CN104005077B - The electroplanting device of optimized temperature field distribution and electro-plating method thereof - Google Patents
The electroplanting device of optimized temperature field distribution and electro-plating method thereof Download PDFInfo
- Publication number
- CN104005077B CN104005077B CN201410203254.3A CN201410203254A CN104005077B CN 104005077 B CN104005077 B CN 104005077B CN 201410203254 A CN201410203254 A CN 201410203254A CN 104005077 B CN104005077 B CN 104005077B
- Authority
- CN
- China
- Prior art keywords
- work nest
- liquid
- electrolyte
- plating
- temperature field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
nullThe invention provides electroplanting device and the electro-plating method thereof of a kind of optimized temperature field distribution，This electroplanting device includes the elements such as electroplating power supply，Plating workpiece、Insoluble anode is all connected with electroplating power supply outfan，Plating workpiece and insoluble anode are all located at inside work nest，Pump for giving-out is connected on drain pipe，Polyrrhea groove is positioned at the outside of work nest，Bottom liquid inlet device is positioned at the lower section of work nest，Liquid spill-way is positioned at the top of work nest wall，Reservoir is positioned at the side of polyrrhea groove，Electroplating power supply carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece，Work nest has electrolyte and is to electroplate the main place implemented，Insoluble anode submergence in the electrolytic solution and energising time occur anode reaction，Bottom liquid inlet device is the entrance that electrolyte enters work nest,Polyrrhea groove has been the electrolyte of electroplating process place of concentration after liquid spill-way flows out.Present configuration is simple, has that construction cost is low, the feature of optimized temperature field.
Description
Technical field
The present invention relates to a kind of electroplanting device and electro-plating method thereof, in particular it relates to the electroplanting device of a kind of optimized temperature field distribution and electro-plating method thereof.
Background technology
The temperature field of electroplating bath plays vital effect to workpiece quality of coating.Borofluoride lead plating is a kind of conventional lead plating technique, and bath temperature is too high, and coating can be roughening.Electrodeposited chromium is very strict to temperature controlled requirement, because temperature not only affects deposition efficiency, has an effect on coating surface quality and hardness.Obtain the chrome plating of light, it is necessary to strict temperature control changes.The change of temperature is bigger on the impact of alloy plating.Research to nickel tungsten shows, the W content in coating is the most sensitive to temperature, and W content can increase along with the rising of temperature.During electrodepositing zinc-nickel alloy coating, under given electric current density, increasing with temperature, the nickel content in coating is linearly increasing.If temperature is too high, cathode efficiency also will be caused to reduce, cause deposition velocity to reduce.Research to dilval shows, temperature raises, and the deposition velocity of nickel slows down, and the iron content in coating raises, and coating crystallization is thicker.
During plating, owing to the resistance of electrolyte can produce Joule heat, the temperature of electrolyte is caused to raise.For miniature workpiece, because the electric current used is less, if adding strong mixing and solution circulation, the problem of local temperature rise would not be projected into the degree affecting quality of coating.And for some larger-size workpiece, the electric current of employing is general very big, local temperature rise is the most very important, once temperature of electroplating solution field distribution is uneven, easily causing surface of the work thickness of coating uneven, composition is inconsistent, degradation problem under poor surface quality and coating mechanical performance.
Numerous researcheres propose and include swap cathode method, rotating cathode method, and air stirring method etc. solves this problem.Swap cathode method be negative electrode in moving process, change thermo parameters method by disturbance electrolyte, accelerate mass transfer in liquid phase, less concentration polarization.During movable cathode, the gas produced at negative electrode can also escape in time, it is to avoid the generation of surface pinholes.Rotating cathode method is applicable to the plating of rotary body, and negative electrode, in rotary course, in the tangential direction of its surface pivots, produces disturbance to liquid stream, reaches the purpose of optimized temperature field with this.Air stirring method is also the conventional method improving bath temperature field.But these methods are all unsuitable for the plating occasion of larger-size workpiece.It addition, application these three method is required for special equipment, first stage of construction is it is necessary to have bigger fund input.In equipment works, either tumbler or air compression plant, operating to have the biggest power consumption for a long time.
Summary of the invention
For defect of the prior art, it is an object of the invention to provide electroplanting device and the electro-plating method thereof of a kind of optimized temperature field distribution, its simple in construction, have that construction cost is low, the feature of optimized temperature field, need not the movement of complexity, the plant equipment such as rotation, can in whole surface of the work deposition thin and thick uniformly, the good coating of uniform component, surface quality.
nullAccording to an aspect of the present invention，The electroplanting device that a kind of optimized temperature field is distributed is provided，It is characterized in that，It includes electroplating power supply、Plating workpiece、Insoluble anode、Work nest、Pump for giving-out、Reservoir、Bottom liquid inlet device、Polyrrhea groove、Liquid spill-way、Drain pipe，Plating workpiece、Insoluble anode is all connected with electroplating power supply outfan，Plating workpiece and insoluble anode are all located at inside work nest，Pump for giving-out is connected on drain pipe，Polyrrhea groove is positioned at the outside of work nest，Bottom liquid inlet device is positioned at the lower section of work nest，Liquid spill-way is positioned at the top of work nest wall，Reservoir is positioned at the side of polyrrhea groove，Electroplating power supply carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece，Work nest has electrolyte and is to electroplate the main place implemented，Insoluble anode submergence in the electrolytic solution and energising time occur anode reaction，Bottom liquid inlet device is the entrance that electrolyte enters work nest,Polyrrhea groove has been the electrolyte of electroplating process place of concentration after liquid spill-way flows out.
Preferably, the bottom of described bottom liquid inlet device is provided with an inlet, and inlet is connected with reservoir by a feed tube, and liquid outlet is positioned in the bottom side of polyrrhea groove, and feed tube is provided with a liquid feeding pump.
Preferably, described work nest uses variable section structure, and the bottom section area of work nest is maximum, and the topside area of work nest is minimum.
Preferably, the angle between wall and the bottom surface of described work nest is 30 ° to 89 °.
Preferably, described insoluble anode surface has multiple centre distance and the most equal hole of diameter, a diameter of 5 millimeters to 40 millimeters of hole.
Preferably, described insoluble anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.
Preferably, the central structure of described bottom liquid inlet device is groove, and the bottom of bottom liquid inlet device is pyramidal structure.
Preferably, the angle of the cone angle of described pyramidal structure is 90 ° to 160 °.
Preferably, top or the side of described bottom liquid inlet device is uniformly provided with multiple mouth spray.
The present invention also provides for the electro-plating method of the electroplanting device of a kind of optimized temperature field distribution, it is characterised in that this electro-plating method comprises the following steps: after electrolyte adjusts concentration and temperature in reservoir, entered in work nest by liquid feeding pump；The electrolyte flow direction in work nest is from bottom to up；When the liquid level of work nest is higher than liquid spill-way, completes the electrolyte spilling that the temperature of electroplating process is higher, and enter in polyrrhea groove；The bubble that plating workpiece and insoluble anode produce is taken out of by liquid stream simultaneously, it is to avoid gas is detained formation needle pore defect on plating workpiece；Electrolyte in polyrrhea groove, in Pump for giving-out enters into reservoir, starts new circulation after adjusting temperature and concentration.
Compared with prior art, the present invention has following beneficial effect: present configuration is simple, have that construction cost is low, the feature of optimized temperature field, need not the movement of complexity, the plant equipment such as rotation, can in whole surface of the work deposition thin and thick uniformly, the good coating of uniform component, surface quality.The present invention is applicable to the plating application such as larger-size pipe, rod, roll.
Accompanying drawing explanation
The detailed description with reference to the following drawings, non-limiting example made by reading, the other features, objects and advantages of the present invention will become more apparent upon:
Fig. 1 is the structural representation of the electroplanting device of optimized temperature field of the present invention distribution.
Fig. 2 is work nest and the structural representation of polyrrhea groove in the present invention.
Fig. 3 is the structural representation of insoluble anode in the present invention.
Fig. 4 is the perspective view of the first bottom liquid inlet device in the present invention.
Fig. 5 is the side structure schematic diagram of the first bottom liquid inlet device in the present invention.
Fig. 6 is the structural representation of the second bottom liquid inlet device in the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.Following example will assist in those skilled in the art and are further appreciated by the present invention, but limit the present invention the most in any form.It should be pointed out that, to those skilled in the art, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement.These broadly fall into protection scope of the present invention.
nullAs shown in Figures 1 to 6，The electroplanting device of optimized temperature field of the present invention distribution includes electroplating power supply 1、Plating workpiece 2、Insoluble anode 3、Work nest 4、Pump for giving-out 5、Reservoir 6、Bottom liquid inlet device 7、Polyrrhea groove 8、Liquid spill-way 9、Drain pipe 11，Plating workpiece 2、Insoluble anode 3 is all connected with electroplating power supply 1 outfan，Plating workpiece 2、Insoluble anode 3 is all located at the inside of work nest 4，Pump for giving-out 5 is connected on drain pipe 11，Reservoir 6 is positioned at the side of polyrrhea groove 8，Bottom liquid inlet device 7 is positioned at the lower section of work nest 4，Polyrrhea groove 8 is positioned at the outside of work nest 4，Liquid spill-way 9 is positioned at the top of work nest 4 wall，Electroplating power supply 1 carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece，Plating workpiece 2 is negative electrode，Work nest 4 has electrolyte and is to electroplate the main place implemented，Insoluble anode 3 submergence in the electrolytic solution and energising time occur anode reaction，Bottom liquid inlet device 7 is the entrance that electrolyte enters work nest,Polyrrhea groove has been the electrolyte of electroplating process place of concentration after liquid spill-way flows out.Electrolyte just can flow out from overfall equably, it is to avoid fluid field is inconsistent causes temperature field inconsistent.The solution overflowed from work nest enters polyrrhea groove, and returns in reservoir through Pump for giving-out suction.
The bottom of bottom liquid inlet device 7 is provided with an inlet 14, inlet 14 is connected with reservoir 6 by a feed tube 12, liquid outlet 10 is positioned in the bottom side of polyrrhea groove 8, and feed tube 12 is provided with a liquid feeding pump 13, and the positive pole of electroplating power supply 1 outfan is connected with conducting rod 15.
The electro-plating method of the electroplanting device of optimized temperature field of the present invention distribution comprises the following steps: after electrolyte adjusts concentration and temperature in reservoir 6, entered in work nest 4 by liquid feeding pump 13；The electrolyte flow direction in work nest is from bottom to up；When the liquid level of work nest is higher than liquid spill-way, completes the higher electrolyte of the temperature of electroplating process and overflow, and enter in polyrrhea groove, thus the stablizing of temperature field in maintaining whole work nest；The bubble that plating workpiece and insoluble anode produce is taken out of by liquid stream simultaneously, it is to avoid gas is detained formation needle pore defect on plating workpiece；Electrolyte in polyrrhea groove enters in reservoir through Pump for giving-out 5, starts new circulation after adjusting temperature and concentration；Liquid spill-way 9 should keep the good depth of parallelism with the bottom surface of work nest, and such electrolyte will overflow equably from liquid spill-way, it is to avoid the inconsistent thermo parameters method caused of fluid field is inconsistent.
The design of work nest inclined wall is the key optimizing bath temperature field.Work nest shown in Fig. 2 uses variable section structure, and the bottom section area of work nest is maximum, and the topside area of work nest is minimum, by the control of diverse location flow stream velocity reaches the control to whole cell body temperature field.Work nest bottom area is maximum, and electrolyte flow rate is the slowest.The most up, along with work nest reduced cross-sectional area, electrolyte flow rate also will be more and more faster.The electrolyte higher in the temperature of plating surface of the work generation is taken away rapidly, and leaves work nest, to reach to optimize the purpose of bath temperature field.Angle design between work nest wall and bottom surface should consider its control to whole cell body temperature field, considers from the condition of actual field again.Such as, in the case of plating workpiece size is relatively big, if angle choosing is little, the floor space of whole electroplating bath will be the biggest；And angle choosing is excessive, the electrolyte that temperature is higher can not overflow from work nest in time, causes electrolyte thermograde from bottom to top, thus has a negative impact the surface quality of plating workpiece.Usually, this angle selects 30 ° to 89 °, it is highly preferred that this angle is set as 45 ° to 80 °.If this angle is less than 30 °, in the case of plating workpiece size is relatively big, the area of work nest bottom surface will be very big, and whole electroplating bath cell body will occupy the biggest area.If this angle is more than 89 °, the electrolyte that temperature is higher can accumulate on top, causes electrolyte thermograde from bottom to top, has a negative impact the quality of coating on plating workpiece.If not using this work nest variable section structure, due to electrodeposition process heat release, the solution of plating near workpieces can produce thermograde from bottom to up, and thus it is difficult to ensure that coating thin and thick on whole workpiece is uniform, uniform component, surface quality is good.Electrolyte is after the water conservancy diversion of feeding device, evenly in work nest, and flows out through the liquid spill-way parallel with work nest bottom surface.Electrolyte dispersed, can make the temperature field of whole plating near workpieces reach unanimity.
Insoluble anode 3 surface shown in Fig. 3 has multiple centre distance and the most equal hole 31 of diameter, and these holes are regularly arranged, and this some holes enhances the exchange of electrolyte inside and outside anode.Electrolyte between variable section structure compressing wall and the anode of work nest migrates to plating surface of the work, promotes the mass exchange of whole cell body, optimizes the temperature field of whole cell body.These regularly arranged hole centre-to-centre spacing are equal, a diameter of 5 millimeters to 40 millimeters of hole 31, and centre-to-centre spacing is more than diameter.If diameter is too small, such as less than 5 millimeters, the exchange of electrolyte inside and outside anode is insufficient, causes temperature near plating surface of the work too high, affects cell body temperature field.If diameter is excessive, such as larger than 40 millimeters, anode real work area is little, and anodic current density is too high, causes anode reaction to be aggravated, affects stability of solution.Insoluble anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.If distance is less than 10 millimeters, anode and plating workpiece liberated heat cannot be evacuated in time, cause plating workpiece surface temperature too high.If distance is more than 80 millimeters, tank voltage raises, and increases power consumption.
Conducting rod 15 preferably uses the material identical with insoluble anode, it is to avoid conducting rod and positive contact part rupture because of galvanic corrosion.The mode that conducting rod is directly processed preferably with cutting etc..For should not directly shape, argon arc welding technology is used conducting rod and anodic bonding to be connected together.
What Fig. 4 and Fig. 5 represented is the first bottom liquid inlet device.The central structure of the first bottom liquid inlet device is groove 71, and the lower end of plating workpiece directly sinks in this groove.Workpiece both can be played effective shielding action without the part electroplated by this groove, again can be as the positioner of workpiece；The bottom of the first bottom liquid inlet device is pyramidal structure 72.The angle of the cone angle of pyramidal structure is generally 90 ° to 160 °, it is highly preferred that cone angle is 100 ° to 150 °.If the angle of cone angle is less than 90 °, adjusting limited to the speed of electrolyte, the flow velocity in work nest is too fast, although thermo parameters method can also optimize, but solution cycle-index in adding work nest in identical plate cycle, add the burden of circulating pump.If the angle of cone angle is more than 150 °, the speed of the electrolyte in supply work nest is the slowest, causes electrolyte thermograde from bottom to top, has a negative impact the quality of plating workpiece coating.Electrolyte enters into pyramidal structure from inlet 14, and solution flow velocity in this structure is buffered.The top of the first bottom liquid inlet device is uniformly provided with multiple mouth spray 73.Electrolyte, from mouth spray ejection at a high speed, arrives near plating surface of the work, the electroplate liquid of plating surface of the work is produced disturbance, and then optimizes the temperature field of plating surface of the work.Electrolyte spouting velocity relies on the flow-control of liquid feeding pump to be adjusted.The first bottom liquid inlet device is particularly suitable for the electroplating process that heat release is more.
The second bottom liquid inlet device that Fig. 6 represents.It is with the difference of the bottom liquid inlet device that Fig. 4 and Fig. 5 represents, mouth spray not on top at sidepiece.Electrolyte sprays uniformly from the mouth spray of side, then under the promotion of follow-up electrolyte, gradually raises to liquid spill-way 9, finally enters polyrrhea groove.Electrolyte dispersed, it is possible to optimize the temperature field of plating surface of the work.
Above the specific embodiment of the present invention is described.It is to be appreciated that the invention is not limited in above-mentioned specific embodiment, those skilled in the art can make various deformation or amendment within the scope of the claims, and this has no effect on the flesh and blood of the present invention.
Claims (8)
1. the electroplanting device of an optimized temperature field distribution, it is characterised in that it includes electroplating power supply, plating work
Part, insoluble anode, work nest, Pump for giving-out, reservoir, bottom liquid inlet device, polyrrhea groove, liquid spill-way, go out
Liquid pipe, plating workpiece, insoluble anode be all connected with electroplating power supply outfan, and plating workpiece and insoluble anode are all
Being positioned at inside work nest, Pump for giving-out is connected on drain pipe, and polyrrhea groove is positioned at the outside of work nest, and bottom liquid inlet fills
Setting in the lower section of work nest, liquid spill-way is positioned at the top of work nest wall, and reservoir is positioned at the side of polyrrhea groove,
Electroplating power supply carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece, and work nest has electricity
Solve liquid and be plating implement main place, insoluble anode submergence in the electrolytic solution and energising time occur anode reaction,
Bottom liquid inlet device is the entrance that electrolyte enters work nest, and polyrrhea groove has been that the electrolyte of electroplating process is from overflowing
The place that liquid mouth is concentrated after flowing out；
The bottom of described bottom liquid inlet device is provided with an inlet, and inlet is by a feed tube with reservoir even
Connecing, liquid outlet is positioned in the bottom side of polyrrhea groove, and feed tube is provided with a liquid feeding pump；
Described work nest uses variable section structure, and the bottom section area of work nest is maximum, the topside area of work nest
Minimum.
The electroplanting device of optimized temperature field the most according to claim 1 distribution, it is characterised in that described work
Making the angle between the wall of groove and bottom surface is 30 ° to 89 °.
The electroplanting device of optimized temperature field the most according to claim 1 distribution, it is characterised in that described insoluble
Anode surface has multiple centre distance and the most equal hole of diameter, a diameter of 5 millimeters to 40 millimeters of hole.
The electroplanting device of optimized temperature field the most according to claim 1 distribution, it is characterised in that described insoluble
Anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.
The electroplanting device of optimized temperature field the most according to claim 1 distribution, it is characterised in that described bottom is entered
The central structure of liquid device is groove, and the bottom of bottom liquid inlet device is pyramidal structure.
The electroplanting device of optimized temperature field the most according to claim 5 distribution, it is characterised in that described taper is tied
The angle of the cone angle of structure is 90 ° to 160 °.
The electroplanting device of optimized temperature field the most according to claim 1 distribution, it is characterised in that described bottom is entered
The top of liquid device or side are uniformly provided with multiple mouth spray.
8. the electro-plating method of the electroplanting device of an optimized temperature field distribution, it is characterised in that this electro-plating method includes
Following steps: after electrolyte adjusts concentration and temperature in reservoir, entered in work nest by liquid feeding pump；
The electrolyte flow direction in work nest is from bottom to up；When the liquid level of work nest is higher than liquid spill-way, complete to electroplate
The electrolyte that the temperature of journey is higher overflows, and enters in polyrrhea groove；Liquid stream is by plating workpiece and insoluble sun simultaneously
The bubble that pole produces is taken out of, it is to avoid gas is detained formation needle pore defect on plating workpiece；Electrolyte in polyrrhea groove
In Pump for giving-out enters into reservoir, after adjusting temperature and concentration, start new circulation；Described work nest uses
Variable section structure, the bottom section area of work nest is maximum, and the topside area of work nest is minimum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410203254.3A CN104005077B (en) | 2014-05-14 | 2014-05-14 | The electroplanting device of optimized temperature field distribution and electro-plating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410203254.3A CN104005077B (en) | 2014-05-14 | 2014-05-14 | The electroplanting device of optimized temperature field distribution and electro-plating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104005077A CN104005077A (en) | 2014-08-27 |
| CN104005077B true CN104005077B (en) | 2016-11-09 |
Family
ID=51365978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410203254.3A Active CN104005077B (en) | 2014-05-14 | 2014-05-14 | The electroplanting device of optimized temperature field distribution and electro-plating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104005077B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149034A (en) * | 2016-08-15 | 2016-11-23 | 深圳市五株科技股份有限公司 | A kind of plating cylinder |
| CN106149032A (en) * | 2016-08-15 | 2016-11-23 | 深圳市五株科技股份有限公司 | A kind of plating cylinder |
| CN106283166B (en) * | 2016-09-09 | 2018-04-20 | 西北工业大学 | A kind of device for being used to prepare hollow work-piece inner surface Ni SiC composite deposites |
| CN106917132B (en) * | 2017-04-27 | 2018-12-07 | 北京纽堡科技有限公司 | A kind of electroplanting device |
| CN108950625B (en) * | 2018-06-21 | 2020-02-21 | 上海交通大学 | Electroplating system for electroplating chromium on revolving body workpiece |
| CN109023458B (en) * | 2018-08-13 | 2019-11-12 | 惠州市联达金电子有限公司 | A kind of electroplanting device and method of PCB circuit board |
| CN112323131A (en) * | 2020-11-03 | 2021-02-05 | 重庆圣盈达科技开发有限公司 | Method for removing bubbles on surface of electroplated workpiece |
| CN112342601A (en) * | 2020-11-03 | 2021-02-09 | 重庆圣盈达科技开发有限公司 | Novel electroplating stirring device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01294888A (en) * | 1988-05-19 | 1989-11-28 | Mitsubishi Electric Corp | Electrolytic plating equipment |
| JP2003129283A (en) * | 2001-10-18 | 2003-05-08 | Hitachi Ltd | Plating device and process for manufacturing semiconductor device using the same |
| CN1610769A (en) * | 2002-07-18 | 2005-04-27 | 株式会社荏原制作所 | Plating device |
| CN101407935A (en) * | 2007-07-27 | 2009-04-15 | 上村工业株式会社 | Continuous copper electroplating method |
| CN101451264A (en) * | 2007-12-04 | 2009-06-10 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN101517132A (en) * | 2006-10-19 | 2009-08-26 | 本田技研工业株式会社 | Plating apparatus |
| TW201000682A (en) * | 2008-06-19 | 2010-01-01 | Rena Gmbh | Apparatus and process for the one-sided wet-chemical and/or electrolytic treatment of material |
| CN101724881A (en) * | 2008-10-31 | 2010-06-09 | 栢莱化工有限公司 | Application of insoluble anode in electroplating technology |
| CN102011169A (en) * | 2009-09-08 | 2011-04-13 | 上村工业株式会社 | Electroplating apparatus and electroplating method |
| CN102154679A (en) * | 2011-02-28 | 2011-08-17 | 无锡宏联电镀设备有限公司 | Thermostatic plating bath |
-
2014
- 2014-05-14 CN CN201410203254.3A patent/CN104005077B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01294888A (en) * | 1988-05-19 | 1989-11-28 | Mitsubishi Electric Corp | Electrolytic plating equipment |
| JP2003129283A (en) * | 2001-10-18 | 2003-05-08 | Hitachi Ltd | Plating device and process for manufacturing semiconductor device using the same |
| CN1610769A (en) * | 2002-07-18 | 2005-04-27 | 株式会社荏原制作所 | Plating device |
| CN101517132A (en) * | 2006-10-19 | 2009-08-26 | 本田技研工业株式会社 | Plating apparatus |
| CN101407935A (en) * | 2007-07-27 | 2009-04-15 | 上村工业株式会社 | Continuous copper electroplating method |
| CN101451264A (en) * | 2007-12-04 | 2009-06-10 | 株式会社荏原制作所 | Plating apparatus and plating method |
| TW201000682A (en) * | 2008-06-19 | 2010-01-01 | Rena Gmbh | Apparatus and process for the one-sided wet-chemical and/or electrolytic treatment of material |
| CN101724881A (en) * | 2008-10-31 | 2010-06-09 | 栢莱化工有限公司 | Application of insoluble anode in electroplating technology |
| CN102011169A (en) * | 2009-09-08 | 2011-04-13 | 上村工业株式会社 | Electroplating apparatus and electroplating method |
| CN102154679A (en) * | 2011-02-28 | 2011-08-17 | 无锡宏联电镀设备有限公司 | Thermostatic plating bath |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104005077A (en) | 2014-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104005077B (en) | The electroplanting device of optimized temperature field distribution and electro-plating method thereof | |
| CN107254697B (en) | Gradient distribution process and electroplating device for nickel-cobalt alloy plating cobalt of crystallizer copper plate | |
| CN204608194U (en) | A kind of electroplanting device | |
| CN211367772U (en) | Equipment for horizontally electroplating photovoltaic cell | |
| CN104313657A (en) | Electro-deposition device of through hole of HDI printed circuit board | |
| JP3150370U (en) | Electrolytic plating equipment | |
| KR890002839B1 (en) | Process of continuously electrodepositing on strip metal on one or both sides | |
| CN103046096B (en) | Deep hole thickeies chromed hardened processing method | |
| CN112899745A (en) | Equipment for horizontally electroplating photovoltaic cell | |
| CN207468759U (en) | A kind of barrel plating machine for neodymium iron boron plating | |
| CN203625508U (en) | Improved electroplating apparatus | |
| CN103628105A (en) | Electroplating device | |
| JPH0254437B2 (en) | ||
| CN207537587U (en) | Electroplating flower basket | |
| CN103898595B (en) | Sand launder on the continuous Composite Coatings of diamond cutting secant | |
| CN202509147U (en) | Electroplating bath | |
| CN204298483U (en) | The electric deposition device of HDI printed circuit board through hole | |
| CN213142257U (en) | Electroplating device with movable cathode | |
| CN108034977A (en) | Double-flying-target oxidation tank suitable for micro-arc oxidation process | |
| US2424173A (en) | Electrolytic production of alloy coatings | |
| CN205616970U (en) | Electroplating device of pipe fitting | |
| CN206635440U (en) | A kind of metalwork surface film coating device | |
| CN211005664U (en) | Copper foil electroplating experimental device | |
| CN107858737A (en) | A kind of intermetallic composite coating electroplanting device | |
| JP2006233244A (en) | Ultrafine nozzle and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |