CN103911640A - Apparatus for horizontally electroplating printed wiring board used for vertical-type groove - Google Patents
Apparatus for horizontally electroplating printed wiring board used for vertical-type groove Download PDFInfo
- Publication number
- CN103911640A CN103911640A CN201310001881.4A CN201310001881A CN103911640A CN 103911640 A CN103911640 A CN 103911640A CN 201310001881 A CN201310001881 A CN 201310001881A CN 103911640 A CN103911640 A CN 103911640A
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- China
- Prior art keywords
- printed wiring
- circuit board
- carry out
- vertical groove
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a novel apparatus for electroplating a printed wiring board. The apparatus employs a double-rod frame-type structural hanger, the printed wiring board to be electroplated is horizontally placed on the hanger or placed on the hanger with certain angle, thereby a horizontal electroplating process of the printed wiring board can be realized in the vertical-type groove. The structure is characterized in that an elasticity structure hook (2) is arranged on the upper end of the double-rod frame-type structural hanger (1) for communicating with the cathode of the groove, the double-rod frame-type structural hanger (1) is connected to a printed wiring board cutting (3) for fixinga printed boards (4). A net insolubility anode (5) is arranged between the printed boards, the anode nets are fixed on the double-rod frame-type structural hanger (1), and are insulated with the double-rod frame-type structural hanger (1). The net anodes are connected through a lead (6), and are connected to an anode electrode clamp (7) through a telescopic flexible cord (7) for connecting with the anode on the vertical-type groove.
Description
Technical field
The present invention relates to one and carry out printed wiring plate level electro plating device for vertical groove.
Background technology
Printed circuit board is that modern electronic product is realized electron device assembling and interconnected substrate.From household electrical appliance to mobile communication, from the various vehicles to smart machine, all to use printed-wiring board (PWB).Manufacture printed-wiring board (PWB) and will use line pattern electroplating technology, make because substrate is insulating material, except carrying out the position that has copper film, can not conduct electricity, need to electroplate again after first electroless copper.Old printed circuit board electroplating technology adopts vertical groove, wiring board is vertically hung into coating bath and electroplated, advantage is that production line can be shorter, take up an area seldom, but electric force lines distribution is inhomogeneous, is communicated with through-hole plating and is difficult to ensure, clean difficulty, water loss is very large, also will use the electroless copper that environment is had to pollution, can not adapt to the directly electroplating technology of non-chemical plating.
Improve as one, can adopt horizontal electroplating technology.This technology is by printed circuit board horizontal positioned in coating bath, adopts the mode of continuous electroplating to allow wiring board in moving process, implement to electroplate.Can clean easily, can adopt compared with high current density, still can obtain coating comparatively uniformly.And can adopt the direct depositing process of non-chemical plating, be a kind of advanced person's pcb plating technology.But this occupation area of equipment is larger, manufacturing cost is higher.Implementing this technology can not carry out on original electroplating device, need to add expensive new installation, has certain difficulty on applying.
Summary of the invention
In order to overcome above-mentioned difficulties, the invention provides a kind of new electroplating printed circuit board device.
This device is to adopt two bar closed-in construction hangers, the multiple net formula of horizontal arrangement anode, the printed circuit board that needs are electroplated can flatly or have certain angle with horizontal plane and be placed on hanger, thereby can in traditional vertical coating bath, realize the horizontal electroplating process of printed circuit board.So the level that, can utilize traditional vertical plating line to realize printed board is electroplated.Both save resource, adopted again new production technique.
Brief description of the drawings
Accompanying drawing is the schematic diagram that carries out printed circuit board and carry out horizontal electro plating device for vertical groove.In order to implement this invention, the present invention has adopted following structure: two whippy structure negative electrode hooks (2) are installed, to be connected with the negative electrode of coating bath in the time of work in two bar frame hangers (1) upper end.Two bars (1) are also connected with printed circuit board fixing bigslip (3), make cathodic current be sent to every printed board (4).Between every two printed boards, net formula insoluble anode (5) is installed, these anode networks are at least three groups, are also fixed on two bars, but insulate with two bars.Between net formula anode, connect by wire (6), and be connected by telescopic flexible cord and anode electrode folder (7), so that being connected of realization and plating tank Anodic.
Embodiment
The vertical groove printed wiring of embodiment 1 plate level electroplanting device
Make double pole hanger frame (1) with brass bar, at two club head device phosphor-copper elastic holder type hooks (2) of hanger, between two bars, be uniformly distributed for example four bar formula slots (3), slot strip is that conduction is connected with two bars, and keeps horizontality while making printed board (4) be fixed in these cuttings.Between printed board, middle position disposes three groups of titanium metal anode networks (5), and with printed board keeping parallelism.These anode networks insulate with two bars, are only connected with anode chuck (7) by wire (6).Like this, can make to lay the printed circuit board on this device, in vertical coating bath, realize horizontal electroplating technology process.
The vertical groove printed circuit board of embodiment 2 inclination electroplanting device
Make double pole hanger frame (1) with red copper bar, at two club head device phosphor-copper elastic holder type hooks (2) of hanger, be uniformly distributed for example four bar formula slots (3) between two bars, slot strip is that conduction is connected with two bars; Ensureing on the reliable basis of this connection, the non-conduction part of two bars and bar formula slot is being implemented to the painting of insulation paste or paint and carried out.Meanwhile, the inclination that keeps 45 degree while making printed board (4) be fixed in these cuttings.Middle position between printed board disposes anode titanium wire netting (5), and these anode networks insulate with two bars, are only connected with anode chuck (7) by wire (6).Main points are that anode network Installation posture is horizontal by miter angle, like this, can make to lay the printed circuit board on this device, and when turnover plating solution, resistance reduces, and still can in vertical coating bath, realize horizontal electroplating technology process.
The vertical groove printed circuit board of embodiment 3 inclination electroplanting device
Make double pole hanger frame (1) with engineering plastics, at two club head device phosphor-copper elastic holder type hooks (2) of hanger, between two bars, be uniformly distributed for example four bar formula slots (3), slot strip is realized and being connected by wire with two bars.Meanwhile, while making printed board (4) be fixed in these cuttings, keep 30 degree or 45 degree or the just inclination of 60 degree.Middle position between printed board disposes anode titanium wire netting (5), and these anode networks insulate with two bars, are only connected with anode chuck (7) by wire (6).Main points be anode network Installation posture all the time with printed circuit board keeping parallelism, like this, can make to lay the printed circuit board on this device, turnover when plating solution resistance reduce, still can in vertical coating bath, realize horizontal electroplating technology process.
Claims (8)
1. carry out a printed wiring plate level electro plating device for vertical groove, it is characterized in that horizontal positioned printed circuit board on frame hanger, can in vertical coating bath, electroplate.
2. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that being provided with net formula anode between printed circuit board, it is parallel with printed circuit board that this anode remains.
3. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that net formula anode at least can configure 3 groups or more than.
4. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that printed circuit board is connected with negative electrode by bar shaped slot.
5. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that the printed circuit board of being fixed by bar shaped slot remains on horizontality.
6. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that the printed circuit board of being fixed by bar shaped slot also can remain on the states that become 30 degree, 45 platings or 60 degree with level.
7. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that both can having used metal manufacture with double pole shaped as frame hanger, also can manufacture with engineering plastics.
8. according to claim 1ly carry out printed wiring plate level electro plating device for vertical groove, it is characterized in that, in the time that double pole shaped as frame hanger is manufactured with engineering plastics, printed circuit board completed with being connected by the wire being arranged on framework mobile jib of power cathode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310001881.4A CN103911640A (en) | 2013-01-05 | 2013-01-05 | Apparatus for horizontally electroplating printed wiring board used for vertical-type groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310001881.4A CN103911640A (en) | 2013-01-05 | 2013-01-05 | Apparatus for horizontally electroplating printed wiring board used for vertical-type groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103911640A true CN103911640A (en) | 2014-07-09 |
Family
ID=51037634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310001881.4A Pending CN103911640A (en) | 2013-01-05 | 2013-01-05 | Apparatus for horizontally electroplating printed wiring board used for vertical-type groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103911640A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108342756A (en) * | 2017-01-24 | 2018-07-31 | 廖智良 | On multilager base plate horizontal plating electricity and electroless plating method |
| CN114892258A (en) * | 2022-05-23 | 2022-08-12 | 浙江工业大学 | Electrolytic polishing device and method for thinning flat plate tensile sample |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100995A (en) * | 1986-02-28 | 1988-03-16 | 舍林股份公司 | The long frame and the annex of mounted and removable electroplated printed circuit board and various wiring boards |
| US4871435A (en) * | 1988-10-14 | 1989-10-03 | Charles Denofrio | Electroplating apparatus |
| JPH02262397A (en) * | 1989-04-03 | 1990-10-25 | Kihei Otsu | Electroplating of printed-wiring board and its device |
| CN2098509U (en) * | 1991-07-25 | 1992-03-11 | 科龙实业有限公司 | Electroplating device for horizontal holes on pcb |
| CN2486563Y (en) * | 2001-06-26 | 2002-04-17 | 竞铭机械股份有限公司 | Electroplating rack |
| US20030150738A1 (en) * | 2003-03-10 | 2003-08-14 | Modular Components National, Inc. | High efficiency plating apparatus and method |
| CN201437557U (en) * | 2009-09-11 | 2010-04-14 | 深圳市深联电路有限公司 | Improved PCB template rack for automatic electroless copper plating line |
| CN202380116U (en) * | 2011-12-26 | 2012-08-15 | 深圳市星河电路有限公司 | Horizontal hanging tool for thin board electroplating |
-
2013
- 2013-01-05 CN CN201310001881.4A patent/CN103911640A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100995A (en) * | 1986-02-28 | 1988-03-16 | 舍林股份公司 | The long frame and the annex of mounted and removable electroplated printed circuit board and various wiring boards |
| US4871435A (en) * | 1988-10-14 | 1989-10-03 | Charles Denofrio | Electroplating apparatus |
| JPH02262397A (en) * | 1989-04-03 | 1990-10-25 | Kihei Otsu | Electroplating of printed-wiring board and its device |
| CN2098509U (en) * | 1991-07-25 | 1992-03-11 | 科龙实业有限公司 | Electroplating device for horizontal holes on pcb |
| CN2486563Y (en) * | 2001-06-26 | 2002-04-17 | 竞铭机械股份有限公司 | Electroplating rack |
| US20030150738A1 (en) * | 2003-03-10 | 2003-08-14 | Modular Components National, Inc. | High efficiency plating apparatus and method |
| CN201437557U (en) * | 2009-09-11 | 2010-04-14 | 深圳市深联电路有限公司 | Improved PCB template rack for automatic electroless copper plating line |
| CN202380116U (en) * | 2011-12-26 | 2012-08-15 | 深圳市星河电路有限公司 | Horizontal hanging tool for thin board electroplating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108342756A (en) * | 2017-01-24 | 2018-07-31 | 廖智良 | On multilager base plate horizontal plating electricity and electroless plating method |
| CN114892258A (en) * | 2022-05-23 | 2022-08-12 | 浙江工业大学 | Electrolytic polishing device and method for thinning flat plate tensile sample |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140709 |
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| WD01 | Invention patent application deemed withdrawn after publication |