CN112462578A - Exposure method, exposure machine, and computer-readable storage medium - Google Patents
Exposure method, exposure machine, and computer-readable storage medium Download PDFInfo
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- CN112462578A CN112462578A CN202011499334.XA CN202011499334A CN112462578A CN 112462578 A CN112462578 A CN 112462578A CN 202011499334 A CN202011499334 A CN 202011499334A CN 112462578 A CN112462578 A CN 112462578A
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- laser
- platform
- exposure
- exposure method
- exposed
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70025—Production of exposure light, i.e. light sources by lasers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses an exposure method, an exposure machine and a computer readable storage medium, wherein the exposure method is used for exposing a plurality of workpieces to be exposed placed on a platform, and the workpieces to be exposed are sequentially aligned to a laser through the positioning of the platform, and the exposure method comprises the following steps: and controlling the laser to be in an off state at least in part of the time period in the multiple positioning processes of the platform. The invention controls the laser of the exposure machine in a time-sharing way, so that the laser is in a closed state at least in part of the time period when the platform is positioned, the working time of the laser is effectively reduced, the heating of the laser is further reduced, the equipment can be kept at a relatively stable temperature, the positioning precision of the platform is favorably ensured, and meanwhile, the effects of saving electric energy and prolonging the service life of the laser can be achieved.
Description
Technical Field
The invention relates to the technical field of exposure, in particular to an exposure method, an exposure machine and a computer readable storage medium
Background
The control time sequence of a high-power laser on the existing exposure machine is always stable and constant current work after the equipment is powered on. Because the working current of the laser is super large, a large amount of heat is generated, the local temperature of the equipment is increased, the positioning precision of the platform is influenced, and large electric energy consumption is caused. In addition, the laser decays with increasing operating time, which also reduces the lifetime of the laser.
Disclosure of Invention
The invention aims to provide an exposure method, an exposure machine and a computer readable storage medium, which can reduce the heating of a laser, keep equipment at a relatively stable temperature, be beneficial to ensuring the positioning precision of a platform, and simultaneously play the roles of saving electric energy and prolonging the service life of the laser.
In order to achieve the above object, the present invention provides an exposure method for exposing a plurality of workpieces to be exposed placed on a platform, the workpieces to be exposed being sequentially aligned with a laser by positioning the platform, the exposure method comprising:
and controlling the laser to be in an off state at least in part of the time period in the multiple positioning processes of the platform.
Optionally, after the platform starts the positioning process, the laser is controlled to be switched from the on state to the off state.
Optionally, before the platform finishes the positioning process, the laser is controlled to be switched from the off state to the on state.
In order to achieve the above object, the present invention further provides an exposure method for exposing a plurality of workpieces to be exposed placed on a platform, wherein the plurality of workpieces to be exposed are sequentially aligned with a laser by positioning the platform, the exposure method comprising:
after the exposure of the current exposure workpiece is finished, controlling the laser to be switched from an open state to a closed state and controlling the platform to position the next workpiece to be exposed;
when the next workpiece to be exposed is positioned, before the positioning is finished or after the positioning is finished, controlling the laser to be switched from a closed state to an open state so as to expose the workpiece to be exposed;
and repeating the steps.
Optionally, after the currently exposed workpiece is exposed, the platform is controlled to start the positioning process, and then the laser is controlled to be switched from the on state to the off state.
In order to achieve the above object, the present invention further provides an exposure machine, including:
a processor;
a memory having stored therein executable instructions of the processor;
wherein the processor is configured to perform the exposure method as described above via execution of the executable instructions.
To achieve the above object, the present invention also provides a computer-readable storage medium having stored thereon a program which, when executed by a processor, implements the exposure method as described above.
Compared with the prior art, the invention controls the laser of the exposure machine in a time-sharing way, so that the laser is in a closed state at least in part of the time period when the platform is positioned, thereby effectively reducing the working time of the laser, further reducing the heat generation of the laser, keeping the equipment at a relatively stable temperature, being beneficial to ensuring the positioning precision of the platform, and simultaneously playing the roles of saving electric energy and prolonging the service life of the laser.
Drawings
FIG. 1 is a schematic control timing chart of an exposure method according to an embodiment of the present invention.
FIG. 2 is a schematic flow chart of an exposure method according to an embodiment of the present invention.
Fig. 3 is a schematic block diagram of an exposure machine according to an embodiment of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Example one
Referring to fig. 1, the present invention discloses an exposure method for exposing a plurality of workpieces to be exposed placed on a platform, and aligning the plurality of workpieces to be exposed to a laser in sequence by positioning the platform, the exposure method comprising: the laser is controlled to be off for at least a portion of the time during the multiple positioning of the stage. It should be noted that the exposure method of the present embodiment is not limited to be performed in the whole exposure process (exposing all the workpieces), for example, the exposure method may be performed in a certain period or certain periods, or may be performed occasionally, and is not limited herein. In the timing chart shown in fig. 2, the exposure method of the present invention is continuously performed at least for a part of the period.
The exposure method controls the laser of the exposure machine in a time-sharing manner, so that the laser is in a closed state at least in part of the time period when the platform is positioned, the working time of the laser is effectively reduced, the heating of the laser is further reduced, the equipment can be kept at a relatively stable temperature, the positioning precision of the platform is favorably ensured, and meanwhile, the effects of saving electric energy and prolonging the service life of the laser can be achieved.
In some embodiments, after the stage starts the positioning process, the laser is controlled to be switched from the on state to the off state, so as to be beneficial to ensuring the exposure effect. In order to improve the working efficiency, the platform positioning process can be started after the exposure of the current workpiece is finished.
In some embodiments, the control laser is switched from an off state to an on state before the platform ends the positioning process. Through the operation, once the platform is positioned, the laser can immediately and normally expose the corresponding workpiece, so that the exposure method can ensure the efficiency of exposure operation. The invention can be used as the basis for controlling the on-time of the laser according to the preset positioning time or the detection of the detection device.
Example two
Referring to fig. 1 and 2, the present invention discloses an exposure method for exposing a plurality of workpieces to be exposed placed on a platform, and aligning the plurality of workpieces to be exposed to a laser in sequence by positioning the platform, the exposure method comprising:
101. and after the current exposure workpiece is exposed, controlling the laser to be switched from the open state to the closed state and controlling the platform to position the next workpiece to be exposed.
102. And when the next workpiece to be exposed is positioned, before the positioning is finished or after the positioning is finished, controlling the laser to be switched from the closed state to the open state so as to expose the workpiece to be exposed. As a preferable scheme, before the next workpiece to be exposed is positioned, the laser can be controlled to be switched from the off state to the on state, so that once the platform is positioned, the laser can immediately perform normal exposure on the corresponding workpiece, and the exposure method can ensure the efficiency of exposure operation.
And repeating the steps.
It should be noted that the exposure method of the present embodiment is not limited to be performed during the whole exposure process (exposing all the workpieces), and may be performed at a certain time or a certain time period, for example, and is not limited herein. In addition, the exposure completion of the exposure workpiece can be judged according to the set exposure time or other judgment conditions.
The exposure method controls the laser of the exposure machine in a time-sharing manner, so that the laser is in a closed state at least in part of the time period when the platform is positioned, the working time of the laser is effectively reduced, the heating of the laser is further reduced, the equipment can be kept at a relatively stable temperature, the positioning precision of the platform is favorably ensured, and meanwhile, the effects of saving electric energy and prolonging the service life of the laser can be achieved.
In some embodiments, after the exposure of the currently exposed workpiece is completed, the platform is controlled to start the positioning process, and then the laser is controlled to be switched from the open state to the closed state, so that the exposure effect is ensured.
EXAMPLE III
Referring to fig. 3, the present invention also discloses an exposure apparatus, including:
a processor 40;
a memory 50 having stored therein executable instructions of the processor 40;
wherein the processor 40 is configured to execute the exposure method according to the first embodiment or the second embodiment by executing the executable instructions.
Example four
The invention also discloses a computer-readable storage medium on which a program is stored, which, when executed by a processor, implements the exposure method according to the first or second embodiment.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (7)
1. An exposure method is used for exposing a plurality of workpieces to be exposed placed on a platform, and the workpieces to be exposed are sequentially aligned with a laser through the positioning of the platform, and is characterized by comprising the following steps:
and controlling the laser to be in an off state at least in part of the time period in the multiple positioning processes of the platform.
2. The exposure method according to claim 1,
and after the platform is started to position, controlling the laser to be switched from an on state to an off state.
3. The exposure method according to claim 1 or 2,
and controlling the laser to be switched from the off state to the on state before the platform finishes the positioning process.
4. An exposure method is used for exposing a plurality of workpieces to be exposed placed on a platform, and the workpieces to be exposed are sequentially aligned with a laser through the positioning of the platform, and is characterized by comprising the following steps:
after the exposure of the current exposure workpiece is finished, controlling the laser to be switched from an open state to a closed state and controlling the platform to position the next workpiece to be exposed;
when the next workpiece to be exposed is positioned, before the positioning is finished or after the positioning is finished, controlling the laser to be switched from a closed state to an open state so as to expose the workpiece to be exposed;
and repeating the steps.
5. The exposure method according to claim 4,
after the exposure of the current exposure workpiece is finished, the platform is controlled to start the positioning process, and then the laser is controlled to be switched from the open state to the closed state.
6. An exposure machine, characterized by comprising:
a processor;
a memory having stored therein executable instructions of the processor;
wherein the processor is configured to perform the exposure method of any one of claims 1-5 via execution of the executable instructions.
7. A computer-readable storage medium on which a program is stored, the program realizing the exposure method according to any one of claims 1 to 5 when executed by a processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499334.XA CN112462578A (en) | 2020-12-16 | 2020-12-16 | Exposure method, exposure machine, and computer-readable storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499334.XA CN112462578A (en) | 2020-12-16 | 2020-12-16 | Exposure method, exposure machine, and computer-readable storage medium |
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| Publication Number | Publication Date |
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| CN112462578A true CN112462578A (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011499334.XA Pending CN112462578A (en) | 2020-12-16 | 2020-12-16 | Exposure method, exposure machine, and computer-readable storage medium |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH068484A (en) * | 1992-06-29 | 1994-01-18 | Fuji Photo Film Co Ltd | Device and method for image forming exposure |
| US5567928A (en) * | 1993-07-26 | 1996-10-22 | Canon Kabushiki Kaisha | Scanning exposure apparatus and method including controlling irradiation timing of an irradiation beam with respect to relative movement between the beam and a substrate |
| CN105467778A (en) * | 2015-12-28 | 2016-04-06 | 苏州工业职业技术学院 | Laser lithography machine control system and lithography machine adopting same |
| CN105549340A (en) * | 2016-02-24 | 2016-05-04 | 上海大学 | Photoetching method and device of roll to roll flexible substrate |
| CN210075726U (en) * | 2019-04-02 | 2020-02-14 | 金悦通电子（翁源）有限公司 | Two-sided base plate counterpoint exposure machine |
| CN210225912U (en) * | 2019-06-11 | 2020-03-31 | 山东司莱美克新材料科技有限公司 | Automatic exposure platform for copper-plated substrate |
| CN111355897A (en) * | 2018-12-24 | 2020-06-30 | 海信视像科技股份有限公司 | Light control method and device |
-
2020
- 2020-12-16 CN CN202011499334.XA patent/CN112462578A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH068484A (en) * | 1992-06-29 | 1994-01-18 | Fuji Photo Film Co Ltd | Device and method for image forming exposure |
| US5567928A (en) * | 1993-07-26 | 1996-10-22 | Canon Kabushiki Kaisha | Scanning exposure apparatus and method including controlling irradiation timing of an irradiation beam with respect to relative movement between the beam and a substrate |
| CN105467778A (en) * | 2015-12-28 | 2016-04-06 | 苏州工业职业技术学院 | Laser lithography machine control system and lithography machine adopting same |
| CN105549340A (en) * | 2016-02-24 | 2016-05-04 | 上海大学 | Photoetching method and device of roll to roll flexible substrate |
| CN111355897A (en) * | 2018-12-24 | 2020-06-30 | 海信视像科技股份有限公司 | Light control method and device |
| CN210075726U (en) * | 2019-04-02 | 2020-02-14 | 金悦通电子（翁源）有限公司 | Two-sided base plate counterpoint exposure machine |
| CN210225912U (en) * | 2019-06-11 | 2020-03-31 | 山东司莱美克新材料科技有限公司 | Automatic exposure platform for copper-plated substrate |
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Application publication date: 20210309 |