively low problem of design efficiency, real
Design efficiency is now improved, avoids the problem that being easy leakage when pcb board factory carries out back drill bores and bore more, improves the standard of engineers design
True property, greatly shortens the timeliness of validation of information, effectively improves quality when pcb board factory re-packs.
Description of the drawings
Fig. 1 is a kind of crimp back drill via file based on Cadence Skill provided in the embodiment of the present invention
Generation method flow chart；
Fig. 2 is a kind of PCB trace schematic diagram of a layer structure provided in the embodiment of the present invention；
Fig. 3 is a kind of PCB laminations schematic diagram provided in the embodiment of the present invention；
Fig. 4 is a kind of using back drill indicator and back drill file interface after Skill provided in the embodiment of the present invention
Schematic diagram；
Fig. 5 is the back drill indicator and back drill file circle of a kind of unused Skill provided in the embodiment of the present invention
Face schematic diagram；
Fig. 6 is a kind of crimp back drill via file based on Cadence Skill provided in the embodiment of the present invention
Generation system structure diagram.
Specific implementation mode
In order to clearly illustrate the technical characterstic of this programme, below by specific implementation mode, and its attached drawing is combined, to this
Invention is described in detail.Following disclosure provides many different embodiments or example is used for realizing the different knots of the present invention
Structure.In order to simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.In addition, the present invention can be with
Repeat reference numerals and/or letter in different examples.This repetition is that for purposes of simplicity and clarity, itself is not indicated
Relationship between various embodiments and/or setting is discussed.It should be noted that illustrated component is not necessarily to scale in the accompanying drawings
It draws.Present invention omits the descriptions to known assemblies and treatment technology and process to avoid the present invention is unnecessarily limiting.
It is provided for the embodiments of the invention a kind of crimp back drill mistake based on Cadence Skill below in conjunction with the accompanying drawings
The generation method of hole file is described in detail with system.
As shown in Figure 1, the embodiment of the invention discloses a kind of crimp back drill via file based on Cadence Skill
Generation method, include the following steps：
S1, operation Cadence Skill acquire crimp relevant information；
The length information of S2, input crimp position number and crimp flake；
The crimp differential pair via that S3, automatic selection meet setting condition is added back drill；
S4, crimp back drill file is generated.
The secondary development language Skill that Cadence is provided, is a kind of interactive mode based on general artificial intelligence language Lisp
High-level programming language supports the grammer of a set of similar C language, while supporting the repertoire of Lisp language again, can both use
Make simplest implementation language, can also be used as the powerful programming language for developing any application.Skill can be handed over first floor system
Mutually, the abundant interface for accessing each tools of Cadence is also provided.
As shown in Fig. 2, crimp is in the faces TOP, the outlet respectively at TOP, L3 and L5 layers of wiring differential pair.As shown in figure 3, with
For 14 layers of PCB laminations, wiring difference exchange layer stub is very big, needs to carry out back drill at wiring difference exchange layer pin.
At the beginning of back drill via file generated, it is necessary first to which the relevant information for acquiring crimp is closed by reading in software
In the attribute information of crimp, including crawl Backdrill_Max_Pth_Stub settings, by identifying the information, ALLEGRO
Software just can recognize that back drill information.
By in the length information input system of the position number of crimp and flake, such as in embodiments of the present invention, input
Crimp position number " J1 ", crimp flake length " 35mil ", Skill can automatically be captured according to position number and flake length information
Laminated thickness information.
Since back drill depth size and crimp flake length information are closely related, crimp needs to consider flake length,
Back drill level should be Bottom-L6 layers of cloth, and Skill captures flake length, then calculates the layer for the back drill of being carried out automatically
Face, and corresponding back drill mark is added in place level, as shown in figure 4, carrying out back drill mark compared to Skill is not used in Fig. 5
The PCB of knowledge, more intuitively.
Above method is subjected to programming, that is, writes the program for capturing relevant information at crimp differential pair via, so
The Skill programs write are put into Skill menus afterwards, execute the Skill programs can a key addition crimp it is poor
Divide position and the corresponding back drill file of output that back drill is needed to via.
By the length information according to crimp position number and crimp flake, automatic selection meets to be set the embodiment of the present invention
The crimp differential pair via for setting condition is added back drill, and above method is carried out programming, by executing the Skill
Program can generate crimp back drill differential pair via back drill file and back drill symbol with a key, solve PCB factories and be carried on the back
It needs to confirm a large amount of back drill information back and forth when brill, workload is larger, the relatively low problem of design efficiency, realizes and improves design effect
Rate avoids the problem that leakage is easy when pcb board factory carries out back drill bores and bore more, improves the accuracy of engineers design, contracts significantly
The timeliness that short message confirms, effectively improves quality when pcb board factory re-packs.
As shown in fig. 6, the embodiment of the invention also discloses a kind of, the crimp back drill via based on Cadence Skill is literary
The generation system of part, including：
Crimp information acquisition module acquires crimp relevant information for running Cadence Skill；
Flake length input module, the length information for inputting crimp position number and crimp flake；
Back drill add module meets the crimp differential pair via of setting condition and is added back drill for choosing automatically；
Back drill file generating module, for generating crimp back drill file.
The crimp information acquisition module includes：
Setting information placement unit, for capturing Backdrill_Max_Pth_Stub setting informations.
The back drill add module includes：
Flake length placement unit calculates the level for the back drill of being carried out for capturing flake length automatically；
Back drill identifies adding device, for adding corresponding back drill mark in place level.
Backdrill_Max_Pth_Stub setting informations back drill information for identification.
The crimp position number and crimp flake length information are for capturing laminated thickness information.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. a kind of generation method of the crimp back drill via file based on Cadence Skill, which is characterized in that including following
Step：
S1, operation Cadence Skill acquire crimp relevant information；
The length information of S2, input crimp position number and crimp flake；
The crimp differential pair via that S3, automatic selection meet setting condition is added back drill；
S4, crimp back drill file is generated.
2. a kind of generation method of crimp back drill via file based on Cadence Skill according to claim 1,
It is characterized in that, the acquisition crimp relevant information includes crawl Backdrill_Max_Pth_Stub setting informations.
3. a kind of generation method of crimp back drill via file based on Cadence Skill according to claim 1,
It is characterized in that, Backdrill_Max_Pth_Stub setting informations back drill information for identification.
4. a kind of generation method of crimp back drill via file based on Cadence Skill according to claim 1,
It is characterized in that, the crimp position number and crimp flake length information are for capturing laminated thickness information.
5. a kind of crimp back drill via file based on Cadence Skill according to any one of claims 1-4
Generation method, which is characterized in that the step S3 concrete operations are as follows：
S301, automatic crawl flake length, calculate the level for the back drill of being carried out；
S302, corresponding back drill mark is added in place level.
6. a kind of generation system of the crimp back drill via file based on Cadence Skill, which is characterized in that including：
Crimp information acquisition module acquires crimp relevant information for running Cadence Skill；
Flake length input module, the length information for inputting crimp position number and crimp flake；
Back drill add module meets the crimp differential pair via of setting condition and is added back drill for choosing automatically；
Back drill file generating module, for generating crimp back drill file.
7. a kind of generation system of crimp back drill via file based on Cadence Skill according to claim 6,
It is characterized in that, the crimp information acquisition module includes setting information placement unit, for capturing Backdrill_Max_
Pth_Stub setting informations.
8. a kind of generation system of crimp back drill via file based on Cadence Skill according to claim 6,
It is characterized in that, Backdrill_Max_Pth_Stub setting informations back drill information for identification.
9. a kind of generation system of crimp back drill via file based on Cadence Skill according to claim 6,
It is characterized in that, the crimp position number and crimp flake length information are for capturing laminated thickness information.
10. a kind of crimp back drill via file based on Cadence Skill according to claim 6-9 any one
Generation system, which is characterized in that the back drill add module includes：
Flake length placement unit calculates the level for the back drill of being carried out for capturing flake length automatically；
Back drill identifies adding device, for adding corresponding back drill mark in place level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377352.7A CN108595839B (en) | 2018-04-25 | 2018-04-25 | Method and system for generating compression joint back drilling via file based on Cadence skip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377352.7A CN108595839B (en) | 2018-04-25 | 2018-04-25 | Method and system for generating compression joint back drilling via file based on Cadence skip |
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| Publication Number | Publication Date |
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| CN108595839A true CN108595839A (en) | 2018-09-28 |
| CN108595839B CN108595839B (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810377352.7A Active CN108595839B (en) | 2018-04-25 | 2018-04-25 | Method and system for generating compression joint back drilling via file based on Cadence skip |
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Cited By (4)
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| CN109492329A (en) * | 2018-12-03 | 2019-03-19 | 郑州云海信息技术有限公司 | A kind of design method of back drill setting |
| CN110852033A (en) * | 2019-09-24 | 2020-02-28 | 惠州市金百泽电路科技有限公司 | Method for automatically creating via hole on copper sheet of PCB |
| CN111343785A (en) * | 2018-12-19 | 2020-06-26 | 佛山市顺德区顺达电脑厂有限公司 | Back drilling hole setting method for circuit board |
| CN112328554A (en) * | 2020-11-23 | 2021-02-05 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
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| CN108595839B (en) | 2021-11-02 |
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