CN203040024U - Auxiliary frame plate used for flexible circuit board - Google Patents

Auxiliary frame plate used for flexible circuit board Download PDF

Info

Publication number
CN203040024U
CN203040024U CN 201320025669 CN201320025669U CN203040024U CN 203040024 U CN203040024 U CN 203040024U CN 201320025669 CN201320025669 CN 201320025669 CN 201320025669 U CN201320025669 U CN 201320025669U CN 203040024 U CN203040024 U CN 203040024U
Authority
CN
China
Prior art keywords
flexible circuit
circuit board
flexible pcb
deckle board
frame plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201320025669
Other languages
Chinese (zh)
Inventor
雷加兴
刘美才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUIWA HIGH TECHNOLOGY ELECTRONIC INDUSTRIES (XIAMEN) CO Ltd
Original Assignee
SUIWA HIGH TECHNOLOGY ELECTRONIC INDUSTRIES (XIAMEN) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUIWA HIGH TECHNOLOGY ELECTRONIC INDUSTRIES (XIAMEN) CO Ltd filed Critical SUIWA HIGH TECHNOLOGY ELECTRONIC INDUSTRIES (XIAMEN) CO Ltd
Priority to CN 201320025669 priority Critical patent/CN203040024U/en
Application granted granted Critical
Publication of CN203040024U publication Critical patent/CN203040024U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses an auxiliary frame plate used for a flexible circuit board. The auxiliary frame plate (1) is provided with an inner frame (11) and an outer frame (12). A middle part of the inner frame (11) is provided with an opening, and the outer frame (12) is provided with a shape cooperated with the shape of the flexible circuit board to be produced. Two surfaces of the auxiliary frame plate (1) are respectively covered by conductive materials, and a plurality of conductive through holes (10) are uniformly disposed in frame strips between the inner frame (11) and the outer frame (12). According to the utility model, the auxiliary frame plate can be used for reinforcing the flexible circuit board during the production process, and the problem of conventional flexible circuit board products such as wrinkles and high reject ratio can be effectively solved, in addition, the conductive materials can be covered on the two surface of the auxiliary frame plate, and the conductive through holes are uniformly provided, therefore the electroplating process of the flexible circuit board can be directly carried out on the auxiliary frame plate, the flexible circuit board is not required to be taken down for the operation, furthermore the generation of the wrinkles can be prevented, and the yield rate and the reliability of the flexible circuit boards, especially the ultrathin copper flexible circuit board, can be improved.

Description

Flexible PCB production is with assisting deckle board
Technical field
The utility model discloses a kind of auxiliary deckle board, belongs to flexible PCB processing and manufacturing technical field, especially relates to a kind of auxiliary deckle board that can play reinforcement effect in flexible PCB production overall process.
Background technology
Flexible PCB claims " soft board " again, and english abbreviation is FPC(Flexible Printed Circuit), it is base material with polyimides or polyester film, and covers layer of copper again and make after base material applies epoxy resin or acrylic-based adhesives.Because flexible PCB has advantages such as density height, in light weight, thin thickness, pliability are good, can improve the space availability ratio of various products effectively, be very suitable for three-dimensional assembling, so be widely used on the electronic products such as mobile phone, digital camera, notebook computer, printer, and develop towards littler, more accurate direction day by day.Along with going deep into flexible PCB research, new products such as ultra-thin copper flexible PCB have appearred, the thing followed is also more and more higher to the requirement of material and manufacture craft, one of topmost difficult problem is under base material thickness and the thick more and more thinner situation of copper, how effectively to control the bad defective of the wrinkle that produce in the flexible PCB production process.
Traditional technical solution is to increase the diaphragm that one deck plays welding resistance and wrinkle resistant effect on its surface again after flexible PCB is shaped, but this also is not suitable for emerging ultra-thin copper flexible circuit panel products, reason is as follows: first, in the wet flowchart process of production, when especially flexible PCB being adopted the vertical line mode to put into, under the effect of liquid fluidity, thinner ultra-thin copper flexible PCB itself is easy to produce the swing wrinkle, and for liquid medicine being circulated better and washing cylinder and wash more abundant, the liquid medicine cylinder generally is provided with pump-up device, the washing cylinder then is to adopt the overflow washing, this has further strengthened the adverse effect of liquid fluidity to ultra-thin copper flexible circuit panel products, very easily produces the wrinkle defective; Second; after the product circuit etching is finished; before the applying diaphragm; need to use pre-treatment modes such as mechanical nog plate or chemical cleaning that copper face is carried out clean; because the copper of subregion is etched; so wrinkle take place in ultra-thin copper flexible PCB easily in processing procedure, do not possess producing feasibility.
Chinese patent CN201120304789.1 discloses a kind of flexible PCB fixed frame, comprise a plane tabular support plate, support plate inside is provided with a hollow bulb with a plurality of location lug of inwardly stretching out, flexible PCB is bonded on the location lug of hollow bulb by non-drying glue layer, play reinforcement effect with this, prevent from taking place in the flexible PCB processing and manufacturing process metaboly of wrinkle, burr.Yet, there is following defective in the disclosed technical scheme of the document: when proceeding to electroplating work procedure, because fixedly deckle board does not arrange structures such as conductive through hole, can't import electric current and directly electroplate, operation inconvenience, sometimes even the flexible PCB that glues need be taken off from fixed frame and carry out electroplating operations again, treat to be re-sticky back on the fixed frame again after copper facing or gold-plated the finishing, complex steps has reduced production efficiency, and has increased the risk of flexible PCB generation wrinkle.Therefore this technical scheme and be not suitable for ultra-thin copper flexible circuit panel products.
The utility model content
Technical problem to be solved in the utility model is, provide a kind of simple and reasonable, production of can related flexible PCB directly carrying out electroplating operations with auxiliary deckle board, existing flexible PCB fixed frame can't conduct electricity, use is loaded down with trivial details to solve, be not suitable for weak point such as emerging ultra-thin copper flexible circuit panel products.
For achieving the above object, the utility model is achieved through the following technical solutions:
A kind of flexible PCB production is with assisting deckle board, it has the inside casing of a middle opening and the housing that is complementary with required production flexible PCB appearance profile, on the moulding between housing and the inside casing, be provided with a plurality of conductive through holes equably, and deckle board two surfaces all are covered with electric conducting material.
Further, described electric conducting material is metallic conduction material or non-metallic conducting material.
Preferably, described metallic conduction material is copper.Copper material is as a kind of common metallic conduction material, and electric conductivity is outstanding, and ductility is preferable, and resistance to corrosion is strong, and moderate cost, all other performances are also quite good.
Preferably, the distance between described inside casing edge and described housing edge is 5 millimeters.The too small then mechanical strength of deckle board width deficiency does not have due reinforcement effect, and the excessive waste of material that then causes of deckle board width will increase production cost, through facts have proved distance between inside casing edge and housing edge get 5 millimeters comparatively suitable.
The utility model adopts auxiliary deckle board that the flexible PCB in the production process is reinforced, by producing again adhering on this auxiliary deckle board around the flexible PCB, effectively reduce the wrinkle fraction defective that causes because of liquid fluidity in the wet flow process operation process, auxiliary deckle board middle opening, thereby the gap of having avoided liquid medicine to lodge between flexible PCB and the auxiliary deckle board is conducive to drying operation, go back on auxiliary deckle board two surfaces simultaneously that cloth is covered with electric conducting material and conductive through hole evenly is set on moulding, make flexible PCB on auxiliary deckle board, directly carry out electroplating work procedure, need not to take off operation, simplified production stage, further avoided the generation of wrinkle, improve product yield and the reliability of flexible PCB, be particularly useful for the flexible PCB of ultra-thin copper flexible PCB or other relative thinner easy fold.
Description of drawings
Fig. 1 is the utility model structural representation.
In the accompanying drawing:
1. assist deckle board 10. conductive through holes 11. inside casings 12. housings
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
As a specific embodiment, see also the utility model flexible PCB production shown in Figure 1 with assisting deckle board, the auxiliary deckle board 1 that this two surface is covered with electric conducting material has the inside casing 11 of a middle opening and the housing 12 that is complementary with required production flexible PCB appearance profile, and on the moulding between inside casing 11 and the housing 12, also be provided with a plurality of conductive through holes 10 equably, this exemplarily be one around respectively be provided with the rectangular-shaped auxiliary deckle board of 6 conductive through holes, but not as limit, the shape of auxiliary deckle board can cooperate the profile of required production flexible PCB to adopt such as circle, semicircle, trapezoidal other suitable shape that waits, the quantity of conductive through hole and size can arrange flexibly according to the concrete specification of required production flexible PCB under the prerequisite that guarantees electroplating evenness.
In the practical application, because the effect of auxiliary deckle board is that the flexible PCB in the production process is reinforced, so auxiliary deckle board need have certain thickness to guarantee mechanical strength, the electroplating work procedure (copper facing and gold-plated) of flexible PCB needs to import electric current by auxiliary deckle board simultaneously, so auxiliary deckle board surface need be selected electric conducting material for use, as metallic conduction material or non-metallic conducting material, be preferably metallic copper.During the manufacturing: at first, (for example choose a kind of thicker relatively double face copper, base material 1mil, the thick 1OZ of copper, the thick 20um of glue) hole, die-cut, the part of washing out forms the auxiliary deckle board of middle opening than the monolateral little certain distance of the flexible PCB of required production (for example 5mm) with this; Then, be combined in auxiliary deckle board on by pure glue laminated the flexible PCB of required production and carry out drilling operating, around auxiliary deckle board, (for example get out conductive through hole equably with the flexible PCB calmodulin binding domain CaM, aperture 1.0mm, respectively bore 6 all around), herein Zuan Kong purpose be behind the hole metallization in follow-up electroplating work procedure (electro-coppering and electrogilding), electric current can import the flexible PCB of required production by these holes, and the hole and the product that get out product area afterwards again detect the spacing hole whether boring is drilled in acceptability limit on every side; All the other subsequent handlings are consistent with flexible PCB ordinary production technology.Prove through production practices, after the auxiliary deckle board of increase the utility model is produced, improved effectively that wrinkle owing to flexible PCB cause open, the bad problem of quality such as short circuit, try out behind ultra-thin copper flexible PCB, the yield of product by about 15% having risen to about 75% of not adding deckle board, is considered that ultra-thin copper product belongs to special gauge material, expensive, thereby saved production cost greatly, had remarkable economic efficiency and practical value.
The above record only for utilizing the embodiment of this origination techniques content, anyly is familiar with modification, the variation that this skill person uses this creation to do, and all belongs to the claim of this creation opinion, and is not limited to those disclosed embodiments.

Claims (4)

1. a flexible PCB production is with assisting deckle board, it is characterized in that: have the inside casing of a middle opening and the housing that is complementary with required production flexible PCB appearance profile, on the moulding between housing and the inside casing, be provided with a plurality of conductive through holes equably, and deckle board two surfaces all are covered with electric conducting material.
2. the described flexible PCB production of claim 1 is with assisting deckle board, and it is characterized in that: described electric conducting material is metallic conduction material or non-metallic conducting material.
3. the described flexible PCB production of claim 2 is with assisting deckle board, and it is characterized in that: described metallic conduction material is copper.
4. claim 1 or 2 or 3 described flexible PCB productions are with assisting deckle board, and it is characterized in that: the distance between described inside casing edge and described housing edge is 5 millimeters.
CN 201320025669 2013-01-18 2013-01-18 Auxiliary frame plate used for flexible circuit board Expired - Lifetime CN203040024U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320025669 CN203040024U (en) 2013-01-18 2013-01-18 Auxiliary frame plate used for flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320025669 CN203040024U (en) 2013-01-18 2013-01-18 Auxiliary frame plate used for flexible circuit board

Publications (1)

Publication Number Publication Date
CN203040024U true CN203040024U (en) 2013-07-03

Family

ID=48692107

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320025669 Expired - Lifetime CN203040024U (en) 2013-01-18 2013-01-18 Auxiliary frame plate used for flexible circuit board

Country Status (1)

Country Link
CN (1) CN203040024U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104619132A (en) * 2013-11-04 2015-05-13 深圳崇达多层线路板有限公司 Method for processing flexible printed circuit board
CN104780710A (en) * 2014-01-15 2015-07-15 深圳崇达多层线路板有限公司 PCB (Printed circuit board) and manufacturing method thereof
CN115802633A (en) * 2022-11-28 2023-03-14 福莱盈电子股份有限公司 Electroplating uniformity method of circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104619132A (en) * 2013-11-04 2015-05-13 深圳崇达多层线路板有限公司 Method for processing flexible printed circuit board
CN104619132B (en) * 2013-11-04 2017-11-07 深圳崇达多层线路板有限公司 The processing method of flexible print wiring board
CN104780710A (en) * 2014-01-15 2015-07-15 深圳崇达多层线路板有限公司 PCB (Printed circuit board) and manufacturing method thereof
CN115802633A (en) * 2022-11-28 2023-03-14 福莱盈电子股份有限公司 Electroplating uniformity method of circuit board
CN115802633B (en) * 2022-11-28 2023-12-26 福莱盈电子股份有限公司 Electroplating uniformity method of circuit board

Similar Documents

Publication Publication Date Title
CN106961808B (en) The production method of sunk type high density interconnecting board
CN104244597B (en) A kind of preparation method of the coreless substrate of symmetrical structure
CN104244616B (en) A kind of preparation method of centreless thin base sheet
CN102480845B (en) Manufacturing method of flexible printed circuit (FPC)
CN101625529B (en) Circuit board exposure alignment device and circuit board exposure alignment method
CN203040024U (en) Auxiliary frame plate used for flexible circuit board
CN104812171A (en) Printed circuit board and processing method thereof
CN101304639A (en) Method for producing printed circuit board
CN103929884A (en) Method for manufacturing printed circuit board with step slotted hole
CN201383900Y (en) Blind hole type circuit board
CN106535508B (en) The exposed technique of golden finger built in multi-layer board flexible circuit board
CN111665971A (en) Transparent conductive film, touch screen and preparation method thereof
KR20140101260A (en) Multi-layer flexible circuit board and process for producing the same
CN105555061B (en) Improve the pcb board design method and device of internal layer plating orifice plate pressing white edge
CN102209438A (en) High-density flexible circuit board and manufacturing method thereof
CN201383901Y (en) Buried hole type circuit board
CN201674724U (en) High-frequency circuit board
CN108156770B (en) A kind of production method and PCB of PCB
CN104185363A (en) Composite type ultra-thin non-core substrate and manufacturing method thereof
CN103225094B (en) The guard method of a kind of blind hole plate plating single-sided current
CN103561538B (en) Soft or hard double-sided circuit board manufacturing method
CN2930196Y (en) Soft and hard composite printed circuit board structure
KR100641341B1 (en) Flexible copper clad laminate using coducting polymer and the method for producing the same
CN207835908U (en) A kind of flexible circuit board
CN202998646U (en) HDI printed circuit board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130703