Pcb board copper plating device
This utility model relates to circuit board printing technology, particularly relates to a kind of pcb board copper plating device.
Along with electronic product is towards multifunctionality, intelligent direction is constantly brought forth new ideas and develops, for carry
The carrier printed circuit board of electronic component it is also proposed that higher requirement, promote circuit board to light, thin, short,
Little direction is developed.Therefore so that the circuit of design is more and more closeer, increasingly thinner, live width/spacing
3mil/3mil is increasingly becoming the requirement of routine, and the production of the circuit board of 2.5mil, even 2mil circuit is
It is increasingly becoming a kind of trend.
For the finest circuit, its making not only proposes the highest requirement to etch process, heavier
Want is the control to surface copper layer thickness and uniformity thereof.If electro-coppering thickness ununiformity is even, then can cause
The clean short circuit of etching or the etched degree of part circuit and line is thin, thus, better etch capabilities also cannot be more
Mend drawbacks described above.
Therefore, for the problems referred to above, it is necessary to propose further solution.
Utility model content
The purpose of this utility model is to provide a kind of pcb board copper plating device, exists to overcome in prior art
For realizing above-mentioned utility model purpose, offer one pcb board copper plating device of the present utility model, its bag
Include: electroplating bath, anode, negative electrode, shield；
Described anode, negative electrode, shield are positioned in described electroplating bath, and described anode is oppositely arranged, described the moon
Pole is arranged between described anode, has high Current Zone in described electroplating bath, and described shield is respectively close to two
The anode of side is arranged, and between described anode and negative electrode, and described shield is positioned at described high Current Zone
As the improvement of pcb board copper plating device of the present utility model, the end of described anode is provided with anode even
Connecing end, described anode connects end and is connected with outer lead.
As the improvement of pcb board copper plating device of the present utility model, the end of described negative electrode is provided with negative electrode even
Connecing end, described cathode connection terminal is connected with outer lead.
It is many groups as the improvement of pcb board copper plating device of the present utility model, described anode and negative electrode, often group
Including two anodes and a negative electrode, often group anode and cathode separation are arranged.
As the improvement of pcb board copper plating device of the present utility model, the height of described shield is 400mm.
Compared with prior art, the beneficial effects of the utility model are: pcb board copper facing of the present utility model fills
Put so that the pcb board of plating has good uniformity, when can preferably solve pcb board copper facing, local erosion
Carve problem the cleanest, overetched, and the follow-up making hyperfine circuit of 2.5mil, 2mil can be promoted greatly
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that,
Accompanying drawing in describing below is only some embodiments described in this utility model, common for this area
From the point of view of technical staff, on the premise of not paying creative work, it is also possible to obtain it according to these accompanying drawings
His accompanying drawing.
Fig. 1 is the floor map of a detailed description of the invention of pcb board copper plating device of the present utility model.
Detailed description of the invention
This utility model is described in detail by each embodiment shown in below in conjunction with the accompanying drawings, but it should explanation
, these embodiments are not limitation of the utility model, and those of ordinary skill in the art are according to these
Equivalent transformation in embodiment institute work energy, method or structure or replacement, belong to this practicality new
Within the protection domain of type.
As it is shown in figure 1, pcb board copper plating device of the present utility model includes: electroplating bath 10, anode 20, the moon
Pole 30, shield 40.
Being used for holding electrolyte in described electroplating bath 10, described anode 20, negative electrode 30, shield 40 are positioned at
In described electroplating bath 10.Wherein, described anode 20 is oppositely arranged, and described negative electrode 30 is arranged at described anode
Between 20.During plating, under the effect of electrolyte, copper loses electronics at anode, forms bivalent cupric ion,
And under the intermolecular forces of electric charge, move to, at negative electrode, be converted into elemental copper.
The end of described anode 20 is provided with anode and connects end, and described anode connects end and is connected with outer lead.
Analogously, the end of described negative electrode 30 is provided with cathode connection terminal, described cathode connection terminal and outer lead
It is connected.Additionally, described anode 20 and negative electrode 30 could be arranged to many groups, wherein, often group includes two
Anode 20 and a negative electrode 30, and respectively group anode 20 and negative electrode 30 interval are arranged.Additionally, anode 20,
The position of negative electrode 30 and area can be set according to actual needs.
Further, having high Current Zone in described electroplating bath 10, described shield 40 is respectively close to both sides
Anode 20 arrange, and between described anode 20 and negative electrode 30, and described shield 40 is positioned at institute
State in high Current Zone.
Be arranged such, by high Current Zone to anode one end use shield cover dispersion so as to get
The Electric Field Distribution reaching cathode terminal is uniform, it is achieved thereby that cathodic coating purpose in uniform thickness.Wherein, described
The material of the shield used is the mixture that high-molecular organic material is formed with pottery.Described shield 40
Highly preferred for 400mm.
In sum, that the pcb board of plating is had is good equal for pcb board copper plating device of the present utility model
Even property, when can preferably solve pcb board copper facing, local etching problem the cleanest, overetched, and can pole
Big promotes the follow-up ability making the hyperfine circuit of 2.5mil, 2mil.
It is obvious to a person skilled in the art that this utility model is not limited to the thin of above-mentioned one exemplary embodiment
Joint, and in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to concrete with other
Form realizes this utility model.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary
, and be nonrestrictive, scope of the present utility model is limited by claims rather than described above
It is fixed, it is intended that all changes fallen in the implication of equivalency and scope of claim are included at this
In utility model.Should not be considered as limiting involved claim by any reference in claim.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, but the most each enforcement
Mode only comprises an independent technical scheme, and this narrating mode of description is only for clarity sake,
Those skilled in the art should be using description as an entirety, and the technical scheme in each embodiment can also be through
Appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.