CN205398759U - Electroplating pool for electron plate - Google Patents
Electroplating pool for electron plate Download PDFInfo
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- CN205398759U CN205398759U CN201620150856.1U CN201620150856U CN205398759U CN 205398759 U CN205398759 U CN 205398759U CN 201620150856 U CN201620150856 U CN 201620150856U CN 205398759 U CN205398759 U CN 205398759U
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- electroplating
- electroplating bath
- water pump
- pipe
- outlet pipe
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Abstract
The utility model discloses an electroplating pool for electron plate belongs to the electroplating technology apparatus field, including the electroplating pool body and set up a plurality of adjacent plating baths in proper order on the electroplating pool body, be equipped with the water pump on the plating bath, a termination of water pump has the inlet tube, and another termination has the outlet pipe, and the bottom between two adjacent plating baths is equipped with the spray pipe of two plating baths of intercommunication, inlet tube, water pump, outlet pipe, spray pipe constitute plating solution circulation circuit between two adjacent plating baths, and in the water pump was absorb to the plating solution in with a plating bath through the inlet tube, in another plating bath was carried this plating solution to outlet pipe that rethread and water pump are connected, plating solution in another plating bath was in by spray pipe spray feed home plating bath. The utility model discloses it is similar with the upper portion degree of rolling that the electroplating pool can make the electricity cross the liquid bottom degree of rolling to make the cladding material upper portion thickness on the electron plate differ less with lower part thickness, the thickness that effectively reduces cladding material is poor, improves and electroplates the quality.
Description
Technical field
This utility model relates to a kind of electroplating pool, is specifically related to a kind of electron plate electroplating pool, belongs to electroplating apparatus field.
Background technology
The purposes of electroplating technology is very many, mainly include anticorrosion, protected decoration, resistance to wear and electrical property, at present, plating mainly carries out in electroplating pool, and plated body is set to negative electrode, and then logical unidirectional current is electroplated, in order to keep the effect of plating then to need certain condition, mainly including electric current density, electroplating site, stirring condition, current waveform, bath temperature, plating solution pH value and plating solution proportion, wherein generally the effect of stirring is more good, and electroplating efficiency is more high.
Existing electron plate electroplating pool, is provided with several electroplating baths, and each electroplating bath is provided with escape pipe, and escape pipe ejection gas makes electrodeposit liquid rolling in electroplating bath, makes electron plate plating last layer coating.In existing electroplating pool, escape pipe is provided in bottom electroplating bath, therefore electrodeposit liquid rolls degree not as the rolling degree on electroplating bath top bottom electroplating bath, causing that the coating upper thickness on electron plate is more than bottom thickness, the thickness difference of coating is relatively big, affects electroplating quality.
Summary of the invention
For above-mentioned prior art Problems existing, this utility model provides a kind of electron plate electroplating pool, and in electroplating pool, uniformly, the top and the bottom thickness making electron plate coating is close in electroplate liquid rolling, reduces the thickness difference of coating, improves electroplating quality.
To achieve these goals, a kind of electron plate electroplating pool that this utility model adopts, including electroplating pool body and be arranged on the some electroplating baths adjacent successively on electroplating pool body；
Described electroplating bath is provided with water pump, and the one of water pump is terminated with water inlet pipe, and the other end is connected to outlet pipe, and the bottom between adjacent two electroplating baths is communicated with the sparge pipe of two electroplating baths；
Described water inlet pipe, water pump, outlet pipe, sparge pipe constitute electroplate liquid closed circuit between adjacent two electroplating baths, by water inlet pipe, electroplate liquid in one electroplating bath is drawn in water pump, being transported in another electroplating bath again through the outlet pipe being connected with water pump by this electroplate liquid, the electroplate liquid in another electroplating bath is returned in former electroplating bath by sparge pipe spray feed.
As improvement, described electroplating bath includes electroplating bath one and the electroplating bath two adjacent with electroplating bath one；
The upper end of described electroplating bath one is provided with water pump one, one end of water pump one is provided with the water inlet pipe one being arranged in electroplating bath one, the other end of water pump one is connected to the mouth of pipe and is positioned at the outlet pipe one above electroplating bath two, between described electroplating bath one and electroplating bath two, bottom is provided with sparge pipe one, described water pump one is coordinated with outlet pipe one by water inlet pipe one, electroplate liquid in electroplating bath one is delivered in electroplating bath two, again through sparge pipe one, electroplate liquid in electroplating bath two is delivered in electroplating bath one.
As improvement, described sparge pipe and outlet pipe all adopt and are obliquely installed.
Angle of inclination as improvement, described sparge pipe and outlet pipe is 30-60 °.
As improvement, described water inlet pipe extends bottom electroplating bath.
As improvement, described sparge pipe and outlet pipe are oppositely arranged.
Compared with prior art, this utility model is provided with water pump on electroplating bath, the one of water pump is terminated with water inlet pipe, the other end is connected to outlet pipe, bottom between adjacent two electroplating baths is communicated with the sparge pipe of two electroplating baths, when relying on water pump to be transported in another electroplating bath by outlet pipe by the electroplate liquid in one electroplating bath, it is formed for pressure differential between two electroplating baths, now the electroplate liquid in another electroplating bath is just returned former electroplating bath by sparge pipe spray feed, sparge pipe interacts with outlet pipe and forms undercurrent and eddy current, make rolling degree bottom electrodeposit liquid similar with top rolling degree, so that the coating upper thickness on electron plate differs less with bottom thickness, effectively reduce the thickness difference of coating, improve electroplating quality.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is internal structure schematic diagram of the present utility model；
In figure: 1, electroplating pool body, 11, electroplating bath one, 12, electroplating bath two, 2, water pump one, 3, outlet pipe one, 4, sparge pipe one, 5, water inlet pipe one.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearly understand, below by accompanying drawing and embodiment, this utility model being further elaborated.However, it should be understood that specific embodiment described herein is only in order to explain this utility model, it is not limited to scope of the present utility model.
As shown in Figure 1 and Figure 2, a kind of electron plate electroplating pool, including electroplating pool body 1 and be arranged on the some electroplating baths adjacent successively on electroplating pool body 1；
Described electroplating bath is provided with water pump, and the one of water pump is terminated with water inlet pipe, and the other end is connected to outlet pipe, and the bottom between adjacent two electroplating baths is communicated with the sparge pipe of two electroplating baths；
Described water inlet pipe, water pump, outlet pipe, sparge pipe constitute electroplate liquid closed circuit between adjacent two electroplating baths, by water inlet pipe, electroplate liquid in one electroplating bath is drawn in water pump, being transported in another electroplating bath again through the outlet pipe being connected with water pump by this electroplate liquid, the electroplate liquid in another electroplating bath is returned in former electroplating bath by sparge pipe spray feed.
As the improvement of embodiment, described electroplating bath includes electroplating bath 1 and the electroplating bath two 12 adjacent with electroplating bath 1；
The upper end of described electroplating bath 1 is provided with water pump 1, one end of water pump 1 is provided with the water inlet pipe 1 being arranged in electroplating bath 1, the other end of water pump 1 is connected to the mouth of pipe and is positioned at the outlet pipe 1 above electroplating bath 2 12, between described electroplating bath 1 and electroplating bath 2 12, bottom is provided with sparge pipe 1, described water pump 1 is coordinated with outlet pipe 1 by water inlet pipe 1, electroplate liquid in electroplating bath 1 is delivered in electroplating bath 2 12, again through sparge pipe 1, electroplate liquid in electroplating bath 2 12 is delivered in electroplating bath 1.During use, when relying on water pump 1 to be transported in electroplating bath 2 12 by outlet pipe 1 by the electroplate liquid in electroplating bath 1, it is formed for pressure differential between two electroplating baths, now the electroplate liquid in electroplating bath 2 12 is just by sparge pipe 1 spray feed telegram in reply coating bath 1, undercurrent and eddy current is formed with outlet pipe 1 interaction by sparge pipe 1, make rolling degree bottom electrodeposit liquid similar with top rolling degree, so that the coating upper thickness on electron plate differs less with bottom thickness, effectively reduce the thickness difference of coating, improve electroplating quality.
As the improvement of embodiment, described sparge pipe and outlet pipe all adopt and are obliquely installed, it is simple to electroplate liquid is circulation between adjacent electroplating bath.
Improvement as embodiment, the angle of inclination of described sparge pipe and outlet pipe is 30-60 °, it is easy to form undercurrent and eddy current by sparge pipe with outlet pipe interaction, make rolling degree bottom electrodeposit liquid similar with top rolling degree, so that the coating upper thickness on electron plate differs less with bottom thickness.Concrete setting angle can be determined according to actual installation demand.
As the improvement of embodiment, described water inlet pipe extends bottom electroplating bath, effectively guarantees to draw to water pump the electroplate liquid in electroplating bath, it is achieved in an electroplating bath, electroplate liquid can flow in another electroplating bath through water inlet pipe, water pump, outlet pipe.
Improvement as embodiment, described sparge pipe and outlet pipe are oppositely arranged, it is effectively ensured electrodeposit liquid circulation between adjacent two electroplating baths, makes rolling degree bottom electrodeposit liquid similar with top rolling degree, so that the coating upper thickness on electron plate differs less with bottom thickness.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all any amendment, equivalent replacement or improvement etc. made within spirit of the present utility model and principle, should be included within protection domain of the present utility model.
Claims (6)
1. an electron plate electroplating pool, including electroplating pool body (1) and be arranged on the some electroplating baths adjacent successively on electroplating pool body (1), it is characterised in that:
Described electroplating bath is provided with water pump, and the one of water pump is terminated with water inlet pipe, and the other end is connected to outlet pipe, and the bottom between adjacent two electroplating baths is communicated with the sparge pipe of two electroplating baths；
Described water inlet pipe, water pump, outlet pipe, sparge pipe constitute electroplate liquid closed circuit between adjacent two electroplating baths, by water inlet pipe, electroplate liquid in one electroplating bath is drawn in water pump, being transported in another electroplating bath again through the outlet pipe being connected with water pump by this electroplate liquid, the electroplate liquid in another electroplating bath is returned in former electroplating bath by sparge pipe spray feed.
2. a kind of electron plate electroplating pool according to claim 1, it is characterised in that: described electroplating bath includes electroplating bath one (11) and the electroplating bath two (12) adjacent with electroplating bath one (11)；
The upper end of described electroplating bath one (11) is provided with water pump one (2), one end of water pump one (2) is provided with the water inlet pipe one (5) being arranged in electroplating bath one (11), the other end of water pump one (2) is connected to the mouth of pipe and is positioned at the outlet pipe one (3) of electroplating bath two (12) top, between described electroplating bath one (11) and electroplating bath two (12), bottom is provided with sparge pipe one (4), described water pump one (2) is coordinated with outlet pipe one (3) by water inlet pipe one (5), the interior electroplate liquid of electroplating bath one (11) is delivered in electroplating bath two (12), again through sparge pipe one (4), the interior electroplate liquid of electroplating bath two (12) is delivered in electroplating bath one (11).
3. a kind of electron plate electroplating pool according to claim 1, it is characterised in that: described sparge pipe and outlet pipe all adopt and are obliquely installed.
4. a kind of electron plate electroplating pool according to claim 3, it is characterised in that: the angle of inclination of described sparge pipe and outlet pipe is 30-60 °.
5. a kind of electron plate electroplating pool according to claim 1, it is characterised in that: described water inlet pipe extends bottom electroplating bath.
6. a kind of electron plate electroplating pool according to claim 1, it is characterised in that: described sparge pipe and outlet pipe are oppositely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620150856.1U CN205398759U (en) | 2016-02-29 | 2016-02-29 | Electroplating pool for electron plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620150856.1U CN205398759U (en) | 2016-02-29 | 2016-02-29 | Electroplating pool for electron plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205398759U true CN205398759U (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620150856.1U Active CN205398759U (en) | 2016-02-29 | 2016-02-29 | Electroplating pool for electron plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106929903A (en) * | 2017-04-24 | 2017-07-07 | 惠安县金旺达工业设计有限公司 | The barrel plating cleaning product line that a kind of plating solution makes full use of |
| CN106929905A (en) * | 2017-04-24 | 2017-07-07 | 惠安县金旺达工业设计有限公司 | A kind of horizontal barrel plating production line of improve quality |
-
2016
- 2016-02-29 CN CN201620150856.1U patent/CN205398759U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106929903A (en) * | 2017-04-24 | 2017-07-07 | 惠安县金旺达工业设计有限公司 | The barrel plating cleaning product line that a kind of plating solution makes full use of |
| CN106929905A (en) * | 2017-04-24 | 2017-07-07 | 惠安县金旺达工业设计有限公司 | A kind of horizontal barrel plating production line of improve quality |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |