CN117745716B

CN117745716B - Visualization method and system for PCBA defects

Info

Publication number: CN117745716B
Application number: CN202410175289.4A
Authority: CN
Inventors: 王伟
Original assignee: Hunan Renying Technology Co ltd
Current assignee: Hunan Renying Technology Co ltd
Priority date: 2024-02-07
Filing date: 2024-02-07
Publication date: 2024-04-16
Anticipated expiration: 2044-02-07
Also published as: CN117745716A

Abstract

The invention provides a method and a system for visualizing defects of a PCBA board, and relates to the technical field of visualization. Obtaining test result data of PCBA boards of the same type, extracting feature data of components according to the test result data, and forming test basic data of the circuit board; acquiring real-time image data of the PCBA board, carrying out comparative analysis by combining with basic data of circuit board inspection, and carrying out defect marking to form defect inspection marking information; and marking different defects on the real-time inspection image of the PCBA according to the defect inspection mark information to form a defect visual inspection image. The method establishes a reasonable automatic judgment scheme by utilizing an image processing technology, so that the inspection efficiency is greatly improved, and the qualification rate of product production is also improved.

Description

Visualization method and system for PCBA defects

Technical Field

The invention relates to the technical field of visualization, in particular to a method and a system for visualizing defects of a PCBA board.

Background

Printed circuit boards, also known as printed circuit boards, are commonly used for the acronym PCB (Printed circuit board), are important electronic components, as well as support for electronic components, and as a provider for the wiring of electronic components. Because various types of electronic components need to be mounted on the PCBA board, each electronic component needs to be mounted and tested, on one hand, the mounting position of the electronic component is guaranteed to be reasonable, and on the other hand, the circuit connection of the electronic component on the board surface is guaranteed to be correct.

Along with the progress of scientific technology, the quality detection of PCBA boards can be analyzed and judged through image acquisition, but most of the PCBA boards are analyzed and determined by manpower, the detection efficiency is low, a great deal of labor cost is consumed, and meanwhile, the qualification rate of each batch of products is limited due to errors of human factors caused by the manual detection.

Therefore, the visual method and the visual system for the defects of the PCBA board are designed, a reasonable automatic judgment scheme is established by utilizing an image processing technology, so that the inspection efficiency is greatly improved, and meanwhile, the qualification rate of product production is also improved, and the problem to be solved is urgent at present.

Disclosure of Invention

The invention aims to provide a method for visualizing defects of PCBA boards, which is characterized in that large data of inspection results of PCBA boards of the same type are obtained, analysis and extraction of component installation feature data under the large data are carried out, and formed circuit board inspection basic data can provide accurate and reasonable basic comparison data for subsequent real-time PCBA board detection. Meanwhile, when the basic comparison data are utilized to detect the PCBA board in real time, different detection defects are classified and marked, so that different defect problems can be distinguished conveniently, and further, guiding is provided for subsequent targeted repair conveniently. In addition, the defect information obtained by detection is marked in the image data and output, so that a visual detection result is realized, the defect detection information is intuitively and efficiently provided, the defect detection efficiency is greatly improved, and meanwhile, the quality of a product is also ensured.

The invention also aims to provide a visual system for the defects of the PCBA board, which is used for acquiring the detection data of the PCBA board of the same type and the image data of the real-time PCBA board through the image acquisition unit and providing a data analysis basis for subsequent analysis. The data processing unit is mainly used for carrying out big data analysis on PCBA boards of the same type to form basic data which can be referenced for subsequent comparison analysis. And the inspection and analysis unit can call the basic data formed by the data processing unit and the real-time PCBA image data to carry out high-efficiency comparison analysis, so that the defects of the real-time PCBA board are judged, and further the control of the production quality of the PCBA is realized. And meanwhile, the PCBA data which is qualified in inspection is submitted to a data processing unit to be used as original update data for big data analysis, so that more perfect and reasonable basic data are formed. In addition, the visual output unit outputs and displays the defect detection result, so that visual data display can be facilitated.

In a first aspect, the present invention provides a method for visualizing defects of a PCBA board, including obtaining test result data of the same type of PCBA board, and extracting feature data of components according to the test result data to form basic data for testing a circuit board; acquiring real-time image data of the PCBA board, carrying out comparative analysis by combining with basic data of circuit board inspection, and carrying out defect marking to form defect inspection marking information; and marking different defects on the real-time inspection image of the PCBA according to the defect inspection mark information to form a defect visual inspection image.

According to the method, the large data of the inspection result of the PCBA boards of the same type are obtained, the analysis and extraction of the component installation feature data under the large data are carried out, and the formed circuit board inspection basic data can provide accurate and reasonable basic comparison data for the subsequent detection of the PCBA boards in real time. Meanwhile, when the basic comparison data are utilized to detect the PCBA board in real time, different detection defects are classified and marked, so that different defect problems can be distinguished conveniently, and further, guiding is provided for subsequent targeted repair conveniently. In addition, the defect information obtained by detection is marked in the image data and output, so that a visual detection result is realized, the defect detection information is intuitively and efficiently provided, the defect detection efficiency is greatly improved, and meanwhile, the quality of a product is also ensured.

As one possible implementation manner, obtaining test result data of the same type of PCBA board, extracting feature data of components according to the test result data, and forming test base data of the circuit board, including: extracting the position information of each component from the PCBA board inspection result data of the same type and analyzing the position of the component to form component mounting position reference data; acquiring contact position information of each component from the test result data of PCBA boards of the same type and analyzing the contact positions to form contact mounting position reference data; acquiring quality information of each contact from the PCBA board test result data of the same type and carrying out contact quality analysis to form contact quality reference data; and combining the component mounting position reference data, the contact mounting position reference data and the contact quality reference data to form the circuit board inspection basic data.

In the invention, the characteristic data of the components are extracted by analyzing the big data based on the test result data of the PCBA boards of the same type, one aspect is to extract the mounting position data of all the components on the PCBA boards, and the mounting position information of the components determines whether the components are correctly mounted or not, thereby having important effect on influencing the subsequent contact connection and the functions of the electronic circuit. The second aspect is the position of the contact pin of each component, and it can be understood that the component is communicated with the circuit on the board surface through the contact pin so as to play the function of the component. Therefore, the determination of the mounting position of the contact pin is the basis for ensuring that the component can normally operate and the circuit is correct. The third aspect is the contact connection condition of the contact pins, the quality of the contact points determines the performance of electric connection, and the contact points are the basic precondition for ensuring the high-performance work of the PCBA board.

As one possible implementation manner, extracting position information of each component from the same type of PCBA board inspection result data and performing component position analysis to form component mounting position reference data, including: for each PCBA board of the same type passing the inspection, determining a reference origin based on the board surface, and establishing a three-dimensional reference coordinate system taking the reference origin as a coordinate origin and the board surface as a first plane; and determining the position information of each component on the PCBA of the same type passing each inspection according to the three-dimensional reference coordinate system, and carrying out parallel operation on the position information of the same component to form component mounting position reference data of each component.

In the invention, the extraction of the mounting position data of the components mainly considers the positions of the components relative to the PCBA board, so that the contact pins on the components and the connection points of the connection lines can be ensured to be corresponding. The position information is obtained in a projection mode, and a reasonable envelope installation range of each component relative to the PCBA board is obtained based on big data analysis. It should be noted here that, to ensure that the coordinate system established by all PCBA boards of the same type is the same, the object can be achieved by establishing the position on the board as the origin, and after all, the shape and position of the board are the only unchanged relative to the components.

As one possible implementation manner, determining position information of each component on each PCBA board of the same type passing through each inspection according to a three-dimensional reference coordinate system, and performing a union operation on the position information of the same component to form component mounting position reference data of each component, including: taking the first plane as a projection surface to project each component on the PCBA boards of the same typeForming projection position information of the components on the first plane; determining a projection boundary function of a projected shape of each component on a first plane according to the component projection position information Wherein n represents the numbers of different PCBA boards of the same type, and m represents the numbers of different components on the PCBA boards of the same type; obtaining projection boundary functions of all same components>Forming a projection boundary function set of the component, and performing the following parallel operation: establishing a complex etching plane, and enabling all projection boundary functions in the projection boundary function set of the components to be +.>Re-etching on the re-etching plane; obtaining different curve segments with the largest boundary range to form a maximum range envelope curve; obtaining different curve segments with the minimum boundary range to form a minimum range envelope curve; determining a range defined by the maximum range envelope curve and the minimum range envelope curve as a component mounting position projection reference range; and combining the projection reference ranges of the component mounting positions of all the components to form component mounting position reference data.

In the invention, the reasonable envelope installation position of the components on the PCBA board is extracted by obtaining the boundary line formed by projecting the component installation positions on the PCBA board of the same type passing each inspection on the panel and calculating the union range. The aim of the union calculation is to determine the boundary ranges formed by the outermost periphery and the innermost boundary segments formed after intersecting on a plurality of boundary curves, so as to determine the minimum envelope range and the maximum envelope range of the boundary ranges, and further form the installation range interval of the corresponding components.

As one possible implementation manner, the method for obtaining contact position information of each component from the test result data of the PCBA boards of the same type and analyzing the contact positions to form contact mounting position reference data includes: numbering the contact pins of the component to form component contact pin numbering information; for the components on each PCBA board of the same type, combining the component contact pin numbering information to determine the mounting position reference coordinates of the contact pins of the corresponding numbers on each component on the PCBA board; and combining the mounting position reference coordinates of the contact pins with the same number on the same component on all PCBA boards of the same type to form contact mounting position reference data.

In the invention, the data extraction of the contact installation position needs to be considered, on one hand, the contact is used for connecting the contact pin on the component and the connection point of the connection line on the board, and the connection position of each contact pin can be different due to the diversity of line connection, so that a plurality of installation positions which can be connected with the contact pin can be obtained under big data, and on the other hand, the contact pin is an electric signal connection contact pin belonging to the component, so that the determination of the installation position of the contact pin is more reasonable in numbering and positioning by taking the component as a unit. Of course, the more accurate mode is to carry out the combination numbering to all contact pin mounting positions of each component, after all, when the mounting position of one contact pin changes, the other contact pin positions also change, the relevance cannot be embodied by singly carrying out the position determination of the single contact pin, and the combination numbering can be used for judging the test item, so that the accuracy and the correctness of the contact pin mounting position can be more accurately determined.

As one possible implementation manner, obtaining quality information of each contact from the same type of PCBA board inspection result data and performing contact quality analysis to form contact quality reference data, including: for each contact on the PCBA board of the same type which passes the inspection, establishing any three mutually perpendicular planes under a three-dimensional reference coordinate system, and determining the planes as contact projection perpendicular reference planes; respectively projecting the contact points onto three contact point projection vertical reference planes to form contact point projection reference information; carrying out quality analysis on the projected shape of the contact according to the projected reference information of the contact to form projected shape quality reference data of the contact; under a three-dimensional reference coordinate system, each contact point on PCBA boards of the same type is projected onto a first plane to form first plane contact point projection reference information; according to the first plane contact projection reference information, carrying out contact distance quality analysis to form contact projection distance quality reference data; and combining the contact projection shape quality reference data and the contact projection distance quality reference data to form contact quality reference data.

In the invention, the data extraction of the contact quality is divided into two aspects, namely, the quality of the formed electric shock shape determines the electrical connection performance of the contact, such as resistance value, on-off condition and the like. For the data of the shape quality of the contact, the three-dimensional solid object of the contact is considered, and the quality detection cannot be completely carried out by single-direction inspection, so that the shape characteristic data is obtained by determining three mutually perpendicular planes to carry out shape projection under a three-dimensional coordinate system, and further the judgment of the shape quality can be more accurately and reasonably carried out. It can be understood that, because various components are arranged on the PCBA board, the position and environment conditions of the contacts on each component are different, so that three mutually perpendicular planes established for each contact are different, and the three mutually perpendicular planes can be determined according to the environment conditions around the contacts, so that the projection information on each perpendicular plane is complete, and the projection information is prevented from being blocked by other surrounding contacts or components. On the other hand, the distance spacing between the contacts and the surrounding contacts or traces, it being understood that an improper spacing may result in an impermissible electrical connection, thereby causing damage to the traces that affects the performance of the PCBA board. The spacing of the contact from the surrounding electrical connection location is an important test item. Although there are more contacts or lines around the contacts, the minimum amount of spacing can be defined by analysis to reasonably ensure the quality of the spacing of the contacts. The interval information is extracted by projecting the contact points based on the plate surface, and the installation direction and the position of the contact points are considered, so that projection can be performed in a mode of the maximum projection area during projection, and interval quality data can be extracted more conservatively and accurately.

As one possible implementation manner, performing a quality analysis of the projected shape of the contact according to the projected reference information of the contact, to form projected shape quality reference data of the contact, including: acquiring contact projection reference information of the same contact on the PCBA board of the same type passing the inspection in the same direction, and performing sum operation to determine an interval defined by a maximum range formed by a curve segment with the maximum projection boundary range and a minimum range formed by a curve segment with the minimum projection boundary range as a contact direction projection reference range; and collecting the contact point direction projection reference range of each contact point on the three contact point projection vertical reference planes to form contact point quality reference data.

In the invention, the contact shape quality data is obtained by carrying out repeated etching union calculation on projection data on vertical planes in three different directions in each direction, so as to extract the maximum envelope range and the minimum inclusion range, thereby forming a reasonable contact shape range.

As one possible implementation manner, according to the first plane contact projection reference information, performing contact distance quality analysis to form contact projection distance quality reference data, including: for each PCBA board of the same type passing the inspection, determining the minimum distance between each contact and the adjacent contact according to the projection reference information of the first plane contact; obtaining the minimum spacing of the same contacts on PCBA boards of the same type passing the inspection to form a contact minimum spacing set; determining the average minimum pitch of the contacts according to the contact minimum pitch set The method comprises the steps of carrying out a first treatment on the surface of the Determining an average distance offset from the contact minimum pitch set and the average minimum pitchWherein: />，/>，/>Representing the minimum spacing of corresponding contacts on different PCBA boards.

In the present invention, the distance data for the contacts may be obtained by taking the average distance as a reference amount and averaging the deviation amounts. It will be appreciated that, due to the different distance conditions around the contacts, the two distance average differences may be performed separately, for example, an average value of the distance between the target contact and the first contact and an average value of the distance between the target contact and the second contact have a magnitude difference or a larger distance difference, so that distance quality data of two sets of minimum distance group of the contacts can be formed for the two adjacent contacts respectively, and the determination of the difference can be determined based on big data analysis or according to practical experience and needs.

As one possible implementation manner, obtaining real-time image data of the PCBA board, performing comparative analysis in combination with the circuit board inspection basic data, and performing defect marking to form defect inspection marking information, including: extracting a real-time detection image of the PCBA real-time image data, and establishing a three-dimensional reference coordinate system on the real-time detection image; determining a real-time installation position of each component according to a three-dimensional reference coordinate system, projecting the real-time installation position onto a first plane to form a real-time projection position of the component, and extracting a real-time projection boundary curve of the component at the real-time projection position of the component; comparing the real-time projection boundary curve of the component with the projection reference range of the corresponding component mounting position in the component mounting position reference data: if any part of the real-time projection boundary curve of the component does not belong to the projection reference range of the component mounting position, marking the component in a first type; if the real-time projection boundary curve of the component belongs to the projection reference range of the component mounting position, acquiring real-time mounting positions of all contacts of the component, and comparing the real-time mounting positions of the contacts of each contact with corresponding mounting position reference coordinates in the contact mounting position reference data according to the number: if the real-time installation position of the contact is not matched with the reference coordinate of the installation position, marking the contact in a second type; if the real-time installation position of the contact is matched with the reference coordinates of the installation position, respectively acquiring real-time projected shape quality data of the contact under the same contact projected vertical reference plane as the corresponding contact in the contact quality reference data and real-time contact on a first plane Projection distance, and the following comparative analysis was performed: if the projected boundary of each contact projected vertical reference plane in the contact real-time projected shape quality data belongs to the corresponding contact direction projected reference range, and the contact real-time projected distance belongs to the corresponding contact direction projected reference rangeJudging whether the contact is qualified; and otherwise, marking the contacts in a third type.

In the invention, the real-time inspection of defects considers that the quality of the mounting positions of the inspection components, the mounting positions of the contact pins and the contact points has a hierarchical relationship, so that the inspection can be performed step by step, on one hand, the orderly inspection sequence is realized to improve the inspection efficiency, and on the other hand, the inspection time can be saved and the inspection efficiency can be accelerated because the accuracy of the former step is ensured for the next step of implementation of the step by step inspection. Firstly, judging the mounting position of a component, wherein the incorrect mounting position of the component can directly influence the mounting position of a contact pin and the quality of a contact. And secondly, judging the mounting position of the contact pin. And under the condition that the contact pin installation position is correct, analyzing and judging the contact quality. For the quality judgment of the contact, any quality defect of the contact in terms of shape quality and distance quality is considered to cause unqualified quality of the contact, so that comprehensive judgment is needed, and particularly the shape quality is needed to be judged, and the shape quality is required to be judged by ensuring that the shape characteristics in three directions meet the requirements. In addition, different processing modes are considered for different quality defects, and the adjustment of a production system can be guided, so that different types of marks are carried out on different detection defects, and more visual data display is provided for subsequent visualization.

In a second aspect, the present invention provides a system for visualizing a PCBA board defect, which is applied to the method for visualizing a PCBA board defect in the first aspect, and includes an image acquisition unit, configured to acquire a real-time detection image of the PCBA board; the data processing unit is used for extracting the feature data of the components from the obtained PCBA board data of the same type passing the inspection to form basic data for inspecting the circuit board; the inspection analysis unit is used for acquiring the real-time detection image acquired by the image acquisition unit, carrying out contrast analysis by combining with the basic data of the circuit board inspection to form defect inspection mark information, and sending the real-time inspection image passing inspection to the data processing unit according to the inspection result; and the visual output unit is used for outputting and displaying the curve check mark information formed by the check analysis unit.

In the invention, the system acquires the detection data of the PCBA plates of the same type and the image data of the real-time PCBA plates through the image acquisition unit, and provides a basis for data analysis for subsequent analysis. The data processing unit is mainly used for carrying out big data analysis on PCBA boards of the same type to form basic data which can be referenced for subsequent comparison analysis. And the inspection and analysis unit can call the basic data formed by the data processing unit and the real-time PCBA image data to carry out high-efficiency comparison analysis, so that the defects of the real-time PCBA board are judged, and further the control of the production quality of the PCBA is realized. And meanwhile, the PCBA data which is qualified in inspection is submitted to a data processing unit to be used as original update data for big data analysis, so that more perfect and reasonable basic data are formed. In addition, the visual output unit outputs and displays the defect detection result, so that visual data display can be facilitated.

The visual method and the visual system for the defects of the PCBA have the beneficial effects that:

The system acquires the detection data of PCBA boards of the same type and the image data of the real-time PCBA boards through the image acquisition unit, and provides a basis for data analysis for subsequent analysis. The data processing unit is mainly used for carrying out big data analysis on PCBA boards of the same type to form basic data which can be referenced for subsequent comparison analysis. And the inspection and analysis unit can call the basic data formed by the data processing unit and the real-time PCBA image data to carry out high-efficiency comparison analysis, so that the defects of the real-time PCBA board are judged, and further the control of the production quality of the PCBA is realized. And meanwhile, the PCBA data which is qualified in inspection is submitted to a data processing unit to be used as original update data for big data analysis, so that more perfect and reasonable basic data are formed. In addition, the visual output unit outputs and displays the defect detection result, so that visual data display can be facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a step diagram of a method for visualizing defects of a PCBA board according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1, the embodiment of the invention provides a method for visualizing defects of a Printed Circuit Board Assembly (PCBA), which can provide accurate and reasonable basic comparison data for subsequent detection of the PCBA in real time by acquiring large data of the detection results of the PCBA of the same type and analyzing and extracting component mounting characteristic data under the large data to form circuit board detection basic data. Meanwhile, when the basic comparison data are utilized to detect the PCBA board in real time, different detection defects are classified and marked, so that different defect problems can be distinguished conveniently, and further, guiding is provided for subsequent targeted repair conveniently. In addition, the defect information obtained by detection is marked in the image data and output, so that a visual detection result is realized, the defect detection information is intuitively and efficiently provided, the defect detection efficiency is greatly improved, and meanwhile, the quality of a product is also ensured.

The visual method for the defects of the PCBA plate specifically comprises the following steps:

s1: and obtaining the test result data of PCBA boards of the same type, extracting the feature data of the components according to the test result data, and forming the test basic data of the circuit board.

Obtaining test result data of PCBA boards of the same type, extracting feature data of components according to the test result data, and forming test base data of the circuit board, wherein the test base data comprises the following components: extracting the position information of each component from the PCBA board inspection result data of the same type and analyzing the position of the component to form component mounting position reference data; acquiring contact position information of each component from the test result data of PCBA boards of the same type and analyzing the contact positions to form contact mounting position reference data; acquiring quality information of each contact from the PCBA board test result data of the same type and carrying out contact quality analysis to form contact quality reference data; and combining the component mounting position reference data, the contact mounting position reference data and the contact quality reference data to form the circuit board inspection basic data.

The characteristic data of the components and parts are mainly extracted by analyzing the big data based on the test result data of the PCBA boards of the same type, one aspect is to extract the installation position data of all the components and parts on the PCBA boards, and the installation position information of the components determines whether the installation of the components and parts is correct or not, so that the method has an important effect on influencing the subsequent functions of contact connection and electronic circuits. The second aspect is the position of the contact pin of each component, and it can be understood that the component is communicated with the circuit on the board surface through the contact pin so as to play the function of the component. Therefore, the determination of the mounting position of the contact pin is the basis for ensuring that the component can normally operate and the circuit is correct. The third aspect is the contact connection condition of the contact pins, the quality of the contact points determines the performance of electric connection, and the contact points are the basic precondition for ensuring the high-performance work of the PCBA board.

The method for extracting the position information of each component from the PCBA board inspection result data of the same type and analyzing the position of the component to form component mounting position reference data comprises the following steps: for each PCBA board of the same type passing the inspection, determining a reference origin based on the board surface, and establishing a three-dimensional reference coordinate system taking the reference origin as a coordinate origin and the board surface as a first plane; and determining the position information of each component on the PCBA of the same type passing each inspection according to the three-dimensional reference coordinate system, and carrying out parallel operation on the position information of the same component to form component mounting position reference data of each component.

For the extraction of the mounting position data of the components, the positions of the components relative to the PCBA are mainly considered, so that the contact pins on the components and the connection points of the connection lines can be ensured to be corresponding. The position information is obtained in a projection mode, and a reasonable envelope installation range of each component relative to the PCBA board is obtained based on big data analysis. It should be noted here that, to ensure that the coordinate system established by all PCBA boards of the same type is the same, the object can be achieved by establishing the position on the board as the origin, and after all, the shape and position of the board are the only unchanged relative to the components.

Determining the position information of each component on the PCBA board of the same type passing each inspection according to the three-dimensional reference coordinate system, and carrying out the parallel operation on the position information of the same component to form component mounting position reference data of each component, wherein the method comprises the following steps: each component on PCBA boards of the same type is projected onto the first plane by taking the first plane as a projection plane, so that component projection position information is formed; determining a projection boundary function of a projected shape of each component on a first plane according to the component projection position informationWherein n represents the numbers of different PCBA boards of the same type, and m represents the numbers of different components on the PCBA boards of the same type; obtaining projection boundary functions of all same components>Forming a projection boundary function set of the component, and performing the following parallel operation: establishing a complex etching plane, and enabling all projection boundary functions in the projection boundary function set of the components to be +.>Re-etching on the re-etching plane; obtaining different curve segments with the largest boundary range to form a maximum range envelope curve; obtaining different curve segments with the minimum boundary range to form a minimum range envelope curve; determining a range defined by the maximum range envelope curve and the minimum range envelope curve as a component mounting position projection reference range; and combining the projection reference ranges of the component mounting positions of all the components to form component mounting position reference data.

The reasonable envelope installation position of the components on the PCBA board is extracted by obtaining the boundary line formed by projection of the component installation positions on the PCBA board of the same type passing each inspection on the panel, and the calculation of the union range is carried out. The aim of the union calculation is to determine the boundary ranges formed by the outermost periphery and the innermost boundary segments formed after intersecting on a plurality of boundary curves, so as to determine the minimum envelope range and the maximum envelope range of the boundary ranges, and further form the installation range interval of the corresponding components.

The method for obtaining the contact position information of each component from the test result data of the PCBA plates of the same type and analyzing the contact positions to form the contact mounting position reference data comprises the following steps: numbering the contact pins of the component to form component contact pin numbering information; for the components on each PCBA board of the same type, combining the component contact pin numbering information to determine the mounting position reference coordinates of the contact pins of the corresponding numbers on each component on the PCBA board; and combining the mounting position reference coordinates of the contact pins with the same number on the same component on all PCBA boards of the same type to form contact mounting position reference data.

The data extraction of the contact installation position needs to be considered that, on one hand, the contact is used for connecting the contact pin on the component with the connection point of the connection line on the board, and because of the diversity of line connection, the connection position of each contact pin can be different, so that a plurality of installation positions which can be connected with the contact pin can be obtained under big data, and on the other hand, because the contact pin is an electric signal connected contact pin belonging to the component, the determination of the installation position of the contact pin is more reasonable to number and position by taking the component as a unit. Of course, the more accurate mode is to carry out the combination numbering to all contact pin mounting positions of each component, after all, when the mounting position of one contact pin changes, the other contact pin positions also change, the relevance cannot be embodied by singly carrying out the position determination of the single contact pin, and the combination numbering can be used for judging the test item, so that the accuracy and the correctness of the contact pin mounting position can be more accurately determined.

The method for obtaining the quality information of each contact from the test result data of the PCBA plates of the same type and carrying out contact quality analysis to form contact quality reference data comprises the following steps: for each contact on the PCBA board of the same type which passes the inspection, establishing any three mutually perpendicular planes under a three-dimensional reference coordinate system, and determining the planes as contact projection perpendicular reference planes; respectively projecting the contact points onto three contact point projection vertical reference planes to form contact point projection reference information; carrying out quality analysis on the projected shape of the contact according to the projected reference information of the contact to form projected shape quality reference data of the contact; under a three-dimensional reference coordinate system, each contact point on PCBA boards of the same type is projected onto a first plane to form first plane contact point projection reference information; according to the first plane contact projection reference information, carrying out contact distance quality analysis to form contact projection distance quality reference data; and combining the contact projection shape quality reference data and the contact projection distance quality reference data to form contact quality reference data.

The data extraction of the contact quality is divided into two aspects, namely the quality of the formed electric shock shape, and the quality of the contact shape determines the electrical connection performance of the contact, such as resistance value, on-off condition and the like. For the data of the shape quality of the contact, the three-dimensional solid object of the contact is considered, and the quality detection cannot be completely carried out by single-direction inspection, so that the shape characteristic data is obtained by determining three mutually perpendicular planes to carry out shape projection under a three-dimensional coordinate system, and further the judgment of the shape quality can be more accurately and reasonably carried out. It can be understood that, because various components are arranged on the PCBA board, the position and environment conditions of the contacts on each component are different, so that three mutually perpendicular planes established for each contact are different, and the three mutually perpendicular planes can be determined according to the environment conditions around the contacts, so that the projection information on each perpendicular plane is complete, and the projection information is prevented from being blocked by other surrounding contacts or components. On the other hand, the distance spacing between the contacts and the surrounding contacts or traces, it being understood that an improper spacing may result in an impermissible electrical connection, thereby causing damage to the traces that affects the performance of the PCBA board. The spacing of the contact from the surrounding electrical connection location is an important test item. Although there are more contacts or lines around the contacts, the minimum amount of spacing can be defined by analysis to reasonably ensure the quality of the spacing of the contacts. The interval information is extracted by projecting the contact points based on the plate surface, and the installation direction and the position of the contact points are considered, so that projection can be performed in a mode of the maximum projection area during projection, and interval quality data can be extracted more conservatively and accurately.

Performing mass analysis of the projected shape of the contact according to the projected reference information of the contact to form projected shape mass reference data of the contact, comprising: acquiring contact projection reference information of the same contact on the PCBA board of the same type passing the inspection in the same direction, and performing sum operation to determine an interval defined by a maximum range formed by a curve segment with the maximum projection boundary range and a minimum range formed by a curve segment with the minimum projection boundary range as a contact direction projection reference range; and collecting the contact point direction projection reference range of each contact point on the three contact point projection vertical reference planes to form contact point quality reference data.

The contact shape quality data is also obtained by carrying out repeated etching union calculation on projection data on vertical planes in three different directions in each direction, so that the maximum envelope range and the minimum inclusion range are extracted, and a reasonable contact shape range is formed.

According to the first plane contact projection reference information, carrying out contact distance quality analysis to form contact projection distance quality reference data, including: for each PCBA board of the same type passing the inspection, determining the minimum distance between each contact and the adjacent contact according to the projection reference information of the first plane contact; obtaining the minimum spacing of the same contacts on PCBA boards of the same type passing the inspection to form a contact minimum spacing set; determining the average minimum pitch of the contacts according to the contact minimum pitch set The method comprises the steps of carrying out a first treatment on the surface of the Determining an average distance offset from the contact minimum pitch set and the average minimum pitch>Wherein: />，，/>Representing the minimum spacing of corresponding contacts on different PCBA boards.

The distance data for the contacts may be obtained by taking the average distance as a reference amount and averaging over the deviation amount. It will be appreciated that, due to the different distance conditions around the contacts, the two distance average differences may be performed separately, for example, an average value of the distance between the target contact and the first contact and an average value of the distance between the target contact and the second contact have a magnitude difference or a larger distance difference, so that distance quality data of two sets of minimum distance group of the contacts can be formed for the two adjacent contacts respectively, and the determination of the difference can be determined based on big data analysis or according to practical experience and needs.

S2: and acquiring real-time image data of the PCBA, carrying out comparative analysis by combining the basic data of the circuit board inspection, and carrying out defect marking to form defect inspection marking information.

Obtaining PCBA real-time image data, carrying out contrast analysis by combining circuit board inspection basic data, and carrying out defect marking to form defect inspection marking information, wherein the method comprises the following steps: extracting a real-time detection image of the PCBA real-time image data, and establishing a three-dimensional reference coordinate system on the real-time detection image; determining a real-time installation position of each component according to a three-dimensional reference coordinate system, projecting the real-time installation position onto a first plane to form a real-time projection position of the component, and extracting a real-time projection boundary curve of the component at the real-time projection position of the component; comparing the real-time projection boundary curve of the component with the projection reference range of the corresponding component mounting position in the component mounting position reference data: if any part of the real-time projection boundary curve of the component does not belong to the projection reference range of the component mounting position, marking the component in a first type; if the real-time projection boundary curve of the component belongs to the projection reference range of the component mounting position, acquiring real-time mounting positions of all contacts of the component, and carrying out the real-time mounting positions of the contacts of each contact and corresponding mounting position reference coordinates in the contact mounting position reference data according to the numbers Comparison: if the real-time installation position of the contact is not matched with the reference coordinate of the installation position, marking the contact in a second type; if the real-time installation position of the contact is matched with the reference coordinate of the installation position, respectively acquiring the real-time projection shape quality data of the contact under the contact projection vertical reference plane which is the same as the corresponding contact in the contact quality reference data and the real-time projection distance of the contact on the first plane, and carrying out the following comparative analysis: if the projected boundary of each contact projected vertical reference plane in the contact real-time projected shape quality data belongs to the corresponding contact direction projected reference range, and the contact real-time projected distance belongs to the corresponding contact direction projected reference rangeJudging whether the contact is qualified; and otherwise, marking the contacts in a third type.

The real-time detection of defects considers that the quality of the mounting positions of the components, the mounting positions of the contact pins and the contacts have a hierarchical relationship, so that the detection can be performed step by step, on one hand, the detection efficiency is improved by realizing the orderly detection sequence, and on the other hand, the next step of implementation can be performed only by ensuring the correctness of the previous step by step detection, so that the detection time can be saved, and the detection efficiency can be accelerated. Firstly, judging the mounting position of a component, wherein the incorrect mounting position of the component can directly influence the mounting position of a contact pin and the quality of a contact. And secondly, judging the mounting position of the contact pin. And under the condition that the contact pin installation position is correct, analyzing and judging the contact quality. For the quality judgment of the contact, any quality defect of the contact in terms of shape quality and distance quality is considered to cause unqualified quality of the contact, so that comprehensive judgment is needed, and particularly the shape quality is needed to be judged, and the shape quality is required to be judged by ensuring that the shape characteristics in three directions meet the requirements. In addition, different processing modes are considered for different quality defects, and the adjustment of a production system can be guided, so that different types of marks are carried out on different detection defects, and more visual data display is provided for subsequent visualization.

S3: and marking different defects on the real-time inspection image of the PCBA according to the defect inspection mark information to form a defect visual inspection image.

Through visual output display, the defect expression detected is more visual. And is beneficial to efficiently carrying out defect positioning and analysis.

The invention also provides a visual system of the PCBA defects, which adopts the visual method of the PCBA defects, and comprises an image acquisition unit for acquiring real-time detection images of the PCBA; the data processing unit is used for extracting the feature data of the components from the obtained PCBA board data of the same type passing the inspection to form basic data for inspecting the circuit board; the inspection analysis unit is used for acquiring the real-time detection image acquired by the image acquisition unit, carrying out contrast analysis by combining with the basic data of the circuit board inspection to form defect inspection mark information, and sending the real-time inspection image passing inspection to the data processing unit according to the inspection result; and the visual output unit is used for outputting and displaying the curve check mark information formed by the check analysis unit.

In summary, the method and the device for visualizing the defects of the PCBA provided by the embodiment of the invention have the following beneficial effects:

In the present invention, "at least one" means one or more, and "a plurality" means two or more. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b, or c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural.

It should be understood that, in various embodiments of the present invention, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

Those of ordinary skill in the art will appreciate that the elements and method steps of the examples described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or as a combination of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a read-only memory (ROM), a random access memory (random access memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. A method for visualizing defects in a PCBA board, comprising:

obtaining test result data of PCBA boards of the same type, extracting feature data of components according to the test result data, and forming test basic data of the circuit board;

acquiring real-time image data of the PCBA, carrying out contrast analysis by combining the circuit board inspection basic data, and carrying out defect marking to form defect inspection marking information;

marking different defects on the real-time inspection image of the PCBA board according to the defect inspection marking information to form a defect visualized inspection image,

the method comprises the steps of obtaining test result data of PCBA boards of the same type, extracting feature data of components according to the test result data, and forming test basic data of the circuit board, and comprises the following steps:

Extracting the position information of each component from the test result data of the PCBA plates of the same type, and analyzing the positions of the components to form component mounting position reference data:

for each PCBA board of the same type passing the inspection, determining a reference origin on the basis of a board surface, and establishing a three-dimensional reference coordinate system taking the reference origin as a coordinate origin and the board surface as a first plane; determining the position information of each component on the PCBA board of the same type passing each inspection according to the three-dimensional reference coordinate system, and carrying out parallel operation on the position information of the same component to form component mounting position reference data of each component:

taking the first plane as a projection surface, projecting each component on the PCBA of the same type onto the first plane to form component projection position information; determining a projection boundary function of the projected shape of each component on the first plane according to the component projection position informationWherein n represents the numbers of different PCBA boards of the same type, and m represents the numbers of different components on the PCBA boards of the same type; acquiring the projection boundary functions of all the same componentsForming a projection boundary function set of the component, and performing the following parallel operation: establishing a re-etching plane, and connecting the element device All said projection boundary functions in the projection boundary function set +.>Re-engraving on the re-engraving plane; obtaining different curve segments with the largest boundary range to form a maximum range envelope curve; obtaining different curve segments with the minimum boundary range to form a minimum range envelope curve; determining a range defined by the maximum range envelope curve and the minimum range envelope curve as a component mounting position projection reference range; combining the projection reference ranges of the component mounting positions of all components to form component mounting position reference data;

acquiring contact position information of each component from the test result data of PCBA boards of the same type and analyzing the contact positions to form contact mounting position reference data;

acquiring quality information of each contact from the PCBA board test result data of the same type and carrying out contact quality analysis to form contact quality reference data;

and combining the component mounting position reference data, the contact mounting position reference data and the contact quality reference data to form the circuit board inspection basic data.

2. The method for visualizing a PCBA board defect according to claim 1, wherein the obtaining contact position information of each component from the same type of PCBA board inspection result data and performing contact position analysis to form contact mounting position reference data comprises:

Numbering the contact pins of the component to form component contact pin numbering information;

for the components on each PCBA board of the same type, combining the component contact pin numbering information to determine the mounting position reference coordinates of the contact pins of the corresponding numbers on each component on the PCBA board;

and combining the mounting position reference coordinates of the contact pins with the same number on the same component on all PCBA boards of the same type to form the contact mounting position reference data.

3. A method for visualizing a defect in a PCBA board according to claim 2, wherein the obtaining quality information of each contact from the same type of PCBA board inspection result data and performing contact quality analysis to form contact quality reference data comprises:

for each contact on the PCBA board of the same type which passes the inspection, establishing any three mutually perpendicular planes under the three-dimensional reference coordinate system, and determining the planes as contact projection perpendicular reference planes;

respectively projecting the contact points onto three contact point projection vertical reference planes to form contact point projection reference information;

carrying out quality analysis on the projected shape of the contact according to the projected reference information of the contact to form projected shape quality reference data of the contact;

Under the three-dimensional reference coordinate system, each contact point on PCBA boards of the same type is projected onto the first plane to form first plane contact point projection reference information;

according to the first plane contact projection reference information, carrying out contact distance quality analysis to form contact projection distance quality reference data;

and combining the contact projection shape quality reference data and the contact projection distance quality reference data to form the contact quality reference data.

4. A method for visualizing a PCBA board defect according to claim 3, wherein said performing a contact projected shape quality analysis based on said contact projected reference information to form contact projected shape quality reference data comprises:

acquiring contact projection reference information of the same contact on the PCBA board of the same type passing the inspection in the same direction, and carrying out sum operation to determine an interval defined by a maximum range formed by a curve segment with the maximum projection boundary range and a minimum range formed by a curve segment with the minimum projection boundary range as a contact direction projection reference range;

and collecting the projection reference ranges of the contact directions of each contact on three perpendicular reference planes of the contact projection, and forming the contact quality reference data.

5. The method for visualizing a defect in a PCBA board according to claim 4, wherein said performing a contact distance quality analysis based on said first planar contact projection reference information to form contact projection distance quality reference data comprises:

for each PCBA board of the same type passing the inspection, determining the minimum distance between each contact and the adjacent contact according to the projection reference information of the first plane contact;

acquiring the minimum spacing of the same contacts on all PCBA boards of the same type passing the inspection to form a contact minimum spacing set;

determining the average minimum pitch of the contacts according to the contact minimum pitch set；

Determining an average distance offset from the set of contact minimum pitches and the average minimum pitchWherein:，/>，/>representing the minimum spacing of corresponding contacts on different PCBA boards.

6. The method for visualizing a defect in a PCBA board as in claim 5, wherein the obtaining PCBA board real-time image data and performing a comparative analysis in combination with the circuit board inspection base data and performing defect marking to form defect inspection marking information comprises:

extracting a real-time detection image of the PCBA real-time image data, and establishing the three-dimensional reference coordinate system on the real-time detection image;

Determining a real-time installation position of each component according to the three-dimensional reference coordinate system, projecting the real-time installation position onto the first plane to form a real-time projection position of the component, and extracting a real-time projection boundary curve of the component at the real-time projection position of the component;

comparing the real-time projection boundary curve of the component with the projection reference range of the corresponding component mounting position in the component mounting position reference data:

if any part of the real-time projection boundary curve of the component does not belong to the projection reference range of the component mounting position, marking the component in a first type;

if the real-time projection boundary curve of the component belongs to the projection reference range of the component mounting position, acquiring real-time mounting positions of all contacts of the component, and comparing the real-time mounting positions of the contacts of each contact with corresponding mounting position reference coordinates in the contact mounting position reference data according to the number:

if the real-time installation position of the contact is not matched with the reference coordinate of the installation position, marking the contact in a second type;

if the real-time installation position of the contact is matched with the reference coordinate of the installation position, respectively acquiring real-time projection shape quality data of the contact under the vertical projection reference plane of the contact, which is the same as the corresponding contact in the contact quality reference data, and real-time projection distance of the contact on the first plane, and performing the following comparative analysis:

If the projection boundary of each contact projection vertical reference plane in the contact real-time projection shape quality data belongs to the corresponding contact direction projection reference range, and the contact real-time projection distance belongs to the corresponding contact direction projection reference rangeJudging whether the contact is qualified;

and otherwise, marking the contacts in a third type.

7. A system for visualizing a PCBA board defect, employing the method for visualizing a PCBA board defect as recited in any one of claims 1-6, comprising:

the image acquisition unit is used for acquiring real-time detection images of the PCBA board;

the data processing unit is used for extracting the feature data of the components from the obtained PCBA board data of the same type passing the inspection to form basic data for inspecting the circuit board;

the inspection analysis unit is used for acquiring the real-time detection image acquired by the image acquisition unit, carrying out contrast analysis by combining with the basic data of the circuit board inspection to form defect inspection mark information, and sending the real-time inspection image passing inspection to the data processing unit according to the inspection result;

and the visual output unit is used for outputting and displaying the curve inspection mark information formed by the inspection analysis unit.