CN210225912U - Automatic exposure platform for copper-plated substrate - Google Patents
Automatic exposure platform for copper-plated substrate Download PDFInfo
- Publication number
- CN210225912U CN210225912U CN201920871782.4U CN201920871782U CN210225912U CN 210225912 U CN210225912 U CN 210225912U CN 201920871782 U CN201920871782 U CN 201920871782U CN 210225912 U CN210225912 U CN 210225912U
- Authority
- CN
- China
- Prior art keywords
- exposure
- copper
- cover plate
- positioning
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model discloses an automatic exposure platform for copper-plated substrates, which comprises an exposure platform; the exposure platform comprises a cabinet body, an exposure platform surface arranged above the cabinet body, and an exposure lamp arranged above the exposure platform surface; the exposure table-board comprises a bottom plate, an exposure tray and a positioning cover plate from bottom to top in sequence; the positioning cover plate is movably covered above the exposure tray; a vacuum pumping head is arranged between the exposure tray and the positioning cover plate; the vacuum air pumping head is connected with a vacuum air pump through a vacuum tube; a copper-plated substrate coated with photosensitive blue oil is placed on the exposure tray; a film with a printed circuit diagram is placed on the copper-plated substrate; the positioning cover plate is a plastic plate and consists of an outer frame and a plastic film fixed in the center of the outer frame; the plastic film of the positioning cover plate is pressed above the film; the utility model discloses an automatic exposure platform of copper-plated base plate can prevent to have unnecessary light to get into between copper-plated base plate and the film, and it is effectual to improve the exposure.
Description
Technical Field
The utility model relates to an automatic exposure platform of copper-plated base plate belongs to pottery copper-plated board exposure equipment technical field.
Background
With the rapid development of science and technology and the pursuit of higher quality of life for human beings, the application characteristics of many products tend to be extremely strict, so that the use of newly developed materials becomes a necessary means, today's IC packaging process is affected by the pursuit of better transmission efficiency and smaller size (e.g., electronic components of mobile phones and mini-notebook computers), so the industry has invested considerable research expenses in this area, after many years of research, the utility model is a ceramic substrate made of ceramic material, the ceramic substrate has excellent insulation, chemical stability, electromagnetic property, high hardness, high thermal conductivity, wear resistance and high temperature resistance, the efficiency of the ceramic substrate is much better than that of the conventional substrate, and thus the frequency of the ceramic substrate is higher and higher.
However, after a metal layer and a conductive layer are attached to a ceramic substrate by thermocompression, a dry film layer is attached to the conductive layer, and then exposure, development and etching operations are performed to leave the required metal layer and conductive layer to form a circuit. In the processing process of the ceramic substrate, an exposure machine is usually required to be used for carrying out exposure operation on the ceramic substrate, the exposure machine is mainly used for copying and transferring the graph loaded on the film to the substrate, in order to ensure the yield of products, the film and the substrate must be aligned, otherwise, the forming of the graph on the substrate can be influenced by the position deviation of the substrate. At present, manual alignment is mainly adopted between the film and the substrate, an operator visually overlaps the film and the substrate according to a set positioning hole on the film and a positioning hole drilled on the substrate, and then the film and the substrate are bonded together by an adhesive tape, so that the aim of alignment is fulfilled; however, the manual method has the following defects: the manual alignment is considered to have large factor influence, so that product difference and errors are easily caused; the manual alignment requires high professional skills of operators and has low production efficiency; due to the adoption of the adhesive tape for attaching, the adhesive tape is easy to fall off and shift in the operation process; therefore, in order to solve the above problems, it is necessary to design a new automatic exposure stage for copper-plated substrates.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a copper-plated substrate automatic exposure platform, the location is effectual, and can prevent to have unnecessary light to get into between copper-plated substrate and the film, improves the exposure quality.
The utility model discloses an automatic exposure platform for copper-plated substrates, which comprises an exposure platform; the exposure platform comprises a cabinet body, an exposure platform surface arranged above the cabinet body, and an exposure lamp arranged above the exposure platform surface; the exposure table-board comprises a bottom plate, an exposure tray and a positioning cover plate from bottom to top in sequence; the positioning cover plate is movably covered above the exposure tray; a vacuum pumping head is arranged between the exposure tray and the positioning cover plate; the vacuum air pumping head is connected with a vacuum air pump through a vacuum tube; a copper-plated substrate coated with photosensitive blue oil is placed on the exposure tray; a film with a printed circuit diagram is placed on the copper-plated substrate; the positioning cover plate is a plastic plate and consists of an outer frame and a plastic film fixed in the center of the outer frame; the plastic film of the positioning cover plate is pressed above the film; the periphery of the exposure tray is fixedly provided with sealing rubber, and the upper edge of the sealing rubber is tightly attached to the outer frame of the positioning cover plate; the front side of the outer frame of the positioning cover plate is symmetrically provided with two positioning clamping blocks; two positioning columns are fixed on the front side of the exposure tray and are positioned under the two positioning fixture blocks; the positioning fixture block is movably clamped with the positioning column, the copper-plated substrate coated with photosensitive blue oil is placed on an exposure tray of an exposure table board, and a film with a circuit diagram to be printed is placed on the copper-plated substrate; then, covering a positioning cover plate, enabling the sealing rubber at the periphery of the exposure tray to be tightly attached to the outer frame of the positioning cover plate, and clamping and fixing a positioning fixture block at the front side of the positioning cover plate with a positioning column; then, a vacuumizing button on the control panel is pressed, a vacuum air extractor is started, so that a negative pressure state is formed between the positioning cover plate and the exposure tray, the copper-plated substrate and the film sheet are firmly covered by the plastic film of the positioning cover plate on the copper-plated substrate and the film sheet, redundant light can be prevented from entering between the copper-plated substrate and the film sheet, the copper-plated substrate and the film sheet can be pressed and positioned, and the exposure quality is prevented from being influenced by deviation and displacement during exposure treatment; and after vacuum pumping and positioning, carrying out exposure treatment, opening an exposure lamp switch on the control panel, and turning on the exposure lamp to realize exposure operation.
Furthermore, the upper end of the positioning fixture block is hinged with the outer frame of the positioning cover plate through a rotating pin, and the lower end of the positioning fixture block is provided with a clamping groove in a Y-shaped structure; the positioning column is movably clamped in the clamping groove.
Further, the exposure lamp is fixed above the exposure table top through an inverted L-shaped bracket.
Further, a control panel is arranged on the inner side of the inverted L-shaped bracket; the exposure lamp and the vacuum air pump are respectively electrically connected with an exposure lamp switch and a vacuumizing button which are arranged on the control panel through leads.
Further, handles are mounted on the front sides of the exposure tray and the positioning cover plate.
Compared with the prior art, the utility model discloses an automatic exposure platform of copper-plated base plate, with copper-plated base plate and film piece place between exposure tray and location apron, and the location apron is the plastic slab, make to form the negative pressure state between exposure tray and the location apron through the evacuation machine, make copper-plated base plate and film piece firmly cover by the plastic film of above location apron, not only can prevent to have unnecessary light to get into between copper-plated base plate and the film piece, still can carry out the pressfitting location to copper-plated base plate and film piece, avoid causing the skew to walk the position and influence the exposure quality when exposure is handled; the sealing rubber is arranged at the edge connecting part of the exposure tray and the positioning cover plate, so that the sealing property is improved, and the exposure treatment is prevented from being influenced by the external air entering a vacuum environment.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an enlarged schematic view of the position a of the present invention.
Fig. 3 is an enlarged schematic structural diagram of the utility model at B.
The parts in the drawings are marked as follows: 1-cabinet body, 2-exposure table board, 21-bottom board, 22-exposure tray, 23-positioning cover board, 231-outer frame, 232-plastic film, 3-exposure lamp, 4-copper-plated substrate, 5-film, 6-sealing rubber, 7-positioning fixture block, 8-positioning column, 9-rotating pin, 10-clamping groove, 11-inverted L-shaped bracket, 12-control panel, 13-handle, 14-vacuum exhaust head, 15-vacuum tube, 16-exposure lamp switch and 17-vacuum exhaust button.
Detailed Description
The automatic exposure stage for the copper-plated substrate shown in fig. 1 to 3 includes an exposure stage; the exposure platform comprises a cabinet body 1, an exposure platform surface 2 arranged above the cabinet body 1, and an exposure lamp 3 arranged above the exposure platform surface 2; the exposure table top 2 sequentially comprises a bottom plate 21, an exposure tray 22 and a positioning cover plate 23 from bottom to top; the positioning cover plate 23 is movably covered above the exposure tray 21; a vacuum air-pumping head 14 is arranged between the exposure tray 22 and the positioning cover plate 23; the vacuum pumping head 14 is connected with a vacuum air pump (not shown) through a vacuum tube 15; a copper-plated substrate 4 coated with photosensitive blue oil is placed on the exposure tray 22; a film 5 with a printed circuit diagram is placed on the copper-plated substrate 4; the positioning cover plate 23 is a plastic plate, and is composed of an outer frame 231 and a plastic film 232 fixed in the center of the outer frame 231; the plastic film 232 of the positioning cover plate 23 is pressed above the film 5; the periphery of the exposure tray 22 is fixed with a sealing rubber 6, and the upper edge of the sealing rubber 6 is tightly attached to the outer frame 231 of the positioning cover plate 23; the positioning cover plate 23 is symmetrically provided with two positioning fixture blocks 7 at the front side of the outer frame thereof; two positioning columns 8 are fixed on the front side of the exposure tray 22 and are positioned under the two positioning fixture blocks 7; the positioning fixture block 7 is movably clamped with the positioning column 8.
The upper end of the positioning fixture block 7 is hinged with the outer frame 231 of the positioning cover plate 23 through a rotating pin 9, and the lower end of the positioning fixture block 7 is provided with a clamping groove 10 in a Y-shaped structure; the positioning column 8 is movably clamped in the clamping groove 10.
The exposure lamp 3 is fixed above the exposure table top 2 through an inverted L-shaped bracket 11.
The inner side of the inverted L-shaped bracket 11 is provided with a control panel 12; the exposure lamp 3 and the vacuum pump (not shown) are electrically connected to an exposure lamp switch 16 and a vacuum button 17 provided on the control panel 12 through wires, respectively.
The utility model discloses an automatic exposure platform of copper-plated substrate, the copper-plated substrate coated with photosensitive blue oil is placed on the exposure tray of the exposure table-board, and a film with a circuit diagram to be printed is placed on the copper-plated substrate; then, covering a positioning cover plate, enabling the sealing rubber at the periphery of the exposure tray to be tightly attached to the outer frame of the positioning cover plate, and clamping and fixing a positioning fixture block at the front side of the positioning cover plate with a positioning column; then, a vacuumizing button on the control panel is pressed, a vacuum air extractor is started, so that a negative pressure state is formed between the positioning cover plate and the exposure tray, the copper-plated substrate and the film sheet are firmly covered by the plastic film of the positioning cover plate on the copper-plated substrate and the film sheet, redundant light can be prevented from entering between the copper-plated substrate and the film sheet, the copper-plated substrate and the film sheet can be pressed and positioned, and the exposure quality is prevented from being influenced by deviation and displacement during exposure treatment; and after vacuum pumping and positioning, carrying out exposure treatment, opening an exposure lamp switch on the control panel, and turning on the exposure lamp to realize exposure operation.
The above-mentioned embodiment is only the preferred embodiment of the present invention, so all the equivalent changes or modifications made by the structure, features and principles of the present invention are included in the claims of the present invention.
Claims (5)
1. An automatic exposure table for a copper-plated substrate comprises an exposure table; the method is characterized in that: the exposure platform comprises a cabinet body, an exposure platform surface arranged above the cabinet body, and an exposure lamp arranged above the exposure platform surface; the exposure table-board comprises a bottom plate, an exposure tray and a positioning cover plate from bottom to top in sequence; the positioning cover plate is movably covered above the exposure tray; a vacuum pumping head is arranged between the exposure tray and the positioning cover plate; the vacuum air pumping head is connected with a vacuum air pump through a vacuum tube; a copper-plated substrate coated with photosensitive blue oil is placed on the exposure tray; a film with a printed circuit diagram is placed on the copper-plated substrate; the positioning cover plate is a plastic plate and consists of an outer frame and a plastic film fixed in the center of the outer frame; the plastic film of the positioning cover plate is pressed above the film; the periphery of the exposure tray is fixedly provided with sealing rubber, and the upper edge of the sealing rubber is tightly attached to the outer frame of the positioning cover plate; the front side of the outer frame of the positioning cover plate is symmetrically provided with two positioning clamping blocks; two positioning columns are fixed on the front side of the exposure tray and are positioned under the two positioning fixture blocks; the positioning fixture block is movably clamped with the positioning column.
2. The automatic exposure station for copper-coated substrates according to claim 1, characterized in that: the upper end of the positioning fixture block is hinged with the outer frame of the positioning cover plate through a rotating pin, and the lower end of the positioning fixture block is provided with a clamping groove in a Y-shaped structure; the positioning column is movably clamped in the clamping groove.
3. The automatic exposure station for copper-coated substrates according to claim 1, characterized in that: the exposure lamp is fixed above the exposure table board through the inverted L-shaped bracket.
4. The automatic exposure station for copper-coated substrates according to claim 3, characterized in that: the inner side of the inverted L-shaped bracket is provided with an operation panel; the exposure lamp and the vacuum air pump are respectively electrically connected with an exposure lamp switch and a vacuumizing button which are arranged on the control panel through leads.
5. The automatic exposure station for copper-coated substrates according to claim 1, characterized in that: handles are arranged on the front sides of the exposure tray and the positioning cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920871782.4U CN210225912U (en) | 2019-06-11 | 2019-06-11 | Automatic exposure platform for copper-plated substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920871782.4U CN210225912U (en) | 2019-06-11 | 2019-06-11 | Automatic exposure platform for copper-plated substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210225912U true CN210225912U (en) | 2020-03-31 |
Family
ID=69931189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920871782.4U Active CN210225912U (en) | 2019-06-11 | 2019-06-11 | Automatic exposure platform for copper-plated substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210225912U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462578A (en) * | 2020-12-16 | 2021-03-09 | 广东思沃激光科技有限公司 | Exposure method, exposure machine, and computer-readable storage medium |
-
2019
- 2019-06-11 CN CN201920871782.4U patent/CN210225912U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462578A (en) * | 2020-12-16 | 2021-03-09 | 广东思沃激光科技有限公司 | Exposure method, exposure machine, and computer-readable storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101119571B1 (en) | Semiconducter substrate protect film auto peeler | |
| CN210225912U (en) | Automatic exposure platform for copper-plated substrate | |
| CN105448780A (en) | Die bonder | |
| JP2007294781A (en) | Bonding apparatus, and method for sucking circuit board in the same | |
| TWI609612B (en) | Stencil printing method for manufacturing printed circuit board | |
| CN108463062B (en) | Loading method of surface-mounted device repairing printed board soldering paste | |
| CN206237686U (en) | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device | |
| KR20230008467A (en) | In-circuit test pcb inspection equipment | |
| CN110053352B (en) | Silk screen printing device for automatic circuit board production equipment | |
| JP2014175423A (en) | Flexible substrate and mounting method thereof | |
| TWI417010B (en) | Apparatus and method for removing waste material of circuit board | |
| JP2012124444A (en) | Substrate bonding method | |
| CN112331089B (en) | Adsorption device, laminating equipment and laminating method of substrate | |
| JP2008010448A (en) | Method and apparatus of carrying base board | |
| CN209920704U (en) | Vacuum adsorption hot-pressing device | |
| CN207835959U (en) | A kind of weld-ring automatic Picking device for discharging | |
| CN211267296U (en) | PCB (printed circuit board) patch backflow jig | |
| CN207099439U (en) | A kind of connecting plate adsorption jig | |
| JP2014053613A (en) | Carrier jig for substrate transfer | |
| WO2023050035A1 (en) | Circuit board having integrated tact reset switch and manufacturing method therefor | |
| JP2019209369A (en) | Ultrasonic bonding device and ultrasonic bonding method | |
| KR101549123B1 (en) | Apparatus for separating the coverlay | |
| JPH10335869A (en) | Circuit board provided with shielding case and its manufacture | |
| KR20100113781A (en) | Film automatic editing apparatus and edit method | |
| CN218041962U (en) | High accuracy printed circuit board constructs with automatic subsides installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |