CN112985333A - Circuit board inspection method and device - Google Patents
Circuit board inspection method and device Download PDFInfo
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- CN112985333A CN112985333A CN202110191645.8A CN202110191645A CN112985333A CN 112985333 A CN112985333 A CN 112985333A CN 202110191645 A CN202110191645 A CN 202110191645A CN 112985333 A CN112985333 A CN 112985333A
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- circuit board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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Abstract
The disclosure provides a circuit board inspection method and device, and relates to the field of circuit boards. The circuit board inspection method comprises the steps of obtaining position information of a first area covered by a bonding pad connected with all BGA devices on a first surface of a target part of a circuit board by traversing the first surface of the target part; traversing the second surface of the target part of the circuit board to acquire the position information of a second area covered by all the shielding ribs on the second surface of the target part; and judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information. By the inspection method, if the overlapping is detected, prompt information can be output in time, so that designers can correct the design scheme in time. The checking method can be realized by running the script in the software, avoids completely observing and judging by human eyes, and has the characteristics of high efficiency and accuracy. The circuit board inspection device is used for realizing the circuit board inspection method.
Description
Technical Field
The present disclosure relates to the field of circuit boards, and in particular, to a circuit board inspection method and apparatus.
Background
Mounting the device on the surface of the circuit board may cause the circuit board to be subjected to mechanical and thermal stresses, which may cause the circuit board to bend, affecting its performance or even causing the circuit board to fail. Therefore, the layout of the devices on the circuit board needs to be designed reasonably. The design stage of the circuit board is completed by software, and a designer constructs a model (graph) of the circuit board through the software. Usually, designers can judge the rationality of the design by observing the devices on the front and back sides of the circuit board model with naked eyes, for example, whether the designed circuit board is easy to face obvious stress problems in the production and use stages. This type of inspection is inefficient and prone to missed inspection, resulting in poor accuracy.
Disclosure of Invention
The purpose of the present disclosure includes providing a circuit board inspection method and apparatus, which can efficiently and accurately inspect a circuit board model.
Embodiments of the present disclosure may be implemented as follows:
in a first aspect, the present disclosure provides a circuit board inspection method for inspecting a software design model of a circuit board, the circuit board having a first side and a second side opposite to each other, the circuit board inspection method comprising:
traversing the first surface of the target part of the circuit board, and acquiring the position information of a first area covered by the bonding pad connected with all BGA devices on the first surface of the target part;
traversing a second surface of the target part of the circuit board, and acquiring position information of a second area covered by all shielding ribs on the second surface of the target part;
and judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information.
In an alternative embodiment, the circuit board inspection method further includes:
recording the bit number of the BGA device corresponding to the overlapped part;
and/or recording the pin sequence of the BGA device corresponding to the overlapped part;
and/or the name of the pad corresponding to the overlapping part and the position information of the pad.
In an alternative embodiment, the prompt message includes at least one of a bit number of the BGA device located at the overlapping portion, a pin order of the BGA device, a name of the pad, or position information of the pad.
In an alternative embodiment, the prompt information is output and saved in the form of a log file.
In an alternative embodiment, traversing the first surface of the target portion of the circuit board to obtain the position information of the first area covered by the pads connected to all the BGA devices on the first surface of the target portion includes: reading a first surface graph of a target part of the circuit board, screening graphs of a bonding pad connected with the BGA device, and calculating coordinate information of the graphs of the bonding pad as position information of a first area;
traversing the second surface of the target portion of the circuit board, and acquiring the position information of the second area covered by all the shielding ribs on the second surface of the target portion, wherein the position information comprises: and reading a second surface graph of the target part of the circuit board, screening the graphs of the shielding ribs, and calculating the coordinate information of the graphs of the shielding ribs as the position information of the second area.
In an optional embodiment, the determining whether there is an overlapping portion between the first region and the second region in the thickness direction of the circuit board includes:
judging whether the projection of the pattern of the bonding pad on the second surface of the circuit board is intersected with the pattern of the shielding rib or not according to the coordinate information of the pattern of the bonding pad and the pattern of the shielding rib, or judging whether the projection of the pattern of the shielding rib on the first surface of the circuit board is intersected with the pattern of the bonding pad or not;
if so, the first region and the second region are judged to have an overlapping part in the thickness direction of the circuit board.
In an alternative embodiment, the screening of the pattern of the pads to which the BGA device is connected specifically includes: filtering out all graphs with the line width lower than a preset size and the area lower than a preset area in the first surface, and screening out the graphs which accord with the shape characteristics of a bonding pad connected with the BGA device;
screening shielding rib's figure specifically includes: and filtering out the graphs with the line width lower than the preset size and the area lower than the preset area in all the graphs of the second surface, and screening out the graphs which accord with the shape characteristics of the shielding ribs.
In an alternative embodiment, the circuit board inspection method further includes:
acquiring position information of a third area covered by all shielding ribs on the first surface of the target part;
acquiring position information of a fourth area covered by a bonding pad connected with all BGA devices on the second surface of the target part;
and judging whether the third area and the fourth area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information.
In a second aspect, the present disclosure provides a circuit board inspection apparatus for inspecting a software design model of a circuit board, comprising:
the first acquisition module is used for traversing the first surface of the target part of the circuit board and acquiring the position information of a first area covered by the bonding pad connected with all BGA devices on the first surface of the target part;
the second acquisition module is used for traversing the second surface of the target part of the circuit board and acquiring the position information of a second area covered by all the shielding ribs on the second surface of the target part;
the judging module is used for judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board;
and the output module is used for outputting prompt information under the condition that the first area and the second area are judged to have the overlapped part in the thickness direction of the circuit board.
In an optional embodiment, the first obtaining module is further configured to obtain position information of a third area covered by all shielding ribs on the first surface of the target portion;
the second acquisition module is further used for acquiring the position information of a fourth area covered by the bonding pad connected with all the BGA devices on the second surface of the target part;
the judging module is also used for judging whether the third area and the fourth area have an overlapping part in the thickness direction of the circuit board;
the output module is further used for outputting prompt information when the third area and the fourth area are judged to have the overlapped part in the thickness direction of the circuit board.
Beneficial effects of the embodiments of the present disclosure include, for example:
according to the circuit board inspection method, the position information of a first area covered by a bonding pad connected with all BGA devices on the first surface of a target part of a circuit board is acquired by traversing the first surface of the target part; traversing the second surface of the target part of the circuit board to acquire the position information of a second area covered by all the shielding ribs on the second surface of the target part; and judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information. Because the corresponding bonding pad of the BGA device is overlapped with the position of the shielding rib on the other surface, stress concentration is easy to generate to cause the bending of the circuit board, which is avoided as much as possible in the design stage of the circuit board. By the inspection method provided by the disclosure, the position information of the areas covered by all the bonding pads connected with the BGA device on the first surface of the target part of the circuit board and all the shielding ribs on the second surface can be acquired, and whether the overlapped part exists or not can be judged according to the position information. If the overlapping exists, prompt information can be output in time, so that designers can correct the design scheme in time. The circuit board inspection method can be realized by running the script in software, avoids completely observing and judging by human eyes, and has the characteristics of high efficiency and accuracy.
The circuit board inspection device provided by the embodiment of the disclosure is used for realizing the circuit board inspection method, and therefore, the circuit board inspection device also has the characteristics of high inspection efficiency and accurate inspection result.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present disclosure and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings may be obtained from the drawings without inventive effort.
FIG. 1 is a schematic view of a BGA device with pads overlapping shield ribs for connection;
FIG. 2 is a schematic view of a BGA device with a bonding pad and a shielding rib not overlapped;
FIG. 3 is a flow chart of a circuit board inspection method in an embodiment of the disclosure;
fig. 4 is a schematic diagram of a circuit board inspection apparatus provided in an embodiment of the present disclosure.
Icon: 1-a pad; 2-shielding ribs; 100-circuit board inspection device; 110-a first acquisition module; 120-a second acquisition module; 130-a judgment module; 140-output module.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. The components of the embodiments of the present disclosure, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present disclosure, presented in the figures, is not intended to limit the scope of the claimed disclosure, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present disclosure, it should be noted that if the terms "upper", "lower", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which the present invention is used to usually place, the description is only for convenience of describing and simplifying the present disclosure, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present disclosure.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features in the embodiments of the present disclosure may be combined with each other without conflict.
With the miniaturization and weight reduction of electronic equipment, circuit boards and electronic devices are becoming smaller and smaller. Taking a conventional mobile phone as an example, the thickness of the circuit board becomes thinner and thinner, and the circuit board is bent by slight stress. Particularly, when a Ball Grid Array (BGA) device is fixed by soldering, the BGA device is connected to a circuit board through a pad, and a mechanical stress and a thermal stress are generated at a solder joint. Due to the miniaturization of BGA devices and the thinning of circuit boards, the stress bearing capability of solder joints is increasingly poor. Therefore, the mounting position of the device on the circuit board needs to be designed reasonably. In the design stage of the circuit board, the circuit board is usually modeled by software, such as Cadence Allegro software. The constructed circuit board model is presented in a graph form. However, at present, designers gradually confirm whether the mounting position of each BGA device is reasonable or not by observing the pattern of the circuit board model with human eyes, which causes high workload, low efficiency, and possibility of missing inspection, resulting in low accuracy.
In order to improve the efficiency and accuracy of circuit board inspection, the present disclosure provides a circuit board inspection method for inspecting a software design model of a circuit board. The method comprises the steps of obtaining the area covered by a bonding pad and a shielding rib connected with a BGA device by traversing two surfaces of a circuit board model (hereinafter referred to as a circuit board), judging whether an overlapping part exists to determine whether the design is reasonable, and sending out prompt information if the overlapping part exists. The inventor finds that the bonding pad on the circuit board to which the BGA device is connected should not overlap with the shielding rib on the other side of the circuit board (the copper leakage area not covered by the solder mask layer for mounting the shield), and if the overlap is caused, the circuit board is easily bent and damaged due to stress concentration.
Fig. 1 is a schematic view showing a bonding pad 1 to which a BGA device is connected and a shielding rib 2 overlapping each other; fig. 2 is a schematic diagram showing that the bonding pad 1 and the shielding rib 2 connected with the BGA device are not overlapped. As shown in fig. 1 and 2, which are schematic diagrams of relative positions of the pads 1 and the shielding ribs 2 projected on the same plane (i.e., the display plane of the drawings), in the array of pads 1 to which the BGA device of fig. 1 is connected, the pads 1 in the bottom row overlap the shielding ribs 2. There is therefore a risk involved that there will be stress concentrations, and the mounting position of the BGA device should be redesigned; the bonding pad 1 connected with the BGA device in fig. 2 does not overlap the shielding rib 2, and the two do not interfere with each other, which can be considered as a reasonable layout.
The following describes a specific flow of the circuit board inspection method provided by the embodiment of the present disclosure. Fig. 3 is a flowchart of a circuit board inspection method in an embodiment of the disclosure. The circuit board inspection method provided by the embodiment of the disclosure is a circuit board model designed for software, the circuit board is provided with a first surface and a second surface which are opposite, and both the first surface and the second surface can be provided with components and shielding cases. The shield can is connected (e.g., soldered) to the circuit board by the shield ribs. As shown in fig. 3, the circuit board inspection method provided by the present disclosure includes:
step S100, traversing the first surface of the target part of the circuit board, and acquiring the position information of the first area covered by the bonding pad connected with all BGA devices on the first surface of the target part.
In an alternative embodiment of the present disclosure, the circuit board (model) is built based on a coordinate system, and the position of each device corresponds to a coordinate information. In this embodiment, acquiring the position information of the first area may be implemented by: reading a first surface pattern of a target portion of the circuit board, screening a pattern of a bonding pad to which the BGA device is connected, and calculating coordinate information of the pattern of the bonding pad as position information of the first area. In the design software of the circuit board (such as Cadence Allegro), each device is displayed by a simulated graph, when a first surface of a target part of the circuit board is traversed, the graphs of all devices on the first surface are obtained, the graphs of focused key points, namely bonding pads connected with BGA devices, are screened out, and the coordinate information of the graphs of the bonding pads is obtained and is used as the position information of a first area.
It should be understood that the target portion of the circuit board is the portion to be inspected, and when the whole circuit board needs to be inspected, the target portion is the whole circuit board; however, when the target portion needs to be inspected, the target portion of the circuit board is local.
Further, in an alternative embodiment, the screening the pattern of the pads to which the BGA device is connected may specifically include: and filtering out the graphs with the line width lower than the preset size and the area lower than the preset area in all the graphs of the first surface, and screening out the graphs which accord with the shape characteristics of the bonding pad connected with the BGA device. For example, patterns with line widths below 0.4 mm and areas below 1 mm are filtered out. In an optional implementation manner, whether the graph of one device conforms to the shape feature of the pad connected to the BGA device may be determined by determining whether the pad is a circular pad, that is, the shape feature of the pad connected to the BGA device is circular.
It should be understood that the manner of screening the pattern of the pads to which the BGA device is connected is not limited to the above manner. The bonding pads connected with the BGA device can be identified during design, so that the bonding pads can be screened out quickly.
Step S200, traversing the second surface of the target part of the circuit board, and acquiring the position information of the second area covered by all the shielding ribs on the second surface of the target part.
The shielding rib is an area which is not covered by the solder mask layer and is used for connecting the shielding cover on the circuit board. Similar to the implementation manner of step S100, step S200 may be implemented in the following manner: and reading a second surface graph of the target part of the circuit board, screening the graphs of the shielding ribs, and calculating the coordinate information of the graphs of the shielding ribs as the position information of the second area.
Correspondingly, screening the pattern of the shielding rib specifically may include: and filtering out the graphs with the line width lower than the preset size and the area lower than the preset area in all the graphs of the second surface, and screening out the graphs which accord with the shape characteristics of the shielding ribs. The filtering and screening methods are similar to those described in step S100, and are not described herein again. It should be understood that the sequence of step S100 and step S200 may be adjusted, or may be performed simultaneously.
It should be understood that, in the embodiment of the present disclosure, the coordinate information of the graph may be a set of point coordinates, or may be one coordinate point. For example, the coordinate information of the shield rib pattern may be represented by a set of points, and the coordinate information of the BGA pad pattern may be represented by one point or a set of points. When the coordinate information of the graph is a set of points, the coordinate information may represent a position of an area having a certain outline shape, for example, { x, y, z |0 ≦ x ≦ 2, 0 ≦ y ≦ 2, and z ═ 0}, which represents a position of a rectangular area with a side length of 2 in a coordinate plane where z ≦ 0; when coordinate information of the BGA pad is represented by a point coordinate, it may be expressed as a position where a geometric center point of the pad is located, such as {1,1,1 }.
Step S300, judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board.
In this embodiment of the present disclosure, step S300 may specifically include:
judging whether the projection of the pattern of the bonding pad on the second surface of the circuit board is intersected with the pattern of the shielding rib or not according to the coordinate information of the pattern of the bonding pad and the pattern of the shielding rib, or judging whether the projection of the pattern of the shielding rib on the first surface of the circuit board is intersected with the pattern of the bonding pad or not; if so, the first region and the second region are judged to have an overlapping part in the thickness direction of the circuit board.
It can be understood that the first surface and the second surface of the circuit board are not on the same plane, and therefore the pattern of the pads on the first surface and the pattern of the shielding ribs on the second surface need to be determined by means of projection. Taking a rectangular coordinate system as an example, if the thickness direction of the circuit board is the z-axis direction, the x-coordinate and the y-coordinate of the pad pattern and the shielding rib pattern are used to determine whether there is overlap. The area surrounded by the outlines of the pad graph and the shielding rib graph can be regarded as a point set, so that under the condition of ignoring z coordinates, whether the pad graph and the shielding rib graph are overlapped can be judged by judging whether the point sets contained in the area where the pad graph and the shielding rib graph are located have intersection. When the position of the pad pattern is represented by one coordinate point, it is determined whether or not there is overlap by determining whether or not the point coordinates representing the pad fall within the point coordinate set included in the shield rib pattern (ignoring z-coordinate difference).
In this embodiment, after the coordinate information of all the pad patterns on the first surface and the coordinate information of all the shielding rib patterns on the second surface are obtained, whether the pad patterns and the shielding rib patterns are overlapped or not is judged; or judging each bonding pad in sequence, and detecting and judging the bonding pad array corresponding to the next BGA device after detecting and judging the bonding pad array corresponding to one BGA device. Until all the bonding pads are detected and judged.
If it is determined that there is an overlapping portion of the first region and the second region in the thickness direction of the circuit board, performing:
and step S400, outputting prompt information.
In an optional embodiment of the present disclosure, the prompt information includes at least one of a bit number of the BGA device located at the overlapping portion, a pin order of the BGA device, a name of the pad, or position information of the pad. The designer can know that the overlap exists through the prompt information and further know the position where the overlap occurs and the corresponding device, and the checking and modifying efficiency of the designer can be obviously improved. Of course, the output of the prompt message needs other hardware devices such as a display.
In an alternative embodiment, the prompt information is output and saved in the form of a log file. The log file can record the bit number of the BGA device corresponding to the overlapping part, or record the pin sequence of the BGA device corresponding to the overlapping part, or record the name and the position information of the bonding pad corresponding to the overlapping part for later calling and checking.
Based on the above embodiment, optionally, the circuit board inspection method further includes:
acquiring position information of a third area covered by all shielding ribs on the first surface of the target part; acquiring position information of a fourth area covered by a bonding pad connected with all BGA devices on the second surface of the target part; and judging whether the third area and the fourth area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information. These steps are similar to the implementation method of the above steps S100 to S400, and are intended to correspondingly inspect the shielding ribs on the first surface and the pads on the second surface, so that the inspection of the target portion of the circuit board is more complete and can be performed simultaneously with the above steps. The detailed implementation thereof is not described in detail. The finally output prompt information may be output together with the prompt information in step S400 or separately, and may be recorded using one log file.
Fig. 4 is a schematic diagram of a circuit board inspection apparatus 100 according to an embodiment of the disclosure. As shown in fig. 4, the present disclosure also provides a circuit board inspection apparatus 100. As shown in fig. 4, the circuit board inspection apparatus 100 includes:
a first obtaining module 110, configured to traverse a first surface of a target portion of a circuit board, and obtain position information of a first area covered by pads connected to all BGA devices on the first surface of the target portion;
a second obtaining module 120, configured to traverse a second surface of the target portion of the circuit board, and obtain position information of a second area covered by all shielding ribs on the second surface of the target portion;
a judging module 130, configured to judge whether there is an overlapping portion between the first region and the second region in a thickness direction of the circuit board;
and an output module 140, configured to output the prompt message when it is determined that the first region and the second region have an overlapping portion in the thickness direction of the circuit board.
In an alternative embodiment, the first obtaining module 110 is further configured to obtain position information of a third area covered by all shielding ribs on the first surface of the target portion; the second obtaining module 120 is further configured to obtain position information of a fourth area covered by pads connected to all BGA devices on the second surface of the target portion; the judging module 130 is further configured to judge whether there is an overlapping portion between the third region and the fourth region in the thickness direction of the circuit board; the output module 140 is further configured to output a prompt message when it is determined that the third region and the fourth region have an overlapping portion in the thickness direction of the circuit board.
It should be understood that the circuit board inspection apparatus 100 and the modules included in the apparatus are virtual apparatuses and modules, which may be executable instructions such as a computer program, and are used to implement the above-mentioned circuit board inspection method. The circuit board inspection apparatus 100 may be mounted on a computer to implement the above-described inspection method.
To sum up, the circuit board inspection method according to the embodiment of the present disclosure obtains the position information of the first area covered by the bonding pad connected to all BGA devices on the first surface of the target portion by traversing the first surface of the target portion of the circuit board; traversing the second surface of the target part of the circuit board to acquire the position information of a second area covered by all the shielding ribs on the second surface of the target part; and judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information. Because the corresponding bonding pad of the BGA device is overlapped with the position of the shielding rib on the other surface, stress concentration is easy to generate to cause the bending of the circuit board, which is avoided as much as possible in the design stage of the circuit board. By the inspection method provided by the disclosure, the position information of the areas covered by all the bonding pads connected with the BGA device on the first surface and all the shielding ribs on the second surface of the target part of the circuit board can be acquired, and whether the overlapped part exists or not can be judged according to the position information. If the overlapping exists, prompt information can be output in time, so that designers can correct the design scheme in time. The circuit board inspection method can be realized by running the script in software, avoids completely observing and judging by human eyes, and has the characteristics of high efficiency and accuracy.
The circuit board inspection device provided by the embodiment of the disclosure is used for realizing the circuit board inspection method, and therefore, the circuit board inspection device also has the characteristics of high inspection efficiency and accurate inspection result.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (10)
1. A circuit board inspection method for inspecting a software design model of a circuit board, the circuit board having opposing first and second sides, the circuit board inspection method comprising:
traversing a first surface of a target part of a circuit board, and acquiring position information of a first area covered by a bonding pad connected with all BGA devices on the first surface of the target part;
traversing a second surface of the target part of the circuit board, and acquiring position information of a second area covered by all shielding ribs on the second surface of the target part;
and judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information.
2. The circuit board inspection method according to claim 1, further comprising:
recording the bit number of the BGA device corresponding to the overlapped part;
and/or recording the pin sequence of the BGA device corresponding to the overlapped part;
and/or the name of the pad corresponding to the overlapping part and the position information of the pad.
3. The circuit board inspection method of claim 1, wherein the prompt information includes at least one of a bit number of the BGA device located at the overlapping portion, a pin order of the BGA device, a name of the pad, or position information of the pad.
4. The circuit board inspection method according to claim 3, wherein the prompt information is output and saved in the form of a log file.
5. The method of claim 1, wherein traversing a first side of a target portion of a circuit board to obtain location information of a first area covered by pads to which all BGA devices are connected on the first side of the target portion comprises: reading a first surface graph of a target part of the circuit board, screening graphs of a bonding pad connected with the BGA device, and calculating coordinate information of the graphs of the bonding pad as position information of the first area;
traversing the second surface of the target portion of the circuit board, and acquiring the position information of the second area covered by all the shielding ribs on the second surface of the target portion, including: and reading a second surface graph of the target part of the circuit board, screening the graph of the shielding rib, and calculating the coordinate information of the graph of the shielding rib as the position information of the second area.
6. The circuit board inspection method according to claim 5, wherein determining whether there is an overlapping portion of the first region and the second region in a thickness direction of the circuit board includes:
judging whether the projection of the pattern of the bonding pad on the second surface of the circuit board is intersected with the pattern of the shielding rib or not according to the coordinate information of the pattern of the bonding pad and the pattern of the shielding rib, or judging whether the projection of the pattern of the shielding rib on the first surface of the circuit board is intersected with the pattern of the bonding pad or not;
if yes, the first area and the second area are judged to have an overlapping part in the thickness direction of the circuit board.
7. The method of claim 5, wherein screening the pattern of the pads to which the BGA device is connected comprises: filtering out graphs with line widths lower than a preset size and areas lower than a preset area in all graphs of the first surface, and screening out graphs which accord with the shape characteristics of a bonding pad connected with the BGA device;
screening the pattern of the shielding rib specifically comprises: and filtering out the graphs with the line width being lower than the preset size and the area being lower than the preset area in all the graphs of the second surface, and screening out the graphs which accord with the shape characteristics of the shielding ribs.
8. The circuit board inspection method according to claim 1, further comprising:
acquiring position information of a third area covered by all shielding ribs on the first surface of the target part;
acquiring position information of a fourth area covered by a bonding pad connected with all BGA devices on the second surface of the target part;
and judging whether the third area and the fourth area have an overlapping part in the thickness direction of the circuit board, and if so, outputting prompt information.
9. A circuit board inspection apparatus for inspecting a software design model of a circuit board, comprising:
the first acquisition module is used for traversing the first surface of the target part of the circuit board and acquiring the position information of a first area covered by the bonding pad connected with all BGA devices on the first surface of the target part;
the second acquisition module is used for traversing the second surface of the target part of the circuit board and acquiring the position information of a second area covered by all the shielding ribs on the second surface of the target part;
the judging module is used for judging whether the first area and the second area have an overlapping part in the thickness direction of the circuit board;
and the output module is used for outputting prompt information under the condition that the first area and the second area are judged to have an overlapping part in the thickness direction of the circuit board.
10. The circuit board inspection apparatus according to claim 9,
the first acquisition module is further used for acquiring position information of a third area covered by all shielding ribs on the first surface of the target part;
the second acquisition module is further used for acquiring the position information of a fourth area covered by the bonding pad connected with all the BGA devices on the second surface of the target part;
the judging module is further used for judging whether an overlapping part exists between the third area and the fourth area in the thickness direction of the circuit board;
the output module is further configured to output a prompt message when it is determined that the third area and the fourth area have an overlapping portion in the thickness direction of the circuit board.
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Application publication date: 20210618 |