CN206553644U - A kind of hanger of improvement VCP electroplating evenness - Google Patents
A kind of hanger of improvement VCP electroplating evenness Download PDFInfo
- Publication number
- CN206553644U CN206553644U CN201720169430.5U CN201720169430U CN206553644U CN 206553644 U CN206553644 U CN 206553644U CN 201720169430 U CN201720169430 U CN 201720169430U CN 206553644 U CN206553644 U CN 206553644U
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- hanger
- clamping plate
- conducting rod
- vcp
- improvement
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Abstract
The utility model is related to circuit board making field, specially a kind of hanger of improvement VCP electroplating evenness, some clips set including hanger body and in hanger body, each clip includes clamping plate one and clamping plate two, hanger body is provided with conducting rod, each clamping plate one is arranged on conducting rod, is equipped between each clamping plate two and conducting rod for turning on mutual wire.This hanger for improving VCP electroplating evenness is provided between clamping plate two and conducting rod to be used to turn on mutual wire, so that the clip between hanger connects into unified entirety, pass through wire connection conducting excess charge, ensure conductive stable, homogeneous current distribution during plating, so that circuit board electroplating copper thickness is uniform, the uniformity of VCP plating is improved.
Description
Technical field
The utility model is related to circuit board making field, more particularly to a kind of hanger of improvement VCP electroplating evenness.
Background technology
At present, in printed circuit board manufacturing process, electroplating work procedure more and more uses VCP (Vertical
Conveyor plating, vertical continuous plating) production.There are several factors to produce shadow to the uniformity of plating in production process
Ring, such as：Concentration quality, voltage and current parameter, anode, scaffold of plating solution etc..In addition, the hanger of plating vertical line (is commonly called as small
Aircraft) electric conductivity be also an important factor in order.Existing flivver typically has 3~5 clips, the folder of single clip
Connected between plate by spring, electric current on conductive bad, wiring board occurs in the clip that this mode is connected in use
, so as to influence the uniformity of circuit board electroplating copper thickness, there is parcel plating copper in the low problem of skewness, current utilization rate
Partially thick or partially thin, copper thickness extreme difference is big, and causing rear extended meeting to produce, etching is difficult, some lines children occurs or the unnet quality of etching is asked
Topic.
Utility model content
The utility model for hanger exist the problem of conductive bad, CURRENT DISTRIBUTION is uneven, current utilization rate is low there is provided
It is a kind of by enter the clip inside hanger row conductor connect, so as to ensure the improvement of conductive stable and homogeneous current distribution
The hanger of VCP electroplating evenness.
To achieve the above object, the utility model uses following technical scheme：
A kind of hanger body of improvement VCP electroplating evenness, including hanger body and set in hanger body it is some
Clip, each clip includes clamping plate one and clamping plate two, and hanger body is provided with conducting rod, and each clamping plate one is arranged on conducting rod,
It is equipped between each clamping plate two and conducting rod for turning on mutual wire.
It is preferred that, the end of one end connecting cleat two of wire, the other end of wire is arranged on conducting rod.
It is preferred that, conducting rod is provided with some tie points for being used to adjust charge balance.
It is preferred that, clip is spring clip.
Compared with prior art, the beneficial effects of the utility model are：This improves the hanger of VCP electroplating evenness in clamping plate
Being provided between two and conducting rod is used to turn on mutual wire so that the clip between hanger connects into unified entirety, by leading
Line connection conducting excess charge, it is ensured that conductive stable, homogeneous current distribution during plating, so that circuit board electroplating copper thickness is equal
It is even, improve the uniformity of VCP plating.
Brief description of the drawings
The utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is the structural representation of wire connection neighboring clips in embodiment.
Embodiment
In order to more fully understand technology contents of the present utility model, with reference to specific embodiment to of the present utility model
Technical scheme is described further and illustrated.
Embodiment
Reference picture 1, the utility model provides a kind of hanger of improvement VCP electroplating evenness, including hanger body 1 and setting
Some clips 3 in hanger body 1, clip 3 is spring clip.Each clip 3 includes clamping plate 1 and clamping plate 2 32, clamping plate one
Helical spring is provided between 31 and clamping plate 2 32.Hanger body 1 is provided with conducting rod 2, and each clamping plate 1 is arranged at conducting rod 2
On, it is equipped between each clamping plate 2 32 and conducting rod 2 for turning on mutual wire 4.One end connecting cleat 2 32 of wire 4
End, the other end of wire 4 is arranged on conducting rod 2.Conducting rod 2 is provided with some tie points for being used to adjust charge balance
21, the position of tie point can be adjusted according to the quantity of electric charge of each end of clamping plate two.The single wire 4 of clip 3 in the inside of hanger body 1
It is connected with the conducting rod 2 of hanger body 1, by the series connection clip 3 of wire 4, increases multiple conductive channels, improve the conduction of clip 3
Property, it is to avoid clip 3 because spring loosen or contact it is bad cause conductive bad, realize integration, it is ensured that conductive stable, electric current point
Cloth is uniform.
In the present embodiment, VCP clip 3 improves that clip conduction is bad, CURRENT DISTRIBUTION is uneven after being connected with wire 4
Problem, improves electroplating evenness, and copper thickness extreme difference is reduced to 7 μm after wire is connected by 11 μm be not connected with before wire, reduces 5
μm extreme difference, improve VCP electroplating evenness, reduce because electroplating evenness is poor, subsequent etch is not net caused by extreme difference is big
Or the line children quality problem such as bad.
It is described above that technology contents of the present utility model are only further illustrated with embodiment, in order to which reader is easier reason
Solve, but do not represent embodiment of the present utility model and be only limitted to this, any technology done according to the utility model extends or created again
Make, by protection of the present utility model.
Claims (4)
1. a kind of hanger of improvement VCP electroplating evenness, including hanger body and some folders for being set in the hanger body
Son, it is characterised in that：Each clip includes clamping plate one and clamping plate two, and the hanger body is provided with conducting rod, each folder
Plate one is arranged on conducting rod, is equipped between each clamping plate two and conducting rod for turning on mutual wire.
2. the hanger of improvement VCP electroplating evenness according to claim 1, it is characterised in that：One end of the wire connects
The end of fishplate two, the other end of the wire is arranged on conducting rod.
3. the hanger of improvement VCP electroplating evenness according to claim 2, it is characterised in that：The conducting rod is provided with
Some tie points for being used to adjust charge balance.
4. the hanger of improvement VCP electroplating evenness as claimed in any of claims 1 to 3, it is characterised in that：It is described
Clip presss from both sides for helical spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169430.5U CN206553644U (en) | 2017-02-23 | 2017-02-23 | A kind of hanger of improvement VCP electroplating evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169430.5U CN206553644U (en) | 2017-02-23 | 2017-02-23 | A kind of hanger of improvement VCP electroplating evenness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206553644U true CN206553644U (en) | 2017-10-13 |
Family
ID=60360313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720169430.5U Active CN206553644U (en) | 2017-02-23 | 2017-02-23 | A kind of hanger of improvement VCP electroplating evenness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206553644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
-
2017
- 2017-02-23 CN CN201720169430.5U patent/CN206553644U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |