CN2098509U - Electroplating device for horizontal holes on pcb - Google Patents
Electroplating device for horizontal holes on pcb Download PDFInfo
- Publication number
- CN2098509U CN2098509U CN 91218572 CN91218572U CN2098509U CN 2098509 U CN2098509 U CN 2098509U CN 91218572 CN91218572 CN 91218572 CN 91218572 U CN91218572 U CN 91218572U CN 2098509 U CN2098509 U CN 2098509U
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- lower roller
- electroplating
- base plate
- running roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
The utility model relates to a horizontal perforation electroplating device of a circuit base plate, mainly comprising upper and lower roller groups, wherein, the upper and lower roller groups are that a plurality of rollers are arranged on a majority of swing arms, and each of the roller is a conductive body. The upper and the lower roller groups are respectively energized, the circuit base plate is arranged on the lower roller group on horizontal direction, and the circuit base plate is conveyed by the running of the rollers. When the circuit base plate is arrived between the upper and the lower roller groups, the circuit base plate is demanded to conduct by the upper and the lower roller groups to become one stage of electroplating to begin to implement electroplating.
Description
The utility model relates to a kind of circuit substrate horizontal perforation electroplanting device.Be particularly related to the horizontal perforation electroplanting device that more than one lower roll wheels constitute.
Tellite can provide that diversified line design, solid circuit support, error rate is low, saves the space, maintenance easily and be beneficial to advantages such as a large amount of and automatic production, so at present its in electronic product, generally aspect such as electrical equipment and computer technology is subjected to using widely; And tellite is broadly divided into single face, two-sided, multilayer or soft printed base plate, and wherein the plating of printed on both sides substrate perforation circuit substrate is subjected to adopting widely;
Electroplating the perforation circuit substrate mainly is to use electroless-plating with electro-plating method the hole metallization to be connected the two sides circuit, and being suspending with vertical direction, traditional plating need hang on the support body by galvanized circuit substrate, then with this support body with in the vertical direction immersion plating liquid, and the circuit substrate on the support body begins to electroplate then, only electroplating the perforation circuit substrate is the hole metallization that needs on it, and the circuit on its two sides can be connected, in other words, this electroplate liquid needs to immerse really in the hole on the substrate, beginning can make this hole metallization, and above-mentioned rectilinear electrochemical plating, the hole of substrate is very easily because of its aperture and galvanized liquid level tension force, when electroplating, this fresh plating fluid is fully entered in the hole of this substrate, and the hole of this substrate soon can't well be metallized, the two sides circuit is also consolidated and bad connection, and the effect that then should electroplate the perforation circuit substrate is promptly not good; Rectilinear again plating mode meets the substrate that area is big or the thicker aperture of thickness is less and promptly is difficult for implementing.
The purpose of this utility model main purpose is that a kind of circuit substrate horizontal perforation electroplanting device is provided in order to overcome the deficiencies in the prior art.
The utility model circuit substrate horizontal perforation electroplanting device mainly is to be provided with the upper and lower roll wheels on a body, wherein said upper and lower roll wheels are respectively by the running roller of transmission rope transmission on it, this running roller is a conductor, when it transports, pass to same electrode current on it respectively, described circuit substrate places on the lower roll wheels, and passes forward by the running of the running roller of roller set; When described electroplating substrate enters between the upper and lower running roller wheel, the electric current of up-down rollers wheels promptly conducts on the circuit substrate, make it become an electroplating cathode, begin immediately to electroplate, because this electroplating process is to carry out under a horizontality, and this electroplate liquid is followingly directly to wash away surface in circuit substrate towards formula, so electroless plating liquid immerses the problem of substrate hole because of liquid level tension force hinders it, this substrate hole then can be by complete metalization, and have suitable even metal distributive law, electroplate incomplete shortcoming and promptly be overcome and commonly use rectilinear electroplating technology.
The utility model mainly is to be provided with the upper and lower roll wheels on a body, wherein this roller set is to be provided with several running rollers on most revolving bars, this revolving bar is hubbed at respectively on the cell body that both sides form on the body, and these running roller central authorities are formed with chute, circle is wound with transmission rope on this chute, this transmission cringle is around on the running roller on each transmission rod, and this running roller is constituted by a conductor again.
Below in conjunction with accompanying drawing, the utility model is elaborated.
Brief Description Of Drawings:
Fig. 1 is the outside drawing of the utility model electroplanting device.
Fig. 2～Fig. 4 is the operation program figure of the utility model electroplanting device.
As shown in Figure 1, the utility model electroplanting device mainly is to be provided with upper and lower roll wheels 10,20 on a body 1, wherein this roller set the 10, the 20th is provided with several running rollers 12,22 on the revolving bar 11,21 of majority, and this revolving bar 11,21 is hubbed at respectively in the cell body 101 of body 1 both sides formation; These running roller 12,22 central authorities are formed with chute 121,221 again, circle is wound with transmission rope 122,222 on this chute 121,221, this transmission rope the 122, the 222nd, laterally to enclose the running roller 12,22 that is around on each revolving bar 11,21 one by one, the transmission of this transmission rope 122,222 of mat makes each running roller 12,22 around revolving bar 11,21 rotations;
This running roller 12,22 is a conductor again, when 10,20 entrys into service of upper and lower roll wheels, passes to the electric current of homopolarity on it respectively.
Electroplate liquid is followingly directly to wash away surface in circuit substrate towards formula, and the strength of washing away is enough to make electroplate liquid to immerse really in each hole on the circuit substrate, make its each hole be able to complete metalization, and galvanized effect side is guaranteed.
Relevant action part of the present utility model, see also Fig. 2～shown in Figure 4, when circuit substrate 30 places on the lower roll wheels 20, running roller 22 on it is subjected to the transmission of transmission rope 222 and rotates around revolving bar 21, this circuit substrate 30 is passed forward then, treat that it enters, lower roll wheels 10,20, on, lower roll wheels 10, same electrode current on 20 conducts the positive back side in this circuit substrate 30 respectively, and this circuit substrate 30 becomes the negative electrode of a plating form then, when it directly washes away for electroplate liquid, begin then to electroplate, after plating is finished, this circuit substrate 30 is promptly taken out of for the running roller 12 of rotation again, and finishes galvanizing process.
Circuit substrate perforation electroplanting device of the present utility model again is a circulation feeding type, also can be suitable for than big or the thicker circuit substrate of thickness volume, do not commonly use the shortcoming that electroplating machine promptly can't be implemented as larger-size circuit substrate and have, and directly following electroplate liquid towards formula, hydrous water flat electroplanting device, can guarantee that this electroplate liquid immerses in the hole of circuit substrate, make its metallization, and the complete perforation galvanizing process of finishing.
Claims (1)
1, a kind of circuit substrate perforation electroplanting device, it is characterized by: mainly be on a body, to be provided with the upper and lower roll wheels, wherein roller set is to be provided with several running rollers on most revolving bars, this revolving bar is to be hubbed at respectively on the cell body that both sides form on the body, and these running roller central authorities are formed with chute, circle is wound with transmission rope on this chute, and this transmission cringle is around on the running roller on each transmission rod, and this running roller is constituted by a conductor again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91218572 CN2098509U (en) | 1991-07-25 | 1991-07-25 | Electroplating device for horizontal holes on pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91218572 CN2098509U (en) | 1991-07-25 | 1991-07-25 | Electroplating device for horizontal holes on pcb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2098509U true CN2098509U (en) | 1992-03-11 |
Family
ID=4926020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 91218572 Withdrawn CN2098509U (en) | 1991-07-25 | 1991-07-25 | Electroplating device for horizontal holes on pcb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2098509U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103911640A (en) * | 2013-01-05 | 2014-07-09 | 刘仁志 | Apparatus for horizontally electroplating printed wiring board used for vertical-type groove |
-
1991
- 1991-07-25 CN CN 91218572 patent/CN2098509U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103911640A (en) * | 2013-01-05 | 2014-07-09 | 刘仁志 | Apparatus for horizontally electroplating printed wiring board used for vertical-type groove |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |