CN110760918B - Electroplating system with controllable plating layer - Google Patents
Electroplating system with controllable plating layer Download PDFInfo
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- CN110760918B CN110760918B CN201911205672.5A CN201911205672A CN110760918B CN 110760918 B CN110760918 B CN 110760918B CN 201911205672 A CN201911205672 A CN 201911205672A CN 110760918 B CN110760918 B CN 110760918B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a plating layer controllable electroplating system.A supporting insulating plate is respectively provided with an anode clamp and a cathode clamp, and one cathode corresponds to one anode to form a workpiece combination; each supporting insulation board is provided with at least one power supply submachine, the anode is electrically connected with the anode of the output end of the power supply submachine, the cathode is electrically connected with the cathode of the output end of the power supply submachine, the anode and the cathode respectively extend into the electrolytic solution contained in the plating bath, and each group of the anode and the cathode respectively form an independent loop; during electroplating, electroplating current only needs to flow from the anode to the cathode workpiece in the independent workpiece combination, the scale of an electric field is greatly reduced compared with the traditional electric field, the interference is less, and the uniformity of the surface coating of the cathode workpiece is improved; the workpieces cannot influence each other, and all the workpieces can have more consistent coating after being electroplated as long as the combination of each independent workpiece is controlled to have consistent set parameters, including electroplating current value, electroplating time, distance between the workpiece and the anode and the like.
Description
Technical Field
The invention relates to the field of electroplating processes, and further relates to a plating layer controllable electroplating system.
Background
In a conventional electroplating process, all anodes (anode titanium baskets or insoluble anodes) are placed on both sides of an electroplating bath, and a workpiece serving as a cathode passes through the anodes on both sides, so that a plating layer is formed on the surface of the workpiece when an electroplating current flows from the anodes to the cathodes through an electroplating solution. However, in this type of electroplating process, since the scale of the entire electroplating activity exists between all workpieces and all anodes, the coating distribution and thickness of different workpieces will be somewhat different, i.e., will vary.
On the other hand, workpieces with different types and sizes have different plating areas, so different plating currents are needed, and because the plating currents flow from the positive output of the high-power plating rectifier to the anodes at the two sides of the plating tank, and the current loops of all the workpieces are connected together and then connected back to the negative output of the high-power plating rectifier, the plating currents flow to each workpiece in the plating tank, so that a user can only control the total plating current of all the workpieces integrally, but cannot independently control the plating current received by each workpiece. Therefore, in a conventional continuous electroplating line, the anode is generally set to output a calculated specific total electroplating current value, and then the cathode in the middle of the electroplating tank needs to be a same type and a specified number of workpieces to be electroplated, so that the production flexibility is very low.
For those skilled in the art, how to improve the uniformity of the plating layer of the workpiece and improve the flexibility of electroplating production is a technical problem to be solved at present.
Disclosure of Invention
The invention provides a plating layer controllable electroplating system, which improves the consistency of plating layers of workpieces by arranging independent workpiece combinations and has higher electroplating production flexibility.
A plating-controlled electroplating system, comprising:
a supporting insulating plate on which an anode holder for holding an anode and a cathode holder for holding a cathode are respectively provided;
the bearing guide rail is transversely arranged and is used for supporting the plurality of bearing insulating plates which are transversely arranged;
the power sub machine is arranged on each supporting insulation plate, the anode is electrically connected with the anode of the output end of the power sub machine, and the cathode is electrically connected with the cathode of the output end of the power sub machine;
and the plating tank is used for containing electrolytic solution.
Optionally, conductive rails capable of conducting electricity are respectively arranged on two sides of the bearing guide rail, and the two conductive rails are respectively connected to the positive electrode and the negative electrode of the power supply mother machine;
the input end of each power supply submachine is respectively in conductive connection with the two conductive rails.
Optionally, two rows of sliding metal wheels are arranged on the supporting insulating plate, and the two rows of sliding metal wheels are respectively in conductive contact with the two conductive rails and roll along the conductive rails;
the input end of the power sub machine is respectively connected with the sliding metal wheels at two sides.
Optionally, the device further comprises a pushing wheel arranged on the supporting insulating plate, wherein the pushing wheel is located on the lower surface of the bearing guide rail and is matched with the sliding metal wheel to clamp the bearing guide rail.
Optionally, the pushing wheel and the sliding metal wheel are arranged in a staggered mode.
Optionally, two sides of the bearing guide rail are stepped and sunken, and the conductive rail is arranged on the lower step surface.
Optionally, an insulating layer is provided between the conductive rail and the load bearing rail.
Optionally, the anode clamp and the cathode clamp are both made of conductive metal, and the output end of the power supply submachine is respectively connected to the anode clamp and the cathode clamp.
The invention provides a plating layer controllable electroplating system.A supporting insulating plate is respectively provided with an anode clamp for clamping an anode and a cathode clamp for clamping a cathode, which correspondingly form a workpiece combination; a plurality of supporting insulation plates arranged transversely on the bearing guide rail; each supporting insulation board is provided with at least one power supply submachine, the anode is electrically connected with the anode of the output end of the power supply submachine, the cathode is electrically connected with the cathode of the output end of the power supply submachine, the anode and the cathode respectively extend into the electrolytic solution contained in the plating bath, and each group of the anode and the cathode respectively form an independent loop; during electroplating, electroplating current only needs to flow from the anode to the cathode workpiece in the independent workpiece combination, the scale of the electric field is greatly reduced compared with the traditional electric field, so that the change of interference is very little, and the uniformity of the surface coating of the cathode workpiece can be improved; in addition, each workpiece has its own independent workpiece combination, so that the workpieces do not affect each other, and all the workpieces can be plated more consistently after being plated as long as the independent workpiece combinations are controlled to have consistent set parameters including plating current value, plating time, distance between the workpiece and the anode, shape and number of the anode and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1A is a front view of a plating control electroplating system according to the present invention
FIG. 1B is a partial enlarged view of FIG. 1A;
FIG. 2A is a side view of a plating controlled electroplating system according to the present invention;
fig. 2B is a partially enlarged view of fig. 2A.
The figure includes:
the device comprises a supporting insulating plate 1, an anode clamp 11, a cathode clamp 12, a sliding metal wheel 13, a pushing wheel 14, an insulating layer 15, a bearing guide rail 2, a conductor rail 21, a power supply submachine 3, a plating tank 4 and a power supply mother machine 5.
Detailed Description
The core of the invention is to provide a plating layer controllable electroplating system, which improves the consistency of the plating layer of the workpiece by arranging independent workpiece combinations and has higher electroplating production flexibility.
In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and specific embodiments.
The invention provides a plating layer controllable electroplating system, which comprises a supporting insulating plate 1, a bearing guide rail 2, a power supply submachine 3, a plating tank 4 and other structures, wherein as shown in a figure 1A and a figure 2A, the front view and the side view of the plating layer controllable electroplating system are respectively provided by the invention; FIG. 1B is a partial enlarged view of FIG. 1A, and FIG. 2B is a partial enlarged view of FIG. 2A, in which A denotes an anode and B denotes a cathode; the supporting insulating plate 1 is made of insulating materials, and plays a role in insulating and supporting, so that the switch for supporting the insulating plate 1 is not limited to be in a flat plate shape; an anode holder 11 for holding an anode and a cathode holder 12 for holding a cathode workpiece are provided on the supporting insulating plate 1, respectively, the anode is fixed to the supporting insulating plate 1 by the anode holder 11, and the cathode is fixed to the supporting insulating plate 1 by the cathode holder 12.
The workpiece is used as a cathode, for the workpiece needing plating on both sides, the anode clamps 11 are arranged on both sides of the workpiece, each anode clamp 11 clamps one anode, each cathode clamp 12 clamps one cathode workpiece, and the cathode workpiece is positioned between the anodes on both sides, so that plating can be quickly formed on both sides.
The bearing guide rail 2 is transversely arranged, the length of the bearing guide rail 2 is far greater than that of the bearing insulating plate 1, and the bearing guide rail 2 is used for supporting a plurality of bearing insulating plates 1 which are transversely arranged, namely, a plurality of different bearing insulating plates 1 are supported by the same bearing guide rail 2. The carrier rail 2 can be made of an insulating material.
The power supply submachine 3 is used for controlling the current and the voltage required by the electroplating of a cathode workpiece, one or more power supply submachine 3 are arranged on each supporting insulation board 1, the anode is electrically connected with the anode of the output end of the power supply submachine 3, the cathode is electrically connected with the cathode of the output end of the power supply submachine 3, the anode and the cathode on each supporting insulation board 1 form an independent workpiece combination, a conductive loop is formed inside each independent workpiece combination, and a coating is formed on the cathode workpiece. It should be noted that each independent workpiece combination does not have to have only one power supply submachine 3, two or more power supply submachines 3 can be arranged to be connected with a plurality of anodes, and the anodes at the two sides of the workpiece can be respectively and independently controlled by one power supply submachine to control the electroplating current; when the electroplating area of the workpiece is large, even if a plurality of anodes can be arranged on one side of the workpiece, a plurality of power supply submachine can be arranged; and only one workpiece. The plating bath 4 is used for containing electrolytic solution, and the cathode and the anode are inserted into the plating bath 4.
The plating-controlled electroplating system of the invention forms an independent workpiece combination by the anode and the cathode which are relatively fixed on each supporting insulating plate 1, and each independent workpiece combination independently operates in the plating bath. Because the anodes are not arranged at two sides of the plating bath any longer, but are fixed by the supporting insulating plate 1 and then clamped by the anode clamp 11 connected with the positive output end of the power submachine 3; the cathode workpiece is also fixed by the supporting insulating plate 1 and then clamped by the cathode clamp 12 connected with the negative output end of the power sub-machine 3; therefore, during electroplating, the electroplating current only needs to flow from the anode to the cathode workpiece in the independent workpiece combination; the scale of the electric field is greatly reduced compared with the traditional common cathode and common anode structures, so that the change of interference is very little, and the uniformity of the coating on the surface of a workpiece can be improved; in addition, each cathode workpiece is electroplated through an independent workpiece combination, so that the workpieces cannot be influenced mutually, and all the workpieces can have more consistent coatings after being electroplated as long as the independent workpiece combinations are controlled to have consistent set parameters including electroplating current value, electroplating time, distance between the workpiece and the anode, shape and quantity of the anode and the like.
Because each independent workpiece combination is independent, each workpiece combination can be configured with different workpieces, and then the power supply submachine of different independent workpiece combinations is controlled to output matched electroplating current in a radio control mode so as to accurately perform electroplating; radio communication components and antennas are arranged in the power sub-machine, and the content of a single chip Microcomputer (MCU) is received and transmitted in a radio interface mode. Thus, the electroplating device is different from the traditional continuous electroplating production line which needs to electroplate workpieces of the same type and a specified quantity. This provides great flexibility for the production process, greatly increasing the productivity of the user.
Because the design of independent workpiece combination is adopted, the distance between the anode and the cathode workpiece can be shortened, so that the electroplating voltage can be reduced, the electroplating efficiency is higher, and the energy-saving effect is achieved.
On the basis of the scheme, conductive rails 21 capable of conducting electricity are respectively arranged on two sides of the bearing guide rail 2, the two conductive rails 21 are respectively connected to the positive electrode and the negative electrode of the power supply mother machine 5, the power supply mother machine 5 is connected with a power supply and used for outputting current, and the two conductive rails 21 are respectively connected to different outputs of the power supply mother machine 5. The input end of each power sub-machine 3 is respectively in conductive connection with two conductor rails 21, that is, each power sub-machine 3 is in conductive connection with the power parent machine 5 through the conductor rails 21, the power parent machine 5 uniformly supplies power to each power sub-machine 3, and each power sub-machine 3 independently adjusts the output parameter thereof, so as to control the thickness of the coating.
The power supply of the whole electroplating system is divided into two groups, the first group is a power supply mother machine 5, the power supply mother machine is an AC-DC power supply (AC-DC Converter), and 220V or 380V AC power transmission and distribution is converted into 24V, 36V or 48V low-voltage DC power. The second group is a power supply submachine 3 which is an adjustable output direct current-to-direct current power supply (DC-DC Converter) and converts the low-voltage direct current output by the power supply mother machine into the output required by electroplating.
A single chip Microcomputer (MCU) is arranged in the power sub-machine, and current and voltage output parameters required by a user can be provided for the MCU through different communication modes such as radio, RS485 and RS 232; the single chip microcomputer can instantaneously control and regulate the output current or voltage according to the parameters required by the user and the currently detected output current or voltage, and finally the output current or voltage is regulated to the value required by the user.
Specifically, the invention provides two rows of sliding metal wheels 13 on the supporting insulating plate 1, the sliding metal wheels 13 can rotate relative to the supporting insulating plate 1; the two rows of sliding metal wheels 13 are respectively in conductive contact with two conductive rails 21 and roll along the conductive rails 21, so that the supporting insulating plate 1 moves transversely relative to the bearing guide rail 2. The supporting insulating plate 1 obtains power from the conductive rail at the same time, provides low-voltage direct current from the power mother machine for the power son machine, and is pushed to continuously move forwards until the whole electroplating process is finished.
In the whole electroplating process, the independent workpieces are combined on the bearing guide rail 2 to slide, and because the workpieces have independent power supply submachine to supply electroplating current, the current cannot jump and stop due to uneven distribution of the electroplating current on each workpiece or unstable large-scale electric field, and the electroplating quality is not influenced.
The input end of the power sub-machine 3 is respectively connected with the sliding metal wheels 13 on the two sides, and no matter the sliding metal wheels 13 move to any position, the input end of the power sub-machine 3 is in conductive communication with the conductive rail 21, so that the power sub-machine 3 is in conductive connection with the power main machine 5 all the time. The sliding metal wheel 13 can be provided with no driving power, a new independent workpiece combination is arranged at the rear, the sliding metal wheel is pushed forwards by the workpiece combination from the rear, and the rear supporting insulation plate is contacted with the front supporting insulation plate to push the front supporting insulation plate to move forwards.
Furthermore, the invention also comprises a pushing wheel 14 arranged on the supporting insulating plate 1, wherein the pushing wheel 14 can rotate relative to the supporting insulating plate 1, and the rotating shafts of the pushing wheel 14 and the sliding metal wheel 13 are both horizontal; the pushing wheel 14 is positioned on the lower surface of the bearing guide rail 2, the sliding metal wheel 13 is positioned on the upper surface of the bearing guide rail 2, the pushing wheel 14 and the sliding metal wheel 13 are oppositely connected through a connecting rod at the side to form an Contraband-shaped structure, and the pushing wheel and the sliding metal wheel are clamped on the side of the bearing guide rail 2; the pushing wheel 14 and the sliding metal wheel 13 are matched to clamp the bearing guide rail 2, so that the supporting insulation board 1 moves on the bearing guide rail 2 more stably.
As shown in fig. 1A, the pushing wheels 14 and the sliding metal wheels 13 are arranged in a staggered manner, that is, the vertical projections of the pushing wheels 14 and the sliding metal wheels 13 on the horizontal plane do not coincide with each other, so as to further improve the smoothness of the supporting insulating plate 1 in the transverse movement.
As shown in fig. 2B, both sides of the carrier rail 2 are stepped, the cross section of the carrier rail 2 is in the shape of a step with a high middle and two low sides, the conductive rail 21 is disposed on the lower step surface, and the upper surface of the carrier rail 2 is substantially flush with the sliding metal wheel 13.
An insulating layer 15 is provided between the conductor rails 21 and the carrier rail 2 to further avoid short-circuiting between the two conductor rails 21.
Specifically, the anode clamp 11 and the cathode clamp 12 are both conductive metal, the anode clamp 11 and the cathode clamp 12 are fixed below the supporting insulation board 1, the output end of the power supply submachine 3 is respectively connected to the anode clamp 11 and the cathode clamp 12, and is conductively connected with the anode through the anode clamp 11 and is conductively connected with the cathode workpiece through the cathode clamp 12.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A plating-controlled electroplating system, comprising:
a supporting insulating plate (1) on which an anode clamp (11) for clamping an anode and a cathode clamp (12) for clamping a cathode are respectively arranged;
the bearing guide rail (2) is transversely arranged and is used for supporting the plurality of bearing insulating plates (1) which are transversely arranged;
each supporting insulation board (1) is provided with at least one power sub-machine (3), the anode of each power sub-machine is electrically connected with the anode of the output end of the power sub-machine (3), and the cathode of each power sub-machine is electrically connected with the cathode of the output end of the power sub-machine (3);
the plating tank (4) is used for containing electrolytic solution;
conductive rails (21) capable of conducting electricity are respectively arranged on two sides of the bearing guide rail (2), and the two conductive rails (21) are respectively connected to the positive electrode and the negative electrode of the power supply main machine (5);
the input end of each power supply submachine (3) is respectively in conductive connection with the two conductive rails (21);
two rows of sliding metal wheels (13) are arranged on the supporting insulating plate (1), and the two rows of sliding metal wheels (13) are respectively in conductive contact with the two conductive rails (21) and roll along the conductive rails (21);
the input end of the power sub-machine (3) is respectively connected with the sliding metal wheels (13) on two sides.
2. The plating controlled electroplating system according to claim 1, further comprising a pushing wheel (14) arranged on the supporting insulating plate (1), wherein the pushing wheel (14) is positioned on the lower surface of the bearing guide rail (2) and cooperates with the sliding metal wheel (13) to clamp the bearing guide rail (2).
3. The plating controlled electroplating system according to claim 2, characterized in that the pushing wheels (14) are staggered with respect to the sliding metal wheels (13).
4. The plating controlled electroplating system according to claim 1, wherein the two sides of the load-bearing rail (2) are stepped, and the conductive rail (21) is arranged on the lower stepped surface.
5. The plating controlled electroplating system according to claim 1, characterized in that an insulating layer (15) is provided between the conductive rail (21) and the carrier rail (2).
6. The plating controllable electroplating system according to claim 1, characterized in that the anode clamp (11) and the cathode clamp (12) are both conductive metal, and the output end of the power supply sub-machine (3) is respectively connected to the anode clamp (11) and the cathode clamp (12).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911205672.5A CN110760918B (en) | 2019-11-29 | 2019-11-29 | Electroplating system with controllable plating layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911205672.5A CN110760918B (en) | 2019-11-29 | 2019-11-29 | Electroplating system with controllable plating layer |
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| CN110760918A CN110760918A (en) | 2020-02-07 |
| CN110760918B true CN110760918B (en) | 2022-02-18 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114775023A (en) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | Electroplating device |
| CN116988131B (en) * | 2023-09-28 | 2023-12-15 | 江苏台祥自动化科技有限公司 | Barrel plating equipment for electroplating production |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546739A (en) * | 2003-12-04 | 2004-11-17 | 宝龙自动机械（深圳）有限公司 | Double guide rail transmission device |
| KR20140145426A (en) * | 2013-06-13 | 2014-12-23 | 삼성전기주식회사 | Faulty hanger test apparatus |
| CN205295523U (en) * | 2015-12-07 | 2016-06-08 | 依力柏电能有限公司 | Plating device |
| CN106835249A (en) * | 2017-03-13 | 2017-06-13 | 东莞市威力固电路板设备有限公司 | A kind of portable electroplanting device |
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN107268064A (en) * | 2017-06-28 | 2017-10-20 | 广州明毅电子机械有限公司 | A kind of conductive copper rail device of Full-automatic vertical continuous plating line |
| CN105350062B (en) * | 2015-12-07 | 2018-01-19 | 依力柏电能有限公司 | A kind of electroplanting device |
| CN207079293U (en) * | 2017-06-16 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN108774746A (en) * | 2018-07-20 | 2018-11-09 | 东莞宇宙电路板设备有限公司 | Drive mechanism and electroplating device |
| CN211420344U (en) * | 2019-11-29 | 2020-09-04 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
-
2019
- 2019-11-29 CN CN201911205672.5A patent/CN110760918B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546739A (en) * | 2003-12-04 | 2004-11-17 | 宝龙自动机械（深圳）有限公司 | Double guide rail transmission device |
| KR20140145426A (en) * | 2013-06-13 | 2014-12-23 | 삼성전기주식회사 | Faulty hanger test apparatus |
| CN205295523U (en) * | 2015-12-07 | 2016-06-08 | 依力柏电能有限公司 | Plating device |
| CN105350062B (en) * | 2015-12-07 | 2018-01-19 | 依力柏电能有限公司 | A kind of electroplanting device |
| CN106835249A (en) * | 2017-03-13 | 2017-06-13 | 东莞市威力固电路板设备有限公司 | A kind of portable electroplanting device |
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN207079293U (en) * | 2017-06-16 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN107268064A (en) * | 2017-06-28 | 2017-10-20 | 广州明毅电子机械有限公司 | A kind of conductive copper rail device of Full-automatic vertical continuous plating line |
| CN108774746A (en) * | 2018-07-20 | 2018-11-09 | 东莞宇宙电路板设备有限公司 | Drive mechanism and electroplating device |
| CN211420344U (en) * | 2019-11-29 | 2020-09-04 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
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