CN106149039A - electroplating device - Google Patents
electroplating device Download PDFInfo
- Publication number
- CN106149039A CN106149039A CN201510161517.3A CN201510161517A CN106149039A CN 106149039 A CN106149039 A CN 106149039A CN 201510161517 A CN201510161517 A CN 201510161517A CN 106149039 A CN106149039 A CN 106149039A
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- China
- Prior art keywords
- power supply
- supply unit
- anode
- conductor
- shunting
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Abstract
The open a kind of electroplating device of the present invention, including main power source supply, multiple movable hanging frame group and first anode electric-conductor.Multiple movable hanging frame groups are in order to drive multiple plated body continuous moving, each movable hanging frame group includes hanger and is electrically connected with the shunting power supply unit of main power source supply, hanger includes contact site and in order to clamp the clamping part of plated body, wherein shunting power supply unit connects clamping part with negative electrode, and connects contact site with anode；First anode electric-conductor is electrically connected with multiple plated materials, and each movable hanging frame group keeps being electrically connected with and moving along first anode electric-conductor by contact site and first anode electric-conductor.Plurality of plated body is assigned to identical cathode current by each shunting power supply unit, and multiple plated material shares the anode of each shunting power supply unit by first anode electric-conductor.
Description
Technical field
The present invention relates to a kind of electroplating device, a kind of plating that each plated body is provided independent cathode current
Equipment.
Background technology
In the manufacture process of printed circuit board (PCB), need to form the conductive path between substrate via electroplating process, then enter
Row sequent surface processes, so that printed circuit board (PCB) is able to molding.As it is shown in figure 1, general printed circuit board (PCB) is fixed
Electroplating device 80, is that the plated material B connecting power supply unit 81 anode is arranged on electroplating bath 82 in design
Both sides, and by connect power supply unit 81 negative electrode plated body A insert the both sides plated material B in electroplating bath 82
Between, make plated body A keep stationary state；Afterwards by the electric current output state of control power supply unit 81, make
Can must be deposited on plated body A from the metal ion of plated material B.
And the basic setup of the power supply unit 81 for this fixed electroplating device 80, it is by all plated body A
It is fixed on same the conducting copper 83 having connected negative electrode, and all plated material B is fixed on same and is connected to
The conducting copper 84 of same anode, then controlled Current Output Power to perform electroplating process by power supply unit 81.
Another kind of continuous-moving type electroplating device 90, as shown in Figures 2 and 3, in design with aforementioned fixed electricity
Coating apparatus is similar, and difference is that continuous-moving type electroplating device 90 is can be relative in electroplating bath 92 by plated body A
Plated material B continuous moving.The moving member 93 of each clamping plated body A can be by sliding part 931 along conductive copper
Row 94 slip, and moving member 93 is electrically connected with the negative electrode of power supply unit 91 so that plated body A and conducting copper
94 all band negative electrodes are electric.Multiple plated material B are then divided into zones of different, and each region is electrically connected with power supply unit
The different anodes of 91.
And the setting of the power supply unit 91 for this continuous-moving type electroplating device 90, it is by all plated body A mats
Connected identical negative electrode by conducting copper 94 and make it along a direction continuous moving in electroplating bath 92, and by all electricity
Plating material B fixes but connects different anodes, then is controlled Current Output Power to perform plating by power supply unit 91
Processing procedure.
Regardless of whether any one control mode aforementioned, all plated bodies are all to share identical negative electrode, so work as plated body originally
When body electric conductivity is variant, different plated bodies mutually can be robbed electricity and cause between plated body unequal by electricity, affect plated
The uniformity of coating film thickness on thing.
Summary of the invention
The main object of the present invention is to provide a kind of electroplating device that each material to be plated provides independent cathode current,
To solve the shortcoming that the electroplating device of known common cathode electric current easily produces thickness of coating inequality to plated body.
For reaching above-mentioned purpose, electroplating device includes that main power source supply, multiple movable hanging frame group and the first anode are led
Electricity part.Multiple movable hanging frame groups are in order to drive multiple plated body continuous moving, and each movable hanging frame group includes hanger and combination
The shunting power supply unit of hanger, hanger includes contact site and in order to clamp the clamping part of plated body, and shunting power supply supplies
Device is answered to be electrically connected with main power source supply；Wherein shunting power supply unit connects clamping part with negative electrode, and connects with anode
Contact site.First anode electric-conductor is electrically connected with multiple plated materials, and the most each movable hanging frame group is by contact site and the
One anode conducting part keeps being electrically connected with and moving along first anode electric-conductor.Plurality of plated body is by multiple shiftings
Each shunting power supply unit of dynamic hanger group is assigned to identical cathode current, and multiple plated material is by the first anode
Electric-conductor shares the anode of each shunting power supply unit.
Further include at least one second plate electric-conductor, at least one second plate electric-conductor in order to arrange multiple plated material,
And each plated material is electrically connected with first anode electric-conductor by least one second plate electric-conductor.
Shunting power supply unit includes controlled in wireless module, in order to accept wireless control signal to control power supply output.
Electroplating device further includes conductive component, and main power source supply is electrically connected to each shunting power supply by conductive component and supplies
Answer device, in order to be transmitted to each shunting power supply unit through conductive component by DC source.
Each shunting power supply unit further includes sliding part, and sliding part is formed with conductive component and is slidably connected.
Contact site is at least one slide assemblies.
The output voltage of main power source supply is more than the output voltage of each shunting power supply unit.
Thereby designing, each plated body individually can be controlled by independent shunting power supply unit so that each plated body
There is identical cathode current, improve the plated film uniformity of plated body.
Accompanying drawing explanation
Fig. 1 is the sectional view of known fixed electroplating device.
Fig. 2 is the sectional view of known continuous way electroplating device.
Fig. 3 is the top view of known continuous way electroplating device.
Fig. 4 is the main power source supply composition schematic diagram with multiple movable hanging frame groups of electroplating device.
Fig. 5 is the sectional view of electroplating device.
Fig. 6 is the top view of electroplating device.
Symbol description:
Electroplating device 1
Main power source supply 10
Movable hanging frame group 20
Hanger 21
Contact site 211
Clamping part 212
Shunting power supply unit 22
Controlled in wireless module 221
Negative electrode 222
Anode 223
Sliding part 224
First anode electric-conductor 30
Second plate electric-conductor 40
Electroplating bath 50
Conductive component 60
Plated body A
Plated material B
Direction initialization L
(known techniques)
Fixed electroplating device 80
Power supply unit 81
Electroplating bath 82
Conducting copper 83
Conducting copper 84
Continuous-moving type electroplating device 90
Power supply unit 91
Electroplating bath 92
Moving member 93
Sliding part 931
Conducting copper 94
Plated body A
Plated material B
Direction initialization L
Detailed description of the invention
For the above and other objects, features and advantages of the application can be become apparent, cited below particularly go out the present invention
Specific embodiment, and coordinate institute's accompanying drawings, it is described in detail below.
Hereinafter please refer to Fig. 4.As shown in Figure 4, electroplating device 1 includes main power source supply 10 and multiple movement
Hanger group 20.Main power source supply 10 in order to be converted into DC source by alternating current power supply, and is exported extremely by DC source
Multiple movable hanging frame group 20 is for subsequent applications.Multiple movable hanging frame group 20 sequential, and can driven device
(such as motor etc., not shown) drive with along a direction initialization L continuous moving.
Each movable hanging frame group 20 includes hanger 21 and shunting power supply unit 22, and shunting power supply unit 22 combines
In hanger 21.Main power source supply 10 is electrically connected with the shunting power supply unit 22 of each movable hanging frame group 20, with mat
Less output electric current is obtained by each shunting power supply unit 22.In one embodiment of this invention, main power source supply
10 DC sources that high-tension alternating current power supply can be converted into low voltage, then through output distribution to each shunting power supply
Supply 22, so that respectively shunting power supply unit 22 obtains less output DC source, but aforementioned DC source sets
Meter is not limited with the present embodiment.
It is noted that the quantity of movable hanging frame group 20 increases and decreases depending on plating demand and instrument size；And hang when mobile
When the quantity of frame group 20 is more, also can optionally increase the number of main power source supply 10 arranging of electroplating device 1
Amount, with the shunting power supply unit 22 in response to distribution out-put supply to multiple movable hanging frame groups 20.
In the present embodiment, shunting power supply unit 22 includes controlled in wireless module 221.Controlled in wireless module 221
In order to accept from extraneous wireless control signal, and export with the power supply of control own according to this wireless control signal.This
Place's controlled in wireless module 221 can use bluetooth module, infrared ray module, Wi-Fi module, 3G/4G network communication mould
Group or the controlled in wireless module of other tool transmission of wireless signals functions.Therefore, user is mechanical, electrical by remote controller, hands
Brain equal controller, just can export at the power supply of the shunting power supply unit 22 that far-end controls each movable hanging frame group 20,
Reach the effect immediately controlled, and increase operation ease.
Below please also refer to Fig. 5 and Fig. 6.As shown in Figures 5 and 6, electroplating device 1 further includes the first anode and leads
Electricity part 30, and first anode electric-conductor 30 is electrically connected with multiple plated material B.The hanger of each movable hanging frame group 20
21 include contact site 211 and clamping part 212.Contact site 211 is in order to keep electrically connecting with first anode electric-conductor 30
Connect, and make hanger 21 can move along first anode electric-conductor 30.In the present embodiment, first anode electric-conductor 30
Being to use an anode copper bar, contact site 211 is to use at least one slide assemblies, and such as roller group etc., by slip
Assembly is combined slidably with anode copper bar so that hanger 21 not only can be relatively stable and smoothly by contact site 211
Move along first anode electric-conductor 30, can ensure that again the electric connection of contact site 211 and first anode electric-conductor 30,
But the design of contact site 211 is not limited.
Clamping part 212 is in order to clamp plated body A so that when movable hanging frame group 20 moves, and can drive plated body A mono-
And it is mobile.In the present embodiment, clamping part 212 is to use at least one clamping piece, such as metal clip etc., by manually
Or electronic mode clamps or gets loose plated body A.
The shunting power supply unit 22 of each movable hanging frame group 20 includes negative electrode 222 and anode 223.Wherein shunt electricity
The negative electrode 222 of source supply 22 is electrically connected with clamping part 212, and the anode 223 of shunting power supply unit 22 is even
Connect contact site 211.Thereby, the negative electrode 222 energy output cathode electric current of shunting power supply unit 22 is to clamping part 212
Clamped plated body A so that plated body A band negative electrode electric charge；Shunt the anode 223 of power supply unit 22 then
It is electrically connected to first anode electric-conductor 30 so that plated material B band anode electric charge by contact site 211.
In one embodiment of this invention, electroplating device 1 further includes at least one second plate electric-conductor 40, in order to do
For the electric connection medium between first anode electric-conductor 30 and multiple plated material B.It is to say, at least one
Two anode conducting parts 40 can in order to arrange multiple plated material B, and each plated material B also can by least one second sun
Pole electric-conductor 40 is electrically connected with first anode electric-conductor 30.At least one second plate electric-conductor 40 is employing two herein
Prop up anode copper bar, be separately positioned on the both sides of electroplating bath 50, and every anode copper bar is all for arranging multiple plated material B.
It is noted that at least one second plate electric-conductor 40 quantity is set and pattern is not limited.
Thereby, the negative electrode 222 of each shunting power supply unit 22 can independent output cathode electric current to clamping part 212 right
The plated body A that should clamp, say, that each plated body A can correspond to an independent shunting power supply unit
22；The anode 223 respectively shunting power supply unit 22 is then electrically connected to first anode conduction by contact site 211
Part 30, forms the effect of each anode 223 parallel connection, so that anode 223 forms common anode loop.
As shown in Figures 5 and 6, in the present embodiment, electroplating device 1 further includes conductive component 60.This conduction group
Part 60 is the conduction matchmaker shunted between power supply unit 22 as main power source supply 10 and each movable hanging frame group 20
It is situated between, in order to each movable hanging frame group 20 remains to and main power source supply 10 when moving relative to main power source supply 10
Keep being electrically connected with.Main power source supply 10 is electrically connected to each shunting power supply unit 22 by conductive component 60,
DC source in order to be exported by main power source supply 10 transmits to each shunting power supply unit through conductive component 60
22。
In design, conductive component 60 includes two conducting coppers, connects the anode of main power source supply 10 respectively
DC terminal and negative electrode RTN terminal；And respectively shunt power supply unit 22 and further include sliding part 224, sliding part 224
Can be formed with two conducting coppers respectively with the collar, snap fit or other conductive slide constructions etc. and be slidably connected,
Make each movable hanging frame group 20 still can keep being electrically connected with main power source supply 10 in moving process, but this
Bright it is not limited.
When reality performs electroplating process, electroplating device 1 can drive multiple movable hanging frame group 20 to lead along the first anode
Electricity part 30 is towards direction initialization L continuous moving；Each multiple plated body A clamped by the most each movable hanging frame group 20 can quilt
Drive, and continuous moving between multiple plated material B of electroplating bath 50 both sides.Certainly, each shunting power supply supply
Device 22 also can be driven by each movable hanging frame group 20 and with continuous moving.Electricity by each shunting power supply unit 22
Source exports, and each plated material B can become anode, and each plated body A can become negative electrode.
Owing to each movable hanging frame group 20 all has independent shunting power supply unit 22 so that each plated body A can be by
Corresponding shunting power supply unit 22 individually controls so that it is can be assigned to identical and stable cathode current, will not be because of quilt
It is likely to be of conductivity difference between plating thing A and causes by electricity unequal；Multiple plated material B are then by the first sun
Pole electric-conductor 30 shares the anode of each shunting power supply unit 22, forms same anode loop.
Thereby, the cathode current assigned by each plated body A is identical, can keep its coating when performing plating
The uniformity of thickness, the shortcoming being greatly improved known electroplating device.User also can be by remote control unit immediately monitoring
The state of electroplating device, to guarantee yield and the effect of electroplating process.
To sum up institute is old, and the present invention, no matter with regard to purpose, means and effect, all shows that it is totally different in the feature of known techniques.
Only it should be noted that above-mentioned many embodiments are illustrated only for the purposes of explanation, the right model that the present invention is advocated
Enclose from being as the criterion with described in claims, rather than be only limitted to above-described embodiment.
Claims (7)
1. an electroplating device, in order to plate plated material by multiple plated bodies, it is characterised in that this electroplating device bag
Include:
One main power source supply；
Multiple movable hanging frame groups, in order to drive the plurality of plated body continuous moving, respectively this movable hanging frame group includes a hanger
And combine this hanger one shunting power supply unit, this hanger includes a contact site and in order to clamp a folder of this plated body
Hold portion, and this shunting power supply unit is electrically connected with this main power source supply；Wherein this shunting power supply unit is cloudy with one
Pole connects this clamping part, and this shunting power supply unit connects this contact site with an anode；And
One first anode electric-conductor, is electrically connected with multiple plated material；Respectively this movable hanging frame group is by this contact site
Keep being electrically connected with and moving along this first anode electric-conductor with this first anode electric-conductor；
The most the plurality of plated body is assigned to identical the moon by respectively this shunting power supply unit of the plurality of movable hanging frame group
Electrode current, and the plurality of plated material is by this anode of shared respectively this shunting power supply unit of this first anode electric-conductor.
2. electroplating device as claimed in claim 1, it is characterised in that further include at least one second plate electric-conductor,
This at least one second plate electric-conductor in order to arrange the plurality of plated material, and respectively this plated material by this at least one
Two anode conducting parts are electrically connected with this first anode electric-conductor.
3. electroplating device as claimed in claim 1, it is characterised in that wherein this shunting power supply unit includes
Controlled in wireless module, in order to accept a wireless control signal to control power supply output.
4. electroplating device as claimed in claim 1, it is characterised in that further include a conductive component, this main power source
Supply is electrically connected to respectively this shunting power supply unit by this conductive component, in order to by DC source through this conduction group
Part transmits to respectively this shunting power supply unit.
5. electroplating device as claimed in claim 4, it is characterised in that respectively this shunting power supply unit more wraps
Including sliding part, this sliding part is formed with this conductive component and is slidably connected.
6. electroplating device as claimed in claim 1, it is characterised in that wherein this contact site is at least one Slide Group
Part.
7. electroplating device as claimed in claim 1, it is characterised in that the wherein output voltage of this main power source supply
Output voltage more than respectively this shunting power supply unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510161517.3A CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510161517.3A CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106149039A true CN106149039A (en) | 2016-11-23 |
| CN106149039B CN106149039B (en) | 2017-11-24 |
Family
ID=57337839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510161517.3A Active CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106149039B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494561A (en) * | 1993-01-22 | 1996-02-27 | Societe Anonyme Dite Regie Nationale Des Usines Renault | Apparatus for surface treatment by cataphoresis of metal parts, particularly of motor vehicle bodies |
| JP2006037134A (en) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | Current control method for continuous plating device of carrier system |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| KR20100115955A (en) * | 2009-04-21 | 2010-10-29 | 주식회사 티케이씨 | Serial plating system machine rectifeer an electrode plate system |
| CN103031588A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| CN204714932U (en) * | 2015-04-08 | 2015-10-21 | 亚硕企业股份有限公司 | electroplating device |
-
2015
- 2015-04-08 CN CN201510161517.3A patent/CN106149039B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494561A (en) * | 1993-01-22 | 1996-02-27 | Societe Anonyme Dite Regie Nationale Des Usines Renault | Apparatus for surface treatment by cataphoresis of metal parts, particularly of motor vehicle bodies |
| JP2006037134A (en) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | Current control method for continuous plating device of carrier system |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| KR20100115955A (en) * | 2009-04-21 | 2010-10-29 | 주식회사 티케이씨 | Serial plating system machine rectifeer an electrode plate system |
| CN103031588A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| CN204714932U (en) * | 2015-04-08 | 2015-10-21 | 亚硕企业股份有限公司 | electroplating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106149039B (en) | 2017-11-24 |
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