CN214782230U - Cathode conductive pressing type conveying roller horizontal copper plating device - Google Patents
Cathode conductive pressing type conveying roller horizontal copper plating device Download PDFInfo
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- CN214782230U CN214782230U CN202120990417.2U CN202120990417U CN214782230U CN 214782230 U CN214782230 U CN 214782230U CN 202120990417 U CN202120990417 U CN 202120990417U CN 214782230 U CN214782230 U CN 214782230U
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- copper plating
- cathode conductive
- conveying roller
- pressing type
- type conveying
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Abstract
The utility model discloses a cathode conductive pressing type conveying roller horizontal copper plating device, which comprises a frame, a pretreatment mechanism, a copper plating cylinder mechanism and a post-treatment mechanism; the rack is provided with a horizontally arranged transmission mechanism; the copper plating cylinder mechanism comprises a cylinder body and a pressing assembly, a liquid sprayer is arranged in the cylinder body, the pressing assembly comprises a cathode conductive pressing type conveying roller and a second guide wheel, and the cathode conductive pressing type conveying roller is electrified; the pretreatment mechanism, the copper plating cylinder mechanism and the post-treatment mechanism are sequentially arranged along the transmission direction of the transmission mechanism; the materials to be plated with copper are always conveyed by the conveying mechanism to keep the movement process, copper ions can quickly move and adsorb to the materials to be plated with negative electricity, and the positions of the materials to be plated with copper are continuously changed in the movement process, so that the consistency of copper plating on the whole surfaces of the materials to be plated with copper can be ensured.
Description
Technical Field
The utility model relates to a copper facing field, especially a horizontal copper facing device of electrically conductive pressing mode conveying gyro wheel of negative pole.
Background
Continuous vertical copper plating and gantry copper plating are generally used for copper plating of the flexible circuit board, and the copper plating modes easily cause obvious potential difference, uneven copper thickness on the board surface and falling of the self weight of the substrate; the copper plating effect is not good, which brings difficulty to the subsequent production process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a negative pole electrically conductive pressing mode conveying roller horizontal copper facing device.
The utility model provides a technical scheme that its problem adopted is:
the utility model provides a horizontal copper facing device of electrically conductive pressing mode conveying roller of negative pole, includes:
the device comprises a rack, wherein a horizontally arranged transmission mechanism is arranged on the rack;
the pretreatment mechanism is arranged on the rack;
the copper plating cylinder mechanism is arranged on the rack and comprises a cylinder body and pressing assemblies arranged on two sides outside the cylinder body, a liquid sprayer for spraying copper plating liquid is arranged in the cylinder body, each pressing assembly comprises a cathode conductive pressing type conveying roller and a second guide wheel, the cathode conductive pressing type conveying rollers clamp materials to be plated from two sides respectively, and the cathode conductive pressing type conveying rollers are electrified;
the post-processing mechanism is arranged on the rack;
the pretreatment mechanism, the copper plating cylinder mechanism and the post-treatment mechanism are sequentially arranged along the transmission direction of the transmission mechanism.
Furthermore, an ultrasonic device or an electric vibration device is arranged in the cylinder body.
Further, pretreatment mechanism includes along deoiling device, first washing device, microetching device and the second washing device that transmission direction of transmission mechanism set gradually.
Further, the post-processing mechanism comprises a second-stage water washing device, a first-stage water washing device and a hot air drying device which are sequentially arranged along the transmission direction of the transmission mechanism.
Further, a material discharging device is arranged at the front end of the conveying mechanism, and a material receiving device is arranged at the rear end of the conveying mechanism.
Further, the cathode conductive pressing type conveying roller is provided with an electrode and an electric brush, and the cathode conductive pressing type conveying roller is electrically connected with the rectifier.
Further, the liquid sprayer comprises an upper liquid sprayer and a lower liquid sprayer, and the upper liquid sprayer and the lower liquid sprayer are respectively positioned on the upper side and the lower side of the transmission mechanism.
Further, a plurality of anode bags are arranged in the cylinder body; the anode bags are connected with an anode conducting rod, and the anode conducting rod is electrically connected with the rectifier.
Further, the import and the export of cylinder body all are equipped with waterproof guide wheel group.
Further, a limiting backflow device and a circulating water pump are arranged in the cylinder body.
The copper plating device at least has the following beneficial effects: in the process of passing through the cylinder body, the material to be plated is always in contact with one or two of the cathode conductive pressing type conveying rollers positioned on the two sides of the cylinder body, so that the material to be plated is always in a conductive state, and electrolytic reaction is guaranteed to be carried out to plate copper on the surface of the material to be plated. In the process of copper plating, the materials to be plated are always conveyed by the conveying mechanism to keep the process of movement, copper ions can quickly move and adsorb to the materials to be plated with negative electricity, and the positions of the materials to be plated for power supply are continuously changed in the movement process, so that the consistency of copper plating on the whole surface of the materials to be plated can be ensured, the copper plating on the surface of the materials to be plated is uniform, and the copper plating quality is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples.
FIG. 1 is a structural diagram of a cathode conductive pressing type conveying roller horizontal copper plating device according to an embodiment of the present invention;
FIG. 2 is a structural view of a copper plating cylinder mechanism.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 and 2, an embodiment of the present invention provides a cathode conductive compact type conveying roller horizontal copper plating apparatus.
The copper plating device comprises a frame 100, a pretreatment mechanism 200, a copper plating cylinder mechanism 400 and a post-treatment mechanism 300.
Wherein, the rack 100 is provided with a horizontally arranged transmission mechanism 110; the preprocessing mechanism 200 is arranged on the frame 100; the copper plating cylinder mechanism 400 is arranged on the frame 100, the copper plating cylinder mechanism 400 comprises a cylinder body 410 and pressing assemblies 420 arranged on two sides outside the cylinder body 410, a liquid sprayer 430 for spraying copper plating liquid is arranged in the cylinder body 410, the pressing assemblies 420 comprise a cathode conductive pressing type conveying roller 421 and a second guide wheel 422 for clamping a material to be plated with copper from two sides respectively, and the cathode conductive pressing type conveying roller 421 is electrified; the post-processing mechanism 300 is provided on the rack 100; the pretreatment mechanism 200, the copper plating cylinder mechanism 400, and the post-treatment mechanism 300 are arranged in this order along the conveyance direction of the conveyance mechanism 110.
In the embodiment, a material to be plated with copper is placed on a horizontally arranged conveying mechanism 110 for conveying, the surface of the material to be plated with copper is pretreated by a pretreatment mechanism 200, the pretreated material to be plated with copper enters a copper plating cylinder mechanism 400 and is pressed by a pressing component 420, meanwhile, a cathode conductive pressing type conveying roller 421 is electrified, so that the material to be plated with copper, which is in contact with the cathode conductive pressing type conveying roller 421, is electrified, the electrified material to be plated with copper enters a cylinder body 410 and is subjected to an electrolytic reaction with copper plating liquid in the cylinder body 410, and copper is plated on the surface of the material to be plated with copper; the material after copper plating enters the post-processing mechanism 300 for post-processing.
It should be noted that, in the process of passing through the cylinder 410, the material to be plated is always in contact with one or two of the cathode conductive pressing type conveying rollers 421 located at the two sides of the cylinder 410, so that the material to be plated is always kept in a conductive state, and an electrolytic reaction is ensured to be performed to plate copper on the surface of the material to be plated. In the process of copper plating, the materials to be plated are always transmitted by the transmission mechanism 110 to keep the motion process, copper ions can quickly move and adsorb to the materials to be plated with negative electricity, and the positions of the materials to be plated for power supply are continuously changed in the motion process, so that the consistency of copper plating on the whole surface of the materials to be plated can be ensured, the copper plating on the surface of the materials to be plated is uniform, and the copper plating quality is improved. The copper plating mode has no potential difference, does not need to reserve an electroplating position on the edge of the plate, and can increase the utilization rate of the substrate.
In addition, the pressing assembly 420 at each side comprises at least two sets of guide wheel sets consisting of a cathode conductive pressing type conveying roller 421 and a second guide wheel 422, wherein the cathode conductive pressing type conveying roller 421 of one set of guide wheel set is arranged at the upper side of the material to be plated with copper, and the cathode conductive pressing type conveying roller 421 of the other set of guide wheel set is arranged at the lower side of the material to be plated with copper, so as to ensure that the material to be plated with copper is electrified.
Specifically, the material to be plated with copper is in the shape of a flat long plate.
In some embodiments of the present invention, an ultrasonic device or an electric vibration device is disposed in the cylinder 410.
In the embodiment, the material to be plated with copper has small holes or micropores, and the small holes or the micropores are required to be plated with copper; however, because the small holes or the micropores have a water film effect, the copper plating solution can easily form a water film in the small holes or the micropores of the material to be plated with copper, and can not enter the holes, so that the small holes or the micropores can not be plated with copper; the water film effect is eliminated by an ultrasonic device or an electric vibration device, so that the copper plating solution can enter the small holes or the micropores, and then the small holes or the micropores can be plated with copper.
In some embodiments of the present invention, the pretreatment mechanism 200 includes an oil removing device 210, a first water washing device 220, a micro-etching device 230, and a second water washing device 240, which are sequentially disposed along the transmission direction of the transmission mechanism 110.
In this embodiment, the surface of the material to be plated with copper is subjected to degreasing treatment by a degreasing device 210; the materials to be plated with copper after being subjected to oil removal treatment are washed by the first washing device 220, so that the surfaces of the materials to be plated with copper are clean, and the influence on the subsequent microetching process is avoided. Carrying out microetching treatment on the surface of the material to be plated with copper by using a microetching device 230; the material to be plated with copper after the microetching treatment is washed by the second washing device 240, so that the surface of the material to be plated with copper is clean, and the subsequent electroplating process is prevented from being affected.
Certain embodiments of the present disclosure, the post-processing mechanism 300 includes a second-stage washing device 310, a first-stage washing device 320, and a hot air drying device 330, which are sequentially arranged along the transmission direction of the transmission mechanism 110.
In this embodiment, the electroplated material is subjected to secondary water washing by the secondary water washing device 310, and then subjected to primary water washing by the primary water washing device 320, so as to remove the copper plating solution residue on the surface of the material, so that the surface of the material is clean. The material is then hot air dried by the hot air drying device 330 so that the surface of the material is free of residual moisture.
The utility model discloses a certain embodiment, the front end of transport mechanism 110 is equipped with blowing device 120, and the rear end of transport mechanism 110 is equipped with material collecting device 130. The material to be plated with copper is automatically placed on the conveying mechanism 110 through the discharging device 120, and the material to be plated with copper is automatically withdrawn from the conveying mechanism 110 through the receiving device 130.
Specifically, the transmission mechanism 110 is composed of a plurality of guide wheels.
The copper plating device realizes unmanned, automatic and intelligent operation. And the roll-to-roll continuous production is adopted, so that the production efficiency is greatly improved.
The utility model discloses a certain embodiment is equipped with electrode and brush on the electrically conductive pressing mode transfer roller 421 of negative pole, and the electrically conductive pressing mode transfer roller 421 of negative pole is connected with rectifier 440 electricity. Good contact with the material to be plated is ensured by the electric brush. Because the material to be plated with copper is subjected to reduction reaction, the material to be plated with copper is a cathode, and the material to be plated with copper is in contact with the material to be plated with copper and is a cathode conductive compression type conveying roller 421. The cathode conductive pressing type conveying roller 421 and the second guide wheel 422 of the pressing device are both positioned outside the cylinder body 410 and are not in contact with the copper plating solution.
In some embodiments of the present invention, the liquid sprayer 430 includes an upper liquid sprayer 430 and a lower liquid sprayer 430, and the upper liquid sprayer 430 and the lower liquid sprayer 430 are respectively disposed on the upper side and the lower side of the transmission mechanism 110. The transport mechanism 110 is positioned between the upper sprayer 430 and the lower sprayer 430, the upper sprayer 430 facing the transport mechanism 110, and the lower sprayer 430 facing the transport mechanism 110.
In some embodiments of the present invention, a plurality of anode bags 451 are disposed in the cylinder 410; the plurality of anode pockets 451 are connected to an anode conductive rod 452, and the anode conductive rod 452 is electrically connected to the rectifier 440. The anode bag 451 functions to filter the anode impurities and to make the distribution of the metal ions separated out from the anode more uniform when entering the copper plating solution.
In addition, the rectifier 440 is electrically connected to the rectifier switch. The rectifier 440 functions to convert the alternating current into direct current.
In some embodiments of the present invention, the inlet and outlet of the cylinder 410 are provided with a waterproof guide wheel set 460. The sealing performance of the cylinder body 410 is ensured through the waterproof guide wheel, and the copper plating solution is prevented from leaking.
In some embodiments of the present invention, a limiting backflow device 471 and a circulating water pump 472 are disposed in the cylinder 410. The recycling of the copper plating solution in the cylinder 410 is realized through the limiting reflux device 471 and the circulating water pump 472.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and the technical effects of the present invention can be achieved by the same means, which all belong to the protection scope of the present invention.
Claims (10)
1. The utility model provides a horizontal copper facing device of electrically conductive pressing mode conveying roller of negative pole which characterized in that includes:
the device comprises a rack, wherein a horizontally arranged transmission mechanism is arranged on the rack;
the pretreatment mechanism is arranged on the rack;
the copper plating cylinder mechanism is arranged on the rack and comprises a cylinder body and pressing assemblies arranged on two sides outside the cylinder body, a liquid sprayer for spraying copper plating liquid is arranged in the cylinder body, each pressing assembly comprises a cathode conductive pressing type conveying roller and a second guide wheel, the cathode conductive pressing type conveying rollers clamp materials to be plated from two sides respectively, and the cathode conductive pressing type conveying rollers are electrified;
the post-processing mechanism is arranged on the rack;
the pretreatment mechanism, the copper plating cylinder mechanism and the post-treatment mechanism are sequentially arranged along the transmission direction of the transmission mechanism.
2. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein an ultrasonic device or an electric vibration device is arranged in the cylinder body.
3. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein the pretreatment mechanism comprises an oil removing device, a first water washing device, a micro-etching device and a second water washing device which are arranged in sequence along the conveying direction of the conveying mechanism.
4. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein the post-treatment mechanism comprises a secondary water washing device, a primary water washing device and a hot air drying device which are sequentially arranged along the conveying direction of the conveying mechanism.
5. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein a discharging device is arranged at the front end of the conveying mechanism, and a receiving device is arranged at the rear end of the conveying mechanism.
6. The horizontal copper plating device with the cathode conductive pressing type conveying roller according to claim 1, wherein the cathode conductive pressing type conveying roller is provided with an electrode and an electric brush, and the cathode conductive pressing type conveying roller is electrically connected with a rectifier.
7. The apparatus of claim 1, wherein the liquid sprayer comprises an upper liquid sprayer and a lower liquid sprayer, the upper liquid sprayer and the lower liquid sprayer are respectively positioned at the upper side and the lower side of the conveying mechanism.
8. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 6, wherein a plurality of anode bags are arranged in the cylinder body; the anode bags are connected with an anode conducting rod, and the anode conducting rod is electrically connected with the rectifier.
9. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein a waterproof guide wheel set is arranged at each of an inlet and an outlet of the cylinder body.
10. The cathode conductive pressing type conveying roller horizontal copper plating device according to claim 1, wherein a limiting backflow device and a circulating water pump are arranged in the cylinder body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120990417.2U CN214782230U (en) | 2021-05-08 | 2021-05-08 | Cathode conductive pressing type conveying roller horizontal copper plating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120990417.2U CN214782230U (en) | 2021-05-08 | 2021-05-08 | Cathode conductive pressing type conveying roller horizontal copper plating device |
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| Publication Number | Publication Date |
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| CN214782230U true CN214782230U (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120990417.2U Active CN214782230U (en) | 2021-05-08 | 2021-05-08 | Cathode conductive pressing type conveying roller horizontal copper plating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115074795A (en) * | 2022-08-19 | 2022-09-20 | 昆山科比精工设备有限公司 | Cathode conducting device and electroplating equipment |
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2021
- 2021-05-08 CN CN202120990417.2U patent/CN214782230U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115074795A (en) * | 2022-08-19 | 2022-09-20 | 昆山科比精工设备有限公司 | Cathode conducting device and electroplating equipment |
| CN115074795B (en) * | 2022-08-19 | 2023-01-31 | 昆山科比精工设备有限公司 | Cathode conducting device and electroplating equipment |
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