CN201534890U - Pure tin electroplating device - Google Patents
Pure tin electroplating device Download PDFInfo
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- CN201534890U CN201534890U CN2009201682553U CN200920168255U CN201534890U CN 201534890 U CN201534890 U CN 201534890U CN 2009201682553 U CN2009201682553 U CN 2009201682553U CN 200920168255 U CN200920168255 U CN 200920168255U CN 201534890 U CN201534890 U CN 201534890U
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- hanger
- pure tin
- electroplanting device
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Abstract
A pure tin electroplating device comprises an electroplating bath filled with electroplating solution; a negative pole and a positive pole are arranged in the electroplating bath; the negative pole is connected with a negative hanger; an electroplating product is hung on the negative hanger; the positive pole is connected with a positive titanium basket full of tin balls; an insulation shield plate is arranged between the positive titanium basket and the negative hanger; and openings are formed on the shield plate. The utility model has the advantages that the insulation PP shield plate in proper size is mounted in the plating bath in the position adjacent to the positive pole, so that the problem that the inconvenience for mounting the plate near the negative pole is solved; meanwhile, the thickness of electroplating coatings is improved; and power lines in the high-current density area are transferred to the low-current density area, so the thickness of electrolytic coatings of tin becomes more uniform, and the requirements of product quality are met.
Description
Technical field
The utility model relates to a kind of electroplanting device, and especially a kind of pure tin electroplanting device belongs to the electroplating technology field.
Background technology
At electroplating industry, whether metal plating distributes even on workpiece, whether coating is complete is an important factor of decision quality of coating quality, the coating protection performance that thickness is evenly complete is good, and thickness differs big or the incomplete barrier propterty of coating is poor, and no matter from corrosion or outward appearance, the machining property aspect is said, all wish to improve the thickness of coating homogeneity, sometimes in order to guarantee that thinnest part reaches final size and requires to have to strengthen greatly average thickness of coating; So improving the thickness distribution ability of coating is the key that is related to plated item quality quality.
Faraday's law is pointed out: the quality of separating out material in the electrodeposition process is proportional to the electric weight that flows through in the coating bath, m=KQ=KIt, and the material that negative electrode is separated out when promptly electroplating under certain electric current and time is a constant.But the influence of factors such as point effect and fringing effect during owing to rack plating, in fact the last point of the negative electrode quality of separating out material is different, and the intensive place of power line current density height, thickness are also just thicker, a little less than the sparse local current density of power line, this place's thickness of coating is corresponding just thinner; On producing, usually prolong electroplating time and increase mean thickness, cause the too thick and waste anode resource of areas of high current density product, reduce production efficiency in order to guarantee to reach minimum thickness; Improve the current density upper limit and can cause defective productss such as high current density region is burnt, burr again.
How making thickness of coating more even under the condition that does not change plating mode and basic production equipment, improving product quality is the problem of everybody joint research.
The utility model content
Technical problem to be solved in the utility model is, provide a kind of pure tin electroplanting device at the deficiencies in the prior art, by near anode position sizeable insulation PP shielding slab being installed at plating tank, solved near the problem of fitting operation inconvenience negative electrode, improve thickness of coating simultaneously, the high current density region power line is shifted to the low current density district, make the eleetrotinplate layer thickness profile more even, satisfy product quality requirement.
Technical problem to be solved in the utility model is achieved by the following technical solution:
A kind of pure tin electroplanting device, comprise the plating coating bath that electroplate liquid is housed, electroplate in the coating bath and be provided with cathode electrode and anode electrode, cathode electrode links to each other with the negative electrode hanger, be hung with the plating piece product on the negative electrode hanger, anode electrode links to each other with anode titanium basket, fills the tin ball in the anode titanium basket, be provided with shielding slab between described anode titanium basket and the negative electrode hanger, offer opening on the shielding slab.
In order effectively to change the direction of power line, the distance of the last lower rim of the opening of offering on the described shielding slab is less than the height of anode titanium basket.
As required, the opening of offering on the described shielding slab is 1 or 2.
Generally, the opening of offering on the described shielding slab is a rectangular aperture; Four drift angle places of described rectangular aperture are provided with chamfering.
The opening of offering on the described shielding slab can also two long limits be the straight line that be arranged in parallel, and two minor faces are camber line.
Distance between described anode electrode and the described shielding slab is 2CM.
As required, described anode titanium basket is 2 groups, 7 every group.
Described negative electrode hanger is folder point hanger, the pros and cons setting, and every 4 row, every row hang 15 plating piece products.
Described negative electrode hanger is the T0 hanger, is single-point contact conductive plated, and each hook is hung a plating piece product.
The plating piece product that hangs on the described negative electrode hanger is apart from electroplate liquid liquid level 1CM.
In sum, the utility model is installed sizeable insulation PP shielding slab at plating tank near anode position, solved near the problem of fitting operation inconvenience negative electrode, improve thickness of coating simultaneously, high Current Zone power line is shifted to the low current density district, make the eleetrotinplate layer thickness profile more even, satisfy product quality requirement.
Below in conjunction with the drawings and specific embodiments the technical solution of the utility model is described in detail.
Description of drawings
Fig. 1 is the one-piece construction synoptic diagram of the utility model embodiment one;
Fig. 2 is the electric force lines distribution figure when shielding slab is not set;
Fig. 3 is provided with shielding slab electric force lines distribution figure afterwards;
Fig. 4 is the utility model embodiment one hanging tool structure synoptic diagram;
Fig. 5 is the hanging tool structure synoptic diagram of the utility model embodiment two;
Fig. 6 is that the plating piece product on the utility model embodiment one negative electrode hanger and the position of electroplating between the coating bath concern synoptic diagram;
Fig. 7 is the structural representation of the utility model embodiment one shielding slab;
Fig. 8 is that the plating piece product on the utility model embodiment two negative electrode hangers and the position of electroplating between the coating bath concern synoptic diagram;
Fig. 9 is the structural representation of the utility model embodiment two shielding slabs.
Embodiment
In order to satisfy the environmental requirement of increasingly stringent, the galvanized application of unleaded in recent years pure tin more and more widely.For weldability that improves pure tin and the growth that suppresses the tin palpus, acid zinc-plated thickness should reach 7 microns at least, the low dispersing property of acid tin plating liquid, in actual production if do not take other additional measures, guarantee that minimum thickness mean thickness then reaches about 14 microns, electroplating time was wanted more than 25 minutes.Theoretical and the point effect principle according to electric force lines distribution, fix the moderate insulation shielding plate of a piece size near the anode of the utility model in electroplating coating bath, the part power line that makes high current density region can't penetrate and transfer to the low current density district, make electric force lines distribution more even, thickness is also more even, electroplating time was reduced to 20 minutes by common 25 minutes, average tin coating thickness drops to about 10 microns, overall COV% drops to 13.4 by original 37.6, (standard deviation/population mean) reaches the design effect of saving material, raising the efficiency.
Embodiment one
Fig. 1 is the one-piece construction synoptic diagram of the utility model embodiment one.As shown in Figure 1, the utility model provides a kind of pure tin electroplanting device, comprise the plating coating bath 8 that electroplate liquid is housed, electroplate in the coating bath 8 and be provided with cathode electrode 1 and anode electrode 3, cathode electrode 1 links to each other with negative electrode hanger 2, is hung with plating piece product 6 on the negative electrode hanger 2, anode electrode 3 links to each other with anode titanium basket 4, fill tin ball 5 in the anode titanium basket 4, be provided with insulation shielding plate 7 between described anode electrode 3 and the cathode electrode 1, offer opening 71 on the shielding slab 7.In order effectively to change the direction of power line, the last lower rim of described opening 71 apart from the height h of d less than anode titanium basket.As required, the opening of offering on the shielding slab 7 71 can be 1 or 2, and the quantity of present embodiment split shed 71 is 1.Fig. 6 is that the plating piece product on the utility model embodiment one negative electrode hanger and the position of electroplating between the coating bath concern synoptic diagram, and Fig. 7 is the structural representation of the utility model embodiment one shielding slab.In conjunction with shown in Figure 7, two long limits of opening 71 are the straight line 711 that be arranged in parallel, are shaped as rectangle as Fig. 6, are provided with chamfering on four angles of orthogonal; Article two, minor face is the straight line 712 that be arranged in parallel.For easy to operate, the distance between anode electrode 3 and the shielding slab 7 is 2CM.As required, anode titanium basket 4 can be 2 groups, 7 every group.Fig. 4 is the utility model embodiment one hanging tool structure synoptic diagram, and as shown in Figure 4, the negative electrode hanger can adopt the hanger of multiple structure formation, the negative electrode hanger 2 that is adopted in the present embodiment is folder point hanger, pros and cons is provided with, every 4 row, and every row hang 15 plating piece products.
Specifically, in the present embodiment, for making the plating bath circulation evenly, the employing flow is 10 tons/hour a filter, 1000 liters of plating baths of every cylinder, bottom land circulating line water outlet is in the mid-way of electroplating coating bath 8, and not conductively-closed plate 7 blocks, shielding slab 7 is pressed close to the position of anode electrode 3, plating piece product 6 is come in and gone out electroplate coating bath 8 handled easilies.Plating bath is the existing conventional plating bath, such as: bright pure tin liquid medicine 848 systems of the new sunlight in Shanghai, adopt 4 contact hangers to produce the SOT-89 product, hanger does not have the galvanic protection of employing layer, anode adopts every group of 7 titanium baskets, be arranged in centre, 7 titanium basket total lengths are 76CM, and it is the pure tin anode ball of Φ 20mm that diameter is housed in the titanium basket; Single coating bath length overall is 126CM, wide 64CM, the dark 66CM of plating bath.
Production is adopted folder point hanger with hanger, and the hanger product is as negative electrode, and it is tin in cathodic reduction that negative electrode generation reduction reaction tin ion obtains electronics; The long 106CM of negative electrode product on the hanger, high 52CM, hanger be totally 4 row, and every row are totally 15 products from top to bottom, and tow sides amount to 120 products.
Anode generation oxidizing reaction during plating, the anode tin ball loses electronics and is dissolved into tin ion, and 7 titanium baskets of anode total width 76CM is distributed in center position, and the titanium basket gos deep into 46CM under the plating bath liquid level.
Fig. 2 is the electric force lines distribution figure when shielding slab is not set, and Fig. 3 is provided with shielding slab electric force lines distribution figure afterwards.As Fig. 2, shown in Figure 3, after being provided with shielding slab 7, obvious variation has taken place in the distribution of power line.
In order to verify effect of the present utility model, the plating piece product test point sampling and testing and random test have been carried out.Get first, second row during sampling and testing respectively, play the 1st, 5,10,15 billot bars from top to bottom and do thickness measuring, every product is surveyed in the middle of the left side respectively and three points in the right, the test pin middle part; Random sampling is a random sampling Thickness Measurement by Microwave from salable product, middle and three points in the right in the same Thickness Measurement by Microwave of the every billot bar left side.
Electroplating technical conditions: electroplating time 25 minutes whenever flies to harrow 120 billot bars, every billot bar 0.65CM
2Electroplate area and amount to 78CM
2, electric current 100A, DK=1.2A/DM2, two hangers before not making shielding slab, get two row material bars on the same hanger in coating bath position correspondence, and every row get 1,5,10,15 products, 3 points of every product thickness measuring, data are as follows:
Different positions institute Thickness Measurement by Microwave data show from the negative electrode, the thickness distribution of each point is uneven on the negative electrode, the point that thickness is thicker mainly concentrates on high current density region, low current density areas thickness is relatively thin, need make the shielding insulation plate to the intensive place of the high power line in periphery, to disperse this regional power line toward middle low power line regional centralized.
After using shielding slab to do shielding, data show at the leftmost edge thickness of first row obviously thin partially, and intermediate zone thicknesses is significantly improved, shielding slab shielding periphery power line is too much, need revise shield size, test thickness after the correction once more and finely tune, determine the size of shielding slab at last.
Do the following tabulation of shielding measured each point data in back with this anode shield plate:
Shielding slab meets design effect, but population mean thickness is thick partially, can reduce mean thickness by shortening electroplating time, can enhance productivity simultaneously, galvanization coating thickness and electroplating time, current density is relevant with current efficiency, and current density is relevant with plating liquid medicine system with current efficiency, electroplating time was reduced to 20 minutes from 25 minutes, and theoretical mean thickness is about 10.6 microns.
Through proof test, all install plating tank additional the anode shield plate, electroplating time is adjusted 20 minutes, and the product random sampling after electroplating is carried out Thickness Measurement by Microwave, the following tabulation of thickness data:
| 10.7 | 9.2 | 8.62 |
| 8.5 | 7.7 | 7.1 |
| 8 | 8.4 | 10.1 |
| 8.4 | 7.3 | 9.5 |
| 11.3 | 10 | 12.3 |
| 7.96 | 10.5 | 9.2 |
| 9.5 | 9.8 | 10.6 |
| 10.5 | 12 | 12.4 |
| 10.9 | 11.3 | 12.8 |
| 8.74 | 10.1 | 11.7 |
| 10.7 | 9.2 | 8.62 |
| 10.7 | 9.6 | 8.8 |
| 10.8 | 9.3 | 8.3 |
| 10.5 | 10.6 | 10.8 |
| 10.9 | 12.7 | 13.9 |
| 12.4 | 13 | 14.1 |
| 11.6 | 12 | 13 |
| 10 | 7.91 | 8.93 |
| 11.1 | 9.4 | 11.6 |
| 9.2 | 10.9 | 9.4 |
| 8.1 | 8.72 | 8.3 |
| 8.2 | 7.7 | 10.6 |
| 10.4 | 8.45 | 8.92 |
| 10.7 | 8.2 | 7.7 |
| 10.8 | 10.2 | 9.5 |
| 11.6 | 9.4 | 8.19 |
| 9 | 10.4 | 10.8 |
| 9.3 | 9.4 | 11 |
| 10.3 | 9.6 | 9.2 |
| 11 | 11.6 | 13.7 |
| 11.1 | 9.2 | 7.96 |
| 10.7 | 9.2 | 8.62 |
| 8.8 | 9.5 | 10.3 |
| 8.9 | 8.69 | 7.77 |
| 12 | 7.95 | 7.02 |
| 11.2 | 10.3 | 8.9 |
| 11.5 | 10.4 | 10.1 |
| 10.3 | 10.5 | 10.9 |
| 9.62 | 10 | 10.3 |
| 9.87 | 11.7 | 12.9 |
| 10.4 | 10.4 | 11.7 |
| 10.6 | 10.5 | 9.05 |
| Mean value; 9.85 | Standard deviation: 1.32 | Overall COV:13.4% |
Embodiment two
On the basis of embodiment one, basic electroplating device, the plating tank size, plating liquid medicine is constant, and anode ball position and size constancy adopt the TO hanger of another size and profile to produce the TO-220F product, product length is 18CM, every product is hung point of end muscle, product apart from tank level control at 1CM, electroplating current density DK=1.2ASD.Fig. 5 is the hanging tool structure synoptic diagram of the utility model embodiment two, and as shown in Figure 5, present embodiment adopts two hangers to be adjacent to the set-up mode that occupy the negative electrode center.Fig. 8 is that the plating piece product on the utility model embodiment two negative electrode hangers and the position of electroplating between the coating bath concern synoptic diagram.In conjunction with Fig. 8 and determined the physical dimension of anode shielding slab under this condition according to the thickness measuring situation, Fig. 9 is the structural representation of the utility model embodiment two shielding slabs, offer 2 openings on the shielding slab 9, two long limits of opening 91 are the straight line 911 that be arranged in parallel, article two, minor face is a camber line 912, uses the overall COV% behind this conceptual design shielding slab to be reduced to 17.6% by original 42%.
Comprehensive the foregoing description, electroplate the rack plating line and electroplate the pure tin product, owing to electroplate fringing effect and point effect, make that the product thickness of high low current density areas exists than big-difference on the negative electrode hanger, by near anode position sizeable insulation PP shielding slab being installed at plating tank, solved near the problem of fitting operation inconvenience negative electrode, simultaneously reasonable in designly equally can reach the effect of improving thickness distribution, high Current Zone power line is shifted to the low current density district, make the eleetrotinplate layer thickness profile more even, satisfy product quality.
The design of shielding slab, need be on negative electrode the high, medium and low current density regions sampling and testing electrolytic coating thickness that makes marks respectively, and according to the result this shielding slab is debugged, the shielding slab principle of design is to block the power line of high Current Zone, does reference from the profile and the distribution of negative electrode product.
It should be noted that at last: above embodiment is only unrestricted in order to the explanation the technical solution of the utility model.Although the utility model is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that, still can make amendment and be equal to replacement the technical solution of the utility model, and not breaking away from the spirit and scope of the technical program, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (11)
1. pure tin electroplanting device, comprise the plating coating bath that electroplate liquid is housed, electroplate in the coating bath and be provided with cathode electrode and anode electrode, cathode electrode links to each other with the negative electrode hanger, is hung with the plating piece product on the negative electrode hanger, and anode electrode links to each other with anode titanium basket, fill the tin ball in the anode titanium basket, it is characterized in that, be provided with shielding slab between described anode titanium basket and the negative electrode hanger, offer opening on the shielding slab.
2. pure tin electroplanting device as claimed in claim 1 is characterized in that the distance of the last lower rim of the opening of offering on the described shielding slab is less than the height of anode titanium basket.
3. pure tin electroplanting device as claimed in claim 2 is characterized in that, the opening of offering on the described shielding slab is 1 or 2.
4. pure tin electroplanting device as claimed in claim 3 is characterized in that, the opening of offering on the described shielding slab is a rectangular aperture.
5. pure tin electroplanting device as claimed in claim 4 is characterized in that, four drift angle places of described rectangular aperture are provided with chamfering.
6. pure tin electroplanting device as claimed in claim 3 is characterized in that, two long limits of the opening of offering on the described shielding slab are the straight line that be arranged in parallel, and two minor faces are camber line.
7. pure tin electroplanting device as claimed in claim 2 is characterized in that, the distance between described anode electrode and the described shielding slab is 2CM.
8. pure tin electroplanting device as claimed in claim 1 is characterized in that, described anode titanium basket is 2 groups, 7 every group.
9. pure tin electroplanting device as claimed in claim 1 is characterized in that, described negative electrode hanger is folder point hanger, the pros and cons setting, and every 4 row, every row hang 15 plating piece products.
10. pure tin electroplanting device as claimed in claim 1 is characterized in that, described negative electrode hanger is the T0 hanger, is single-point contact conductive plated, and each hook is hung a plating piece product.
11. pure tin electroplanting device as claimed in claim 1 is characterized in that, the plating piece product that hangs on the described negative electrode hanger is apart from electroplate liquid liquid level 1CM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201682553U CN201534890U (en) | 2009-08-27 | 2009-08-27 | Pure tin electroplating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201682553U CN201534890U (en) | 2009-08-27 | 2009-08-27 | Pure tin electroplating device |
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| CN201534890U true CN201534890U (en) | 2010-07-28 |
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Cited By (11)
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| CN102345153A (en) * | 2011-09-09 | 2012-02-08 | 东莞生益电子有限公司 | Copper-plated cylinder organic pollution purification device and purification method thereof |
| CN102400192A (en) * | 2011-11-10 | 2012-04-04 | 深南电路有限公司 | Method for electroplating gold to circuit boards |
| CN102605401A (en) * | 2012-03-23 | 2012-07-25 | 如皋市易达电子有限责任公司 | Online tin recycling structure for surface treating tank |
| CN104195625B (en) * | 2014-08-08 | 2016-07-06 | 南开大学 | A kind of method making thick plating gravure printing roller surface coating homogenization |
| CN108004575A (en) * | 2017-12-29 | 2018-05-08 | 上海新阳半导体材料股份有限公司 | Plating screening arrangement |
| CN108149289A (en) * | 2018-03-16 | 2018-06-12 | 湖南文理学院 | A kind of plating masking jig |
| CN108265325A (en) * | 2018-03-14 | 2018-07-10 | 电子科技大学 | A kind of electroplating bath |
| CN109023437A (en) * | 2018-07-12 | 2018-12-18 | 包头蓝谷科技有限公司 | Reparation tooling, prosthetic device and the restorative procedure of plate slab crystallizer |
| CN109778289A (en) * | 2019-02-27 | 2019-05-21 | 中国电子科技集团公司第二十九研究所 | A kind of electroplating clamp and the circuit board electroplating method using electroplating clamp |
| CN110172717A (en) * | 2019-06-27 | 2019-08-27 | 翔声科技（厦门）有限公司 | A kind of copper electroplating method of ceramic substrate |
| JP2020020034A (en) * | 2018-07-24 | 2020-02-06 | 富士ゼロックス株式会社 | Plating apparatus and manufacturing method of plated parts |
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| CN102345153A (en) * | 2011-09-09 | 2012-02-08 | 东莞生益电子有限公司 | Copper-plated cylinder organic pollution purification device and purification method thereof |
| CN102400192A (en) * | 2011-11-10 | 2012-04-04 | 深南电路有限公司 | Method for electroplating gold to circuit boards |
| CN102605401A (en) * | 2012-03-23 | 2012-07-25 | 如皋市易达电子有限责任公司 | Online tin recycling structure for surface treating tank |
| CN102605401B (en) * | 2012-03-23 | 2015-11-18 | 如皋市易达电子有限责任公司 | The online tin recovery structure of a kind of surface processing trough |
| CN104195625B (en) * | 2014-08-08 | 2016-07-06 | 南开大学 | A kind of method making thick plating gravure printing roller surface coating homogenization |
| CN108004575A (en) * | 2017-12-29 | 2018-05-08 | 上海新阳半导体材料股份有限公司 | Plating screening arrangement |
| CN108004575B (en) * | 2017-12-29 | 2024-04-16 | 上海新阳半导体材料股份有限公司 | Shielding device for electroplating |
| CN108265325B (en) * | 2018-03-14 | 2023-07-07 | 电子科技大学 | Plating bath |
| CN108265325A (en) * | 2018-03-14 | 2018-07-10 | 电子科技大学 | A kind of electroplating bath |
| CN108149289A (en) * | 2018-03-16 | 2018-06-12 | 湖南文理学院 | A kind of plating masking jig |
| CN109023437A (en) * | 2018-07-12 | 2018-12-18 | 包头蓝谷科技有限公司 | Reparation tooling, prosthetic device and the restorative procedure of plate slab crystallizer |
| JP2020020034A (en) * | 2018-07-24 | 2020-02-06 | 富士ゼロックス株式会社 | Plating apparatus and manufacturing method of plated parts |
| JP7293765B2 (en) | 2018-07-24 | 2023-06-20 | 富士フイルムビジネスイノベーション株式会社 | Plating equipment |
| CN109778289B (en) * | 2019-02-27 | 2020-06-12 | 中国电子科技集团公司第二十九研究所 | Electroplating clamp and circuit board electroplating method using same |
| CN109778289A (en) * | 2019-02-27 | 2019-05-21 | 中国电子科技集团公司第二十九研究所 | A kind of electroplating clamp and the circuit board electroplating method using electroplating clamp |
| CN110172717A (en) * | 2019-06-27 | 2019-08-27 | 翔声科技（厦门）有限公司 | A kind of copper electroplating method of ceramic substrate |
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| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 528000 Guangdong Province, Foshan city Chancheng District ancient road No. 45 Patentee after: Foshan Blue Rocket Electronics Co., Ltd. Address before: 528000 Guangdong Province, Foshan city Chancheng District Road No. 1 Buddha Patentee before: Foshan Blue Rocket Electronics Co., Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20100728 |
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| CX01 | Expiry of patent term |