CN204714932U - electroplating device - Google Patents
electroplating device Download PDFInfo
- Publication number
- CN204714932U CN204714932U CN201520205199.1U CN201520205199U CN204714932U CN 204714932 U CN204714932 U CN 204714932U CN 201520205199 U CN201520205199 U CN 201520205199U CN 204714932 U CN204714932 U CN 204714932U
- Authority
- CN
- China
- Prior art keywords
- power supply
- supply unit
- conductor
- anode
- electroplating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of electroplating device, comprises primary source supply, multiple movable hanging frame group and first anode electric-conductor.Multiple movable hanging frame group is in order to drive multiple plated body continuous moving, each movable hanging frame group comprises hanger and is electrically connected the shunting power supply unit of primary source supply, hanger comprises contact part and the clamping part in order to clamp plated body, wherein shunt power supply unit and connect clamping part with negative electrode, and connect contact part with anode; First anode electric-conductor is electrically connected multiple plated material, and each movable hanging frame group keeps being electrically connected by contact part and first anode electric-conductor and moves along first anode electric-conductor.Wherein multiple plated body is assigned to identical cathodic current by each shunting power supply unit, and multiple plated material shares the anode of each shunting power supply unit by first anode electric-conductor.
Description
Technical field
The utility model relates to a kind of electroplating device, particularly a kind of electroplating device each plated body being provided to independent cathodic current.
Background technology
In the manufacturing processed of printed circuit board (PCB), need to form conductive path between substrate via electroplating process, then carry out sequent surface process, shaping to make printed circuit board (PCB) be able to.As shown in Figure 1, the fixed electroplating device 80 of general printed circuit board (PCB), the both sides plated material B connecting power supply unit 81 anode being arranged on plating tank 82 in design, and the plated body A connecting power supply unit 81 negative electrode is inserted between the both sides plated material B in plating tank 82, make plated body A keep stationary state; Afterwards by the electric current output state controlling power supply unit 81, the metal ion from plated material B can be deposited on plated body A.
And the basic setup of power supply unit 81 for this fixed electroplating device 80, that all plated body A are fixed on the conducting copper 83 that same has connected negative electrode, and all plated material B are fixed on same and are connected to the conducting copper 84 of same anode, then control Current Output Power to perform electroplating process by power supply unit 81.
Another kind of continuous-moving type electroplating device 90, as shown in Figures 2 and 3, similar to aforementioned fixed electroplating device in design, difference is that continuous-moving type electroplating device 90 is can relative to plated material B continuous moving in plating tank 92 by plated body A.The moving member 93 of each clamping plated body A can slide along conducting copper 94 by sliding part 931, and moving member 93 is electrically connected the negative electrode of power supply unit 91, makes plated body A and conducting copper 94 all be with cathodic electricity.Multiple plated material B is divided into different zones, and each region is electrically connected the different anodes of power supply unit 91 respectively.
And the setting of power supply unit 91 for this continuous-moving type electroplating device 90, all plated body A are connected identical negative electrode by conducting copper 94 and makes it in plating tank 92 along a direction continuous moving, and fixed by all plated material B but connect different anodes, then control Current Output Power to perform electroplating process by power supply unit 91.
No matter and any one control mode aforementioned, all plated bodies are all shared identical negative electrodes, so when the electroconductibility of plated body own is variant, different plated body mutually can be robbed electricity and cause powered inequality between plated body, affects the homogeneity of coating film thickness on plated body.
Utility model content
The main purpose of the application is to provide a kind of electroplating device each material to be plated being provided to independent cathodic current, easily plated body is produced to the shortcoming of thickness of coating inequality with the electroplating device solving known common cathode electric current.
For reaching above-mentioned object, electroplating device comprises primary source supply, multiple movable hanging frame group and first anode electric-conductor.Multiple movable hanging frame group is in order to drive multiple plated body continuous moving, each movable hanging frame group comprises hanger and the shunting power supply unit in conjunction with hanger, hanger comprises contact part and the clamping part in order to clamp plated body, and shunting power supply unit is electrically connected primary source supply; Wherein shunt power supply unit and connect clamping part with negative electrode, and connect contact part with anode.First anode electric-conductor is electrically connected multiple plated material, and wherein each movable hanging frame group keeps being electrically connected by contact part and first anode electric-conductor and moves along first anode electric-conductor.Wherein multiple plated body is assigned to identical cathodic current by each shunting power supply unit of multiple movable hanging frame group, and multiple plated material shares the anode of each shunting power supply unit by first anode electric-conductor.
More comprise at least one second anode electric-conductor, at least one second anode electric-conductor is in order to arrange multiple plated material, and each plated material is electrically connected first anode electric-conductor by least one second anode electric-conductor.
Shunting power supply unit comprises controlled in wireless module, exports to control power supply in order to accept wireless control signal.
Electroplating device more comprises conductive component, and primary source supply is electrically connected to each shunting power supply unit by conductive component, in order to direct supply is transferred to each shunting power supply unit through conductive component.
Each shunting power supply unit more comprises sliding part, and sliding part is formed with conductive component and is connected slidably.
Contact part is at least one slide assemblies.
The output voltage of primary source supply is greater than the output voltage of each shunting power supply unit.
Design by this, each plated body can control separately by independently shunting power supply unit, makes each plated body have identical cathodic current, improves the plated film homogeneity of plated body.
Accompanying drawing explanation
Fig. 1 is the sectional view of known fixed electroplating device.
Fig. 2 is the sectional view of known continous way electroplating device.
Fig. 3 is the vertical view of known continous way electroplating device.
Fig. 4 is the primary source supply of electroplating device and the composition schematic diagram of multiple movable hanging frame group.
Fig. 5 is the sectional view of electroplating device.
Fig. 6 is the vertical view of electroplating device.
Nomenclature:
Electroplating device 1
Primary source supply 10
Movable hanging frame group 20
Hanger 21
Contact part 211
Clamping part 212
Shunting power supply unit 22
Controlled in wireless module 221
Negative electrode 222
Anode 223
Sliding part 224
First anode electric-conductor 30
Second anode electric-conductor 40
Plating tank 50
Conductive component 60
Plated body A
Plated material B
Direction initialization L (known techniques)
Fixed electroplating device 80
Power supply unit 81
Plating tank 82
Conducting copper 83
Conducting copper 84
Continuous-moving type electroplating device 90
Power supply unit 91
Plating tank 92
Moving member 93
Sliding part 931
Conducting copper 94
Plated body A
Plated material B
Direction initialization L
Embodiment
For the above and other object of the application, feature and advantage can be become apparent, cited below particularly go out the specific embodiment of the application, and coordinate institute's accompanying drawings, be described in detail below.
Below please refer to Fig. 4.As shown in Figure 4, electroplating device 1 comprises primary source supply 10 and multiple movable hanging frame group 20.Direct supply in order to convert AC power to direct supply, and is exported to multiple movable hanging frame group 20 for subsequent applications by primary source supply 10.Multiple movable hanging frame group 20 sequential, and can drive with along a direction initialization L continuous moving by driven device (such as motor etc., figure do not show).
Each movable hanging frame group 20 comprises hanger 21 and shunting power supply unit 22, and shunting power supply unit 22 is incorporated into hanger 21.Primary source supply 10 is electrically connected the shunting power supply unit 22 of each movable hanging frame group 20, to obtain less outward current by each shunting power supply unit 22.In an embodiment of the application, high-tension AC power can be converted to the direct supply of low voltage by primary source supply 10, each shunting power supply unit 22 is dispensed to again through exporting, to make each shunting power supply unit 22 obtain less output direct supply, but the design of aforementioned direct supply is not limited with the present embodiment.
It is noted that the quantity of movable hanging frame group 20 increases and decreases depending on plating demand and instrument size; And when the quantity of movable hanging frame group 20 is more, in the quantity that also optionally can increase primary source supply 10 that arranges of electroplating device 1, with in response to distributing out-put supply to the shunting power supply unit 22 of multiple movable hanging frame group 20.
In the present embodiment, shunt power supply unit 22 and comprise controlled in wireless module 221.Controlled in wireless module 221 in order to accept the wireless control signal from the external world, and exports to control power supply own according to this wireless control signal.Controlled in wireless module 221 can adopt the controlled in wireless module of bluetooth module, infrared rays module, Wi-Fi module, 3G/4G network communication module or other tool transmission of wireless signals functions herein.Therefore, user, by telepilot, mobile phone, computer equal controller, just can control the power supply output of the shunting power supply unit 22 of each movable hanging frame group 20, reach the instant effect controlled, and increase operation ease at far-end.
Below please also refer to Fig. 5 and Fig. 6.As shown in Figures 5 and 6, electroplating device 1 more comprises first anode electric-conductor 30, and first anode electric-conductor 30 is electrically connected multiple plated material B.The hanger 21 of each movable hanging frame group 20 comprises contact part 211 and clamping part 212.Contact part 211 in order to keep being electrically connected with first anode electric-conductor 30, and makes hanger 21 can move along first anode electric-conductor 30.In the present embodiment, first anode electric-conductor 30 is employing anode copper bars, contact part 211 adopts at least one slide assemblies, such as roller set etc., be combined slidably with anode copper bar by slide assemblies, make hanger 21 not only by contact part 211 can comparatively stablize and smoothly move along first anode electric-conductor 30, the electric connection of contact part 211 and first anode electric-conductor 30 can be guaranteed again, but the design of contact part 211 is not as limit.
Clamping part 212, in order to clamp plated body A, when movable hanging frame group 20 is moved, can drive plated body A to move in the lump.In the present embodiment, clamping part 212 adopts at least one clamping piece, such as metal clip etc., to clamp or get loose plated body A by manual or electronic mode.
The shunting power supply unit 22 of each movable hanging frame group 20 comprises negative electrode 222 and anode 223.The negative electrode 222 wherein shunting power supply unit 22 is electrically connected clamping part 212, and the anode 223 of shunting power supply unit 22 connects contact part 211.By this, the plated body A clamped by negative electrode 222 energy output cathode electric current to clamping part 212 of shunting power supply unit 22, makes plated body A be with negative electrode electric charge; The anode 223 shunting power supply unit 22 is then electrically connected to first anode electric-conductor 30 by contact part 211, makes plated material B be with anode electric charge.
In an embodiment of the application, electroplating device 1 more comprises at least one second anode electric-conductor 40, in order to as the electric connection medium between first anode electric-conductor 30 and multiple plated material B.That is, at least one second anode electric-conductor 40 can in order to arrange multiple plated material B, and each plated material B also can be electrically connected first anode electric-conductor 30 by least one second anode electric-conductor 40.At least one second anode electric-conductor 40 is employing two anode copper bars herein, is separately positioned on the both sides of plating tank 50, and often props up anode copper bar all for arranging multiple plated material B.It is noted that the magnitude setting of at least one second anode electric-conductor 40 and pattern be not as limit.
By this, the independent output cathode electric current of negative electrode 222 energy of each shunting power supply unit 22 is to the corresponding plated body A clamped of clamping part 212, and that is, each plated body A can correspond to one and independently shunt power supply unit 22; The anode 223 respectively shunting power supply unit 22 is then electrically connected to first anode electric-conductor 30 by contact part 211, forms the effect of each anode 223 parallel connection, forms common anode loop to make anode 223.
As shown in Figures 5 and 6, in the present embodiment, electroplating device 1 more comprises conductive component 60.This conductive component 60 is as the conductive media between primary source supply 10 and the shunting power supply unit 22 of each movable hanging frame group 20, so that still can keep being electrically connected with primary source supply 10 when each movable hanging frame group 20 moves relative to primary source supply 10.Primary source supply 10 is electrically connected to each shunting power supply unit 22 by conductive component 60, transfers to each shunting power supply unit 22 in order to the direct supply exported by primary source supply 10 through conductive component 60.
In design, conductive component 60 comprises two conducting coppers, connects anode DC terminal and the negative electrode RTN terminal of primary source supply 10 respectively; And respectively shunt power supply unit 22 and more comprise sliding part 224, sliding part 224 can be formed with two conducting coppers respectively with the collar, snap fit or other conductive slide constructions etc. and be connected slidably, make each movable hanging frame group 20 still can keep being electrically connected with primary source supply 10 in moving process, but the application is not as limit.
When reality performs electroplating process, electroplating device 1 can drive multiple movable hanging frame group 20 along first anode electric-conductor 30 towards direction initialization L continuous moving; Each multiple plated body A now clamped by each movable hanging frame group 20 can be driven, and between multiple plated material B of plating tank 50 both sides continuous moving.Certainly, each shunting power supply unit 22 also can be driven by each movable hanging frame group 20 and with continuous moving.Power supply by each shunting power supply unit 22 exports, and each plated material B can become anode, and each plated body A can become negative electrode.
Independently power supply unit 22 is shunted because each movable hanging frame group 20 all has, make each plated body A can shunt power supply unit 22 by correspondence to control separately, identical and stable cathodic current can be assigned to, powered inequality can not be caused because of may conductivity difference be had between plated body A; Multiple plated material B then shares the anode of each shunting power supply unit 22 by first anode electric-conductor 30, form same plate tank.
By this, the cathodic current assigned by each plated body A is identical, can keep the homogeneity of its coating thickness, significantly improving the shortcoming of known electroplating device when performing plating.User also can by the state of telemanipulator immediately monitoring electroplating device, to guarantee yield and the effect of electroplating process.
To sum up institute is old, and the application, no matter with regard to object, means and effect, all shows that it is totally different in the feature of known techniques.Only it should be noted, above-mentioned many embodiments are only citing for convenience of explanation, and the interest field that the application advocates from should being as the criterion with described in claims, but not is only limitted to above-described embodiment.
Claims (7)
1. an electroplating device, in order to multiple plated body is plated plated material, is characterized in that, this electroplating device comprises:
One primary source supply;
Multiple movable hanging frame group, in order to drive the plurality of plated body continuous moving, respectively this movable hanging frame group comprises a hanger and the shunting power supply unit in conjunction with this hanger, this hanger comprises a contact part and the clamping part in order to clamp this plated body, and this shunting power supply unit is electrically connected this primary source supply; Wherein this shunting power supply unit connects this clamping part with a negative electrode, and this shunting power supply unit connects this contact part with an anode; And
One first anode electric-conductor, is electrically connected multiple plated material; Wherein respectively this movable hanging frame group keeps being electrically connected by this contact part and this first anode electric-conductor and moves along this first anode electric-conductor;
Wherein the plurality of plated body is assigned to identical cathodic current by respectively this shunting power supply unit of the plurality of movable hanging frame group, and the plurality of plated material shares this anode of respectively this shunting power supply unit by this first anode electric-conductor.
2. electroplating device as claimed in claim 1, it is characterized in that, more comprise at least one second anode electric-conductor, this at least one second anode electric-conductor is in order to arrange the plurality of plated material, and respectively this plated material is electrically connected this first anode electric-conductor by this at least one second anode electric-conductor.
3. electroplating device as claimed in claim 1, it is characterized in that, wherein this shunting power supply unit comprises a controlled in wireless module, exports to control power supply in order to accept a wireless control signal.
4. electroplating device as claimed in claim 1, it is characterized in that, more comprise a conductive component, this primary source supply is electrically connected to respectively this shunting power supply unit by this conductive component, in order to direct supply is transferred to respectively this shunting power supply unit through this conductive component.
5. electroplating device as claimed in claim 4, it is characterized in that, wherein respectively this shunting power supply unit more comprises sliding part, and this sliding part is formed with this conductive component and is connected slidably.
6. electroplating device as claimed in claim 1, it is characterized in that, wherein this contact part is at least one slide assemblies.
7. electroplating device as claimed in claim 1, it is characterized in that, wherein the output voltage of this primary source supply is greater than the output voltage of respectively this shunting power supply unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520205199.1U CN204714932U (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520205199.1U CN204714932U (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204714932U true CN204714932U (en) | 2015-10-21 |
Family
ID=54313937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520205199.1U Withdrawn - After Issue CN204714932U (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204714932U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048699A (en) * | 2016-08-21 | 2016-10-26 | 无锡鸿运电镀有限公司 | Electroplating hanging frame for installing monitor equipment |
| CN106149039A (en) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | electroplating device |
-
2015
- 2015-04-08 CN CN201520205199.1U patent/CN204714932U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149039A (en) * | 2015-04-08 | 2016-11-23 | 亚硕企业股份有限公司 | electroplating device |
| CN106149039B (en) * | 2015-04-08 | 2017-11-24 | 亚硕企业股份有限公司 | electroplating device |
| CN106048699A (en) * | 2016-08-21 | 2016-10-26 | 无锡鸿运电镀有限公司 | Electroplating hanging frame for installing monitor equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105896646A (en) | Intelligent buck-boost charging/discharging circuit and charging/discharging method thereof | |
| CN204714932U (en) | electroplating device | |
| CN105048611A (en) | Wireless charging device and wireless charging method | |
| CN204982125U (en) | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB | |
| CN205529121U (en) | Electroplated anode device | |
| CN106149039B (en) | electroplating device | |
| CN105552973A (en) | Electric energy transmission system and power supply system and charging combination thereof | |
| CN106786978A (en) | A kind of charging system and mobile terminal | |
| CN104404605B (en) | A kind of electroplanting device of tool dual output commutator | |
| EP4123785A1 (en) | Series formation system | |
| CN110760918B (en) | Electroplating system with controllable plating layer | |
| CN211420344U (en) | Electroplating system with controllable plating layer | |
| CN205669074U (en) | PCB board copper plating device | |
| TWM504102U (en) | Electroplating equipment | |
| CN204342906U (en) | A kind of electroplanting device of tool dual output rectifier | |
| CN207079293U (en) | A kind of electroplating device | |
| CN109539794A (en) | A kind of two electric three furnace process units with baker function | |
| CN205817089U (en) | charger production line automatic laser etching station | |
| TWI575117B (en) | Electroplating equipment | |
| CN205241839U (en) | Integration formula stopper braking piston hard chrome plating hanger | |
| CA2687313A1 (en) | Work electrodeposition coating method and work electrodeposition coating device | |
| CN109290652A (en) | The weld assembly of solar panels terminal box | |
| CN103746420B (en) | Mobile terminal wireless charging circuit | |
| CN206401981U (en) | A kind of distributed heat imager electric power system | |
| CN206553644U (en) | A kind of hanger of improvement VCP electroplating evenness |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151021 Effective date of abandoning: 20171124 |
|
| AV01 | Patent right actively abandoned |