CN107119308A - A kind of electroplating device - Google Patents
A kind of electroplating device Download PDFInfo
- Publication number
- CN107119308A CN107119308A CN201710457164.0A CN201710457164A CN107119308A CN 107119308 A CN107119308 A CN 107119308A CN 201710457164 A CN201710457164 A CN 201710457164A CN 107119308 A CN107119308 A CN 107119308A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- power supply
- supply module
- module
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 61
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 claims abstract description 41
- 230000000712 assembly Effects 0.000 claims abstract description 30
- 238000000429 assembly Methods 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000020004 porter Nutrition 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of electroplating device, electroplating bath, hanger mechanism and some plating modules including being equipped with electroplate liquid, the hanger mechanism is located at the top of the electroplating bath, the plating module includes power supply module, anode assemblies and cathode assembly, the input of power supply module is connected with external power source, and the electric current of cathode output end and cathode output end is controlled by internal control assembly；Anode assemblies are electrically connected with the cathode output end of the power supply module；Cathode assembly is electrically connected with the cathode output end of the power supply module, and lower end is electrically connected with workpiece；The anode assemblies and the cathode assembly are connected with the hanger mechanism respectively.Each plating module can be controlled for the electroplating process of the workpiece each connected, the limitation of the specification and quantity of workpiece is no longer influenced by during plating, using flexible, the corresponding plating module of workpiece that can also be directly to scrapping is adjusted, it is to avoid batch workpiece is scrapped.
Description
Technical field
The present invention relates to the technical field of plating, more particularly to a kind of electroplating device.
Background technology
On the overhead traveling crane that current electroplating device generally comprises electroplating bath, frame and run along frame in plating stage, overhead traveling crane
Hanger is set, and workpiece to be electroplated is moved by hanger.Electroplate liquid and anode are equipped with electroplating bath, in plating, hanger meeting
Connected, then connected with workpiece with the negative pole of power supply by connecting line so that workpiece turns into negative electrode.Such a electroplating device needs to hang
By defined spacing workpiece placed side by side on tool, and three workpiece are one group, and the specification of the workpiece of same batch processing will be kept
Unanimously, with influence of the edge effect to electroplating effect when reducing workpiece plating.In addition, for the equipment of batch plating,
The workpiece of plating, which has to reach, could start plating during certain quantity, current density and design load difference be too during electroplating
Greatly, electroplating effect is influenceed.Therefore, such a electroplating device can only electroplate same rule in batches after piece count reaches certain amount
The workpiece of lattice, it is impossible to be adjusted to single workpiece, very flexible, and there is larger batch workpiece and scrap hidden danger.
The content of the invention
It is an object of the invention to propose a kind of electroplating device, the electroplating process of each workpiece can individually be controlled,
Do not limited by the specification and number of workpiece, and avoid batch workpiece from scrapping.
For up to this purpose, the present invention uses following technical scheme：
A kind of electroplating device, including it is equipped with the electroplating bath of electroplate liquid, hanger mechanism and some plating modules, the hanger
Mechanism is located at the top of the electroplating bath, and the plating module includes：Power supply module, anode assemblies and cathode assembly, power supply group
The input of part is connected with external power source, and the electric current of cathode output end and cathode output end is controlled by internal control assembly；
Anode assemblies are electrically connected with the cathode output end of the power supply module；The cathode output end electricity of cathode assembly and the power supply module
Connection, lower end is electrically connected with workpiece；The anode assemblies and the cathode assembly are connected with the hanger mechanism respectively.
Wherein, the quantity of the cathode assembly is one, and the quantity of the anode assemblies is two, and is located at respectively described
The both sides of cathode assembly.
Wherein, power supply module includes two cathode output ends and a cathode output end, the output of each cathode output end
Electric current independent control, and an anode assemblies are connected respectively.
Wherein, the hanger mechanism includes rack rail, travel mechanism and lifting parts, and the rack rail is located at the electricity
The top of coating bath, the top of the lifting parts is connected with the rack rail by travel mechanism and moved along the rack rail
It is dynamic, anode lifting mechanism and negative electrode hoisting mechanism, the anode lifting mechanism and the anode unit are provided with the lifting parts
Part is connected, and the negative electrode hoisting mechanism is connected with the cathode assembly.
Wherein, the electric connection line connected with external power source, the input of the power supply module are disposed with along the rack rail
End is connected by conduction brush with the electric connection line.
Wherein, the control assembly of the power supply module includes microprocessor and the rectification mould being connected with the microprocessor
Group, the input of the rectification module is connected with the conduction brush, and the microprocessor is also dynamic with the travel mechanism respectively
The power part electrical connection of power part, the power part of the anode lifting mechanism and the negative electrode hoisting mechanism.
Wherein, the power supply module also includes wireless communication module, the wireless communication module and microprocessor electricity
Connection.
Wherein, the bottom of the lifting parts is fixed with fender bracket, and the fender bracket surround what is be connected with the cathode assembly
Workpiece setting.
Beneficial effect：The invention provides a kind of electroplating device, including be equipped with the electroplating bath of electroplate liquid, hanger mechanism and
Some plating modules, the hanger mechanism is located at the top of the electroplating bath, and the plating module includes：Power supply module, anode
Component and cathode assembly, the input of power supply module are connected with external power source, control positive pole to export by internal control assembly
End and the electric current of cathode output end；Anode assemblies are electrically connected with the cathode output end of the power supply module；Cathode assembly with it is described
The cathode output end electrical connection of power supply module, lower end is electrically connected with workpiece；The anode assemblies and the cathode assembly respectively with
The hanger mechanism connection.Electroplating device be integrated with electroplating process by electroplating module required for power supply module, anode assemblies
And cathode assembly, and each plating module connects a workpiece to be electroplated.In plating, by hanger mechanism by anode assemblies
Bottom and the workpiece that is connected with cathode assembly be put into the electroplate liquid of electroplating bath, each plating module can be directly against each
The electroplating process of the workpiece connected is controlled, mainly the size of control electric current, and electroplating process is entered according to each workpiece
Row adjustment.When needing high-volume to electroplate, electroplating device can be arranged as required to some plating modules, can to each workpiece
Individually it is precisely controlled, is no longer rely on the spacing of each workpiece to ensure the uniformity of electric current.It therefore, there is no need to keep same batch
The specification of workpiece must be consistent, it is not required that three one group of workpiece formation, it is not required that the quantity of workpiece, which is met, to be required to come
Ensure current density.That is, plating when be no longer influenced by workpiece specification and quantity limitation, can also be directly to report using flexible
The corresponding plating module of useless workpiece is adjusted, it is to avoid batch workpiece is scrapped.
Brief description of the drawings
Fig. 1 is the structural representation for the electroplating device that the present invention is provided.
Wherein：
1- electroplating baths, 2- hangers mechanism, 21- rack rails, 22- travel mechanisms, 23- lifting parts, 231- anode hoisters
Structure, 232- negative electrode hoisting mechanisms, 3- plating modules, 31- power supply modules, 311- conduction brush, 32- anode assemblies, 33- cathode sets
Part, 4- workpiece.
Embodiment
For make present invention solves the technical problem that, the technical scheme that uses and the technique effect that reaches it is clearer, below
Technical scheme is further illustrated with reference to accompanying drawing and by embodiment.
As shown in figure 1, the invention provides a kind of electroplating device, including it is equipped with the electroplating bath 1 of electroplate liquid, hanger mechanism
2 and it is some plating module 3.Hanger mechanism 2 is located at the top of electroplating bath 1, and plating module 3 includes power supply module 31, anode assemblies
32 and cathode assembly 33.The input of power supply module 31 is connected with external power source, and controls positive pole by internal control assembly
The electric current of output end and cathode output end.Anode assemblies 32 are electrically connected with the cathode output end of power supply module.Cathode assembly 33 with
The cathode output end electrical connection of power supply module, lower end is electrically connected with workpiece 4.Anode assemblies 32 and cathode assembly 33 respectively with hanger
Mechanism 2 is connected.Specifically, cathode assembly 33 can be electrically connected by certain fixture or hanger etc. with workpiece 4, and to work
Part 4 is fixed.
The electroplating device of the present invention be integrated with electroplating process by electroplating module 3 required for power supply module 31, anode unit
Part 32 and cathode assembly 33, cathode assembly 33 connect workpiece 4 to be electroplated.In plating, by hanger mechanism 2 by anode assemblies
32 bottom and the workpiece 4 being connected with cathode assembly 33 are put into the electroplate liquid of electroplating bath 1, and each plating module 3 can be direct
It is controlled for the electroplating process of each connected workpiece 4, mainly the size of control electric current, according to each 4 pairs of workpiece
Electroplating process is adjusted.When needing high-volume to electroplate, electroplating device can be arranged as required to some plating modules 3, right
Each workpiece 4 can be individually precisely controlled, and be no longer rely on the spacing of each workpiece 4 to ensure the uniformity of electric current.Therefore, it is not required to
Keeping the specification of the workpiece 4 of same batch must be consistent, it is not required that three one group of formation of workpiece 4, it is not required that workpiece 4
Quantity meet and require to ensure current density.That is, plating when be no longer influenced by workpiece specification and quantity limitation, use spirit
Living, the corresponding plating module 3 of workpiece 4 that can also be directly to scrapping is adjusted, it is to avoid the batch of workpiece 4 is scrapped.
The quantity of the cathode assembly 33 of the present invention can be one, and the quantity of anode assemblies 32 can be two, and two
Anode assemblies 32 are located at the both sides of cathode assembly 33 respectively.Specifically, the obverse and reverse of workpiece 4 corresponds to an anode respectively
Component 32.Such a structure is conducive to the stabilization of the obverse and reverse electroplating current of workpiece 4, especially when electroplating device is provided with many
When individual plating module 3 is electroplated to respective workpiece 4 respectively, influence of other plating modules to workpiece 4 can be avoided.For two
For individual anode assemblies 32, two cathode output ends, the output current of each cathode output end can be set in power supply module 31
Independent control, and an anode assemblies 32 are connected respectively.Two anode assemblies 32 of electric current independent control can adjust work respectively
The plating conditions of the both sides of part 4, are further precisely controlled, and obtain more preferable electroplating effect.
The hanger mechanism 2 of the present invention includes rack rail 21, travel mechanism 22 and lifting parts 23, and rack rail 21 is located at electricity
The top of coating bath 1, the top of lifting parts 23 is connected with rack rail 21 by travel mechanism 22 and moved along rack rail 21, is carried
Anode lifting mechanism 231 and negative electrode hoisting mechanism 232 are provided with ascending part 23, anode lifting mechanism 231 connects with anode assemblies 32
Connect, negative electrode hoisting mechanism 232 is connected with cathode assembly 33.It can be passed through by travel mechanism 22 with the position in movable lifting portion 23
Anode lifting mechanism 231 and negative electrode hoisting mechanism 232 in lifting parts 23 can control anode assemblies 32 and cathode assembly respectively
33 height, therefore, passes through whole hanger mechanism 2, it is possible to achieve the movement and lifting of anode assemblies 32 and workpiece 4, completes electricity
To the carrying of workpiece 4 during plating.
In order to introduce electric energy during plating and required for porter's workpiece 4, electroplating device along rack rail 21 be disposed with
The electric connection line of external power source connection, the input of power supply module 31 is connected by conduction brush 311 with electric connection line, to ensure
When being moved to different positions, it can obtain electric energy and complete corresponding plating or handling process.
The control assembly of the power supply module 31 of the present invention includes microprocessor and the rectification module being connected with microprocessor, whole
The input of stream module is connected with conduction brush 311, power part, the anode hoister of microprocessor also respectively with travel mechanism 22
The power part electrical connection of the power part and negative electrode hoisting mechanism 232 of structure 231.Pass through the electricity of microprocessor individually to workpiece 4
When the handling process of plating process sum is controlled, it can be adjusted for different workpiece 4.The electricity laid along rack rail 21
The resistance of connecting line is in different positions and differs, and power supply module 31 and workpiece 4 are kept into independent control, common mobile
When, the resistance between power supply module 31 and workpiece 4 keeps constant, can avoid the resistance variations of electric connection line to electroplating current
Influence, can improve translational speed during plating.
The power supply module of the present invention can also set wireless communication module, and wireless communication module is electrically connected with microprocessor,
One control centre is set in electroplating workshop again, connected by wireless communication module with the wireless communication module on each plating module
Connect, and then pass through the electro-plating situation of each workpiece 4 of each microprocessor control.
In order to improve the protection to workpiece 4, it is to avoid inwall when workpiece 4 is moved with cathode assembly 33 with electroplating bath 1 is scraped,
Fender bracket can be fixed in the bottom of lifting parts 23, fender bracket is set around the workpiece 4 being connected with cathode assembly 33, fender bracket 23
Plating module and workpiece 4 is followed to move, it is to avoid workpiece 4 is scraped by collision.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Limitation.
Claims (8)
1. a kind of electroplating device, it is characterised in that electroplating bath (1), hanger mechanism (2) and some electricity including being equipped with electroplate liquid
Module (3) is plated, the hanger mechanism (2) is located at the top of the electroplating bath (1), and the plating module (3) includes：
Power supply module (31), its input is connected with external power source, and cathode output end is controlled and negative by internal control assembly
The electric current of pole output end；
Anode assemblies (32), are electrically connected with the cathode output end of the power supply module (31)；
Cathode assembly (33), is electrically connected with the cathode output end of the power supply module (31), and lower end is electrically connected with workpiece (4)；Institute
Anode assemblies (32) and the cathode assembly (33) is stated to be connected with the hanger mechanism (2) respectively.
2. electroplating device as claimed in claim 1, it is characterised in that the quantity of the cathode assembly (33) is one, described
The quantity of anode assemblies (32) is two, and is located at the both sides of the cathode assembly (33) respectively.
3. electroplating device as claimed in claim 2, it is characterised in that it is defeated that the power supply module (31) includes two positive poles
Go out end, the output current independent control of each cathode output end, and connect an anode assemblies (32) respectively.
4. the electroplating device as described in claim any one of 1-3, it is characterised in that the hanger mechanism (2) includes frame rail
Road (21), travel mechanism (22) and lifting parts (23), the rack rail (21) are located at the top of the electroplating bath (1), described
The top of lifting parts (23) is connected with the rack rail (21) by travel mechanism (22) and moved along the rack rail (21)
It is dynamic, it is provided with anode lifting mechanism (231) and negative electrode hoisting mechanism (232), the anode hoister in the lifting parts (23)
Structure (231) is connected with the anode assemblies (32), and the negative electrode hoisting mechanism (232) is connected with the cathode assembly (33).
5. electroplating device as claimed in claim 4, it is characterised in that be disposed with and external power source along the rack rail (21)
The electric connection line of connection, the input of the power supply module (31) is connected by conduction brush (311) with the electric connection line.
6. electroplating device as claimed in claim 5, it is characterised in that the control assembly of the power supply module (31) includes micro- place
Reason device and the rectification module being connected with the microprocessor, the input of the rectification module are connected with the conduction brush (311),
Power part, the power part of the anode lifting mechanism (231) of the microprocessor also respectively with the travel mechanism (22)
The power part electrical connection of part and the negative electrode hoisting mechanism (232).
7. electroplating device as claimed in claim 6, it is characterised in that the power supply module (31) also includes radio communication mold
Block, the wireless communication module is electrically connected with the microprocessor.
8. electroplating device as claimed in claim 7, it is characterised in that the bottom of the lifting parts (23) is fixed with fender bracket,
The fender bracket is set around the workpiece (4) being connected with the cathode assembly (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710457164.0A CN107119308A (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710457164.0A CN107119308A (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107119308A true CN107119308A (en) | 2017-09-01 |
Family
ID=59718990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710457164.0A Pending CN107119308A (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN107119308A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866615A (en) * | 2018-09-07 | 2018-11-23 | 东莞市丰卓自动化科技有限公司 | The electroplating device intelligent control method of the free mixture manufacturing of different product |
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002030492A (en) * | 2000-07-21 | 2002-01-31 | Saginomiya Seisakusho Inc | Electroplating apparatus |
| CN201971916U (en) * | 2011-01-10 | 2011-09-14 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for thin printed circuit board |
| CN105278550A (en) * | 2014-07-26 | 2016-01-27 | 西安众智惠泽光电科技有限公司 | Method for remotely controlling electroplating travelling crane |
| CN105350062A (en) * | 2015-12-07 | 2016-02-24 | 依力柏电能有限公司 | Electroplating device |
| CN106149039A (en) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | electroplating device |
| CN207079293U (en) * | 2017-06-16 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
-
2017
- 2017-06-16 CN CN201710457164.0A patent/CN107119308A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002030492A (en) * | 2000-07-21 | 2002-01-31 | Saginomiya Seisakusho Inc | Electroplating apparatus |
| CN201971916U (en) * | 2011-01-10 | 2011-09-14 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for thin printed circuit board |
| CN105278550A (en) * | 2014-07-26 | 2016-01-27 | 西安众智惠泽光电科技有限公司 | Method for remotely controlling electroplating travelling crane |
| CN106149039A (en) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | electroplating device |
| CN105350062A (en) * | 2015-12-07 | 2016-02-24 | 依力柏电能有限公司 | Electroplating device |
| CN207079293U (en) * | 2017-06-16 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866615A (en) * | 2018-09-07 | 2018-11-23 | 东莞市丰卓自动化科技有限公司 | The electroplating device intelligent control method of the free mixture manufacturing of different product |
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN110760918B (en) * | 2019-11-29 | 2022-02-18 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
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| PB01 | Publication | ||
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Application publication date: 20170901 |