CN113481573A - Film coating machine, electroplating production line and continuous production method of battery current collector - Google Patents
Film coating machine, electroplating production line and continuous production method of battery current collector Download PDFInfo
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- CN113481573A CN113481573A CN202110736842.3A CN202110736842A CN113481573A CN 113481573 A CN113481573 A CN 113481573A CN 202110736842 A CN202110736842 A CN 202110736842A CN 113481573 A CN113481573 A CN 113481573A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000010924 continuous production Methods 0.000 title claims abstract description 12
- 239000007888 film coating Substances 0.000 title description 7
- 238000009501 film coating Methods 0.000 title description 7
- 238000007747 plating Methods 0.000 claims abstract description 188
- 230000000694 effects Effects 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 63
- 238000007789 sealing Methods 0.000 claims description 47
- 238000004140 cleaning Methods 0.000 claims description 42
- 238000005406 washing Methods 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 230000033001 locomotion Effects 0.000 claims description 16
- 238000005554 pickling Methods 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 14
- 238000004804 winding Methods 0.000 claims description 12
- 230000001174 ascending effect Effects 0.000 claims description 10
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 230000003064 anti-oxidating effect Effects 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 2
- 230000015556 catabolic process Effects 0.000 abstract description 10
- 238000001816 cooling Methods 0.000 abstract description 7
- 210000002469 basement membrane Anatomy 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 239000002253 acid Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 230000009347 mechanical transmission Effects 0.000 description 3
- 210000004379 membrane Anatomy 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000011149 active material Substances 0.000 description 2
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- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a film plating machine, an electroplating production line and a continuous production method of a battery current collector, wherein the film plating machine comprises a plating solution tank, a conductive base film conveying device and a power supply, wherein plating solution and an anode piece are arranged in the plating solution tank; the conductive base film conveying devices are arranged on two sides of the plating solution tank and used for clamping two opposite side edges of the horizontally placed conductive base film and driving the conductive base film to horizontally enter and exit the plating solution tank along a first direction; the positive pole of power with positive pole spare electricity is connected, and the negative pole of power passes through electrically conductive basement membrane conveyer to be connected with electrically conductive basement membrane electricity. Thereby can guarantee the cooling effect of electrically conductive base film, prevent that electrically conductive base film from appearing the phenomenon of electric breakdown.
Description
Technical Field
The application relates to the technical field of electroplating, in particular to a coating machine, an electroplating production line and a continuous production method of a battery current collector.
Background
The lithium ion battery is used as a new green and environment-friendly energy source, and has the advantages of large capacity, small volume, light weight and the like. The method is widely applied to the fields of electric vehicles, digital products, household appliances and the like.
The current collector is an important component of a lithium ion battery, and mainly refers to a matrix metal, such as copper foil, aluminum foil and the like, for attaching an active material to a positive electrode or a negative electrode of the battery. The function of the battery is mainly to collect the current generated by the active materials of the battery so as to form larger current to be output. When the current collector is manufactured, a thicker metal plating layer is usually formed on the conductive base film in an electroplating mode so as to ensure the conductivity of the current collector. The conductive base film can be electroplated by a film plating machine.
The current access of current with the power negative pole of current coating machine adopts conductive roller usually to make conductive base film electroplated in plating solution, but, because conductive roller sets up outside plating bath groove usually, therefore conductive base film also is in plating bath groove when the conductive roller, exposes the electric conductivity and the cooling effect of the conductive base film in the air and can descend to can make conductive base film the through-hole that electric breakdown appears, influence the product yield and can lead to electroplating efficiency to descend.
Disclosure of Invention
The embodiment of the application discloses a film plating machine, an electroplating production line and a continuous production method of a battery current collector, which can prevent an electric breakdown phenomenon of a conductive base film and can improve electroplating efficiency.
In order to achieve the above object, in a first aspect, an embodiment of the present application discloses a film plating machine, including:
the plating solution tank is internally provided with a plating solution and an anode piece;
the conductive base film conveying devices are arranged on two sides of the plating solution tank and are used for clamping two opposite side edges of a horizontally placed conductive base film and driving the conductive base film to horizontally enter and exit the plating solution tank along a first direction;
and the positive pole of the power supply is electrically connected with the anode piece, and the negative pole of the power supply is electrically connected with the conductive base film through the conductive base film conveying device.
The application embodiment provides a coating machine, at the in-process that electrically conductive base film conveyer drove the conveying of electrically conductive base film, electrically conductive base film conveyer horizontal centre gripping electrically conductive base film carries out the conveying, and electrically conductive to the electrically conductive base film through electrically conductive base film conveyer, need not use the conducting roller to conduct electricity, consequently can make electrically conductive base film be located the plating bath all the time at the coating film in-process to can guarantee the cooling effect of electrically conductive base film, prevent that electrically conductive base film from appearing the phenomenon of electric breakdown. And because the conducting basal membrane in the plating solution has stronger current bearing capacity, the power supply current can be properly increased, so that the plating efficiency is improved.
In a possible implementation manner of the first aspect, the conductive base film conveying apparatus includes:
the first conveying device comprises a first conveying belt, a plurality of first conductive clips and a first driving assembly, the first conveying belt extends along the first direction, the first conductive clips are arranged on the first conveying belt along the first direction, the first conductive clips are communicated with a negative electrode of the power supply, and the first driving assembly is used for driving the first conveying belt to convey the first conductive clips along the first direction;
the second conveying device comprises a second conveying belt, a plurality of second conductive clips and a second driving assembly, the second conveying belt extends along the first direction, the second conductive clips are arranged on the second conveying belt along the first direction, the second conductive clips are communicated with a negative electrode of the power supply, and the second driving assembly is used for driving the second conveying belt to convey the second conductive clips along the first direction;
the first conveying belt and the second conveying belt are symmetrically arranged on two sides of the plating solution tank, and the first conductive clamp and the second conductive clamp are respectively used for clamping two opposite side edges of the conductive base film.
Therefore, the conductive base film can be horizontally clamped and conveyed, and the conductive base film can be electrically connected with the power supply cathode on the premise of not using a conductive roller.
In a possible implementation manner of the first aspect, each of the first conductive clip and the second conductive clip includes:
the first clamping part comprises a first clamping surface, and the first clamping surface is a conductive surface and is communicated with the negative electrode of the power supply;
the second clamping part comprises a second clamping surface which is a conductive surface and is communicated with the negative electrode of the power supply;
the first clamping part and the second clamping part can move relatively to enable the conductive clamp to be in a clamping state or an opening state, and when the conductive clamp clamps the conductive base film, the first clamping surface and the second clamping surface are both in contact conduction with the conductive base film;
the surfaces of the first and second conductive clips are configured to: except the first clamping surface and the second clamping surface, the rest surfaces which can be immersed in plating solution during plating are insulating surfaces.
Therefore, the surfaces of the first conductive clip and the second conductive clip cannot conduct electricity after being immersed in the plating solution, so that the current passing through the conductive base film cannot be reduced, and the reduction of the plating efficiency is prevented.
In a possible implementation manner of the first aspect, a first sealing portion is formed on the first clamping portion around the first clamping surface; a second sealing part is formed on the second clamping part around the second clamping surface; when the conductive clip clamps the conductive base film, the first sealing portion is matched with the second sealing portion to seal the first clamping face and the second clamping face.
Therefore, the plating solution is prevented from contacting the first clamping surface and the second clamping surface, so that the first clamping surface and the second clamping surface are prevented from being plated with copper, the conductive clamp is ensured to be opened and closed smoothly, and the conductive base film is prevented from being punctured by the plating layer of the clamping surface.
In a possible implementation manner of the first aspect, the first sealing portion is a first sealing ring arranged around the first clamping surface, at least part of the first sealing ring protrudes out of the first clamping surface, the second sealing portion is a first annular sealing groove arranged around the second clamping surface, and when the conductive clamp is in a clamping state, the part of the first sealing ring protruding out of the first clamping surface is matched and clamped into the first annular sealing groove.
Therefore, the matching structure of the sealing ring and the annular sealing groove is adopted, the sealing area can be increased, and the sealing effect is further improved.
In a possible implementation manner of the first aspect, the plating solution tank further includes an opening and closing mechanism, the opening and closing mechanism includes a first guide rail and a second guide rail that are symmetrically disposed on two sides of the plating solution tank, the first guide rail and the second guide rail both extend along the first direction, the first guide rail is used for being matched with the first conductive clip to guide the first conductive clip to be opened or closed, and the second guide rail is used for being matched with the second conductive clip to guide the second conductive clip to be opened or closed.
Therefore, the normally open type conductive clamp can be opened or closed at a preset position.
In a possible implementation manner of the first aspect, the first conductive clip is a normally open conductive clip, the first guide rail corresponds to the position of the plating solution tank, the first guide rail includes a closed guide section, a horizontal guide section, and an open guide section, which are sequentially arranged along the first direction, when the first conductive clip slides along the closed guide section, the first conductive clip is gradually closed under a guide effect of the closed guide section, when the first conductive clip slides along the horizontal guide section, the first conductive clip is kept in a clamping state to move, and when the first conductive clip slides along the open guide section, the first conductive clip is gradually opened under a guide effect of the open guide section.
Therefore, the normally open type conductive clamp can be opened or closed at a preset position.
In a possible implementation manner of the first aspect, the normally-open conductive clip includes a bracket, a guide post is disposed on the bracket, both the first clamping portion and the second clamping portion are slidably connected to the guide post, and an elastic member is disposed between the first clamping portion and the second clamping portion and used for keeping the first clamping portion and the second clamping portion in an open state; the movement track of the first conductive clamp is positioned between the upper guide rail and the lower guide rail, along the movement direction of the first conductive clamp, the distance between the lower surface of the upper guide rail and the upper surface of the lower guide rail is gradually reduced, then is kept unchanged, and finally is gradually increased, and the part with the unchanged distance corresponds to the position of the plating solution tank.
From this, when the electrically conductive clamp of open in usual moves the part that reduces gradually to the top rail and lower rail interval, first clamping part and second clamping part are extruded and draw close gradually by top rail and lower rail respectively, with the electrically conductive base film of centre gripping, the electrically conductive clamp of open in usual keeps the in-process of unchangeable part motion at the interval, electrically conductive base film is the electrically conductive centre gripping conveying of the electrically conductive clamp of open in plating bath tank, when the electrically conductive clamp of open in usual moves the part that increases gradually to top rail and lower rail interval, first clamping part and second clamping part keep away from each other gradually under the effect of elastic component, thereby can loosen electrically conductive base film.
In a possible implementation manner of the first aspect, the conductive clip is a normally closed conductive clip, the first guide rail includes a first guide section and a second guide section, the first guide section corresponds to a slot-in side of the plating solution tank, the second guide section corresponds to a slot-out side of the plating solution tank, when the first conductive clip slides along the first guide section, the first guide section guides the first conductive clip to open, when the first conductive clip slides between the first guide section and the second guide section, the first conductive clip is in a normally closed state, and when the first conductive clip slides along the second guide section, the second guide section guides the first conductive clip to open again.
Therefore, the normally closed conductive clamp can be opened or closed at a preset position.
In a possible implementation manner of the first aspect, the first clamping portion is fixed relative to the first conveyor belt, the second clamping portion is movably connected with the first clamping portion, the second clamping portion can move up and down relative to the first clamping portion, the second clamping surface is located above the first clamping surface, the first guide section and the second guide section both include an ascending slope and a descending slope which are sequentially arranged along the first direction, when the second clamping portion is matched with the ascending slope, the second clamping portion is gradually lifted, so that the first conductive clip is opened, and when the second clamping portion is matched with the descending slope, the second clamping portion gradually descends under the action of gravity, so that the first conductive clip is closed.
Therefore, when the normally closed conductive clamp moves to the tank entering side of the plating solution tank, the second clamping part is matched with the first guide section, the second clamping part is lifted by the ascending inclined surface and then descends along the descending inclined surface, so that the normally closed conductive clamp is opened and then closed, and the conductive base film can be clamped. The electrically conductive base film of normal close formula keeps the centre gripping state conveying in the plating bath groove afterwards, and when the electrically conductive clamp of normal close formula moved to the play groove side of plating bath groove, second clamping part and the cooperation of second guide section, by the ascending inclined plane lifting of second guide section, make the electrically conductive clamp of normal close formula open to unclamp the electrically conductive base film.
In a possible implementation manner of the first aspect, the first conveyor belt and the second conveyor belt are both waist-circular conveyor belts. The waist-shaped circular conveyor belt can circularly convey the plurality of first conductive clips to realize continuous conveying of the conductive base film.
In a possible implementation manner of the first aspect, the first conveyor belt includes a first horizontal segment and a second horizontal segment, the first horizontal segment and the second horizontal segment are parallel to each other and extend along the first direction, one end of the first horizontal segment is connected to one end of the second horizontal segment through a first arc segment, and the other end of the first horizontal segment is connected to the other end of the second horizontal segment through a second arc segment; first drive assembly includes motor, action wheel and follows the driving wheel, the pivot of action wheel with the pivot from the driving wheel is parallel to each other, the motor is used for driving the action wheel rotates, first circular arc section cover is located on the action wheel, second circular arc section cover is located from the driving wheel.
From this, drive the conveying of first conveyer belt through setting up the action wheel and driving the wheel from the driving, can improve the motion stability of conveyer belt.
In a possible implementation manner of the first aspect, the film plating machine further includes a first conductive clip cleaning mechanism and a second conductive clip cleaning mechanism, which are symmetrically arranged on two sides of the plating solution tank, the first conductive clip cleaning mechanism is used for cleaning the first conductive clip, the second conductive clip cleaning mechanism is used for cleaning the second conductive clip, and the first conductive clip cleaning mechanism includes:
the first washing device is arranged at the downstream of the electroplating bath along the motion track of the first conductive clamp and is used for washing the first conductive clamp so as to remove plating solution on the surface of the first conductive clamp;
the pickling electrolysis device is arranged at the downstream of the first washing device along the motion track of the first conductive clamp, and is used for pickling and electrolyzing the first conductive clamp through a pickling solution so as to remove the metal coating on the surface of the first conductive clamp;
and the second washing device is used for washing the first conductive clamp to remove the pickling solution on the surface of the first conductive clamp.
The cleaning mode can prevent the mixing of the pickling solution and the plating solution while ensuring better cleaning effect, thereby avoiding the pollution of the plating solution and the pickling solution.
In a possible implementation manner of the first aspect, the apparatus further includes a conductive mechanism, where the conductive mechanism includes:
the first conductive assembly comprises a plurality of first brushes arranged along the first direction and a plurality of first conductive blocks arranged on the first conveyor belt, the plurality of first brushes are fixed relative to the plating solution tank and are electrically connected with the negative electrode of the power supply, and when the first conveyor belt drives the first conductive blocks to move to the positions of the first brushes, the first conductive blocks can be in sliding electrical connection with the first brushes;
and the second conductive assembly comprises a plurality of second electric brushes arranged along the first direction and a plurality of second conductive blocks arranged on the second conveyor belt, the second electric brushes are fixed relative to the plating solution tank and are electrically connected with the negative electrode of the power supply, and when the first conveyor belt drives the second conductive blocks to move to the positions of the second electric brushes, the second conductive blocks can be electrically connected with the second electric brushes in a sliding manner.
Therefore, the conductive clamp is electrified only when the conductive base film is clamped by the conductive clamp, and electric energy is saved.
In a possible implementation manner of the first aspect, the plating solution tank comprises:
the plating bath is arranged in the main tank;
the plating solution in the main tank can overflow into the auxiliary tank after reaching a preset liquid level;
and the circulating pump is used for pumping the electroplating liquid in the auxiliary tank and conveying the electroplating liquid into the main tank.
Therefore, the cyclic supply of the electroplating solution can be realized, the electroplating solution in the main tank is always in a flowing state, the concentration of metal cations in the electroplating solution can be uniformly distributed, and the uniform thickness of the plating layer on the surface of the conductive base film can be realized.
In a possible implementation manner of the first aspect, the anode member is formed by splicing a plurality of anode member splicing units, the anode member splicing units are arranged along the width direction of the plating solution tank, two adjacent anode member splicing units are separated by an insulating medium, and each anode member splicing unit is connected with the positive electrode of the power supply.
Therefore, the anode piece splicing units can be connected in parallel, the current of the power supply introduced into each anode piece splicing unit is close to each other, and the consistency of the surface coating of the conductive base film is further ensured.
In a second aspect, the embodiment of the present application further discloses an electroplating production line, including setting gradually along the direction of conveyance of the conductive base film:
the unwinding mechanism is used for sending out the conductive base film which is not coated with a film;
a coating machine of the first aspect;
and the winding mechanism is used for winding the conductive base film after coating.
The electroplating production line provided by the embodiment of the application adopts the film coating machine of the first aspect. Therefore, the conductive base film can be always positioned in the plating solution in the film plating process, thereby ensuring the cooling effect of the conductive base film and preventing the conductive base film from electric breakdown. And because the conducting basal membrane in the plating solution has stronger current bearing capacity, the power supply current can be properly increased, so that the plating efficiency is improved.
In a possible implementation manner of the second aspect, a coating machine and the winding mechanism are sequentially provided with:
the cleaning tank is used for cleaning the plating solution on the surface of the conductive base film;
a passivation tank for forming an oxidation-resistant plating layer on a surface of the conductive base film;
the drying oven is used for drying the antioxidant liquid remained on the surface of the conductive base film;
and the cutting device is used for cutting off the areas clamped by the conductive base film conveying device on the two sides of the conductive base film.
Thus, a current collector strip with a uniform plating layer and an antioxidant effect can be formed.
In a third aspect, an embodiment of the present application further discloses a continuous production method of a battery current collector, including the following steps:
unreeling and sending out the conductive base film to be electroplated;
electroplating, wherein a metal coating is formed on the surface of the conductive base film to be electroplated;
passivating, namely forming an anti-oxidation coating on the surface of the electroplated conductive base film;
cutting, removing the edge areas on two sides of the conductive base film which forms the antioxidant coating to form a current collecting belt;
and (6) rolling, namely rolling the current collector belt.
According to the continuous production method of the battery current collector, the whole process can be continuously carried out, the current collector belt with the anti-oxidation effect can be finally formed, roll-to-roll continuous production of the current collector belt can be realized, and therefore the production efficiency can be improved.
In a possible implementation manner of the third aspect, the forming of the metal plating layer on the surface of the conductive base film to be electroplated includes: and clamping two opposite side edges of the horizontally arranged conductive base film, and driving the conductive base film to horizontally enter a plating solution tank for electroplating.
Therefore, the conductive base film can be ensured to be always positioned in the plating solution in the film plating process, so that the phenomenon of electric breakdown of the conductive base film is prevented.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of a conventional electroplating line;
fig. 2 is a schematic perspective view of a film plating machine according to an embodiment of the present invention;
FIG. 3 is a top view of FIG. 2;
FIG. 4 is a perspective view of the first conveyor;
FIG. 5 is a schematic perspective view of a normally open conductive clip;
FIG. 6 is an exploded view of FIG. 5;
FIG. 7 is a schematic structural view of a normally open conductive clip entering and exiting the opening/closing mechanism;
FIG. 8 is a schematic perspective view of a normally closed conductive clip;
FIG. 9 is a schematic view of a normally closed conductive clip in and out of the opening and closing mechanism;
FIG. 10 is a schematic view of a normally closed conductive clip
FIG. 11 is an enlarged view taken at A of FIG. 10;
FIG. 12 is a cross-sectional view A-A of FIG. 10;
FIG. 13 is a schematic view of a second clamping surface of the normally closed conductive clamp;
fig. 14 is a schematic perspective view of a conductive mechanism of a film plating machine according to an embodiment of the present invention;
FIG. 15 is an enlarged view at B of FIG. 14;
FIG. 16 is a schematic top view of a coater provided with a first conductive clip cleaning mechanism and a second conductive clip cleaning mechanism according to an embodiment of the present invention;
FIG. 17 is a sectional view showing the structure of a plating liquid tank;
FIG. 18 is a schematic structural view of an anode member;
FIG. 19 is a schematic structural diagram of an electroplating line according to a second embodiment of the present invention;
fig. 20 is a flowchart of a continuous production method of a current collector provided in the third embodiment of the present invention.
Description of reference numerals:
01-unwinding reel, 02-electrolytic bath, 03-plating bath, 04-water washing bath, 05-passivation bath, 06-drying box, 07-cutter, 08-anode plate, 09-conductive roller, 010-winding drum, 100-plating bath, 101-main bath, 102-auxiliary bath, 103-circulating pump, 104-liquid supply pipe, 105-spraying device, 200-conductive base film conveying device, 201-first conveying belt, 2011-first horizontal segment, 2012-second horizontal segment, 2013-first circular arc segment, 2014-second circular arc segment, 202-second conveying belt, 203-first conductive clamp, 2031-bracket, 2032-first clamping part, 2033-second clamping part, 2034-guide column, 2035-elastic part, 2036-fixed clamping part, 2037-a movable clamping part, 20361-a first clamping surface, 20371-a second clamping surface, 2038-a first sealing part, 2039-a second sealing part, 204-a second conductive clip, 205-a first driving component, 2051-a driving wheel, 2052-a driven wheel, 206-a second driving component, 300-an anode piece, 301-an anode piece splicing unit, 302-an insulating medium, 400-an opening and closing mechanism, 401-an upper rail, 402-a lower rail, 403-a first guide section, 404-a second guide section, 4031-an ascending slope, 4032-a descending slope, 405-a oval rail, 500-a conductive mechanism, 510-a first conductive component, 511-a first conductive block, 512-a first brush, 520-a second conductive component, 521-a second conductive block, 522-a second electric brush, 600-a first conductive clip cleaning mechanism, 601-a first water washing device, 602-an acid washing electrolysis device, 603-a second water washing device, 700-a second conductive clip cleaning mechanism and 1-an unwinding mechanism; 2-a first flattening roll, 3-a film coating machine, 4-a cleaning tank, 5-a passivation tank, 6-an oven, 7-a cutting device, 8-a second flattening roll, 9-a pressing roll, 10-a winding device and 800-a conductive base film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
Electroplating is the process of plating a layer of other metal or alloy on the surface of some plated parts by using the principle of electrolysis. Specifically, a plating metal or other insoluble materials is used as an anode, a workpiece to be plated is used as a cathode, and a liquid containing plating metal ions is used as a plating solution. Before electroplating, the anode and the cathode are electrified, the current forms a loop among the anode, the plating solution and the cathode, and cations of plating metal are reduced on the surface of a workpiece to be plated to form a plating layer in the electroplating process.
In a process of manufacturing a current collector of a lithium ion battery, a thick metal plating layer is generally formed on a conductive base film using an electroplating process to manufacture the current collector. The electroplating process can be specifically completed by using a film coating machine.
As shown in fig. 1, the structure of an electroplating production line is schematically illustrated, and the electroplating production line includes a reel 01, an electrolyte tank 02, a water washing tank 04, a passivation tank 05, a drying box 06, a slitter 07 and a reel 010, which are sequentially arranged, wherein a plurality of plating tanks 03 are arranged in the electrolyte tank 02, plating solutions and anode plates 08 are arranged in the plating tanks 03, and conductive rollers 09 are arranged outside the plating tanks 03. The conductive base film is discharged from the unwinding cylinder 01 and then sequentially enters each plating solution pool 03 for electroplating, the anode plate 08 in each plating solution pool 03 is electrically connected with the anode of a power supply, the conductive rollers 09 are electrically connected with the cathode of the power supply, and the conductive base film 800 passes between the two conductive rollers 09 and is in contact with the conductive rollers 09, so that the conductive base film 800 is communicated with the cathode of the power supply, and the conductive base film 800 in each plating solution pool 03 is electroplated.
Since the conductive roller 09 is made of metal, the conductive roller 09 can only be disposed outside the plating solution tank 03 in order to prevent the surface of the conductive roller 09 from being plated. Therefore, the conductive base film 800 is also positioned outside the plating solution tank 03 when passing through the conductive roller 09, and the cooling effect of the conductive base film 800 exposed in the air is reduced, so that the conductive base film 800 has through holes for electrical breakdown, and the product yield is affected. And since the conductive base film 800 exposed to the air is weakened in the ability to withstand current, a larger current cannot be applied, thereby affecting the conductive efficiency.
In view of this point, embodiments of the present invention provide a film plating machine and an electroplating production line, which can keep a conductive base film in a plating solution all the time during a film plating process, thereby preventing the conductive base film from electrical breakdown and improving the conductive efficiency.
The coating machine and the electroplating line are explained in detail by the following specific examples:
example one
The embodiment of the application provides a film coating machine, as shown in fig. 2 and fig. 3, comprising a plating solution tank 100, a conductive base film conveying device 200 and a power supply, wherein the plating solution tank 100 is internally provided with a plating solution and an anode part 300; wherein the anode member 300 is immersed in the plating solution and electrically connected to the positive electrode of the power supply to serve as an anode for plating.
The conductive base film conveying device 200 is used for clamping two opposite side edges of a horizontally placed conductive base film 800 and driving the conductive base film 800 to horizontally enter and exit the plating solution tank 100 along a first direction; also, the conductive base film transfer apparatus 200 is in communication with a negative electrode of a power source so that current can be conducted to the conductive base film 800, making the conductive base film 800 a plating cathode.
In the process that electrically conductive base film conveyor 200 drove electrically conductive base film 800 and conveys, electrically conductive base film conveyor 200 horizontal centre gripping electrically conductive base film 800 carries out the conveying, and electrically conducts to electrically conductive base film 800 through electrically conductive base film conveyor 200, need not use the conducting roller to conduct electricity, consequently electrically conductive base film 800 is located the plating bath all the time at the coating film in-process to can guarantee electrically conductive base film 800's cooling effect, prevent that electrically conductive base film 800 from appearing the phenomenon of electric breakdown. And because the conductive basement membrane 800 in the plating solution bears the current ability stronger, so can increase the supply current properly, make the electroplating efficiency promote.
The first direction is a transport direction of the conductive base film 800, and may be a longitudinal direction of the plating liquid tank 100, i.e., an X direction in fig. 2 and 3.
In order to achieve horizontal clamping and conveyance of the conductive base film 800, as shown in fig. 2 and 3, the conductive base film conveyance apparatus 200 may specifically include a first conveyance apparatus including a first conveyance belt 201, a first driving assembly 205, and a first conductive nip 203, and a second conveyance apparatus. The second conveyor comprises a second conveyor belt 202, a second drive assembly 206, and a second conductive clip 204. First conveyer belt 201 and second conveyer belt 202 are parallel to each other and extend along the X direction, first conveyer belt 201 and second conveyer belt 202 set up respectively in the both sides of plating bath 100, be equipped with a plurality of edges on the first conveyer belt 201 the first electrically conductive clamp 203 that the X direction was arranged, be equipped with a plurality of second electrically conductive clamps 204 that arrange along the X direction on the second conveyer belt 202, first drive assembly 205 is used for driving first conveyer belt 201 and conveys along the X direction, and then drives first electrically conductive clamp 203 and removes along the X direction, second drive assembly 206 is used for driving second conveyer belt 202 and conveys along the X direction, and then drives second electrically conductive clamp 204 and remove along the X direction.
The first conductive clip 203 and the second conductive clip 204 are respectively used for clamping two opposite side edges of the conductive base film 800 which is horizontally placed, and when the first conductive clip 203 and the second conductive clip 204 clamp the conductive base film 800, the first conductive clip 203 and the second conductive clip 204 can be communicated with a negative electrode of a power supply. Thus, horizontal clamping and conveyance of the conductive base film 800 can be achieved, and electrical connection of the conductive base film 800 and the power supply negative electrode can be achieved without using a conductive roller.
The following description will be made of a specific implementation of the clamping and conveying of the conductive base film 800 by only taking the first conveyor belt 201 and the first conductive clip 203 as an example, and the clamping and conveying manner of the second conveyor belt 202 and the second conductive clip 204 can be referred to similarly.
As shown in fig. 4, the first conveyor belt 201 is a closed oval structure and is driven to rotate by the driving wheel 2051 and the driven wheel 2052, specifically, the oval conveyor belt includes a first horizontal segment 2011 and a second horizontal segment 2012 parallel to each other, the first horizontal segment 2011 and the second horizontal segment 2012 are parallel to each other and extend along the X direction, one end of the first horizontal segment 2011 and one end of the second horizontal segment 2012 are connected by a first circular arc segment 2013, and the other end are connected by a second circular arc segment 2014. The first arc section 2013 is sleeved on the driving wheel 2051, the second arc section 2014 is sleeved on the driven wheel 2052, the rotating shaft of the driving wheel 2051 and the rotating shaft of the driven wheel 2052 are both vertically arranged, the conveyor belt is vertically arranged, namely the surface of the conveyor belt is vertical to the horizontal plane, and when the driving wheel 2051 rotates, the waist-shaped conveyor belt can be driven to move along a waist-shaped track parallel to the horizontal plane.
The process of conveying the conductive base film 800 by the first conveyor belt 201 as described above is roughly as follows: plating bath groove 100 is close to first horizontal segment 2011 setting, and first electrically conductive clamp 203 arranges at the circumference of oval conveyer belt a week, and electrically conductive base film 800 is held to first electrically conductive clamp 203 when being close to plating bath groove 100 to drive electrically conductive base film 800 and get into plating bath groove 100, pass through the centre gripping simultaneously and towards electrically conductive base film 800 circular telegram. After leaving plating solution tank 100, first conductive clip 203 loosens conductive base film 800 to under the drive of oval conveyer belt turn to the side that is kept away from plating solution tank 100, can set up first conductive clip wiper mechanism in the side that first conveyer belt 201 deviates from plating solution tank 100, in order to wash plating solution and the cladding material on first conductive clip 203, first conductive clip 203 after the washing is conveyed to the side that is close to plating solution tank 100 by oval conveyer belt again, with the conductive base film 800 of follow-up entering of centre gripping conveying. The plurality of first conductive clips 203 provided on the first conveyor belt 201 cyclically perform the above operations to realize continuous conveyance of the conductive base film 800.
In the above process, in order to open or close the first conductive clip 203 at a preset position, an opening and closing mechanism 400 for controlling the opening and closing of the first conductive clip 203 may be disposed on a motion trace of the first conductive clip 203. The opening and closing mechanism 400 is different for the first conductive clip 203 with different structures, which will be described below.
In a possible implementation manner, as shown in fig. 5 and fig. 6, the first conductive clip 203 is a normally open conductive clip, and the conductive clip includes a bracket 2031, a first clamping portion 2032 and a second clamping portion 2033, a guide column 2034 is disposed on the bracket 2031, the first clamping portion 2032 and the second clamping portion 2033 are both connected to the guide column 2034 in a sliding manner, an elastic member 2035 is disposed between the first clamping portion 2032 and the second clamping portion 2033, and the elastic member 2035 is configured to keep the first clamping portion 2032 and the second clamping portion 2033 in an open state.
In order to open or close the normally open conductive clip at a predetermined position, the opening and closing mechanism 400 may be configured as follows: as shown in fig. 7, the opening and closing mechanism 400 includes an upper guide rail 401 and a lower guide rail 402 which are oppositely arranged, the motion track of the first conductive clip 203 is located between the upper guide rail 401 and the lower guide rail 402, along the motion direction of the first conductive clip 203, the distance between the lower surface of the upper guide rail 401 and the upper surface of the lower guide rail 402 is gradually reduced, then is kept unchanged, and finally is gradually increased, and the part where the distance is kept unchanged corresponds to the position of the plating solution tank 100. Therefore, when the normally-open conductive clip moves to the portion where the distance between the upper rail 401 and the lower rail 402 is gradually reduced, the first clamping portion 2032 and the second clamping portion 2033 are respectively squeezed by the upper rail 401 and the lower rail 402 and gradually get close to each other, finally, when the normally-open conductive clip enters the portion where the distance between the upper rail 401 and the lower rail 402 is not changed, the first clamping portion 2032 and the second clamping portion 2033 are closed to clamp the conductive base film 800, and during the movement of the portion where the distance between the normally-open conductive clip is not changed, the conductive base film 800 is clamped and conveyed in the plating solution tank 100 by the normally-open conductive clip, and when the normally-open conductive clip moves to the portion where the distance between the upper rail 401 and the lower rail 402 is gradually increased, the first clamping portion 2032 and the second clamping portion 2033 gradually get away from each other under the action of the elastic member 2035, so that the conductive base film 800 is loosened. Therefore, the normally open type conductive clamp can be opened or closed at a preset position.
In another possible implementation manner, as shown in fig. 8, the first conductive clip 203 is a normally closed conductive clip, and the conductive clip includes a fixed clamping portion 2036 and a movable clamping portion 2037, the fixed clamping portion 2036 is fixed with respect to the first conveying belt 201, the movable clamping portion 2037 is movably connected to the fixed clamping portion 2036, the movable clamping portion 2037 can move up and down with respect to the fixed clamping portion 2036, and a clamping surface of the movable clamping portion 2037 is located above a clamping surface of the fixed clamping portion 2036.
In order to achieve the opening or closing of the normally closed conductive clip at the predetermined position, the opening and closing mechanism 400 may be configured as follows: as shown in fig. 9, the opening and closing mechanism 400 includes a first guide section 403 and a second guide section 404, the first guide section 403 corresponds to the groove-entering side of the plating solution tank 100, the second guide section 404 corresponds to the groove-exiting side of the plating solution tank 100, the first guide section 403 and the second guide section 404 each include an ascending inclined surface 4031 and a descending inclined surface 4032 sequentially arranged along the first direction, when the movable clamping portion 2037 is matched with the ascending inclined surface 4031, the movable clamping portion 2037 is gradually lifted to open the first conductive clip 203, and when the movable clamping portion 2037 is matched with the descending inclined surface 4032, the movable clamping portion 2037 is gradually lowered under the action of gravity to close the first conductive clip 203. Therefore, when the normally closed conductive clip moves to the slot-entering side of the plating solution slot 100, the movable clamping portion 2037 is engaged with the first guide section 403, and the movable clamping portion 2037 is lifted by the ascending inclined surface 4031 and then descends along the descending inclined surface 4032, so that the normally closed conductive clip is opened and then closed, and the conductive base film 800 can be clamped. Then, the normally closed conductive clip is held in a clamping state to transfer the conductive base film 800 in the plating bath tank 100, and when the normally closed conductive clip moves to the outlet side of the plating bath tank 100, the movable clamping portion 2037 is engaged with the second guide section 404 and lifted by the rising inclined surface 4031 of the second guide section 404, so that the normally closed conductive clip is opened to loosen the conductive base film 800. Therefore, the normally closed conductive clamp can be opened or closed at a preset position.
The conductive clip is used for driving the conductive base film 800 to move and conducting the negative electrode of the power supply with the conductive base film 800, so that the conductive clip needs to be conductive. Specifically, taking a normally closed conductive clip as an example, as shown in fig. 10 and 11, the fixing clamping portion 2036 of the conductive clip includes a first clamping surface 20361, the first clamping surface 20361 is a conductive surface and is communicated with the negative electrode of the power supply; the movable clamping portion 2037 of the conductive clip comprises a second clamping surface 20371, the second clamping surface 20371 is a conductive surface and is communicated with the negative electrode of the power supply; when the conductive clip clamps the conductive base film 800, the first clamping surface 20361 and the second clamping surface 20371 are in contact with the conductive base film 800. Thereby, the conductive base film 800 can be conducted with the negative electrode of the power supply.
Since the conductive clip does not need to be connected to a power source when the conductive base film 800 is not sandwiched, the conductive clip may be designed to be powered on only when the conductive base film 800 is sandwiched, and to be disconnected from the power source when the conductive clip does not sandwich the conductive base film 800, in order to save electric power. To achieve the above function, the following conductive mechanism 500 may be employed:
as shown in fig. 14 and 15, the conductive mechanism 500 includes a first conductive member 510 and a second conductive member 520, the first conductive member 510 includes a plurality of first conductive blocks 511 disposed at an upper edge of the first conveyor 201, and a plurality of first brushes 512 disposed at positions close to an edge of the plating bath tank 100 and corresponding to the first horizontal section 2011 of the first conveyor 201, and each of the plurality of first brushes 512 is electrically connected to a negative electrode of the power supply. The plurality of first brushes 512 are fixed structures, do not move with the first conveyor belt 201, and are arranged along the moving path of the first conductive block 511. When the first conveyor belt 201 drives the first conductive block 511 to move to the position of the first brush 512, the first conductive block 511 and the first brush 512 can form sliding electrical connection, so that the first conductive clip 203 corresponding to the lower portion of the first conductive block 511 is conducted with the negative electrode of the power supply. The first conductive block 511 that is not in contact with the first brush 512 is disconnected from the power source, and the corresponding first conductive clip 203 is not energized. Thereby, it is achieved that the first conductive clip 203 is energized only when the conductive base film 800 is sandwiched, thereby saving electric power.
Correspondingly, the second conductive assembly 520 includes a plurality of second conductive blocks 521 disposed on the upper edge of the second conveyor belt 202, and a plurality of second brushes 522 disposed near the edge of the plating solution tank 100 and corresponding to a side of the second conveyor belt 202 near the plating solution tank, each of the plurality of second brushes 522 being electrically connected to the negative electrode of the power supply. The plurality of second brushes 522 are each of a fixed structure, do not move with the second conveyor belt 202, and are arranged along the moving path of the second conductive block 521. The working principle of the second conductive element 520 is similar to that of the first conductive element 510, and is not described herein.
Further, the arrangement length of the plurality of first brushes 512 and the plurality of second brushes 522 along the first direction can be adapted to the length of the plating bath tank 100, so that the first conductive clip 203 and the second conductive clip 204 can be always conducted with the negative electrode of the power supply during the movement of the first conductive clip 203 and the second conductive clip 204 in the plating bath tank 100, and the first conductive clip 203 and the second conductive clip 204 can be disconnected with the power supply when leaving the plating bath tank.
In the electroplating process, the conductive clamp needs to frequently go in and out of the plating solution, and because the conductive clamp is made of a conductive material, a layer of plating layer is often formed on the surface of the conductive clamp, so that the use of the conductive clamp is influenced.
Therefore, in order to prevent the above problem, the conductive clip except for the clamping surface may be designed as an insulating surface, for example, the conductive clip may be made of an insulating material as a whole, only the conductive sheets are disposed on the first clamping surface 20361 and the second clamping surface 20371, and then the conductive sheets are connected to the negative electrode of the power supply through the wires.
Alternatively, as shown in fig. 10, the conductive clip may be made of a conductive metal material, and then an insulating sleeve is coated on the surface of the conductive clip, so that the insulating sleeve is set to be separated from the first clamping surface 20361 and the second clamping surface 20371. The whole inner part of the conductive clamp can be made to be a conductive body, so that the first clamping surface 20361 and the second clamping surface 20371 can be electrified from the inner part of the conductive clamp, for example, a part of conductive surface exposed at the top of the conductive clamp is not coated with an insulating layer, or a conductive hole is formed at the top to be connected with a power supply cathode, so that a lead can be avoided, and the structure of the conductive clamp is simpler.
To further prevent the clamping surfaces of the conductive clip from being plated with copper, a first seal 2038 may be provided around the first clamping surface 20361 and a second seal 2039 may be provided around the second clamping surface 20371, as shown in fig. 11. Thus, when the conductive clip is in the clamped state, the first sealing portion 2038 can cooperate with the second sealing portion 2039 to seal the first clamping surface 20361 and the second clamping surface 20371. When the conductive clamp in the clamping state needs to enter the plating solution, the part of the conductive clamp entering the plating solution is completely protected by the insulating layer, so that the current flowing through the plated part is increased, and the electroplating efficiency is improved. The areas of the conductive clip where the first clamping surface 20361 and the second clamping surface 20371 are located are sealed by the first sealing portion 2038 and the second sealing portion 2039 after being matched, so as to prevent the plating solution from contacting the first clamping surface 20361 and the second clamping surface 20371, thereby preventing the first clamping surface 20361 and the second clamping surface 20371 from being plated with copper, ensuring that the conductive clip can be opened and closed smoothly, and preventing the conductive base film 800 from being punctured by the plating layer of the clamping surfaces.
Specifically, the first sealing portion 2038 and the second sealing portion 2039 can be implemented in various ways, as shown in fig. 12 and 13, the first sealing portion 2038 can be designed as a first sealing ring disposed around the first clamping surface 20361, the second sealing portion 2039 can be designed as a first annular sealing groove disposed around the second clamping surface 20371, when the conductive clip is in the clamping state, a portion of the first sealing ring protruding out of the first clamping surface 20361 is fitted and clamped into the first annular sealing groove, and the conductive base film 800 contacting with an end of the first sealing ring is also squeezed into the first annular sealing groove along with the first sealing ring, so as to seal the first clamping surface 20361 and the second clamping surface 20371 and prevent the plating solution from contacting with the clamping surface. The structure adopts the matching structure of the sealing ring and the annular sealing groove, so that the sealing area can be increased, and the sealing effect is further improved.
Of course, despite the above protective measures, it is possible for the conductive clip to be plated with copper in certain special cases, and the conductive clip will also behave with the plating solution after removal from the plating bath tank 100. The conductive clip removed from the plating bath tank 100 can be cleaned to improve the operational reliability of the conductive clip. Specifically, the conductive clip cleaning mechanism may be provided on the moving track of the conductive clip after the conductive clip is moved out of the plating bath tank 100. As shown in fig. 16, the conductive clip cleaning mechanism includes a first conductive clip cleaning mechanism 600 and a second conductive clip cleaning mechanism 700 symmetrically disposed at two sides of the plating solution tank 100, the first conductive clip cleaning mechanism 600 is used for cleaning the first conductive clip 203, the second conductive clip cleaning mechanism 700 is used for cleaning the second conductive clip 204, the first conductive clip cleaning mechanism 600 is taken as an example for description, and the second conductive clip cleaning mechanism 700 can be referred to similarly.
As shown in fig. 16, the first conductive clip cleaning mechanism 600 includes a first water washing device 601, an acid washing and electrolyzing device 602, and a second water washing device 603 sequentially arranged along the motion track of the first conductive clip 203, wherein the first water washing device 601 is arranged downstream of the electroplating bath, and the first water washing device 601 is used for washing the first conductive clip 203 to remove the plating solution on the surface of the first conductive clip 203. The pickling electrolysis device 602 performs pickling and electrolysis on the first conductive clip 203 through a pickling solution to remove the metal plating on the surface of the first conductive clip 203. The second washing apparatus 603 is configured to wash the first conductive clip 203 with water to remove the acid washing solution on the surface of the first conductive clip 203. The cleaning mode can prevent the mixing of the pickling solution and the plating solution while ensuring better cleaning effect, thereby avoiding the pollution of the plating solution and the pickling solution.
Specifically, when the oval conveyor belt is used, the first water washing device 601, the acid washing electrolysis device 602, and the second water washing device 603 are disposed in this order in the conveying direction of the second horizontal section 2012. After leaving the plating solution tank 100, the first conductive clip 203 is driven by the oval conveyor belt to turn to a side of the first conveyor belt 201 away from the plating solution tank 100, and then sequentially passes through the first water washing device 601, the acid washing electrolysis device 602, and the second water washing device 603, and the cleaned first conductive clip 203 is conveyed into the plating solution tank 100 by the oval conveyor belt again to clamp and convey the conductive base film 800.
In the above embodiment, in order to keep the first conductive clip 203 in the open state while passing through the first water washing apparatus 601, the acid washing electrolysis apparatus 602, and the second water washing apparatus 603, as shown in fig. 16, the opening and closing mechanism 400 may be provided as a kidney-shaped guide rail 405 having a break, the kidney-shaped guide rail 405 being provided around the kidney-shaped conveyor belt, and the break of the kidney-shaped guide rail 405 corresponding to the position of the plating bath 100. So configured, the positions where the first conductive clip 203 is engaged with the kidney-shaped rail 405 are both in an open state and are only closed at the fracture. Therefore, the first conductive clamp 203 can be kept in an open state when passing through the first water washing device 601, the acid washing electrolysis device 602 and the second water washing device 603, so that the clamping surface of the conductive clamp can be conveniently washed by the washing device, and the washing effect is improved.
In the plating bath tank 100, a plating bath containing metal cations for forming a plating layer is provided, and the plating bath can be maintained in a flowing state in order to make the concentration of the metal cations in the plating bath uniform. In order to achieve the above object, as shown in fig. 17, the plating liquid tank 100 includes a main tank 101 and a sub tank 102, plating liquids are provided in both the main tank 101 and the sub tank 102, and the plating liquid in the main tank 101 can overflow into the sub tank 102 after reaching a predetermined level. A circulation pump 103 is also connected between the main tank 101 and the sub-tank 102, and the circulation pump 103 can pump the plating liquid in the sub-tank 102 and feed the plating liquid into the main tank 101.
Therefore, when the electroplating solution in the main tank 101 reaches a preset liquid level, the electroplating solution can overflow into the auxiliary tank 102, and the electroplating solution in the auxiliary tank 102 can be supplemented into the main tank 101 under the action of the circulating pump 103 and the spraying device 105, so that the circulating supply of the electroplating solution can be realized, the electroplating solution in the main tank 101 is always in a flowing state, the concentration of metal cations in the electroplating solution can be uniformly distributed, and the consistency of the thickness of the electroplating layer on the surface of the conductive base film 800 can be realized.
Specifically, a liquid supply pipe 104 may be provided in the main tank 101 or a spray device 105 may be provided above the main tank 101, and a circulation pump 103 may be connected to the liquid supply pipe 104 or the spray device 105 to replenish the plating solution into the main tank 101.
Another factor affecting the uniformity of the surface thickness of the conductive base film 800 is the anode member 300, and since the anode member 300 is generally a unitary structure, the length of the anode member 300 is adapted to the width specification of the coater. When the width specification of the film plating machine is small, the length of the anode piece 300 is small, the current flowing in each part of the anode piece is similar, and the consistency of the surface coating of the conductive base film 800 can be ensured; when the width of the coater is large, the length of the anode 300 is long, and since the current is usually connected from the two ends of the anode 300, the current at the two ends of the anode 300 is large, the current at the middle part of the anode 300 is too small, and the current directly affects the thickness of the plating layer on the conductive base film 800, that is, the plating layer at the corresponding area on the conductive base film 800 is thick due to the area of the anode 300 with large current, and the plating layer at the corresponding area on the conductive base film 800 is thin due to the area of the anode 300 with small current.
Therefore, in order to improve the uniformity of the surface plating layer of the conductive base film 800, as shown in fig. 18, the anode member 300 may be formed by splicing a plurality of anode member splicing units 301, the anode member splicing units 301 are arranged along the width direction of the plating solution tank 100, two adjacent anode member splicing units 301 are separated by an insulating medium 302, and each anode member splicing unit 301 is connected with the positive electrode of the power supply.
Therefore, the anode piece splicing units 301 can be connected in parallel, the current passing through each anode piece splicing unit 301 by the power supply is close to each other, and the consistency of the surface coating of the conductive base film 800 is further ensured.
It should be noted that the anode member splicing unit 301 may be a soluble anode member, such as titanium blue and phosphor-copper balls disposed in the titanium blue; or may be an insoluble anode member, such as an insoluble anode plate. And is not limited herein.
Example two
The embodiment of the application provides an electroplating production line, as shown in fig. 19, the electroplating production line comprises an unwinding mechanism 1, a first flattening roller 2, a coating machine, a cleaning tank 4, a passivation tank 5, an oven 6, a slitting device 7, a second flattening roller 8, a pressing roller 9 and a winding device 10 which are sequentially arranged along the conveying direction of a conductive base film 800.
The specific operation process of the electroplating production line is as follows: before coating, a traction film is arranged on an unreeling mechanism 1, then a mechanical transmission part of an electroplating production line is started, the traction film passes through the whole production line and reaches a reeling mechanism under the drive of the mechanical transmission part, after the traction film is connected with the reeling mechanism, a conductive base film 800 to be coated is arranged at the unreeling mechanism 1, the conductive base film 800 to be coated is bonded with the traction film, and the traction film pulls the conductive base film 800 to sequentially pass through a first flattening roller 2, a coating tank 100 of a coating machine, a cleaning tank 4, a passivation tank 5, an oven 6, a slitting device 7, a second flattening roller 8 and a compression roller 9, and finally reaches the reeling device 10 to be coiled. Finally, the current collector product with the plated film can be obtained.
It should be noted that the mechanical transmission part of the starting apparatus mainly refers to the starting unwinding mechanism 1, the winding mechanism, the conductive base film conveying device 200 of the film coating machine, and one or more driving rollers (not shown in the figure) distributed on the whole production line. The effect of above part is for providing the power of carrying for electrically conductive basement membrane, and the rotational speed is the same to the effect of realizing the electrically conductive basement membrane of constant speed conveying prevents that electrically conductive basement membrane from taking place the fold or the tension in the transfer process is too tight.
The unwinding mechanism 1 is configured to send out an uncoated conductive base film 800, the sent-out conductive base film 800 is flattened by the first flattening roller 2 to be conveyed forward along the horizontal direction, then the two opposite side edges of the conductive base film 800 are clamped by the conductive base film conveying device 200 of the film plating machine, the conductive base film 800 is conveyed into the plating bath 100 to be plated, the conductive base film 800 which is plated enters the cleaning bath 4 to be cleaned, so as to remove the plating solution remaining on the surface of the conductive base film 800, the cleaned conductive base film 800 enters the passivation bath 5, and the passivation bath 5 is configured to form an antioxidant plating layer on the surface of the conductive base film 800, so as to prevent the plating layer from being oxidized and discolored in the air. The conductive base film 800 formed with the oxidation-resistant plating layer is then sent into the oven 6 to dry the oxidation-resistant liquid remaining on the surface of the conductive base film 800. The dried conductive base film 800 is cut by the cutting device 7 to remove regions on both sides of the conductive base film 800 which are clamped by the conductive base film transfer device 200 or regions where plating layers are thicker on both sides of the conductive base film 800 due to the edge effect of current. The conductive base film 800 retained after slitting is rolled by the rolling mechanism 10, and the compression roller 9 arranged on the rolling mechanism 10 can compress the conductive base film 800 to ensure the hardness and smoothness of rolling.
EXAMPLE III
The embodiment of the present application provides a method for continuously producing a current collector, as shown in fig. 20, including the following steps:
s10, unwinding, and sending out the conductive base film to be electroplated;
s20, electroplating, and forming a metal plating layer on the surface of the conductive base film to be electroplated;
s30, cleaning, and removing residual plating solution on the surface of the electroplated conductive base film;
s40, passivating, and forming an anti-oxidation coating on the surface of the electroplated conductive base film;
s50, drying, namely drying the antioxidant liquid remained on the surface of the conductive base film with the antioxidant coating;
s60, cutting, removing the edge areas on the two sides of the conductive base film which forms the anti-oxidation coating to form a current collector belt;
and S70, winding, namely winding the current collector belt.
The whole process of the method can be continuously carried out, the current collector belt with the anti-oxidation effect can be finally formed, and the roll-to-roll continuous production of the current collector belt can be realized, so that the production efficiency can be improved.
Further, the step of forming the metal plating layer on the surface of the conductive base film to be electroplated specifically includes:
the two opposite side edges of the horizontally arranged conductive base film are clamped, and the conductive base film is driven to horizontally enter a plating solution tank for electroplating.
From this, the relative both sides limit centre gripping of the electrically conductive base film that sets up the level carries out the conveying, need not use the conducting roller to conduct, can make electrically conductive base film be located the plating bath all the time at the coating film in-process to can guarantee the cooling effect of electrically conductive base film, prevent that electrically conductive base film from appearing the phenomenon of electric breakdown. And because the conducting basal membrane in the plating solution has stronger current bearing capacity, the power supply current can be properly increased, so that the plating efficiency is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (20)
1. A coating machine is characterized by comprising:
the plating solution tank is internally provided with a plating solution and an anode piece;
the conductive base film conveying devices are arranged on two sides of the plating solution tank and are used for clamping two opposite side edges of a horizontally placed conductive base film and driving the conductive base film to horizontally enter and exit the plating solution tank along a first direction;
and the positive pole of the power supply is electrically connected with the anode piece, and the negative pole of the power supply is electrically connected with the conductive base film through the conductive base film conveying device.
2. The coater according to claim 1 wherein said conductive base film transfer means comprises:
the first conveying device comprises a first conveying belt, a plurality of first conductive clips and a first driving assembly, the first conveying belt extends along the first direction, the first conductive clips are arranged on the first conveying belt along the first direction, the first conductive clips are communicated with a negative electrode of the power supply, and the first driving assembly is used for driving the first conveying belt to convey the first conductive clips along the first direction;
the second conveying device comprises a second conveying belt, a plurality of second conductive clips and a second driving assembly, the second conveying belt extends along the first direction, the second conductive clips are arranged on the second conveying belt along the first direction, the second conductive clips are communicated with a negative electrode of the power supply, and the second driving assembly is used for driving the second conveying belt to convey the second conductive clips along the first direction;
the first conveying belt and the second conveying belt are symmetrically arranged on two sides of the plating solution tank, and the first conductive clamp and the second conductive clamp are respectively used for clamping two opposite side edges of the conductive base film.
3. The coater of claim 2 wherein the first and second conductive clips each comprise:
the first clamping part comprises a first clamping surface, and the first clamping surface is a conductive surface and is communicated with the negative electrode of the power supply;
the second clamping part comprises a second clamping surface which is a conductive surface and is communicated with the negative electrode of the power supply;
the first clamping part and the second clamping part can move relatively to enable the conductive clamp to be in a clamping state or an opening state, and when the conductive clamp clamps the conductive base film, the first clamping surface and the second clamping surface are both in contact conduction with the conductive base film;
surfaces of the first and second conductive clips are configured to: except the first clamping surface and the second clamping surface, the rest surfaces which can be immersed in plating solution during plating are insulating surfaces.
4. The coater of claim 3 wherein,
a first sealing part is formed on the first clamping part around the first clamping surface;
a second sealing part is formed on the second clamping part around the second clamping surface;
when the conductive clip clamps the conductive base film, the first sealing portion is matched with the second sealing portion to seal the first clamping face and the second clamping face.
5. The coater of claim 4 wherein,
the first sealing portion is a first sealing ring arranged around the first clamping face, at least part of the first sealing ring protrudes out of the first clamping face, the second sealing portion is a first annular sealing groove arranged around the second clamping face, and when the conductive clamp is in a clamping state, the part, protruding out of the first sealing ring, of the first clamping face is matched and clamped into the first annular sealing groove.
6. The coating machine as claimed in any one of claims 3 to 5, further comprising an opening and closing mechanism, wherein the opening and closing mechanism comprises a first guide rail and a second guide rail which are symmetrically arranged on two sides of the plating solution tank, the first guide rail and the second guide rail both extend along the first direction, the first guide rail is used for being matched with the first conductive clip to guide the first conductive clip to be opened or closed, and the second guide rail is used for being matched with the second conductive clip to guide the second conductive clip to be opened or closed.
7. The coater according to claim 6, wherein the first conductive clamp is a normally open conductive clamp, the first guide rail corresponds to the plating bath tank, the first guide rail comprises a closed guide section, a horizontal guide section and an open guide section, the closed guide section, the horizontal guide section and the open guide section are sequentially arranged in the first direction, the first conductive clamp is gradually closed under the guide effect of the closed guide section when the first conductive clamp slides along the closed guide section, the first conductive clamp moves in a clamping state when the first conductive clamp slides along the horizontal guide section, and the first conductive clamp is gradually opened under the guide effect of the open guide section when the first conductive clamp slides along the open guide section.
8. The coater according to claim 7, wherein the normally open conductive clamp comprises a bracket, a guide post is arranged on the bracket, the first clamping portion and the second clamping portion are both connected with the guide post in a sliding manner, and an elastic member is arranged between the first clamping portion and the second clamping portion and used for keeping the first clamping portion and the second clamping portion in an open state;
the first guide rail comprises an upper guide rail and a lower guide rail which are oppositely arranged, the motion track of the first conductive clamp is positioned between the upper guide rail and the lower guide rail, along the motion direction of the first conductive clamp, the distance between the lower surface of the upper guide rail and the upper surface of the lower guide rail is gradually reduced, then is kept unchanged, and finally is gradually increased, and the part with the unchanged distance corresponds to the position of the plating solution tank.
9. The coater according to claim 6 wherein the conductive clamp is a normally closed conductive clamp, the first guide rail comprises a first guide section and a second guide section, the first guide section corresponds to the tank-in side of the bath and the second guide section corresponds to the tank-out side of the bath, the first guide section guides the first conductive clamp to open when the first conductive clamp slides along the first guide section, the first conductive clamp is normally closed when the first conductive clamp slides between the first guide section and the second guide section, and the second guide section guides the first conductive clamp to reopen when the first conductive clamp slides along the second guide section.
10. The coater of claim 9 wherein a first clamping portion is fixed relative to the first conveyor belt, the second clamping portion is movably connected to the first clamping portion, the second clamping portion is movable up and down relative to the first clamping portion, and the second clamping surface is positioned above the first clamping surface,
first direction section with second direction section all includes the edge ascending inclined plane and the decline inclined plane that first direction set gradually work as the second clamping part with during the ascending inclined plane cooperates, the second clamping part is by the lifting gradually, makes first electrically conductive clamp is opened, works as the second clamping part with during the decline inclined plane cooperates, the second clamping part descends gradually under the action of gravity, makes first electrically conductive clamp is closed.
11. A coater as claimed in any one of claims 2 to 5, wherein the first and second conveyors are waisted circular conveyors.
12. The coater of claim 11 wherein,
the first conveyor belt comprises a first horizontal section and a second horizontal section, the first horizontal section and the second horizontal section are parallel to each other and extend along the first direction, one ends of the first horizontal section and the second horizontal section are connected through a first circular arc section, and the other ends of the first horizontal section and the second horizontal section are connected through a second circular arc section;
first drive assembly includes motor, action wheel and follows the driving wheel, the pivot of action wheel with the pivot from the driving wheel is parallel to each other, the motor is used for driving the action wheel rotates, first circular arc section cover is located on the action wheel, second circular arc section cover is located from the driving wheel.
13. The coating machine as claimed in any one of claims 2 to 5, further comprising a first conductive clip cleaning mechanism and a second conductive clip cleaning mechanism symmetrically arranged on both sides of the coating tank, wherein the first conductive clip cleaning mechanism is used for cleaning the first conductive clip, the second conductive clip cleaning mechanism is used for cleaning the second conductive clip, and the first conductive clip cleaning mechanism comprises:
the first washing device is arranged at the downstream of the electroplating bath along the motion track of the first conductive clamp and is used for washing the first conductive clamp so as to remove plating solution on the surface of the first conductive clamp;
the pickling electrolysis device is arranged at the downstream of the first washing device along the motion track of the first conductive clamp, and is used for pickling and electrolyzing the first conductive clamp through a pickling solution so as to remove the metal coating on the surface of the first conductive clamp;
and the second washing device is used for washing the first conductive clamp to remove the pickling solution on the surface of the first conductive clamp.
14. A coater as set forth in any one of claims 2 to 5 further comprising a conductive mechanism, said conductive mechanism comprising:
the first conductive assembly comprises a plurality of first brushes arranged along the first direction and a plurality of first conductive blocks arranged on the first conveyor belt, the plurality of first brushes are fixed relative to the plating solution tank and are electrically connected with the negative electrode of the power supply, and when the first conveyor belt drives the first conductive blocks to move to the positions of the first brushes, the first conductive blocks can be in sliding electrical connection with the first brushes;
and the second conductive assembly comprises a plurality of second electric brushes arranged along the first direction and a plurality of second conductive blocks arranged on the second conveyor belt, the second electric brushes are fixed relative to the plating solution tank and are electrically connected with the negative electrode of the power supply, and when the first conveyor belt drives the second conductive blocks to move to the positions of the second electric brushes, the second conductive blocks can be electrically connected with the second electric brushes in a sliding manner.
15. A coater as set forth in any one of claims 1 to 5 wherein said bath includes:
the plating bath is arranged in the main tank;
the plating solution in the main tank can overflow into the auxiliary tank after reaching a preset liquid level;
and the circulating pump is used for pumping the electroplating liquid in the auxiliary tank and conveying the electroplating liquid into the main tank.
16. A coating machine as claimed in any one of claims 1 to 5, wherein the anode member is formed by splicing a plurality of anode member splicing units, the anode member splicing units are arranged along the width direction of the coating bath tank, two adjacent anode member splicing units are separated by an insulating medium, and each anode member splicing unit is connected with the positive electrode of the power supply.
17. The electroplating production line is characterized by comprising the following components in sequence along the conveying direction of a conductive base film:
the unwinding mechanism is used for sending out the conductive base film which is not coated with a film;
a coater as claimed in any one of claims 1 to 16;
and the winding mechanism is used for winding the conductive base film after coating.
18. The electroplating production line of claim 17, wherein, the coating machine and the winding mechanism are sequentially provided with:
the cleaning tank is used for cleaning the plating solution on the surface of the conductive base film;
a passivation tank for forming an oxidation-resistant plating layer on a surface of the conductive base film;
the drying oven is used for drying the antioxidant liquid remained on the surface of the conductive base film;
and the cutting device is used for cutting off the areas clamped by the conductive base film conveying device on the two sides of the conductive base film.
19. A method for the continuous production of a current collector for batteries, characterized in that it comprises the following steps:
unreeling and sending out the conductive base film to be electroplated;
electroplating, wherein a metal coating is formed on the surface of the conductive base film to be electroplated;
passivating, namely forming an anti-oxidation coating on the surface of the electroplated conductive base film;
cutting, removing the edge areas on two sides of the conductive base film which forms the antioxidant coating to form a current collecting belt;
and (6) rolling, namely rolling the current collector belt.
20. The continuous production method of a battery current collector as claimed in claim 19, wherein the forming of the metal plating layer on the surface of the conductive base film to be plated comprises:
and clamping two opposite side edges of the horizontally arranged conductive base film, and driving the conductive base film to horizontally enter a plating solution tank for electroplating.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
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| CN202120125321X | 2021-01-18 | ||
| CN202120125321 | 2021-01-18 | ||
| CN2021202648758 | 2021-01-30 | ||
| CN202120264875 | 2021-01-30 | ||
| CN2021202648813 | 2021-01-30 | ||
| CN202120264881 | 2021-01-30 | ||
| CN2021203674529 | 2021-02-07 | ||
| CN202120367452 | 2021-02-07 |
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| CN113481573A true CN113481573A (en) | 2021-10-08 |
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| CN202121481863.7U Active CN215925112U (en) | 2021-01-18 | 2021-06-30 | Conveyer and coating machine |
| CN202110736842.3A Pending CN113481573A (en) | 2021-01-18 | 2021-06-30 | Film coating machine, electroplating production line and continuous production method of battery current collector |
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| CN202121481863.7U Active CN215925112U (en) | 2021-01-18 | 2021-06-30 | Conveyer and coating machine |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114318482A (en) * | 2022-01-11 | 2022-04-12 | 昆山鑫美源电子科技有限公司 | Production and processing system and production and processing method of ultrathin current collector |
| CN114481271A (en) * | 2022-01-25 | 2022-05-13 | 重庆金美新材料科技有限公司 | Electroplating bath, conductive film production equipment and production method |
| CN114703533A (en) * | 2022-04-06 | 2022-07-05 | 天津市津荣天晟金属表面处理有限公司 | Local thick silver plating production line for moving contact of miniature circuit breaker |
| CN115012020A (en) * | 2022-06-15 | 2022-09-06 | 江苏亨通精密铜业有限公司 | Electroplating clamp and coating machine |
| CN115058759A (en) * | 2022-07-04 | 2022-09-16 | 厦门海辰新材料科技有限公司 | Electroplating equipment and coating machine |
| CN115058757A (en) * | 2022-07-04 | 2022-09-16 | 厦门海辰新材料科技有限公司 | Electroplating equipment and coating machine |
| CN115058760A (en) * | 2022-07-04 | 2022-09-16 | 厦门海辰新材料科技有限公司 | Electroplating equipment and coating machine |
| CN116532999A (en) * | 2023-07-06 | 2023-08-04 | 山东壹贰壹保温材料有限公司 | Multidimensional wire inserting welding machine |
Families Citing this family (1)
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| CN215925113U (en) * | 2021-01-18 | 2022-03-01 | 厦门海辰新能源科技有限公司 | Coating machine and electroplating production line |
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| CN114318482A (en) * | 2022-01-11 | 2022-04-12 | 昆山鑫美源电子科技有限公司 | Production and processing system and production and processing method of ultrathin current collector |
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| CN116532999A (en) * | 2023-07-06 | 2023-08-04 | 山东壹贰壹保温材料有限公司 | Multidimensional wire inserting welding machine |
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| CN215925113U (en) | 2022-03-01 |
| CN215925112U (en) | 2022-03-01 |
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