CN107268064A - A kind of conductive copper rail device of Full-automatic vertical continuous plating line - Google Patents
A kind of conductive copper rail device of Full-automatic vertical continuous plating line Download PDFInfo
- Publication number
- CN107268064A CN107268064A CN201710505783.2A CN201710505783A CN107268064A CN 107268064 A CN107268064 A CN 107268064A CN 201710505783 A CN201710505783 A CN 201710505783A CN 107268064 A CN107268064 A CN 107268064A
- Authority
- CN
- China
- Prior art keywords
- conductive copper
- plating
- copper rail
- shaped connector
- folder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
Abstract
A kind of conductive copper rail device of Full-automatic vertical continuous plating line, including：One swab case, is elongate slots；One conductive copper rail, for long rectangular strip, top surface is provided with elongated slot along major axis, be fixed with copper rail binding post, bottom surface sideways is then fixed in the middle of swab case groove floor；The one T-shaped connector of plating folder, montant is pressed from both sides provided with plating, and one end of cross bar is provided with two transversely arranged vertically-guided holes；One conductive copper plate, is provided with the perpendicular screwed hole corresponding to vertically-guided hole；Two leads, top is that be slidably matched vertically-guided hole, the bottom of the T-shaped connector of plating folder of screw thread, stage casing is the thread head for coordinating copper billet perpendicular screwed hole；One tensioning spring；Lead initially passes through the vertically-guided hole of the T-shaped connector cross bar one end of plating folder, pierces into the perpendicular screwed hole that tensioning spring is finally screwed into conductive copper plate again, and the setting of the T-shaped connector of plating folder should cause conductive copper plate is just corresponded to be pressed in conductive copper rail elongated slot.The present invention is simple in construction, and electric conductivity is good, durable and reliable.
Description
Technical field
The present invention relates to the conductive copper rail device on electroplating bath in a kind of Full-automatic vertical continuous plating line, i.e. plating line
Electric installation.
Background technology
Full-automatic continuous electroplating line is current domestic state-of-the-art electroplating device, the electric installation that current industry is mainly used
There are two kinds.A kind of is the electric installation with plating folder, referred to as conducting brush rail set in copper plating groove.Conducting brush track is filled
Put as shown in figure 1, being made up of energization box, brush binding post, conductive stainless steel track, conducting brush.Conducting brush track is filled
Put in the presence of two shortcomings, one is when the electric current of guiding is larger, brush bristle can be burnt up；The second is as use time is cumulative,
Brush loss causes loose contact, it is necessary to change brush.
Another is the electric installation with conductive roller, referred to as conductive roller device in copper plating groove.Conductive roller is filled
Put as shown in Fig. 2 being made up of cathode terminal, anode terminal and conductive roller.There are two shortcomings in conductive roller device, one is
It is conductive uneven；The second is the easy loose contact of the way of contact of this tensioning, it is difficult to ensure reliable contact.
The content of the invention
The technical problems to be solved by the invention, are just to provide a kind of conductive copper rail dress of Full-automatic vertical continuous plating line
Put.
Above-mentioned technical problem is solved, the present invention is adopted the following technical scheme that.
A kind of conductive copper rail device of Full-automatic vertical continuous plating line, it is characterized in that including：
One swab case 2, is elongated channel-shaped；
One conductive copper rail 1, for long rectangular strip, top surface along major axis be provided with elongated slot (namely the centre of cross section be provided with it is recessed
Groove), be fixed with the copper rail binding post of at least one, bottom surface sideways and be then fixed in the middle of the swab case groove floor；
The one T-shaped connector 5 of plating folder, montant is provided with 2 laterally rows provided with plating folder (prior art), one end of cross bar
The vertically-guided hole of row；
One conductive copper plate 4, is provided with 2 normal threads corresponding to the T-shaped connector cross bar one end vertically-guided hole of plating folder
Hole；
Two leads 6, upper end is slidably matched vertically-guided hole, bottom to coordinate copper billet normal thread provided with bulge loop, stage casing
The thread head in hole；
One tensioning spring 7；
Described lead initially passes through the vertically-guided hole of the T-shaped connector cross bar one end of plating folder, pierced into again from top to bottom
Tensioning spring, the perpendicular screwed hole for being finally screwed into conductive copper plate, the setting of the T-shaped connector of plating folder should cause conductive copper plate just
Correspondence is pressed in the conductive copper rail elongated slot.
Preferably, axial threaded hole is bored on the bulge loop top of described lead, is screwed with nut, is connected to wire and is connected to plating
Press from both sides the plating folder on the T-shaped montant of connector 5.
Described copper rail binding post has 2, is equally spacedly fixed in the conductive copper rail；Described copper rail passes through branch
Support side is logical to be fixed on the swab case bottom surface.
The present invention has the advantages that：
The conductive copper rail device of the present invention is using the way of contact of copper rail and conductive copper plate come conductive, the electric-conductor of copper material
Conduct electricity very well, bootable high current, and in the absence of the problem of burning out conductive pieces；In addition, copper rail contact with conductive copper rail
It is elastic tension contact, on the one hand, the electric-conductor of copper material itself is wear-resisting, and conductive copper rail contact surface scribbles conductive paste,
Strengthen electric conductivity and enhancing frictional behaviour；On the other hand, even if causing copper material electric-conductor to wear and tear because long-time is used, bullet
Property tensioning contact can offset the brought loose contact effect of wearing and tearing, that is, ensure to be in close contact.The present invention it is simple in construction, be it is complete from
Dynamic vertical continuous plating lines provide a kind of new electric installation, and this electric installation electric conductivity is good, durable and reliable.
Brief description of the drawings
Fig. 1 is the conducting brush rail set schematic diagram of one of prior art；
Fig. 2 is two conductive roller schematic device of prior art；
Fig. 3 is the Nomenclature Composition and Structure of Complexes schematic perspective view of the invention；
Fig. 4 is the Nomenclature Composition and Structure of Complexes partial schematic sectional view of the invention；
Fig. 5 is Fig. 4 close-up schematic view.
Reference is referred in figure：1- conduction copper rails, 2- swab cases, 3- copper rail binding posts, 4- conductive copper plates, 5- electricity
The T-shaped connector of plating folder, 6- leads, 7- tensioning springs.
Embodiment
The present invention is further elaborated with specific embodiment of the invention below in conjunction with the accompanying drawings.
Fig. 1 and Fig. 2 is the conducting brush rail set and conductive roller schematic device of prior art.
As shown in Figure 3 and Figure 4, it is the conductive copper rail device embodiment of Full-automatic vertical continuous plating line of the present invention, it is wrapped
Include：One swab case 2, is elongated channel-shaped；One conductive copper rail 1, for long rectangular strip, it is (namely transversal that top surface is provided with elongated slot along major axis
The centre in face is provided with groove), be fixed with two copper rail binding posts 3, bottom surfaces sideways and be then fixed in the groove floor of swab case 2
Between；The one T-shaped connector 5 of plating folder, montant is pressed from both sides provided with plating, and one end of cross bar is provided with 2 transversely arranged vertically-guideds
Hole；One conductive copper plate 4, is provided with 2 perpendicular screwed holes corresponding to the T-shaped cross bar one end vertically-guided hole of connector 5 of plating folder；Two
Lead 6, upper end is slidably matched the vertically-guided hole of T-shaped cross bar one end of connector 5, bottom to coordinate copper provided with bulge loop, stage casing
Axial threaded hole is bored on the thread head of block perpendicular screwed hole, bulge loop top, is screwed with nut, is connected to wire and is connected to the T-shaped company of plating folder
Plating folder on the montant of fitting 5；One tensioning spring 7.
Lead 6 initially passes through the vertically-guided hole of the T-shaped connector cross bar one end of plating folder, pierces into tensioning bullet again from top to bottom
Spring 7, the perpendicular screwed hole for being finally screwed into conductive copper plate, the setting of plating folder T type connectors should cause conductive copper plate just to correspond to
It is pressed in conductive copper rail elongated slot.
Copper rail binding post is equally spacedly fixed in conductive copper rail, and copper rail is fixed on swab case bottom by the way that support side is logical
Face.
During running, conductive copper rail 1 scribbles one layer of conductive paste with the surface that conductive copper plate 4 is contacted.
Claims (4)
1. a kind of conductive copper rail device of Full-automatic vertical continuous plating line, it is characterized in that including：
One swab case (2), is elongated channel-shaped；
One conductive copper rail (1), for long rectangular strip, top surface is provided with elongated slot along major axis, be fixed with the copper rail of at least one sideways connects
Line terminals (3), bottom surface are then fixed in the middle of the swab case groove floor；
The one T-shaped connector (5) of plating folder, montant is pressed from both sides provided with plating, and one end of cross bar is provided with two and transversely arranged vertical led
Xiang Kong；
One conductive copper plate (4), is provided with 2 perpendicular screwed holes corresponding to the T-shaped connector cross bar one end vertically-guided hole of plating folder；
Two leads (6), upper end provided with bulge loop, stage casing be slidably matched T-shaped connector (5) cross bar of plating folder vertically-guided hole,
Bottom is the thread head for coordinating copper billet perpendicular screwed hole；
One tensioning spring (7)；
Described lead initially passes through the vertically-guided hole of the T-shaped connector cross bar one end of plating folder, pierces into tensioning again from top to bottom
Spring, the perpendicular screwed hole for being finally screwed into conductive copper plate, the setting of the T-shaped connector of plating folder should cause conductive copper plate just to correspond to
It is pressed in the conductive copper rail elongated slot.
2. the conductive copper rail device of Full-automatic vertical continuous plating line according to claim 1, it is characterized in that：Described guiding
The bulge loop top of post is drilled with axial threaded hole, is screwed with nut, is connected to wire and is connected on T-shaped connector (5) montant of plating folder
Plating folder.
3. the conductive copper rail device of Full-automatic vertical continuous plating line according to claim 2, it is characterized in that：Described copper rail
Binding post has 2, is equally spacedly fixed in the conductive copper rail.
4. the conductive copper rail device of Full-automatic vertical continuous plating line according to claim 3, it is characterized in that：Described copper rail
The swab case bottom surface is fixed on by the way that support side is logical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710505783.2A CN107268064A (en) | 2017-06-28 | 2017-06-28 | A kind of conductive copper rail device of Full-automatic vertical continuous plating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710505783.2A CN107268064A (en) | 2017-06-28 | 2017-06-28 | A kind of conductive copper rail device of Full-automatic vertical continuous plating line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107268064A true CN107268064A (en) | 2017-10-20 |
Family
ID=60071088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710505783.2A Withdrawn CN107268064A (en) | 2017-06-28 | 2017-06-28 | A kind of conductive copper rail device of Full-automatic vertical continuous plating line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107268064A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN113445110A (en) * | 2021-07-08 | 2021-09-28 | 深圳远荣智能制造股份有限公司 | Gantry type full-automatic anodic oxidation production line and method |
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| US4898657A (en) * | 1988-07-07 | 1990-02-06 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces |
| CN103741196A (en) * | 2013-12-13 | 2014-04-23 | 广州明毅电子机械有限公司 | Automatic vertical continuous electroplating line main transmission device |
| CN104451846A (en) * | 2014-11-20 | 2015-03-25 | 东莞市鸿展机电设备有限公司 | Vertical continuous electroplating device |
| CN204434754U (en) * | 2015-02-06 | 2015-07-01 | 苏州创峰光电科技有限公司 | A kind of electroplating clamp electric installation |
| CN104790022A (en) * | 2015-04-27 | 2015-07-22 | 栾善东 | Novel full-automatic vertical and continuous electroplating device for PCB |
| CN204550770U (en) * | 2015-02-12 | 2015-08-12 | 昆山竞铭机械有限公司 | A kind of Electropolating hangers with high conduction performance |
| CN104947171A (en) * | 2015-06-29 | 2015-09-30 | 东莞市开美电路板设备有限公司 | Cathode hanging frame for circuit board electroplating |
| CN204849102U (en) * | 2015-08-18 | 2015-12-09 | 昆山科比精工设备有限公司 | Perpendicular continuous type electro -coppering equipment |
| CN204982125U (en) * | 2015-08-24 | 2016-01-20 | 黄海 | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB |
| CN206345937U (en) * | 2016-12-23 | 2017-07-21 | 广东成功自动化设备有限公司 | A kind of conductive mechanism for being used to electroplate pcb board |
| CN206970731U (en) * | 2017-06-28 | 2018-02-06 | 广州明毅电子机械有限公司 | A kind of Full-automatic vertical continuous plating line conduction copper rail device |
-
2017
- 2017-06-28 CN CN201710505783.2A patent/CN107268064A/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4898657A (en) * | 1988-07-07 | 1990-02-06 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces |
| CN103741196A (en) * | 2013-12-13 | 2014-04-23 | 广州明毅电子机械有限公司 | Automatic vertical continuous electroplating line main transmission device |
| CN104451846A (en) * | 2014-11-20 | 2015-03-25 | 东莞市鸿展机电设备有限公司 | Vertical continuous electroplating device |
| CN204434754U (en) * | 2015-02-06 | 2015-07-01 | 苏州创峰光电科技有限公司 | A kind of electroplating clamp electric installation |
| CN204550770U (en) * | 2015-02-12 | 2015-08-12 | 昆山竞铭机械有限公司 | A kind of Electropolating hangers with high conduction performance |
| CN104790022A (en) * | 2015-04-27 | 2015-07-22 | 栾善东 | Novel full-automatic vertical and continuous electroplating device for PCB |
| CN104947171A (en) * | 2015-06-29 | 2015-09-30 | 东莞市开美电路板设备有限公司 | Cathode hanging frame for circuit board electroplating |
| CN204849102U (en) * | 2015-08-18 | 2015-12-09 | 昆山科比精工设备有限公司 | Perpendicular continuous type electro -coppering equipment |
| CN204982125U (en) * | 2015-08-24 | 2016-01-20 | 黄海 | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB |
| CN206345937U (en) * | 2016-12-23 | 2017-07-21 | 广东成功自动化设备有限公司 | A kind of conductive mechanism for being used to electroplate pcb board |
| CN206970731U (en) * | 2017-06-28 | 2018-02-06 | 广州明毅电子机械有限公司 | A kind of Full-automatic vertical continuous plating line conduction copper rail device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN110760918B (en) * | 2019-11-29 | 2022-02-18 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN113445110A (en) * | 2021-07-08 | 2021-09-28 | 深圳远荣智能制造股份有限公司 | Gantry type full-automatic anodic oxidation production line and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171020 |